JP4204058B2 - LED lighting fixtures - Google Patents

Description

  The present invention relates to an LED lighting apparatus including a light emitting device using an LED chip (light emitting diode chip) as a light source.

  Conventionally, LED chips are combined with LED chips and phosphors (fluorescent pigments, fluorescent dyes, etc.) as wavelength conversion materials that are excited by light emitted from the LED chips and emit light of a different emission color from the LED chips. Research and development of light-emitting devices that emit light of a color different from the color of the light is being conducted in various places. As this type of light-emitting device, for example, a white light-emitting device (generally called a white LED) that obtains white light (white light emission spectrum) by combining an LED chip that emits blue light or ultraviolet light and a phosphor. Has been commercialized.

  In addition, with the recent increase in output of white LEDs, research and development for expanding white LEDs into lighting applications has become active, but the above-mentioned white LEDs require a relatively large light output, such as general lighting. When using for a purpose, it is impossible to obtain a desired light output with a single white LED. Therefore, an LED unit in which a plurality of white LEDs are mounted on a single circuit board is configured, and the desired overall LED unit is formed. Generally, light output is ensured (for example, Patent Document 1).

  Conventionally, in an LED unit including a plurality of LED chips and a circuit board on which each LED chip is mounted, the increase in the junction temperature of each LED chip is suppressed and the input power is increased to increase the light output. In order to achieve this, a structure for efficiently radiating the heat generated in the light emitting portion of each LED chip to the outside has been proposed (see, for example, Patent Documents 2 and 3).

  In the LED unit disclosed in Patent Document 2, as shown in FIG. 14, as a circuit board 300, a metal substrate in which a circuit pattern 303 made of a conductor pattern is formed on a metal plate 301 via an insulating resin layer 302. The heat generated in each LED chip 10 ′ is transferred to the metal plate 301 via the heat transfer member 310. Here, each LED chip 10 ′ is a GaN-based blue LED chip formed on one surface side of a crystal growth substrate made of a sapphire substrate whose light-emitting portion made of a GaN-based compound semiconductor material is an insulator, and a circuit board The other surface of the crystal growth substrate is a light extraction surface.

In the LED unit disclosed in Patent Document 3, each LED chip 10 "is mounted on a circuit board 300 made of a metal substrate as shown in FIG. The anode electrode is formed on the other surface side and the cathode electrode is formed on the other surface side. The electrode closer to the circuit board 300 of the anode electrode and the cathode electrode is electrically connected to the first conductor plate 312. And the electrode on the side far from the circuit board 300 is electrically connected to the second conductor plate 313 via a bonding wire 314 made of a fine metal wire, and the first conductor plate 312 and the second conductor plate 313 are electrically connected to each other. Each of the conductor plates 313 is bonded to the circuit pattern 303 of the circuit board 300.
JP 2003-59332 A JP 2003-168829 A (paragraph [0030] and FIG. 6) JP 2001-203396 A (FIG. 6)

  By the way, when using the LED unit of the structure shown in FIG.14 or FIG.15 for a lighting fixture, the fixture main body is made of metal, and the metal plate 301 in the circuit board 300 of the LED unit is thermally coupled to the fixture main body. Although it is conceivable to dissipate the heat of the unit more efficiently, for example, as a sheet-like insulating member (insulating layer) between the fixture body and the metal plate 301 of the circuit board 300 in order to ensure lightning surge resistance. For example, a rubber sheet-like heat dissipation sheet such as Sarcon (registered trademark) is currently sandwiched, and the thermal resistance from the light emitting portion of each LED chip 10 ′, 10 ″ to the instrument body increases, The input power to each LED chip 10 ′, 10 ″ is limited so that the junction temperature of the LED chips 10 ′, 10 ″ does not exceed the maximum junction temperature. There is required, higher output of the light output has been difficult.

  In addition, when the above-described heat dissipation sheet is sandwiched between the metal plate 301 of the circuit board 300 and the instrument body, a gap is generated between the metal plate 301 and the heat dissipation sheet due to insufficient adhesion between the metal plate 301 and the heat dissipation sheet. Or the thermal resistance to the fixture body varies for each light emitting part of each LED chip 10 ', 10 ".

  In the LED unit disclosed in Patent Document 2, heat generated in the light emitting portion of the LED chip 10 ′ is transferred to the metal plate 301 via the heat transfer member 310 smaller than the size of the LED chip 10 ′. The thermal resistance from the LED chip 10 ′ to the metal plate 301 is relatively large, and when the sapphire substrate that is a crystal growth substrate is mounted so as to be thermally coupled to the metal plate 301, the thermal resistance of the sapphire substrate is increased. There was also a problem that it ended up.

  This invention is made | formed in view of the said reason, The objective is to provide the LED lighting fixture which can suppress the temperature rise of LED chip and can aim at the high output of light output.

The invention of claim 1 is a lighting fixture in which a light emitting device using an LED chip is held in a metal fixture body, and the light emitting device is made of an LED chip and a heat conductive material, and the LED chip is mounted thereon. A wiring board that has a heat transfer plate and a conductor pattern for supplying power to the LED chip on one surface side, and is fixed to the LED chip mounting surface side of the heat transfer plate, and exposes the LED chip mounting surface of the heat transfer plate A wiring board on which an exposed part is formed, a sealing part in which the LED chip is sealed on the one surface side of the wiring board, and a color different from the emission color of the LED chip excited by light emitted from the LED chip A dome-shaped color conversion member that is formed of a fluorescent material that emits light and a translucent material and that is disposed on the one surface side of the wiring board so as to surround the sealing portion, and has an electrical insulation property Heat transfer And it is bonded to the fixture body via an intervening insulating layer to and thermally coupled to joining them together between the instrument body, the insulating layer is turned into a low viscosity at the time of content to and heating the filling material consisting of filler the It is formed of an epoxy resin sheet having high fluidity during heating .

According to this invention, compared with the conventional case where a sheet-like heat dissipation sheet is sandwiched between the circuit board on which the LED chip is mounted and the instrument body, the thermal resistance from the light emitting part of the LED chip to the instrument body Since the heat dissipation is improved and the temperature rise of the junction temperature of the LED chip can be suppressed, the input power can be increased and the light output can be increased. Further, when used with the same light output as before, there is an advantage that the junction temperature of the LED chip can be reduced and the life of the LED chip is prolonged as compared with the conventional one. Moreover, since the insulating layer contains a filler composed of a filler and is formed of an epoxy resin sheet having a low viscosity during heating and high fluidity during heating, the fluidity during heating is high, and the uneven surface Adhesion is high, and the heat resistance increases due to insufficient adhesion between the heat transfer plate and the insulating layer, resulting in an increase in thermal resistance, and the heat transfer plate and the insulating layer due to aging of the insulating layer. It is possible to prevent a thermal resistance from increasing due to a gap between the two.

  According to a second aspect of the present invention, in the light emitting device according to the first aspect of the present invention, the light emitting device relieves stress applied to the LED chip due to a difference in linear expansion coefficient between the LED chip and the heat transfer plate. It is mounted on the heat transfer plate through a submount member.

  According to this invention, it is possible to prevent the LED chip from being damaged due to a difference in linear expansion coefficient between the LED chip and the heat transfer plate, and to improve reliability.

A third aspect of the invention is characterized in that, in the first or second aspect of the invention, the insulating layer is set to have a larger planar size than the heat transfer plate.

  According to this invention, compared with the case where the insulating layer and the heat transfer plate are formed in the same plane size, the creepage distance between the heat transfer plate and the instrument body can be increased, Lightning surge resistance can be improved.

  According to the first aspect of the present invention, since the heat resistance from the light emitting part of the LED chip to the fixture body can be reduced and the heat dissipation is improved and the temperature rise of the junction temperature of the LED chip can be suppressed compared to the conventional case, the input power is increased. This has the effect of increasing the optical output. In the first aspect of the present invention, a gap is generated between the heat transfer plate and the insulating layer due to insufficient adhesion between the heat transfer plate and the insulating layer, and the heat resistance is increased. There is an effect that it is possible to prevent an increase in thermal resistance due to a gap between the plate and the insulating layer.

(Embodiment 1)
Hereinafter, the LED lighting fixture of this embodiment is demonstrated, referring FIGS.

  The LED lighting apparatus of this embodiment is used as, for example, a spotlight. As shown in FIG. 4, one end of the LED lighting apparatus is coupled to a rotating base 120 fixed on a support base 110 using a shaft screw 121. A tool body 100 made of metal (for example, metal having high thermal conductivity such as Al or Cu) is coupled to the arm 122 using a coupling screw 123.

  The instrument main body 100 is formed in a shallow bottomed cylindrical shape having an opening on one surface, and the mounting substrate 20 on which the LED chip 10 and the conductor patterns 23 and 23 for supplying power to the LED chip 10 are provided and the LED chip 10 is mounted. A plurality of (in the present embodiment, eight) light emitting devices 1 having a wiring pattern (not shown) including a circuit pattern that defines the connection relationship of each light emitting device 1 is formed, and each light emitting device 1 And a disk-like circuit board 200 in which an opening window 204 through which a part of each light emitting device 1 is passed is housed, and the one surface is closed by a front cover 130. In addition, as a material of the insulating base material of the circuit board, for example, a glass epoxy resin such as FR4 may be employed. However, the material is not limited to the glass epoxy resin, and may be, for example, a polyimide resin, a phenol resin, or the like.

  Here, in the LED lighting fixture of this embodiment, each light emitting device 1 is held by the fixture main body 100 by mounting each light emitting device 1 on the bottom wall 100 a of the fixture main body 100. On the other hand, in the circuit board 200, the above-described opening windows 204 are formed at portions corresponding to the respective light-emitting devices 1, and the periphery of each opening window 204 overlaps with the periphery of the mounting substrate 20 of each light-emitting device 1. Thus, the instrument body 100 is disposed away from the bottom wall 100a. The opening size of the opening window 204 is set to be larger than the outer diameter of the color conversion member 70 described later.

  The wiring pattern on the circuit board 200 is designed so that the connection relationship of the plurality of light emitting devices 1 is a serial connection relationship, and the electric wire is inserted through the central portion of the bottom wall 100a of the instrument body 100. A pair of power supply wires (not shown) inserted through the holes 101 (see FIG. 5) are electrically connected. Specifically, the wire connection through-hole wirings 205, 205 are inserted using solder after the wires are inserted inside the pair of wire connection through-hole wirings 205, 205 formed at the center of the circuit board 200, respectively. 205 and the above-described electric wires are connected. In the circuit board 200, light-emitting device connection through-hole wirings 207 for electrically connecting the circuit pattern and the conductor pattern 23 of the light-emitting device 1 are formed in the periphery of each opening window 204. Here, the through-hole wirings 205 and 205 for connecting the electric wires and the through-hole wiring 207 for connecting the light emitting devices are respectively the inner surfaces of the through holes penetrating in the thickness direction of the circuit board 200 and the circumferences of the through holes on both surfaces of the circuit board 200. And is connected to the circuit pattern. In the circuit board 200, the circuit pattern is formed on one surface side facing the bottom wall 100a of the instrument body 100, and on the other surface side, a light reflecting layer (a metal layer or a white resist layer ( (Not shown) is formed.

  In addition, power is supplied from a power supply circuit (not shown) to each light emitting device 1 whose connection relation is defined in the circuit board 200 via the pair of wires described above. As the power supply circuit, for example, a power supply circuit having a rectifier circuit composed of a diode bridge that rectifies and smoothes the AC output of an AC power supply such as a commercial power supply and a smoothing capacitor that smoothes the output of the rectifier circuit is employed. That's fine. Moreover, in this embodiment, although the several light-emitting device 1 is connected in series, the connection relationship of the several light-emitting device 1 is not specifically limited, For example, you may make it connect in parallel, A series connection and a parallel connection may be combined.

  The front cover 130 includes a translucent plate 130 a made of a disk-shaped glass plate and an annular window frame 130 b that holds the translucent plate 130 a, and the window frame 130 b is attached to the instrument body 100. . The translucent plate 130a is not limited to a glass substrate, but may be formed of a material having translucency. Further, a lens for controlling the light distribution of the light emitted from each light emitting device 1 may be integrally provided on the light transmitting plate 130a.

  The light emitting device 1 includes an LED chip 10, a rectangular plate-shaped mounting substrate 20 on which the LED chip 10 is mounted, a frame body 40 that surrounds the LED chip 10 on the mounting surface side of the LED chip 10 on the mounting substrate 20, From the LED chip 10, the LED chip 10 and the sealing portion 50 made of a sealing resin that seals the bonding wires 14 and 14 electrically connected to the LED chip 10 inside the body 40 and having translucency and elasticity; An optical member 60 composed of a lens that controls the light distribution of the light that has been emitted and transmitted through the sealing portion 50, and is excited by the light emitted from the LED chip 10 to emit light of a color different from the emission color of the LED chip 10. And a dome-shaped color conversion member 70 that is formed of a fluorescent material and a translucent material, and is disposed between the mounting substrate 20 and the sealing portion 50. There. Here, the color conversion member 70 is arranged on the mounting surface side of the LED chip 10 in the mounting substrate 20 in such a manner that an air layer 80 is formed between the light emitting surface 60 b of the optical member 60 and the outer surface of the frame body 40. (In this embodiment, the sealing portion 50 is surrounded by the frame body 40 and the optical member 60, and the color conversion member 70 is disposed so as to surround the optical member 60 and the frame body 40. Have been).

  The mounting substrate 20 is made of a heat conductive material and has a rectangular plate-like heat transfer plate 21 on which the LED chip 10 is mounted, and a rectangular plate-like shape fixed to one surface side (the upper surface side in FIG. 1) of the heat transfer plate 21. A rectangular window hole 24 that exposes the mounting surface (a part of the one surface) of the LED chip 10 in the heat transfer plate 21 is formed at the center of the wiring substrate 22. 10 is mounted on the heat transfer plate 21 via a submount member 30 disposed inside the window hole 24. Therefore, the heat generated in the LED chip 10 is transferred to the submount member 30 and the heat transfer plate 21 without passing through the wiring board 22. In this embodiment, Cu, which is a metal having high thermal conductivity, is adopted as the heat conductive material of the heat transfer plate 21 (that is, a metal plate is adopted as the heat transfer plate 21). The conductive material is not limited to Cu, and for example, other metals such as Al or non-metals having high thermal conductivity may be adopted as well as these metals. Moreover, in this embodiment, the window hole 24 of the wiring board 22 comprises the exposed part which exposes the mounting surface of the LED chip 10 in the heat exchanger plate 21.

  The above-described wiring board 22 has a pair of power supply conductor patterns (leads) electrically connected to each electrode (not shown) of the LED chip 10 on one surface side of an insulating base material 22a made of a glass epoxy board. Pattern) 23, 23 is provided. Each of the conductor patterns 23 and 23 is configured by a laminated film of a Cu film, a Ni film, and an Au film, and the portion inside the frame body 40 in the plan view forms the inner lead portions 23a and 23a, and color conversion is performed. Sites outside the member 70 constitute outer lead portions 23b and 23b. The heat transfer plate 21 and the wiring board 22 are fixed via a fixing sheet 25 made of an insulating sheet-like adhesive film. In addition, the material of the insulating base material 22a is not limited to a glass epoxy resin such as FR4, and may be, for example, a polyimide resin or a phenol resin.

  The LED chip 10 is a GaN-based blue LED chip that emits blue light, and is a conductive substrate made of an n-type SiC substrate that has a lattice constant and a crystal structure close to GaN as a crystal growth substrate and has conductivity compared to a sapphire substrate. The light emitting portion 12 formed of a GaN-based compound semiconductor material and having, for example, a double hetero structure is formed on the main surface side of the conductive substrate 11 by an epitaxial growth method (for example, MOVPE method). ), A cathode electrode (n electrode) which is a cathode side electrode (not shown) is formed on the back surface of the conductive substrate 11, and is shown on the surface of the light emitting unit 12 (the outermost surface on the main surface side of the conductive substrate 11). An anode electrode (p electrode) which is an electrode on the anode side that is not to be formed is formed. In short, the LED chip 10 has an anode electrode formed on one surface side and a cathode electrode formed on the other surface side. The cathode electrode and the anode electrode are composed of a laminated film of a Ni film and an Au film, but the material of the cathode electrode and the anode electrode is not particularly limited, and a material capable of obtaining good ohmic characteristics For example, Al or the like may be employed.

  In the present embodiment, the light emitting unit 12 of the LED chip 10 is mounted on the heat transfer plate 21 so as to be on the side farther from the heat transfer plate 21 than the conductive substrate 11. The heat transfer plate 21 may be mounted so that 12 is closer to the heat transfer plate 21 than the conductive substrate 11. In consideration of the light extraction efficiency, it is desirable to arrange the light emitting unit 12 on the side away from the heat transfer plate 21, but in this embodiment, the conductive substrate 11 and the light emitting unit 12 have the same refractive index. Therefore, even if the light emitting unit 12 is disposed on the side close to the heat transfer plate 21, the light extraction loss does not become too large.

  By the way, in the present embodiment, a blue LED chip whose emission color is blue is adopted as the LED chip 10, and a SiC substrate is adopted as the conductive substrate 11, but a GaN substrate is used instead of the SiC substrate. As can be seen from Table 1 below, when a SiC substrate or a GaN substrate is used, the crystal growth is higher than that when a sapphire substrate, which is an insulator, is used as the crystal growth substrate as in Patent Document 2 above. The thermal conductivity of the growth substrate is high, and the thermal resistance of the crystal growth substrate can be reduced. Further, the light emission color of the LED chip 10 is not limited to blue, and may be, for example, red or green. That is, the material of the light-emitting portion 12 of the LED chip 10 is not limited to the GaN-based compound semiconductor material, and a GaAs-based compound semiconductor material, a GaP-based compound semiconductor material, or the like may be employed according to the emission color of the LED chip 10. Further, the conductive substrate 11 is not limited to the SiC substrate, and may be appropriately selected from, for example, a GaAs substrate and a GsP substrate according to the material of the light emitting unit 12.

  The LED chip 10 is formed on the above-described heat transfer plate 21 in a rectangular plate shape larger than the chip size of the LED chip 10, and is caused by a difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21. It is mounted via a submount member 30 that relieves stress acting on the LED chip 10.

  The submount member 30 has not only a function of relieving the stress but also a heat conduction function of transferring heat generated in the LED chip 10 to a range wider than the chip size of the LED chip 10 in the heat transfer plate 21. The surface area of the heat transfer plate 21 on the LED chip 10 side is preferably sufficiently larger than the surface area of the LED chip 10 on the heat transfer plate 21 side. For example, in order to efficiently exhaust heat from the 0.3-1.0 mm square LED chip 10, an insulating layer 90 and a heat transfer plate 21, which will be described later, interposed between the heat transfer plate 21 and the instrument main body 100, It is preferable to reduce the thermal resistance so that the heat of the LED chip 10 is uniformly conducted over a wide range, and the surface area of the heat transfer plate 21 on the LED chip 10 side is reduced. The area of the surface of the LED chip 10 on the heat transfer plate 21 side is preferably 10 times or more. Here, the submount member 30 only needs to have a function of relieving the stress, and the thickness dimension is made smaller than the thickness dimension of the circuit board 300 in the LED unit described in Patent Documents 1 to 3. Therefore, it is possible to reduce the thermal resistance by adopting a material having a relatively high thermal conductivity.

  In the present embodiment, AlN having a relatively high thermal conductivity and insulation is adopted as the material of the submount member 30, and the LED chip 10 has the cathode electrode on the side of the heat transfer plate 21 in the submount member 30. Is electrically connected to one conductor pattern 23 via a bonding wire 14 made of a conductive pattern 31 and a fine metal wire (for example, a gold fine wire, an aluminum fine wire, etc.) provided on the surface on the opposite side, and the anode electrode It is electrically connected to the other conductor pattern 23 via the bonding wire 14. Here, in the submount member 30, a reflective film (for example, a laminated film of a Ni film and an Ag film) 32 that reflects light emitted from the side surface of the LED chip 10 is formed around the conductive pattern 31. . The LED chip 10 and the submount member 30 are bonded using lead-free solder such as AuSn or SnAgCu.

  The material of the submount member 30 is not limited to AlN. For example, as can be seen from Table 2 below, the material of the submount member 30 is a material whose linear expansion coefficient is relatively close to 6H—SiC which is the material of the conductive substrate 11 and whose thermal conductivity is relatively high. For example, CuW, W, composite SiC, Si, or the like may be employed. However, when a conductive material such as CuW or W is adopted as the material of the submount member 30, the above-described conductive pattern 31 is not necessarily provided.

  Here, when the material of the heat transfer plate 21 is Cu, if CuW or W is adopted as the material of the submount member 30, the submount member 30 and the heat transfer plate 21 can be directly joined. For example, as shown in Table 3 below, compared to the case where the submount member 30 and the heat transfer plate 21 are bonded using a brazing material, the bonding area between the submount member 30 and the heat transfer plate 21 can be increased. The thermal resistance of the joint between the mount member 30 and the heat transfer plate 21 can be reduced. The LED chip 10 and the submount member 30 may be bonded using, for example, solder such as SnPb, AuSn, SnAgCu, or silver paste, but may be bonded using lead-free solder such as AuSn, SnAgCu. It is preferable. Here, when the submount member 30 is made of Cu and bonded using AuSn, a pretreatment for forming a metal layer made of Au or Ag on the bonding surface of the submount member 30 is required. .

  Further, when W is used as the material of the submount member 30 and the submount member 30 and the heat transfer plate 21 are directly joined, as can be seen from Table 4 below, the submount member 30 and the heat transfer plate 21 are made of silver. Compared with the case where it joins using brazing, thermal conductivity becomes large and thermal resistance can be reduced. When the material of the heat transfer plate 21 is Cu and AlN, composite SiC, or the like is adopted as the material of the submount member 30, the heat transfer plate 21 and the submount member 30 are made of lead such as AuSn and SnAgCu. Bonding may be performed using free solder. However, when bonding using AuSn, pretreatment for forming a metal layer made of Au or Ag on the bonding surface of the heat transfer plate 21 is necessary.

  By the way, in the light emitting device 1 in this embodiment, the thickness dimension of the submount member 30 is set so that the surface of the submount member 30 is farther from the heat transfer plate 21 than the surface of the wiring substrate 22. It is possible to prevent the light radiated laterally from 10 from being absorbed by the wiring substrate 22 through the inner peripheral surface of the window hole 24 of the wiring substrate 22 and the light radiated laterally from the LED chip 10. It is possible to prevent the light from being emitted through the joint portion between the color conversion member 70 and the mounting substrate 20 (that is, the blue light emitted from the LED chip 10 is emitted outside without passing through the color conversion member 70). Can be prevented). Further, as described above, the light emitted from the LED chip 10 is reflected around the conductive pattern 31 which is a bonding portion with the LED chip 10 on the surface of the submount member 30 on the side where the LED chip 10 is bonded. Since the reflective film 32 is formed, it is possible to prevent the light emitted from the side surface of the LED chip 10 from being absorbed by the submount member 30 and to further increase the light extraction efficiency to the outside. Become.

  In the light emitting device 1, the outer peripheral shape of each of the LED chip 10 and the submount member 30 in a plan view is a square shape, and the outer peripheral line of the LED chip 10 is located on the inner side of the outer peripheral line of the submant member 30 in the plan view. In addition, the LED chip 10 is joined to the central portion of the submount member 30 so that the outer peripheral lines are not parallel to each other, and the diagonal line of the LED chip 10 and the diagonal line of the submount member 30 are not parallel. More specifically, the LED chip 10 is joined to the central portion of the sub-mant member 30 so that the angle formed by the diagonal line of the LED chip 10 and the diagonal line of the sub-mount member 30 is approximately 45 degrees.

  Therefore, compared with the case where the LED chip 10 and the submount member 30 are in a positional relationship such that the outer peripheral lines of the LED chip 10 and the submount member 30 are parallel to each other, one diagonal line of the LED chip 10 is obtained without reducing the planar size of the submount member 30. A linear distance between both ends of the bonding wire 14 extending in the direction along the line (that is, the inner lead portion 23a of the conductor pattern 23 electrically connected to the electrode on the surface of the LED chip 10 and the electrode via the bonding wire 14). The distance between the frame body 40 and the light emitting device 1 as a whole can be reduced. In short, it is possible to suppress a decrease in light extraction efficiency due to the bonding wire 14 without reducing the heat conduction function of the submount member 30 and to reduce the size of the frame body 40 and the light emitting device 1 as a whole. it can.

  Moreover, as a sealing resin which is a material of the above-mentioned sealing part 50, although silicone resin is used, not only silicone resin but acrylic resin etc. may be used.

  The frame body 40 has a cylindrical shape and is made of a light-transmitting material (for example, silicone). Here, the frame 40 is a translucent material having a linear expansion coefficient equivalent to that of the sealing resin that is the material of the sealing portion 50 and does not fall below the refractive index and the elastic modulus of the sealing resin. In the case where the sealing resin is an acrylic resin, it is desirable to employ an acrylic resin as the translucent material of the frame body 40. In the present embodiment, after the frame body 40 is fixed to the mounting substrate 20, the sealing portion 50 is formed by filling (potting) a sealing resin inside the frame body 40 and thermosetting the resin.

  The optical member 60 is composed of a biconvex lens in which each of the light incident surface 60a and the light emitting surface 60b on the sealing portion 50 side is formed in a convex curved surface shape. Here, the optical member 60 is made of a molded product of silicone (in short, formed of silicone), and has the same refractive index as that of the sealing portion 50. However, the optical member 60 is made of silicone. For example, it may be constituted by an acrylic resin molded product.

  By the way, the optical member 60 has a light exit surface 60b formed in a convex curved surface shape that does not totally reflect the light incident from the light incident surface 60a at the boundary between the light exit surface 60b and the air layer 80 described above. Here, the optical member 60 is disposed so that the optical axis of the optical member 60 is positioned on the center line of the light emitting unit 12 along the thickness direction of the LED chip 10. The light emitted from the side surface of the LED chip 10 propagates through the sealing portion 50 and then propagates through the optical member 60 or the frame body 40 and the air layer 80 to reach the color conversion member 70 and reaches the color conversion member 70. The fluorescent material is excited or transmitted through the color conversion member 70 without colliding with the fluorescent material.

  The color conversion member 70 is formed of a mixture in which a translucent material such as silicone is mixed with a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10. (That is, the color conversion member 70 is formed of a translucent material and a phosphor). Therefore, in the light emitting device 1, the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor are emitted through the outer surface 70 b of the color conversion member 70, and white light can be obtained. The translucent material used as the material of the color conversion member 70 is not limited to silicone. For example, an organic / inorganic hybrid material in which an acrylic resin, glass, an organic component and an inorganic component are mixed and combined at the nm level or the molecular level. Etc. may be adopted. Further, the phosphor mixed with the translucent material used as the material of the color conversion member 70 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor.

  In the color conversion member 70 described above, the inner surface 70 a is formed in a shape along the light emitting surface 60 b of the optical member 60 and the outer surface of the frame body 40. Therefore, the distance between the light emitting surface 60b and the inner surface 70a of the color conversion member 70 in the normal direction is a substantially constant value regardless of the position of the light emitting surface 60b of the optical member 60. In addition, the color conversion member 70 is shape | molded so that the thickness along a normal line direction may become uniform irrespective of a position. In addition, the color conversion member 70 may be bonded to the mounting substrate 20 with an end edge (periphery of the opening) on the mounting substrate 20 side using, for example, an adhesive (for example, a silicone resin, an epoxy resin, or the like).

  In the light emitting device 1 described above, the color conversion member 70 may be disposed in a form in which an air layer 80 is formed between the light emitting surface 60b of the optical member 60 and the outer surface of the frame body 40. Since it is not necessary to make 70 closely adhere to the optical member 60 and the frame body 40, it is possible to suppress a decrease in yield due to the dimensional accuracy and positioning accuracy of the color conversion member 70. Further, in the light emitting device 1, since the assembly of the color conversion member 70 is a final process at the time of assembly, the color conversion member 70 in which the phosphor composition with respect to the translucent material is adjusted according to the emission wavelength of the LED chip 10 is used. Thus, the color variation can be reduced.

  In the light emitting device 1, since the air layer 80 is formed between the color conversion member 70, the optical member 60, and the frame body 40 as described above, color conversion is performed when an external force acts on the color conversion member 70. The possibility that the member 70 is deformed and contacts the optical member 60 or the frame body 40 is reduced, and the stress generated in the color conversion member 70 by the external force is transmitted to the LED chip 10 and the bonding wires 14 and 14. Since the variation of the light emission characteristics of the LED chip 10 due to the external force and the disconnection of the bonding wires 14 and 14 are less likely to occur, there is an advantage that the reliability is improved, and the air layer 80 described above is formed. This makes it difficult for moisture in the external atmosphere to reach the LED chip 10 and the color conversion that is emitted from the LED chip 10 and enters the color conversion member 70. Of the light scattered by the yellow phosphor particles in the material 70, the amount of light scattered to the optical member 60 side or the frame body 40 side and transmitted through the optical member 60 or the frame body 40 can be reduced, and the light emitting device 1 as a whole. There is an advantage that the light extraction efficiency to the outside can be improved.

  By the way, in the LED lighting fixture of this embodiment, each light-emitting device 1 has electrical insulation, and is interposed between the heat exchanger plate 21 and the fixture main body 100, and the insulating layer 90 which thermally couples both is interposed. It is joined to the instrument body 100 (that is, each light emitting device 1 is mounted on the bottom wall 100a of the instrument body 100 via the insulating layer 90).

  Here, the insulating layer 90 is made of a resin sheet containing a filler composed of a filler such as silica or alumina and having a low viscosity when heated (for example, an organic green sheet such as an epoxy resin sheet highly filled with fused silica). It is formed using the joining member which becomes. As the insulating layer 90, a green sheet made of an unsintered ceramic body formed into a sheet shape may be used.

  Here, in the case where a conventional rubber sheet-like heat radiation sheet (heat conduction sheet) is used instead of the above-described insulation layer 90, the heat transfer plate 21 and the insulation layer 90 are insufficiently adhered to each other due to insufficient adhesion. Since the air gap is generated between them and the thermal resistance increases or the thermal resistance to the instrument main body 100 varies for each light emitting device 1, it is necessary to manage the torque when a load is applied to the heat transfer plate 21 and the like. It is also conceivable to employ insulating grease as the insulating layer 90 described above. In this case, it is possible to prevent a gap from being formed between the heat transfer plate 21 and the insulating layer 90. There is a possibility that a gap is generated between the two due to the aging of 90 (viscosity change, shrinkage, etc.) and the thermal resistance increases, or the thermal resistance up to the instrument main body 100 varies for each light emitting device 1.

On the other hand, the bonding member made of the resin sheet has electrical insulation, high thermal conductivity, high fluidity during heating, and high adhesion to the uneven surface. The plate 21 is joined to the metallic instrument body 100 (the joining member is interposed between the heat transfer plate 21 and the bottom wall 100a of the instrument body 100, and then the joining member is heated to heat the plate 21). Can be prevented from being generated between the joining member, the heat transfer plate 21 and the instrument body 100 when the instrument body 100 is joined to the instrument body 100, and the contact reliability is improved and the secular change occurs. It is possible to prevent an increase in thermal resistance and variations due to insufficient adhesion, and a gap is generated between the heat transfer plate 21 and the insulating layer 90 due to aging of the insulating layer 90, resulting in a decrease in thermal resistance. Can prevent the increase . In order to suppress the thermal resistance of the insulating layer 90 to 1 K / W or less when the effective contact area for heat transfer in the insulating layer 90 is 25 mm ² and the thickness of the insulating layer 90 is 0.1 mm, the insulating layer 90 It is necessary to satisfy the condition that the thermal conductivity of 90 is 4 W / m · K or more. However, if the above-described organic green sheet is used as the resin sheet, this condition can also be satisfied.

  In manufacturing the LED lighting apparatus of the present embodiment, first, for example, the mounting substrate 20 that is a constituent element of each light-emitting device 1 is applied to the apparatus main body 100 via the insulating layer 90 using, for example, a vacuum thermocompression bonding technique. After that, the submount member 30 to which the LED chip 10 is previously bonded is bonded to the heat transfer plate 21. Thereafter, the electrodes of the LED chip 10 and the conductor patterns 23 and 23 of the mounting substrate 20 are electrically connected by bonding wires 14 and 14, and then the frame body 40 is bonded to the wiring substrate 22 of the mounting substrate 20. It is fixed with an agent (for example, silicone resin, epoxy resin, etc.). Next, the sealing portion 50 is formed by filling (potting) a sealing resin such as a silicone resin inside the frame body 40 and thermosetting it. Thereafter, the optical member 60 is fixed to the sealing portion 50 and the frame body 40. Subsequently, the color conversion member 70 is bonded to the wiring substrate 22 of the mounting substrate 20, for example, an adhesive (for example, silicone resin, epoxy resin). It may be fixed by. Thereafter, the circuit board 200 is accommodated in the instrument body 100 and attached to the instrument body 100, and the circuit board 200, each light emitting device 1 and each electric wire are electrically connected, and then the front cover 130 is attached to the instrument body 100. Just attach it.

  In the LED lighting fixture of this embodiment described above, each light-emitting device 1 has an insulating layer 90 that has electrical insulation and is interposed between the heat transfer plate 21 and the fixture main body 100 to thermally couple them. The heat generated in each light emitting device 1 during lighting is transferred to the metal tool body 100 via the insulating layer 90 without passing through the circuit board 200 having a relatively large thickness. As in the conventional structure, a rubber sheet-like heat radiation sheet such as Sarcon (registered trademark) is sandwiched between the circuit board 300 (see FIGS. 14 and 15) of the LED unit and the instrument body as in the prior art. In comparison with the above, the thermal resistance from the LED chip 10 to the fixture body 100 can be reduced, the heat dissipation is improved and the variation in thermal resistance is reduced, and the junction temperature of the LED chip 10 is increased. Because can be suppressed, it can increase the input power, thereby a high light output. In each light emitting device 1, the combined thickness dimension of the heat transfer plate 21 and the submount member 30 can be made smaller than the thickness dimension of the circuit board 300.

  Moreover, in the LED lighting fixture of this embodiment, when using it with the same light output as the conventional LED lighting fixture, compared with the structure of the conventional LED lighting fixture, the junction temperature of the LED chip 10 can be reduced, and the LED chip 10 can be reduced. There is an advantage that the life of the battery becomes longer. In the LED lighting apparatus of the present embodiment, since the light emitting device 1 is provided with the outer lead portions 23b and 23b made of a part of the conductor patterns 23 and 23 on the mounting surface side of the LED chip 10 on the mounting substrate 20, If the light emitting devices 1 are appropriately connected by lead wires or the like without using the circuit board 200, the cost can be reduced and the degree of freedom of arrangement of the light emitting devices 1 is increased, and the number of light emitting devices 1 is changed. And layout changes are easy.

  Moreover, in the LED lighting fixture of this embodiment, in each light-emitting device 1, the LED chip 10 relaxes the stress acting on the LED chip 10 due to the difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21. Since it is mounted on the heat transfer plate 21 via the member 30, it is possible to prevent the LED chip 10 from being damaged due to a difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21, and reliability. Can be increased. Note that, as described above, the submount member 30 interposed between the LED chip 10 and the heat transfer plate 21 has a relatively small difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21. The distance between the LED chip 10 and the bottom wall 100a of the metal instrument body 100 is smaller when the submount member 30 is not interposed between the LED chip 10 and the heat transfer plate 21. The heat resistance from the light emitting part 12 of the LED chip 10 to the instrument body 100 can be further reduced and the heat dissipation is further improved, so that the light output can be further increased.

  Moreover, in the LED lighting fixture of this embodiment, since the planar size of the insulating layer 90 is set larger than the planar size of the heat exchanger plate 21, the insulating layer 90 and the heat exchanger plate 21 are formed in the same planar size. Compared with the case where it has, the creeping distance between the heat exchanger plate 21 which consists of metal materials, and the instrument main body 100 which is a metal member can be lengthened, and lightning surge resistance can be improved. Here, although it is necessary to design the thickness of the insulating layer 90 according to the required withstand voltage for lightning surge resistance, it is desirable to set it thinner from the viewpoint of reducing the thermal resistance. Therefore, regarding the insulating layer 90, after setting the thickness, the plane size may be set so that the creepage distance requirement can be satisfied.

  Moreover, in the LED lighting fixture of this embodiment, the frame 40 in each light-emitting device 1 is a translucent material having a linear expansion coefficient equivalent to that of the sealing resin that is the material of the sealing portion 50, and the sealing resin Since the frame body 40 and the sealing portion 50 are formed of a translucent material that does not fall below the refractive index and the elastic modulus of the frame body 40 as compared with the case where the frame body 40 is formed of a metal material (for example, Al). Since the difference in linear expansion coefficient can be reduced and the occurrence of voids in the sealing portion 50 at the low temperature of the heat cycle test can be suppressed, the reliability can be improved and the frame 40 can As a result, it is possible to suppress the occurrence of the reflection loss, thereby improving the light output.

(Embodiment 2)
Hereinafter, the LED lighting fixture of this embodiment is demonstrated based on FIGS.

  The basic configuration of the LED lighting apparatus of the present embodiment is substantially the same as that of the first embodiment, and the structure of the light emitting device 1 and the structure of the circuit board 200 are different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  The light emitting device 1 in the present embodiment does not include the frame body 40 described in the first embodiment, and the optical member 60 that controls the light distribution of the light emitted from the LED chip 10 is between the mounting substrate 20 and the light emitting device 1. The LED chip 10 is housed in a dome shape disposed on the one surface side of the mounting substrate 20, and the LED chip 10 and bonding wires 14 and 14 electrically connected to the LED chip 10 are connected to each other. The sealed sealing part 50 is filled in a space surrounded by the optical member 60 and the mounting substrate 20, and the color conversion member 70 is a light emitting surface of the optical member 60 on the one surface side of the mounting substrate 20. An air layer 80 is formed between the air gap 60b and 60b.

  In this embodiment, a flexible printed wiring board in which a pair of conductive patterns 23 and 23 for feeding is formed on one surface side of an insulating base material 22a made of a polyimide film is adopted as the wiring board 22 in the mounting board 20. is doing.

  Further, the wiring board 22 is made of a white resin that covers each conductor pattern 23, 23 and a portion of the insulating base material 22a where the conductor patterns 23, 23 are not formed on one surface side of the insulating base material 22a. A resist layer 26 is laminated. Therefore, since the light emitted from the side surface of the LED chip 10 and incident on the surface of the resist layer 26 is reflected by the surface of the resist layer 26, the light emitted from the LED chip 10 is prevented from being absorbed by the wiring substrate 22. Thus, the light output can be improved by improving the light extraction efficiency to the outside. In addition, each conductor pattern 23 and 23 is formed in the outer periphery shape a little smaller than half of the outer periphery shape of the insulating base material 22a. Further, FR4, FR5, paper phenol or the like may be employed as the material of the insulating base material 22a.

  The resist layer 26 is patterned so that two portions of each of the conductor patterns 23 and 23 are exposed in the vicinity of the window hole 24 of the wiring substrate 22 and one portion of each of the conductor patterns 23 and 23 is exposed in the peripheral portion of the wiring substrate 22. In each conductor pattern 23, 23, two rectangular portions exposed in the vicinity of the window hole 24 of the wiring board 22 constitute an inner lead portion (terminal portion) 23a to which the bonding wire 14 is connected, A circular portion exposed in the peripheral portion of the wiring board 22 constitutes an outer lead portion (external connection electrode portion) 23b.

  In the present embodiment, as the LED chip 10, anode electrodes 13a (see FIG. 8 and FIG. 10A) are formed at two adjacent corners on one surface side, and cathode electrodes are formed at the remaining two locations. 13b (see FIG. 8 and FIG. 10A) is used, and each anode electrode 13a is electrically connected to one conductor pattern 23 via bonding wire 14, and each cathode electrode 13b. Each is electrically connected to the other conductor pattern 23 via the bonding wire 14. In addition, a sign “+” is formed on the outer lead portion 23b (the right outer lead portion 23b in FIG. 8) to which the anode electrodes 13a of the LED chip 10 of the two outer lead portions 23b are electrically connected. Since the outer lead portion 23b (the left electrode portion 23b in FIG. 8) to which the cathode electrodes 13b of the LED chip 10 are electrically connected is formed, a sign “-” is formed. The polarities of the lead portions 23a and 23b can be visually recognized, and erroneous connection can be prevented.

  In the present embodiment, the window hole 24 in the wiring board 22 is rectangular, and as shown in FIG. 10A, an inner lead portion 23a is provided in the vicinity of the center of each side of the rectangular window hole 24. However, as shown in FIG. 10B, by providing the inner lead portion 23a in the vicinity of one end of each side of the window hole 24, the entire length of the bonding wire 14 can be increased, and the sealing portion 50 The bonding wire 14 is hardly broken due to expansion and contraction, and reliability is improved.

  The LED chip 10 in the present embodiment is a blue LED chip using a 6H—SiC substrate as a crystal growth substrate, and has a relatively high thermal conductivity as a material of the submount member 30 as in the first embodiment. In addition, although AlN having insulating properties is adopted, the material of the submount member 30 is not limited to AlN, and the linear expansion coefficient is relatively close to 6H-SiC, which is the material for the substrate for crystal growth, and the thermal conductivity is compared. For example, composite SiC, Si, Cu, CuW, or the like may be employed.

  In the light emitting device 1 according to the present embodiment, the thickness dimension of the submount member 30 is set so that the surface of the submount member 30 is farther from the heat transfer plate 21 than the surface of the resist layer 26 of the wiring substrate 22. In addition, light emitted from the LED chip 10 to the side can be prevented from being absorbed by the wiring board 22 through the inner peripheral surface of the window hole 24 of the wiring board 22. As in the first embodiment, a reflective film that reflects light emitted from the LED chip 10 is formed around the bonding portion with the LED chip 10 on the surface of the submount member 30 where the LED chip 10 is bonded. If formed, the light emitted from the side surface of the LED chip 10 can be prevented from being absorbed by the submount member 30, and the light extraction efficiency to the outside can be further increased.

  The optical member 60 is formed of a light-transmitting material (for example, silicone) as in the first embodiment, but in the first embodiment, it is formed in a biconvex lens shape, but in a dome shape. Is formed. Here, in the optical member 60, the light emitting surface 60b is formed in a convex curved surface shape that does not totally reflect the light incident from the light incident surface 60a at the boundary between the light emitting surface 60b and the air layer 80 described above. It arrange | positions so that the chip | tip 10 and an optical axis may correspond. Therefore, the light emitted from the LED chip 10 and incident on the light incident surface 60a of the optical member 60 can easily reach the color conversion member 70 without being totally reflected at the boundary between the light emitting surface 60b and the air layer 80, The total luminous flux can be increased. The light emitted from the side surface of the LED chip 10 propagates through the sealing portion 50, the optical member 60, and the air layer 80 to reach the color conversion member 70 to excite the phosphor of the color conversion member 70 or to the phosphor. Passes through the color conversion member 70 without colliding. Further, the optical member 60 is formed so that the thickness is uniform along the normal direction regardless of the position.

  The color conversion member 70 has an inner surface 70 a formed along the light emitting surface 60 b of the optical member 60. Therefore, the distance between the light emitting surface 60b and the inner surface 70a of the color conversion member 70 in the normal direction is a substantially constant value regardless of the position of the light emitting surface 60b of the optical member 60.

  By the way, in the manufacturing method of the light-emitting device 1 described above, for example, after the LED chip 10 and each of the conductor patterns 23 and 23 are electrically connected through two bonding wires 14, respectively, as shown in FIG. A part of the sealing portion 50 is placed in the gap between the submount member 30 and the wiring board 22 so that the tip of the nozzle 401 of the dispenser 400 is aligned with the resin injection hole 28 formed continuously from the window hole 24 of the wiring board 22. A liquid sealing resin (for example, a silicone resin) is injected and cured (the resin portion 50a made of the sealing resin is shown in FIG. 9), and then inside the dome-shaped optical member 60. After injecting a liquid sealing resin (for example, silicone resin) to be the remaining portion of the sealing portion 50 described above, the optical member 60 is arranged at a predetermined position on the mounting substrate 20 to seal the sealing resin. An optical member 60 at the same time as forming the sealing portion 50 is fixed to the mounting board 20 by curing, after which the manufacturing method as securing the color conversion member 70 to the mounting board 20 can be considered. According to such a manufacturing method, it is possible to suppress the generation of bubbles (voids) in the sealing portion 50 during the manufacturing process, and it is difficult to cause stress concentration on the bonding wire 14 due to the voids. Can be increased. However, even when such a manufacturing method is employed, bubbles (voids) may be generated in the sealing portion 50 during the manufacturing process, so it is necessary to inject a large amount of liquid sealing resin into the optical member 60. .

  However, when such a manufacturing method is adopted, when the optical member 60 is arranged at the predetermined position on the mounting substrate 20, a part of the liquid sealing resin is from a space surrounded by the optical member 60 and the mounting substrate 20. Overflowing and spreading on the surface of the resist layer 26, the light emitting device 1 as a whole is caused by light absorption at an unnecessary portion made of the overflowing sealing resin or irregular reflection of light due to unevenness of the unnecessary portion. It is conceivable that the light extraction efficiency decreases.

  Therefore, in the light emitting device 1 of the present embodiment, between the portion overlapping the ring-shaped end edge of the optical member 60 and the portion overlapping the ring-shaped end edge of the color conversion member 70 on the one surface of the mounting substrate 20, A plurality of resin reservoir holes 27 for storing the sealing resin overflowing from the space surrounded by the optical member 60 and the mounting substrate 20 are formed apart from each other in the outer peripheral direction of the optical member 60. Here, the resin reservoir hole 27 includes a through hole 27 a formed in the wiring substrate 22 and a recess 27 b formed in a portion corresponding to the through hole 27 a in the heat transfer plate 21, and the thickness of the wiring substrate 22. Even if the thickness of the resin reservoir hole 27 is reduced, the depth dimension of the resin reservoir hole 27 can be increased, and the amount of sealing resin that can be stored in the resin reservoir hole 27 can be increased. Since the sealing resin cured in step 1 functions as a heat insulating portion that prevents heat transfer from the LED chip 10 to the color conversion member 70, the temperature increase of the color conversion member 70 due to heat generation of the LED chip 10 can be suppressed. A decrease in the luminous efficiency of the phosphor due to the heat generation of the chip 10 can be suppressed.

  In addition, the light emitting device 1 is disposed between a portion overlapping the ring-shaped end edge of the optical member 60 and a portion overlapping the ring-shaped end edge of the color conversion member 70 on the one surface side of the mounting substrate 20. A ring-shaped light absorption preventing substrate 140 covering the resin reservoir hole 27 is provided, and the light absorption by the resin portion made of the sealing resin that is accumulated in each resin reservoir hole 27 and hardened is absorbed. 140 can prevent this. Here, the light absorption preventing substrate 140 is provided with a white resist layer that reflects light from the LED chip 10 and the color conversion member 70 on the surface side opposite to the mounting substrate 20 side. Light absorption can be prevented. The light absorption preventing substrate 140 is filled with the sealing resin overflowing when the optical member 60 is arranged at a predetermined position on the mounting substrate 20 in each resin reservoir hole 27, and What is necessary is just to mount on the said one surface side, and when hardening sealing resin after that, it will adhere to the mounting board | substrate 20 with sealing resin. Here, the ring-shaped light absorption preventing substrate 140 is formed with a plurality of notches 142 for exposing minute regions of the resin reservoir holes 27, and the sealing resin in the resin reservoir holes 27 is cured. It is possible to prevent voids from being generated.

  In the light emitting device 1 described above, between the portion of the one surface of the mounting substrate 20 that overlaps the edge of the optical member 60 on the mounting substrate 20 side and the portion of the color conversion member 70 that overlaps the edge of the mounting substrate 20 side. Since the resin reservoir hole 27 is formed, the sealing resin stored in the resin reservoir hole 27 does not overflow when the color conversion member 70 is fixed to the mounting substrate 20. Since it is possible to suppress the formation of an unnecessary portion made of sealing resin overflowing above, the light extraction efficiency due to light absorption at the unnecessary portion or irregular reflection of light due to the unevenness of the unnecessary portion, etc. The decrease can be suppressed and the light output can be increased.

  Here, in the light emitting device 1 according to the present embodiment, since the plurality of resin reservoir holes 27 are provided apart from each other in the outer peripheral direction of the optical member 60, the optical member 60 is mounted on the one surface of the mounting substrate 20. The surface of the mounting substrate 20 is made of a sealing resin while shortening the distance between the portion overlapping the edge on the substrate 20 side and the portion overlapping the edge on the mounting substrate 20 side of the color conversion member 70. Unnecessary portions can be prevented from being formed, and the conductor patterns 23 and 23 can be prevented from being separated by the resin reservoir holes 27, thereby reducing the resistance of the power supply path to the LED chip 10. Can be planned.

  The circuit board 200 shown in FIG. 12 and FIG. 13 has a wire insertion hole through which a power supply wire (lead wire) inserted through the insertion hole 100c penetrating the bottom wall 100a of the instrument body 100 is inserted. A pair of electric wires inserted through the electric wire insertion hole 206 is electrically connected. Further, the circuit board 200 has a light reflecting layer 203 made of a white resist layer formed on the surface side opposite to the bottom wall 100 a side of the instrument body 100, and most of the wiring pattern 202 is the light reflecting layer 203. Covered by.

  In the circuit board 200, the opening size of each opening window 204 is set to be slightly larger than the planar size of the mounting substrate 20 in the light emitting device 1. Here, in the light emitting device 1 according to the present embodiment, the chamfered portions are formed and rounded at the four corners in the plan view of the mounting substrate 20, but the chamfered portions in the vicinity of the outer lead portions 23b (the left and right chamfered portions in FIG. 8). The radius of curvature of the remaining two chamfered portions (upper and lower chamfered portions in FIG. 8) is larger than that of the first portion of the circuit board 200. Can be bigger. In addition, in order to prevent an overvoltage from being applied to the LED chip 10 of the light emitting device 1, a surface mount type Zener diode 231 and a surface mount type ceramic capacitor 232 for preventing overvoltage are provided in the circuit board 200. It is mounted in the vicinity of the window 204.

  On the other hand, in the light emitting device 1, each outer lead portion 23 b of the mounting board 20 is electrically connected to the wiring pattern 202 of the circuit board 200 via the terminal board 210. Here, the terminal plate 210 forms a terminal piece 211 that is joined to the wiring pattern 202 by using solder or the like so as to overlap the wiring pattern 202 by bending one end of an elongated metal plate into an L shape. The other end portion is bent in a J shape to form a terminal piece 212 that is joined to the outer lead portion 23b using solder or the like so that the thickness direction coincides with the outer lead portion 23b. The stress generated at the joint between the terminal plate 210, the outer lead portion 23b, and the wiring pattern 202 due to the difference in the linear expansion coefficient with respect to 200 can be relaxed. Connection reliability can be increased.

  Also in the LED lighting fixture of this embodiment described above, each light-emitting device 1 has electrical insulation and is interposed between the heat transfer plate 21 and the fixture body 100 as in the first embodiment. Since it is joined to the appliance main body 100 via the insulating layer 90 to be thermally coupled, the conventional circuit board 300 (see FIGS. 14 and 15) of the LED unit and the appliance main body are connected to the SURCON (registered trademark). Compared to a configuration in which a rubber sheet-like heat dissipation sheet or the like is sandwiched, the thermal resistance from the LED chip 10 to the fixture body 100 can be reduced, so that heat dissipation is improved and variation in thermal resistance is reduced. Since the temperature rise of the junction temperature of the chip 10 can be suppressed, the input power can be increased and the optical output can be increased.

  In each of the above embodiments, the insulating layer 90 is provided for each light emitting device 1, but one resin sheet slightly smaller than the bottom wall 100 a of the instrument main body 100 is attached to the plurality of light emitting devices 1. May be shared. Further, the optical member 60 is not necessarily provided, and may be provided as necessary. Further, when the light emission color of the LED chip 10 and the desired light color of the light emitting device 1 are the same, a protective cover that is formed of a translucent material and does not contain a phosphor instead of the color conversion member 70. May be provided. Further, the shape of the instrument body 100 is not particularly limited, and may be, for example, a flat plate shape. Moreover, in each said embodiment, although the spotlight was illustrated as an LED lighting fixture, the LED lighting fixture which can apply the technical idea of this invention is applicable not only to a spotlight but various LED lighting fixtures, for example, It can also be applied to ceiling lights attached to construction materials such as ceiling materials.

It is a principal part schematic sectional drawing which shows the LED lighting fixture of Embodiment 1. FIG. It is a principal part general | schematic disassembled perspective view which a part of LED lighting fixture same as the above fractured. It is a principal part schematic plan view of the light-emitting device in LED lighting fixture same as the above. It is the schematic side view which a part of LED lighting fixture same as the above fractured. It is a principal part schematic disassembled perspective view of LED lighting fixture same as the above. It is a principal part schematic sectional drawing which shows the LED lighting fixture of Embodiment 2. It is a principal part general | schematic disassembled perspective view which a part of LED lighting fixture same as the above fractured. It is explanatory drawing of the manufacturing method of the light-emitting device in a LED lighting fixture same as the above. It is explanatory drawing of the manufacturing method of the light-emitting device in a LED lighting fixture same as the above. It is principal part explanatory drawing of the light-emitting device in a LED lighting fixture same as the above. It is a principal part schematic disassembled perspective view of LED lighting fixture same as the above. It is a principal part schematic disassembled perspective view of LED lighting fixture same as the above. It is the principal part schematic perspective view which a part of LED lighting fixture same as the above fractured. It is a schematic sectional drawing of the LED unit of a prior art example. It is a schematic block diagram of the LED unit of another prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 LED chip 20 Mounting board 21 Heat-transfer board 22 Wiring board 23 Conductor pattern 24 Window hole (exposed part)
30 Submount member 50 Sealing portion 70 Color conversion member 90 Insulating layer (resin sheet)
100 Instrument body

Claims (3)

A lighting device in which a light emitting device using an LED chip is held by a metal device body, the light emitting device comprising an LED chip, a heat transfer plate made of a thermally conductive material and mounted with the LED chip, and one surface A wiring board that has a conductive pattern for supplying power to the LED chip on the side and is fixed to the mounting surface side of the LED chip in the heat transfer plate, and an exposed portion that exposes the mounting surface of the LED chip in the heat transfer plate is formed A wiring board, a sealing portion that seals the LED chip on the one surface side of the wiring board, and a phosphor that is excited by light emitted from the LED chip and emits light having a color different from the emission color of the LED chip And a dome-shaped color conversion member formed of a light-transmitting material and disposed on the one surface side of the wiring board so as to surround the sealing portion, and has an electrical insulation property and has a heat transfer plate and an instrument body Between Interposed becomes joined to the fixture body with the insulating layer to and thermally coupled to joining them together, the insulating layer has a high fluidity at low viscosity turned into the heated during content to and heating the filling material consisting of filler An LED lighting apparatus characterized by being formed of an epoxy resin sheet.   In the light emitting device, the LED chip is mounted on the heat transfer plate via a submount member that relieves stress acting on the LED chip due to a difference in linear expansion coefficient between the LED chip and the heat transfer plate. The LED lighting apparatus according to claim 1, wherein   3. The LED lighting apparatus according to claim 1, wherein the insulating layer has a plane size larger than that of the heat transfer plate.

Images