1337410 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種發光二極體裝置，且特別是有關 於一種發光二極體裝置之封裝結構。 【先前技術】 隨著技術的進步，發光二極體（Light Emiuing DiQde; LED)具有工作電壓低、耗電量小、發光效率高、反應時間 短、光色純、結構牢固、抗衝擊、耐振動、性能穩定可靠、 重量輕、體積小及成本低等特點，因而其應用領域也越來 越廣泛，例如：大面積圖文顯示全彩屏、狀態指示、標誌 照明、彳§號顯示、液晶顯示器的背光源或車内照明。 在傳統地發光二極體裝置之中，散熱材一表面承載發 光二極體片，另一表面則穿透電路基板，以與散熱基板接 觸。發光二極體所產生之熱量，則透過散熱材，消散至散 熱基板。 在此傳統的發光二極體裝置之中，發光二極體晶片所 產生的熱量，僅能透過散熱材傳導至基板。隨著發光二極 體晶片功率提高，熱量產生越來越快，此單一的熱量傳導 路’並無法及時地消散熱量，將造成發光二極體晶片損 壞。 因此需要一種新的發光二極體裝置，能夠有效地消散 發光二極體晶片之熱量。 【發明内容】 5 1337410 因此本發明之一方面就是在提供一種雙向散熱發光二 極體裝置，增加散熱路徑來有效地消散發光二極體晶片之 熱量。 依照本發明之一實施例，雙向散熱發光二極體裝置包 括一發光二極體晶片、一散熱材'一塑膠包覆件以及一電 路基板。散熱材具有承載發光二極體晶片之一本體部，以 及與本體部耦接之一延伸部。發光二極體晶片之熱量分別 透過本體部以及延伸部消散。塑膠包覆件承載並暴露延伸 部於空氣’使發光二極體晶片之熱量透過延伸部消散至空 氣。電路基板以一凹陷容納塑膠包覆件。本體部則貫穿電 路基板之一第一鏤空區域以及塑膠包覆件之一第二鏤空區 域0 本發明之另一方面提供一種雙向散熱發光二極體裝 置’增加散熱路徑以及散熱扣件來消散發光二極體晶片之 熱量。 依照本發明之另一實施例，雙向散熱發光二極體裝置 包括散熱基板、電路基板、塑膠包覆件以及散熱材。電路 基板位於散熱基板之上’且具有一第一鏤空區域。塑膠包 覆件6又置於電路基板之上，具有一第二鏤空區域。散熱材 之一圓柱狀本體貫穿第一鏤空區域以及第二鏤空區域，此 散熱材之一延伸部延伸於電路基板之上，並接觸圓柱狀本 體。發光二極體晶片設置於散熱材之圓柱狀本體上。發光 二極體晶片之熱量透過散熱材之圓柱狀本體以及延伸部， 消散至散熱基板以及外界。 上述實施例之雙向散熱發光二極體裝置，增加了散熱1337410 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode device, and more particularly to a package structure for a light-emitting diode device. [Prior Art] With the advancement of technology, Light Emuing DiQde (LED) has low operating voltage, low power consumption, high luminous efficiency, short reaction time, pure light color, firm structure, impact resistance and resistance. Vibration, stable and reliable performance, light weight, small size and low cost, so its application fields are more and more extensive, such as: large-area graphic display full color screen, status indication, logo lighting, 彳§ display, LCD Backlight or interior lighting. In the conventional light-emitting diode device, one surface of the heat dissipating material carries the light-emitting diode piece, and the other surface penetrates the circuit substrate to contact the heat-dissipating substrate. The heat generated by the light-emitting diode is dissipated to the heat-dissipating substrate through the heat-dissipating material. In the conventional light-emitting diode device, the heat generated by the light-emitting diode wafer can be conducted only to the substrate through the heat-dissipating material. As the power of the LED is increased, the heat generation is getting faster and faster, and the single heat conduction path does not dissipate heat in time, which will cause damage to the LED wafer. There is therefore a need for a new light emitting diode device that is capable of effectively dissipating heat from a light emitting diode chip. SUMMARY OF THE INVENTION 5 1337410 It is therefore an aspect of the present invention to provide a two-way heat-dissipating light-emitting diode device that increases the heat dissipation path to effectively dissipate heat from the light-emitting diode chip. According to an embodiment of the invention, the bidirectional heat emitting diode device comprises a light emitting diode chip, a heat dissipating material, a plastic covering member and a circuit substrate. The heat dissipating material has a body portion carrying the LED chip and an extension portion coupled to the body portion. The heat of the light-emitting diode chip is dissipated through the body portion and the extension portion, respectively. The plastic cover carries and exposes the extension to the air' so that the heat of the LED wafer is dissipated through the extension to the air. The circuit substrate receives the plastic covering member in a recess. The main body portion penetrates through the first hollow region of the circuit substrate and the second hollow region of the plastic covering member. The second aspect of the invention provides a bidirectional heat-dissipating light-emitting diode device to increase the heat dissipation path and the heat dissipation fastener to dissipate the light. The heat of the diode chip. According to another embodiment of the present invention, a two-way heat-dissipating light-emitting diode device includes a heat-dissipating substrate, a circuit substrate, a plastic covering member, and a heat dissipating material. The circuit substrate is located above the heat sink substrate and has a first hollowed out region. The plastic wrapper 6 is placed on top of the circuit substrate and has a second hollowed out area. One of the heat dissipating materials penetrates the first hollow region and the second hollow region, and one of the heat dissipating portions extends over the circuit substrate and contacts the cylindrical body. The light emitting diode chip is disposed on the cylindrical body of the heat dissipation material. The heat of the light-emitting diode chip is transmitted through the cylindrical body of the heat-dissipating material and the extension portion, and is dissipated to the heat-dissipating substrate and the outside. The two-way heat dissipation LED device of the above embodiment increases heat dissipation
(S 6 材之散熱路徑，使發光二極體晶片所產生之熱量，能更有 效地透過散熱材消散’避免損壞發光二極體晶片。 【實施方式】 以下實施例之雙向散熱發光二極體裝置，發光二極體 晶片所產生之熱量’能夠分別透過散熱材之本體部以及延 伸部，消散至散熱基板以及外界。更可增加散熱扣件來扣 合散熱材之延伸部以及散熱基板，使發光二極體、散熱材 以及散熱基板密合，增加散熱效率。 請同時參照第1圖以及第2圖，其係分別繪示本發明 一貫施例之雙向散熱發光二極體裝置立體圖以及剖面圖。 雙向散熱發光二極體裝置包括散熱材1〇5，以及設置於散熱 材105上的發光二極體晶片211。散熱材1 〇5包括承載發光 二極體晶片211之本體部i〇5a，以及與本體部i〇5a耦接之 延伸部105b。散熱材1 〇5之材質可為金屬或陶瓷。 散熱材105之本體部l〇5a呈一圓柱狀，並具有凹陷 1^9。發光二極體晶片211設置於本體部i〇5a之凹陷119 上’然後由透鏡結構101包覆發光二極體晶片211以及本 體部〗〇5a。透鏡結構1〇1之材質為聚碳酸酯 (Polycarbonate)、石夕樹脂（silicone)或樹脂。塑膠環117環繞 透鏡結構101 ’使透鏡結構1〇1呈現圓形或橢圓形。 雙向散熱發光二極體裝置更包含電路基板1〇7以及設 置於電路基板107上的塑膠包覆件1〇3。電路基板1〇7具有 凹陷123，來容納塑膠包覆件1〇3。塑膠包覆件1〇3承載散 熱材105之延伸部l〇5b，並將延伸部i〇5b之一部份1〇5, 1337410 暴露於空氣。散熱材105之本體部105a，貫穿塑膠包覆件 103之第二鏤空區域l〇3a以及電路基板107之第一鏤空區 域 107a 。 由於發光二極體晶片211設置於散熱材1〇5上，發光 二極體晶片211之熱量因而可透過散熱材105之延伸部 105b消散至空氣，或是透過散熱材1〇5之本體部105a往外 界傳遞。此外’發光二極體晶片211上之電極111則可透 過導線121耦接電路基板1〇7上之電路1〇9。 請同時參閱第3圖以及第4圖，其係分別繪示本發明 另一實施例之雙向散熱發光二極體裝置立體圖以及剖面 圖。雙向散熱發光二極體裝置除了上述之結構以外，還可 選擇性地加入梯狀散熱扣件3 13以及散熱基板3 1 5。 散熱基板315承載第1圖所繪示之雙向散熱發光二極 體裝置。發光二極體晶片211之熱量透過散熱材1〇5之本 體部105a，傳導至散熱基板315,再藉由散熱基板3〗5消 散。散熱基板315之材質可為金屬或非金屬。亦可使用印 刷電路板、金屬核心印刷電路板（Metal Core PCB; MCPCB) 或陶瓷基板做為散熱基板315。 梯狀散熱扣件3 13扣合於散熱材1 05之延伸部105b以 及散熱基板315。除了透過本體部i〇5a傳導至散熱基板 315’發光二極體晶片211之熱量亦可透過延伸部l〇5b以 及梯狀散熱扣件313 ’傳導至外界。此外，由於梯狀散熱扣 件313同時黏著於散熱材1〇5、塑膠包覆件1〇3、電路基板 107以及散熱基板315，因而提供了下壓力使散熱材105、 塑膠包覆件103、電路基板107以及散熱基板315之間密 8 1337410 合，發光二極體晶片之熱量能夠更有效率地傳導至散敎基 板或料。梯狀散熱扣件3丨3之材f為金屬或非金屬。 上所述，發光二極體晶片所產生之熱量，能夠分別 透過散熱材之本體部以及延伸部，消散至散熱基板以及外 界°更可增加散熱扣件來扣合於散熱材之延伸部以及散熱 基板’使發光二極體、散熱材以及散熱基板密合增加散(The heat dissipation path of the S6 material enables the heat generated by the LED chip to be more effectively dissipated through the heat dissipation material to avoid damage to the LED chip. [Embodiment] The bidirectional heat-dissipating diode of the following embodiment The heat generated by the light-emitting diode chip can be dissipated to the heat-dissipating substrate and the outside through the body portion and the extending portion of the heat-dissipating material, and the heat-dissipating fastener can be added to fasten the extending portion of the heat-dissipating material and the heat-dissipating substrate. The light-emitting diode, the heat-dissipating material, and the heat-dissipating substrate are closely adhered to increase the heat-dissipating efficiency. Please refer to FIG. 1 and FIG. 2 simultaneously, which are respectively a perspective view and a cross-sectional view of the bidirectional heat-dissipating light-emitting diode device according to the consistent embodiment of the present invention. The two-way heat-dissipating light-emitting diode device includes a heat-dissipating material 1〇5, and a light-emitting diode wafer 211 disposed on the heat-dissipating material 105. The heat-dissipating material 1〇5 includes a body portion i〇5a carrying the light-emitting diode wafer 211, And the extending portion 105b coupled to the main body portion 〇5a. The material of the heat dissipating material 1 〇5 may be metal or ceramic. The main body portion l〇5a of the heat dissipating material 105 has a cylindrical shape and has The recessed film 1 is 9. The light-emitting diode wafer 211 is disposed on the recess 119 of the body portion i〇5a' and then the light-emitting diode wafer 211 and the body portion 〇5a are covered by the lens structure 101. The material of the lens structure 1〇1 It is a polycarbonate (polycarbonate), a silicon resin or a resin. The plastic ring 117 surrounds the lens structure 101 ′ to make the lens structure 1 〇 1 appear circular or elliptical. The bidirectional heat dissipation LED device further includes a circuit substrate 1 And a plastic covering member 1〇3 disposed on the circuit substrate 107. The circuit substrate 1〇7 has a recess 123 for accommodating the plastic covering member 1〇3. The plastic covering member 1〇3 carries an extension of the heat dissipating material 105 The portion l〇5b exposes a portion of the extension portion i〇5b to the air, the body portion 105a of the heat dissipation material 105, the second hollow region l〇3a of the plastic covering member 103, and the circuit substrate. The first hollow region 107a of 107. Since the light emitting diode chip 211 is disposed on the heat dissipating material 1〇5, the heat of the light emitting diode chip 211 can be dissipated to the air through the extending portion 105b of the heat dissipating material 105, or through the heat dissipation. The body portion 105a of the material 1〇5 is outward In addition, the electrode 111 on the LED chip 211 can be coupled to the circuit 1〇9 on the circuit substrate 1〇7 via the wire 121. Please refer to FIG. 3 and FIG. 4 simultaneously, respectively. A perspective view and a cross-sectional view of a two-way heat-dissipating light-emitting diode device according to another embodiment of the present invention. In addition to the above structure, the two-way heat-dissipating light-emitting diode device can selectively include a ladder-shaped heat dissipation member 3 13 and a heat dissipation substrate 3 1 5 The heat dissipation substrate 315 carries the two-way heat-dissipating light-emitting diode device shown in Fig. 1. The heat of the light-emitting diode wafer 211 is transmitted to the heat-dissipating substrate 315 through the body portion 105a of the heat-dissipating material 1〇5, and is further radiated by the heat-dissipating substrate. 3〗 5 dissipated. The material of the heat dissipation substrate 315 may be metal or non-metal. A printed circuit board, a metal core printed circuit board (MCPCB) or a ceramic substrate can also be used as the heat dissipation substrate 315. The ladder heat dissipation member 3 13 is fastened to the extension portion 105b of the heat dissipation material 105 and the heat dissipation substrate 315. The heat transferred to the heat-emitting substrate 315' of the light-emitting diode wafer 211 through the body portion i5a can also be conducted to the outside through the extending portion 105b and the ladder-shaped heat-dissipating member 313'. In addition, since the ladder-shaped heat dissipation member 313 is simultaneously adhered to the heat dissipation material 1〇5, the plastic cover member 1〇3, the circuit substrate 107, and the heat dissipation substrate 315, the downward pressure is provided to cause the heat dissipation material 105, the plastic cover member 103, The heat between the circuit substrate 107 and the heat dissipation substrate 315 is 8 1337410, and the heat of the LED substrate can be more efficiently conducted to the heat dissipation substrate or material. The material f of the ladder heat dissipation member 3丨3 is metal or non-metal. As described above, the heat generated by the LED chip can be dissipated to the heat dissipation substrate and the outside through the body portion and the extension portion of the heat dissipation material, and the heat dissipation fastener can be added to be fastened to the extension portion of the heat dissipation material and the heat dissipation. The substrate 'encloses the light-emitting diode, the heat-dissipating material, and the heat-dissipating substrate
雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何在本發明所職術領域中具有通常知識者， 在不脫離本發明之精神和範圍内，當可作各種之更動盥潤 飾，因此本發明之保護範圍當視後附之申請專利 定者為準。 【圓式簡單說明】 為讓本發明之上述和盆灿曰ίΛ Λ+ 扎牙，、他目的、特徵、優點與實施例The present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. Any one of ordinary skill in the art to which the present invention pertains can make various changes without departing from the spirit and scope of the present invention. The scope of protection of the present invention is determined by the appended patent application. [Circular Simple Description] In order to make the above-mentioned and the pots of the present invention, the purpose, characteristics, advantages and embodiments thereof
旎更明顯易懂，所附圖式之詳細說明如下： 第1圖係繪示本發明―實施例之雙向散熱發光二極體 立體圖。 第2圖係繪示本發明—實施例之雙向散熱發光二極體 第3圖係繪示本發明另— 體裝置立體圖。 第4圖係繪示本發明另— 體裝置剖面圖。 實施例之雙向散熱發光二極 實施例之雙向散熱發光二極 1337410 【主要元件符號說明】 101 :透鏡結構 103 :塑膠包覆件 103a :第二鏤空區域 105 :散熱材 105a :本體部 105b :延伸部 105’ ：延伸部之部分 107 :電路基板 107a :第一鏤空區域 109 :電路 111 :電極 117 :塑膠環 119 :凹陷 121 :導線 123 :凹陷 211 :發光二極體晶片 3 1 3 :梯狀散熱扣件 3 1 5 :散熱基板The drawings are more clearly understood, and the detailed description of the drawings is as follows: Fig. 1 is a perspective view showing a two-way heat-dissipating light-emitting diode of the present invention. Fig. 2 is a perspective view showing a two-way heat-dissipating light-emitting diode of the present invention. Fig. 3 is a perspective view showing another embodiment of the present invention. Figure 4 is a cross-sectional view showing another embodiment of the present invention. Two-way heat-dissipating light-emitting diode of the embodiment of the two-way heat-dissipating light-emitting diode 1337410 [Description of main components] 101: lens structure 103: plastic covering member 103a: second hollow region 105: heat-dissipating material 105a: body portion 105b: extension Portion 105': part 107 of the extension portion: circuit substrate 107a: first hollow region 109: circuit 111: electrode 117: plastic ring 119: recess 121: wire 123: recess 211: light-emitting diode chip 3 1 3 : ladder Heat sink fastener 3 1 5 : heat sink substrate