JP4192742B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light-emitting device, and more particularly to a light-emitting device that can improve heat resistance and heat dissipation for higher output of a light-emitting element.

  In recent years, high-power LEDs (light-emitting diodes) have been developed, and a high-power type of several watts has already been commercialized. LEDs are characterized by low heat generation, but high power (high brightness) type LED elements generate a large amount of current, and therefore generate heat that cannot be ignored.

  Conventionally, the LED element does not have a high output type, and therefore, no special heat dissipation measures are taken, and it is only necessary to dissipate heat from the lead portion. And when heat_generation | fever becomes a problem, measures, such as attaching a copper heat sink to the lower surface of the member which mounts the LED element, were taken (for example, refer patent document 1).

  In the LED package of Patent Document 1, a slag to be a heat sink is insert-molded and inserted into a lead frame having a molded plastic material. A light emitting diode die (LED die) is directly or indirectly attached to the slag via a sub-base having excellent thermal conductivity, and the LED is mounted on the LED die. The LED and light emitting diode die and the lead frame are connected by wires.

With this configuration, the LED die is thermally bonded to the slug, so that the LED die is maintained at a lower junction temperature than the conventional package. By reducing the temperature, it is possible to suppress a decrease in light emission output as an initial characteristic, and it is possible to maintain reliability and good characteristics in high power operation.
JP 2000-150967 A ([0008], FIG. 2)

  However, according to the conventional light emitting device, the LED die seal is a plastic material, and is deteriorated by light or heat. Also, disconnection occurs due to the heat effect during lighting. Furthermore, the lead, slag, and the like are held by an insert-molded plastic material, and the lens is also a plastic material. These are not heat resistant to reflow furnaces that support lead-free solder. That is, silicone is less likely to be deteriorated by light or heat than an epoxy resin, but a cured material of silicone is a deterioration factor. In addition, there is a problem that the refractive index is slightly low and the light extraction efficiency from the LED die is slightly inferior. Also, the plastic material has a much larger coefficient of thermal expansion than the metal and LED die that are slag materials. Although the LED die sealing material is a soft material, the heat generated by the LED die causes stress to the electrode contacts.

  Furthermore, in the case of a heat treatment at approximately 300 ° C., the insert-molded plastic material is softened and deformed.

  Accordingly, an object of the present invention is to provide a light-emitting device that has improved heat resistance and durability and enables high heat dissipation with respect to higher output of a light-emitting element.

In order to achieve the above object, the present invention provides a light-emitting element, a submount on which the light-emitting element is mounted and the light-emitting element and the power feeding side are connected via an electrode or a wiring layer, and the submount includes A metal base portion that dissipates heat of the light emitting element that is mounted and is transmitted through the submount, and a tip end portion that is mounted and connected on the planes at both ends of the submount to electrically connect the light emitting element. And a pair of lead portions that are disposed in an insulated state on the metal base portion, and are bonded to the metal base so as to cover the light emitting element and the submount. and a predetermined formed in a shape Ruga Las sealing portion together with the sub-mount has a stepped portion, the lead emission device characterized that you have been fixed to the step portion To provide.

  In the lead portion, it is preferable that a portion interposed on the metal base portion other than the tip portion is insulated by the glass sealing portion.

  The light-emitting elements may be plural, and power may be supplied separately for a plurality of groups with the same emission color or a plurality of emission color groups.

  The submount is preferably formed with a groove having a depth capable of embedding the tip portions of the pair of lead portions.

In order to achieve the above object, the present invention provides a face-down type light emitting element and a submount in which the light emitting element is mounted and the light emitting element and a power feeding side are connected via an electrode or a wiring layer. And a metal base portion that dissipates heat of the light emitting element that is transferred through the submount and the tip portions are mounted and connected on the flat surfaces at both ends of the submount. A pair of lead portions that are electrically connected to the light emitting element and are disposed in an insulated state on the metal base portion except for the tip portion, and the metal base without contact with the pair of lead portions with superimposed on the parts, and metal reflecting mirror reflecting surface of the bowl-shaped is formed in the center, Ruga partially or entirely disposed to the internal reflection surface of the bowl-shaped to form a lens La And a member, the submount has a stepped portion, the lead to provide a light emitting device which is characterized that you have been fixed to the step portion.

  The glass member is a lens having a structure for condensing light from the light emitting element in the front and side directions, or a state where a lens portion is formed on the same axis of the light emitting element and fills the inside of the mortar-shaped reflection surface. It may be a sealed glass sealing part.

  In the pair of lead portions, it is preferable that the periphery of the portion sandwiched between the metal base portion and the reflecting mirror portion is insulated by a glass material different from the glass sealing portion.

  The metal base portion and the reflecting mirror portion are formed with a cut-out portion having a width that does not contact the pair of lead portions at a portion where the pair of lead portions are disposed, and the pair of lead portions and the metal base It is preferable that the glass material different from the said glass sealing part is arrange | positioned between these parts.

In order to achieve the above object, the present invention provides a face-up type light emitting device, a metal base portion that has a convex portion on which the light emitting device is mounted, and that dissipates heat from the light emitting device, and the metal A pair of lead portions disposed at an upper portion of the metal base portion in a state of being insulated from the base portion and having a tip portion connected to a power feeding portion of the light emitting element via a wire; the light emitting element and the pair of leads manner to cover the tip of the part to provide a light emitting device, characterized in that it comprises a Ruga lath sealing portion is formed in a predetermined shape while being bonded to the metal base.

  According to the light emitting device of the present invention, heat of the light emitting element is transferred to the metal base portion through the submount or directly, and heat is radiated by the metal base portion. It is possible to stabilize the electrical and optical characteristics of the and make it highly reliable. Further, since the light emitting element is sealed with a glass material and is adhered to the metal base portion, cracks and peeling are less likely to occur. Furthermore, since it is composed of a heat-resistant member, the heat resistance is improved and it can withstand heat treatment in a reflow furnace compatible with lead-free solder.

  According to another light emitting device of the present invention, the heat of the light emitting element is transferred to the metal base portion through the submount and further transferred to the metal reflecting mirror. Heat is effectively dissipated by the metal reflecting mirror, the temperature rise of the light emitting element is suppressed, the electrical and optical characteristics of the light emitting element are stabilized, and the reliability is high.

  1A and 1B are diagrams illustrating a configuration of a light emitting device according to a first embodiment of the present invention, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view along AA, and FIG. FIG. The following lead portion is formed as a part of the lead frame. Usually, the lead frame is provided with a belt-like portion connecting the outer side of each lead portion on both sides, but the illustration is omitted here. In addition, a plurality of LED elements (light emitting elements) are usually mounted on the lead frame, but only one is shown here.

The light-emitting device 1 includes a metal base portion 11 made of a copper material (thermal conductivity: 400 W · m ⁻¹ · k ⁻¹ , thermal expansion coefficient: 17 × 10 ⁻⁶ / ° C.) as a radiator, and the metal base portion A submount 12 mounted at the center of the upper surface of the LED 11, an LED element 13 mounted on the submount 12, and lead portions 14a and 14b whose tips are abutted on step surfaces on both sides of the submount 12. , A transparent glass (thermal expansion coefficient: 11.4 × 10 ⁻⁶ / ° C.) so as to cover the exposed surfaces of the metal base portion 11, the submount 12, and the LED element 13 as well as the tip portions of the lead portions 14 a and 14 b. The light emitting device 1 has a short shell-shaped outer shape as a whole.

  The metal base portion 11 is made of a metal having excellent thermal conductivity, such as copper or aluminum, and has a thickness and a size sufficient to obtain a sufficient heat dissipation effect according to the power consumption of the LED element 13.

The submount 12 is made of, for example, high thermal conductivity AlN (aluminum nitride (thermal conductivity: 180 W · m ⁻¹ · k ⁻¹ )), and a Zener diode or the like for preventing element destruction is provided inside the submount 12 as necessary. It has been. The submount 12 has a quadrangular outer shape having a step, the LED element 13 is mounted on the uppermost surface, and the tip portions of the lead portions 14a and 14b are placed and fixed on the upper surfaces on both sides of the lower stage. The submount 12 has electrodes (both not shown) on the upper surface and side surfaces, and both are connected via a wiring pattern or a through hole formed inside, but the illustration thereof is omitted here. ing.

  The LED element 13 is a high output type made of a material such as GaN or AlInGaP, and solder bumps or electrodes used for connection with the conductive portion of the submount 12 are provided on the lower surface. The chip size of the LED element 13 is 0.3 × 0.3 mm (standard size), 1 × 1 mm (large size), or the like. The LED element 13 is of a flip chip (FC) type (here, the connection portion on the lower surface of the element is not shown) having electrodes or bumps as connection elements.

The lead portions 14a and 14b are processed as a part of the lead frame, and are separated and cut from the strip portion of the lead frame after the sealing of the glass sealing portion 15 is completed. A glass material having translucency and a low melting point is used for the glass sealing portion 15, but a material having a thermal expansion coefficient equivalent to that of the lead portions 14 a and 14 b and the metal base portion 11 is used. For example, the metal base 11 and the submount 12 have a thermal conductivity of 100 W · m ⁻¹ · k ⁻¹ or more. By making the thermal expansion coefficient of the metal base part 11 and the glass sealing part 15 equal, it can prevent that the glass sealing part 15 generate | occur | produces a crack.

  It should be noted that with the same coefficient of thermal expansion, compared to bonding with ceramics due to the plasticity of the metal, bonding can be performed even if the difference in coefficient of thermal expansion is large, and the range is wider for soft metals. The ratio means about 0.57 to 1.75.

  FIG. 2 is a perspective view showing a detailed structure of the submount 12. The submount 12 is cut on both sides with respect to the central portion on which the LED element 13 is mounted, and step surfaces 12a and 12b are formed. The stepped surfaces 12a and 12b are formed with grooves having a depth and a width in which the tip portions of the lead portions 14a and 14b are filled. And the electrode or wiring pattern which contacts lead part 14a, 14b is formed in the bottom face or side surface of a groove | channel. Thus, since the groove | channel is formed in the submount 12, lead part 14a, 14b is positioned correctly, and since the height with respect to the upper surface of the metal base part 11 is prescribed | regulated, the metal base part 11 and Can be prevented.

  Next, assembly of the light emitting device 1 will be described.

  First, the submount 12 is mounted at the center of the metal base 11 and fixed with an adhesive or the like. Next, a glass piece corresponding to the width of the lead portions 14 a and 14 b and the length of the portion facing the metal base portion 11 is placed at the laying position of the lead portions 14 a and 14 b of the metal base portion 11. Next, the lead portions 14a and 14b are placed on the glass pieces, and the tip portions are placed on the stepped surfaces 12a and 12b of the submount 12, and the contact surfaces are heat-sealed by exposure to a thermal atmosphere.

  Next, the LED element 13 is mounted on the uppermost surface of the submount 12, and reflow is performed to perform solder connection and fixing between the electrode or wiring layer of the submount 12 and the bump or electrode of the LED element 13. Finally, the glass sealing portion 15 is sealed so as to cover the entire exposed surface of the upper surface of the metal base portion 11 and to fuse with the glass piece. The glass sealing part 15 is formed in a shell shape so that the upper part forms a convex lens. Thus, the light emitting device 1 is completed.

  For example, assuming that the lead portion 14a is connected to the anode side of the LED element 13, the plus side of a DC power source (not shown) is connected to the lead portion 14a, and the minus side is connected to the lead portion 14b. Along with the power supply, the current flows through the path of the lead part 14a → the submount 12 → the LED element 14 → the submount 12 → the lead part 14b, whereby the LED element 13 emits light. Light emitted from the upper surface of the LED element 13 passes through the glass sealing portion 15 and exits to the outside.

  FIG. 3 is a diagram illustrating another configuration example of the submount. (Here, only the LED element mounting surface is shown, and the mounting surface of the lead portion is not shown). 3A is a plan view of the submount, and FIG. 3B is a circuit diagram. Although FIG. 1 shows a configuration in which one LED element is mounted, a plurality of LED elements may be used.

  FIG. 3 shows a state in which nine LED elements (D1 to D9) are mounted. As the number of LED elements mounted increases, the area of the mounting portion on the top surface of the submount needs to be increased.

  In the submount 30 shown in FIG. 3, the LED elements D1 to D9 are arranged on the same plane at equal intervals. Here, nine LED elements are mounted, but any number can be used. Even if all the LED elements D1 to D9 have the same emission color, they may be mounted separately in three according to three colors (R, G, B), but here, every three Power is supplied by connecting them in series and connecting the resistors (R1 to R3) to the three circuits in parallel. Therefore, the LED elements D1 to D9 may have two feeding ends. Here, the anode is provided at one place (electrode 31) and the cathode is provided at three places (electrodes 32 and 33) so that a large current can be supplied. , 34).

  The electrodes 31 and 32 are formed at the upper end of one end, and the electrodes 33 and 34 are formed at the upper end of the other end. Resistors R1, R2, and R3 are connected to the electrodes 32, 33, and 34, respectively. However, this is for current limiting, and heat is generated by energization, and it is difficult to secure a space for mounting in the LED element. Therefore, it is externally attached. The power sources of the resistors R1, R2, and R3 are connected in common and connected to the power supply terminal 35.

  According to the first embodiment described above, the portions of the lead portions 14a and 14b that are not in contact with the submount 12 are insulated by the glass sealing portion 15 (small glass pieces during the manufacturing process). Contact between the portions 14a and 14b and the metal base portion 11 is prevented. And most of the heat conducted from the LED element 13 to the submount 12 is dissipated by being transferred to the metal base part 11, and the other part is dissipated through the lead parts 14a and 14b. Therefore, even if the LED element 13 is a high output type, the temperature rise of the LED element 13 can be suppressed, the electrical / optical characteristics of the LED element 13 can be stabilized, and the reliability can be improved. In addition, since the LED element 13 is sealed by glass, it does not deteriorate due to light or heat. In addition, according to the glass material, an epoxy resin equivalent or higher refractive index material can be selected, and the light extraction efficiency from the LED element 13 can be improved. Further, the thermal expansion coefficient of the glass material is not so different from that of the resin as compared with the metal and the LED element, and the glass is bonded via the metal and the oxide. For this reason, it is also possible to improve reliability in the sense that thermal stress is less likely to occur, and the bonding strength is large and cracks and peeling are unlikely to occur. Furthermore, since the whole light-emitting device is held by the metal base 11 and the glass sealing portion, the light-emitting device can sufficiently withstand a reflow furnace process compatible with lead-free solder.

FIG. 4 is a cross-sectional view showing the configuration of the light emitting device according to the second embodiment. The light emitting device 40 according to the second embodiment is different from the light emitting device 1 according to the first embodiment in that a face-up type LED element that is connected to the power feeding side by a wire is used, and further, the LED element is The light emitting device is characterized by using a low melting point hybrid glass containing a phenyl group or an alkyl group in SiO ₂ as a glass material to be sealed.

  The light emitting device 40 includes a metal base portion 41 that functions as a heat radiator, a face-up LED element 42, lead portions 43 a and 43 b that are insulated from the metal base portion 41 and disposed on the metal base portion 41, and leads Wires 44a and 44b that connect the end portions of the portions 43a and 43b and the electrodes on the LED element 42, and a glass sealing portion 45 that seals the exposed portion of the upper surface of the metal base portion 41. .

  The metal base portion 41 is made of the same material as that of the metal base portion 11 in the first embodiment, and a convex portion 41a for mounting the LED element 42 is formed at the center of the upper surface. Moreover, the glass sealing part 45 uses the material which can make the viscosity of the ground enclosed with a low melting point lower than the glass sealing part 15 in 1st Embodiment.

  Next, a manufacturing procedure of the light emitting device 40 of FIG. 4 will be described.

  First, the LED element 42 is mounted on the central portion on the metal base 41 and fixed by a heat conductive adhesive, solder welding or the like. Next, the tip portions of the lead portions 43 a and 43 b are arranged in a state of being lifted from the metal base portion 41. For this purpose, an elongated glass piece is placed between the lead parts 43a and 43b and the metal base part 11, and the lead parts 43a and 43b are placed on the glass piece. In this state, the tip portions of the lead portions 43a and 43b and the electrodes (not shown) of the LED elements 42 are connected by wires 44a and 44b. Next, the upper surface of the metal base part 41 including the LED element 42 and the wires 44 a and 44 b is sealed with a glass sealing part 45. Note that the glass piece uses the same material as the glass sealing portion 45.

  For example, if the lead portion 43a is connected to the anode side of the LED element 42, the plus side of a DC power supply (not shown) is connected to the lead portion 43a, and the minus side is connected to the lead portion 43b. Along with the power supply, the current flows through the path of the lead part 43a → the wire 44a → the LED element 42 → the wire 44b → the lead part 43b, whereby the LED element 42 emits light. Light emitted from the upper surface of the LED element 42 passes through the glass sealing portion 45 and exits to the outside. In sealing LED elements that require wire connection, some measures are required because the wire is crushed when the viscosity of the sealing material is high. Here, hybrid glass using a combination of an inorganic material and an inductive material is used. Low viscosity during processing.

  According to the second embodiment described above, the heat generated by the operation of the LED element 42 is conducted from the LED element 42 to the metal base portion 41 and is radiated by the metal base portion 41. The LED element 42 and the metal base 41 are in direct contact with each other, and since a submount is not used, the heat dissipation effect can be enhanced as compared with the first embodiment.

  5A and 5B are diagrams showing a configuration of a light emitting device according to the third embodiment, where FIG. 5A is a plan view, FIG. 5B is a CC cross-sectional view, and FIG. 5C is a DD cross-sectional view. . In the light emitting device 50 according to the third embodiment, a metal reflecting mirror serving as a reflecting mirror and a heat radiator is disposed on the upper portion of the metal base portion, and a lens is disposed in a concave portion of the metal reflecting mirror. It is characterized in that the glass sealing portion provided in the form is not provided.

  The light emitting device 50 includes a metal base portion 51, a submount 52 mounted on the metal base portion 51, an LED element 53 mounted on the uppermost surface of the submount 52, and a state laminated on the metal base portion 51. A ring-shaped metal reflecting mirror 54 disposed, a lens 55 (glass member) disposed on the LED element 53 in the recess of the metal reflecting mirror 54, and a tip on the step surfaces on both sides of the submount 52 Lead portions 56a, 56b to which the portions are connected, insulating sealing glasses 57a, 57b disposed on the lower surfaces of the lead portions 56a, 56b, and insulating sealing glasses disposed on the upper surfaces of the lead portions 56a, 56b. 58a, 58b.

  The metal base 51 is made of a material having excellent thermal conductivity such as copper, aluminum, or AlN (aluminum nitride), and has a thickness and a size that can provide a sufficient heat dissipation effect according to the power consumption of the LED element 53. is doing.

  Further, the metal base portion 51 has a groove (not shown) formed in a straight line with the LED element 53 as the center. The groove has a depth that allows the insulating sealing glasses 57a and 57b, the lead portions 56a and 56b, and the insulating sealing glasses 58a and 58b to be embedded. Since the lead portions 56a and 56b are disposed in the groove while being sandwiched between the insulating sealing glasses 57a and 57b and 58a and 58b, the lead portions 56a and 56b are insulated from the metal base portion 51 and electrically Never connected. The metal base 51 is the same size as the metal reflecting mirror 54, but may be larger than the metal reflecting mirror 54 or may have another shape such as a quadrangle.

  The submount 52 is made of, for example, highly heat-conductive AlN (aluminum nitride), and is provided with a Zener diode for preventing element destruction or the like as needed. The submount 52 has a quadrangular outer shape having a step, the LED element 53 is mounted on the uppermost surface, and the tip portions of the lead portions 56a and 56b are mounted on the upper surfaces on both sides of the lower stage. Similar to the submount 12 of FIG. 1, the submount 52 has electrodes (both not shown) on the upper surface and side surfaces. The connection between the electrode on the upper surface and the electrode on the side surface can be made by a wiring layer or a through hole, but the illustration thereof is omitted here.

  The LED element 53 is the same as the LED element 13 described in the first embodiment. The metal reflecting mirror 54 is formed of Cu having excellent thermal conductivity, and a mortar-shaped concave portion is formed at the center, and the inner surface thereof is silver-deposited, chrome or silver-plated, silver or white surface treatment The reflecting surface 54a is formed by finishing in a mirror surface state or the like. Thereby, the light emitted from the lateral direction of the metal reflecting mirror 54 can be effectively guided to the front surface. Moreover, since the metal reflecting mirror 54 uses Cu with good thermal conductivity, it functions as a radiator in addition to the function as a reflecting mirror.

  The lens 55 is made of transparent and low melting glass. The lens 55 and the insulating sealing glasses 57a, 57b, 58a, and 58b are made of a glass material having a thermal expansion coefficient equivalent to that of the metal base portion 51 and the lead portions 56a and 56b.

  Next, assembly of the light emitting device 50 will be described.

  First, the submount 52 is mounted at the center of the metal base 51 and fixed by an adhesive, solder fusion, or the like. Next, the insulating sealing glasses 57a and 57b processed into a long plate shape are placed in the grooves on the metal base 51, and the lead portions 56a and 56b and the insulating sealing are placed on the insulating sealing glasses 57a and 57b. Glasses 58a and 58b are stacked and placed. Further, the metal reflecting mirror 54 is placed on the exposed surfaces of the insulating sealing glasses 58 a and 58 b and the metal base portion 51. In this state, pressure pressing is performed in a high-temperature atmosphere to fix the insulating sealing glasses 57a, 57b, 58a, 58b, the lead portions 56a, 56b, and the metal reflecting mirror 54.

  Since the side surfaces and the upper and lower surfaces other than the tip portions of the lead portions 56a and 56b are insulated by the insulating sealing glasses 57a, 57b, 58a, and 58b, they do not contact the metal base portion 51 and the metal reflector 54. Next, the LED element 53 is mounted on the uppermost surface of the submount 52, and the electrodes or bumps are soldered to the conductor portions of the submount 52. Finally, the lens 55 is formed by sealing the glass material.

  For example, assuming that the lead portion 56a is connected to the anode side of the LED element 53, the plus side of a DC power source (not shown) is connected to the lead portion 56a, and the minus side is connected to the lead portion 56b. Along with the power supply, the current flows through the path of the lead part 56a → the submount 52 → the LED element 53 → the submount 52 → the lead part 56b, whereby the LED element 53 emits light. The light emitted from the upper surface of the LED element 53 passes through the lens 55 and is emitted to the outside. The light emitted from the side surface of the lens 55 is reflected by the reflecting surface 54a of the metal reflecting mirror 54, and then is reflected by the metal reflecting mirror 54. I go out.

According to the third embodiment described above, in addition to the effects of the first embodiment, the following effects can be obtained.
(1) Since the lead portions 56a, 56b are insulated by the insulating sealing glass 57a, 57b, 58a, 58b made of a glass material, the lead portions 56a, 56b are brought into contact with the metal base portion 51 and the metal reflecting mirror 54. Can be prevented.
(2) Since the metal base part 51 and the metal reflecting mirror 54 are directly joined to the other parts except the laying parts of the lead parts 56a and 56b, the LED element 53 is connected to the submount 52 and the lead parts 56a and 56b. The conducted heat is effectively transferred to the metal base portion 51 and the metal reflector 54 and is radiated by the metal base portion 51 and the metal reflector 54. Therefore, even if the LED element 53 is a high output type, the thermal efficiency is increased. This effect is particularly remarkable in a large-sized light emitting device.

  The metal reflecting mirror 54 can also be formed using a metal such as aluminum as another metal having good thermal conductivity.

  FIG. 6 is a cross-sectional view showing a configuration of a light emitting device according to the fourth embodiment. The light emitting device 60 of the fourth embodiment corresponds to a modification of the third embodiment, and the difference from the light emitting device 50 is the shape of the lens.

  That is, in the light emitting device 50 of the third embodiment, the light emitting device 60 replaces the lens 55 with a translucent glass sealing portion 61 (glass member) having a convex lens 61 a in the concave portion of the metal reflecting mirror 54. There is a feature in the place.

  The heat dissipation effect in the light emitting device 60 is the same as that of the light emitting device 50. However, there is a difference in the light output path of light from the LED element 53. The light-emitting device 50 has a two-stage configuration including a first convex lens having a convex lens in the center and a ring-shaped second convex lens formed around the convex lens, whereas the light-emitting device 60 has one light-emitting device 60 in the center. In this configuration, a convex lens is provided. For this reason, since a difference appears in the irradiation distribution of the emitted light, the emission angle, and the like, it can be used properly according to the application. In addition, by making the thermal expansion coefficients of the glass sealing portion 61, the metal base portion 51, and the metal reflecting mirror 54 equal, it is difficult for thermal stress to occur between them, thereby preventing cracks and the like from occurring. it can.

  7A and 7B are diagrams illustrating a configuration of a light emitting device according to a fifth embodiment, in which FIG. 7A is a plan view, FIG. 7B is a cross-sectional view taken along line EE, and FIG. . The basic configuration and operational effects of the light emitting device 70 according to the fifth embodiment are the same as those of the light emitting device 50 according to the third embodiment. The light emitting device 70 of the fifth embodiment is different from the light emitting device 50 of the third embodiment in the laying structure of the lead portion.

  The light emitting device 70 includes a metal base 71, a submount 72 mounted on the metal base 71, an LED element 53 mounted on the uppermost surface of the submount 72, and a stacked state on the metal base 71. A ring-shaped metal reflecting mirror 73 disposed on the lens, a lens 55 disposed on the LED element 53 in the recess of the metal reflecting mirror 73, and a tip portion connected to the step surfaces on both sides of the submount 52. Lead portions 56a and 56b, insulating sealing glasses 57a and 57b disposed on the lower surfaces of the lead portions 56a and 56b, and insulating sealing glasses 58a and 58b disposed on the upper surfaces of the lead portions 56a and 56b. And is configured.

  The metal base portion 71 is made of the same material as the metal base portions 11, 41, 51 in each of the above embodiments, and is the same as the metal reflector 73 and the metal reflector 54 in each of the above embodiments. Made using materials.

  Similar to the metal reflector 54, the metal reflector 73 has a mortar-shaped reflection surface 73a at the center. A groove having a width and a length for embedding the insulating sealing glass 57a and the lead portion 56a and the insulating sealing glass 57b and the lead portion 56b is formed on the upper surface.

  Further, the metal reflecting mirror 73 is formed with a cut-out portion 73b so that the lead portions 56a and 56b and the insulating sealing glasses 57a and 57b can be inserted from above. As shown in FIG. 7C, the cut-through portion 73b has a width that does not contact the lead portions 56a and 56b, and therefore prevents the lead portions 56a and 56b from contacting the metal reflecting mirror 73. Can do.

  According to the fifth embodiment described above, since the cut-out portion 73b is formed so that the lead portions 56a and 56b do not contact the metal reflecting mirror 73, the light emitting devices 50 and 60 shown in FIGS. 5 and 6 are necessary. The insulating sealing glasses 58a and 58b can be eliminated. For this reason, compared with the light-emitting devices 50 and 60, the number of parts can be reduced and the manufacturing process can be simplified.

  In the above-described light emitting devices 1, 40, 60, a phosphor layer for wavelength conversion can be disposed on the glass sealing portions 15, 45, 61. The phosphor layer is, for example, a phosphor such as Ce (cerium): YAG (yttrium, aluminum, garnet) having a characteristic of emitting yellow light when excited by the blue light when the LED element emits blue light. Can be used.

  Further, in each of the above-described embodiments, the metal base portions 11 and 41 and the insulating sealing glasses 57a, 57b, 58a, and 58b are formed with reflective surfaces by plating or vapor deposition with silver or aluminum to emit light. Efficiency may be increased.

  Moreover, in each embodiment, it is possible to form or attach a radiation fin to the metal base parts 11, 41, 51, 71 and the metal reflecting mirrors 54, 73. Thereby, the heat dissipation effect can be further enhanced.

  Also in the second to fifth embodiments, it is possible to mount a plurality of LED elements as shown in FIG.

  Furthermore, in the light emitting device of FIGS. 1 and 4, the glass sealing portions 15 and 45 are bullet-shaped, but other shapes such as a cylindrical shape may be used.

It is a figure which shows the structure of the light-emitting device which concerns on the 1st Embodiment of this invention, (a) is a top view, (b) is AA sectional drawing, (c) is BB sectional drawing. It is a perspective view which shows the detailed structure of the submount which concerns on 1st Embodiment. The other structure of a submount is shown, (a) is a top view, (b) is a circuit diagram. It is sectional drawing which shows the structure of the light-emitting device which concerns on 2nd Embodiment. It is a figure which shows the structure of the light-emitting device which concerns on 3rd Embodiment, (a) is a top view, (b) is CC sectional drawing, (c) is DD sectional drawing. It is sectional drawing which shows the structure of the light-emitting device which concerns on 4th Embodiment. It is a figure which shows the structure of the light-emitting device which concerns on 5th Embodiment, (a) is a top view, (b) is EE sectional drawing, (c) is FF sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 11 Metal base part 12 Submount 12a, 12b Stepped surface 13 LED element 14a, 14b Lead part 15 Glass sealing part 30 Submount 31, 32, 33, 34 Electrode 35 Power supply terminal 40 Light-emitting device 41 Metal base part 41a convex part 42 LED element 43a, 43b lead part 44a, 44b wire 45 glass sealing part 50 light emitting device 51 metal base part 52 submount 53 LED element 54 metal reflecting mirror 55 lens 56a, 56b lead part 57a, 57b, 58a, 58b Insulating sealing glass 60 Light emitting device 61 Glass sealing part 61a Convex lens D1-D9 LED element R1-R3 Resistance

Claims (9)

A light emitting element;
A submount on which the light emitting element is mounted and the light emitting element is connected to the power feeding side via an electrode or a wiring layer;
A metal base portion for dissipating heat of the light emitting element mounted with the submount and transferred through the submount;
The tip portion is placed on and connected to the flat surfaces at both ends of the submount to be electrically connected to the light emitting element, and the portions other than the tip portion are disposed in an insulated state on the metal base portion. A pair of lead portions,
The light emitting element and so as to cover the submount is formed in a predetermined shape while being bonded to the metal base and a Ruga Las sealing portion,
The submount has a stepped portion, the lead emission device characterized that you have been fixed to the step portion.   2. The light emitting device according to claim 1, wherein a portion of the lead portion that is interposed on the metal base portion other than the tip portion is insulated by the glass sealing portion.   The light-emitting device according to claim 1, wherein the light-emitting element includes a plurality of light-emitting elements, and power is supplied separately for a plurality of groups having the same light emission color or a group of light emission colors.   The light emitting device according to claim 1, wherein the submount includes a groove having a depth capable of embedding the tip portion of the pair of lead portions. A face-down light emitting device,
A submount on which the light emitting element is mounted and the light emitting element is connected to the power feeding side via an electrode or a wiring layer;
A metal base portion for dissipating heat of the light emitting element mounted with the submount and transferred through the submount;
The tip portion is placed on and connected to the flat surfaces at both ends of the submount to be electrically connected to the light emitting element, and the portions other than the tip portion are disposed in an insulated state on the metal base portion. A pair of lead portions,
A metal reflector in which the mortar-shaped reflecting surface is formed in the center portion, and is superimposed on the metal base portion in a non-contact manner with the pair of lead portions;
Some or all in the form an lens disposed within the reflecting surface of the bowl-shaped and a Ruga lath member,
The submount has a stepped portion, the lead emission device characterized that you have been fixed to the step portion.   The glass member is a lens having a structure for condensing light from the light emitting element in the front and side directions, or a state where a lens portion is formed on the same axis of the light emitting element and fills the inside of the mortar-shaped reflection surface. The light emitting device according to claim 5, wherein the light emitting device is a sealed glass sealing portion.   6. The light emitting device according to claim 5, wherein the pair of lead portions are insulated by a glass material different from the glass sealing portion around a portion sandwiched between the metal base portion and the reflecting mirror portion. apparatus.   The metal base portion and the reflecting mirror portion are formed with a cut-out portion having a width that does not contact the pair of lead portions at a portion where the pair of lead portions are disposed, and the pair of lead portions and the metal base The light emitting device according to claim 5, wherein a glass material different from the glass sealing portion is disposed between the two portions. A face-up light-emitting element;
A metal base portion having a convex portion on which the light emitting element is mounted and dissipating heat from the light emitting element;
A pair of lead portions disposed on an upper portion of the metal base portion in a state of being insulated from the metal base portion, and having a tip portion connected to a power feeding portion of the light emitting element via a wire;
The light emitting device characterized by comprising a light emitting element and said pair of so as to cover the distal end of the lead portion is formed in a predetermined shape while being bonded to the metal base Ruga Las sealing portion.

Images