JP7053184B2 - Vehicle lighting - Google Patents

Description

The present invention relates to a light source module and a vehicle lamp, and more particularly to a light source module and a vehicle lamp in which a plurality of light emitting diodes are provided on the surface of an element mounting substrate.

Vehicle lighting fixtures are generally capable of switching between low beam and high beam. The low beam illuminates the vicinity with a predetermined illuminance, and the light distribution regulation is set so as not to give glare to the oncoming vehicle or the preceding vehicle, and it is mainly used when traveling in an urban area. On the other hand, the high beam illuminates a wide area and a distant place in front with a relatively high illuminance, and is mainly used when traveling at high speed on a road where there are few oncoming vehicles and preceding vehicles. Therefore, although the high beam is more visible to the driver than the low beam, there is a problem that glare is given to the driver and pedestrian of the vehicle existing in front of the vehicle.

In recent years, ADB (Adaptive Driving Beam) technology for dynamically and adaptively controlling the light distribution pattern of a high beam based on the surrounding condition of a vehicle has been proposed. ADB technology reduces glare given to a vehicle or pedestrian by detecting the presence or absence of a preceding vehicle, oncoming vehicle or pedestrian in front of the vehicle and dimming the area corresponding to the vehicle or pedestrian. be. In such ADB technology, it has been proposed that light emitting elements such as a plurality of LEDs (Light Emitting Diodes) are mounted in a row on a substrate to turn off the LEDs in the area corresponding to a vehicle or a pedestrian (. For example, Patent Document 1).

Further, in recent years, there has been proposed a method in which a large number of light emitting elements are two-dimensionally arranged on a substrate and the light distribution pattern of a high beam is controlled in more detail by selectively switching off and on of the light emitting elements. In a vehicle lamp with such a two-dimensional arrangement of light emitting elements, it is necessary to increase the mounting density of the light emitting elements and improve the accuracy of the mounting position in order to irradiate the two-dimensional light distribution pattern well. be. When an LED is used as a light emitting element, a surface mount type package is adopted, and a structure in which each LED is positioned and mounted on a land formed on a substrate is adopted and mounted at high density.

FIG. 10 is a schematic plan view showing a light source module 1 using the conventionally proposed ADB technique. As shown in FIG. 10, in the conventional light source module 1, a connector 3 for electrically connecting to the outside is mounted on the substrate 2, and a wiring pattern 4 is formed on the surface of the substrate 2 by extending from the connector 3. , A plurality of LEDs 5 are mounted on the wiring pattern 4.

Japanese Unexamined Patent Publication No. 2015-0167773

In such a conventional light source module 1, it is difficult to perform high-density mounting because the distance between the LEDs 5 is widened in order to secure the area of the heat dissipation pattern, and further, since the LEDs 5 are surface-mounted in individual packages, the alignment of the surface mounting is performed. High-density mounting is also difficult in terms of accuracy. As a result, when the distance between the LEDs 5 is widened, there is a problem that it is difficult to improve the overall luminous intensity obtained by lighting the adjacent LEDs 5. Further, in the ADB technology, the LEDs are selectively turned on one by one, and the light irradiation is precisely controlled according to the lighting area. Therefore, it is necessary that the light emitted from the LEDs leaks.

Therefore, it is an object of the present invention to provide a light source module and a lamp for a vehicle capable of preventing light leakage while improving the luminous intensity by mounting a light emitting element at a high density.

In order to solve the above problems, the vehicle lamp of the present invention has a submount in which a submount wiring is formed on one surface, and a plurality of light emitting elements mounted on the submount wiring along the first direction. And the width of the light-reflecting resin portion filled between the adjacent light-emitting elements and provided with a light-reflecting resin portion that seals the side surface of the light-emitting element. Is in the range of 0.1 mm to 0.6 mm, and is characterized in that power is selectively supplied to the plurality of the light emitting elements.

In such a vehicle lamp of the present invention, the space between adjacent light emitting elements is filled with a light reflecting resin portion and sealed, and the distance between the side surfaces of the light emitting elements is in the range of 0.1 mm to 0.6 mm. It is possible to prevent light leakage while improving the luminous intensity by mounting a light emitting element at a high density.

Further, in one aspect of the present invention, the plurality of the submounts are arranged as the first row extending in the first direction.

Further, in one aspect of the present invention, a plurality of the submounts are arranged adjacent to the first row as the second row extending in the first direction.

Further, in one aspect of the present invention, the metal wire corresponding to each light emitting element is connected to the submount wiring, and the light emitting elements in the first row and the second row are connected to the first row. It is located between the metal wire and the metal wire connected to the second row.

INDUSTRIAL APPLICABILITY The present invention can provide a light source module and a lamp for a vehicle capable of preventing light leakage while improving the luminous intensity by mounting a light emitting element at a high density.

It is an exploded perspective view which shows the lamp 100 for a vehicle in 1st Embodiment. It is a schematic perspective view which shows the light source module 40 in 1st Embodiment. It is a schematic plan view which shows the mounting substrate 41 in 1st Embodiment. It is a figure explaining the structure of the mounting board 41 in 1st Embodiment in detail, FIG. 4A is an exploded perspective view, and FIG. 4B is a schematic cross-sectional view. It is a schematic plan view which shows the light source module 40 in the state which each member is mounted on the mounting board 41. It is an enlarged perspective view which shows the submount 43 in an enlarged manner. It is a partially enlarged sectional view which shows the state which the submount 43 is mounted in the light emitting part mounting area 49. It is an enlarged plan view which shows the periphery of the light emitting part mounting area 49 in an enlarged manner. 9A and 9B are graphs showing the combined luminous intensity from adjacent light emitting elements 43c in the second embodiment, and FIG. 9A shows an example in which the distance between the light emitting elements 43c is long and the combined luminous intensity is insufficient, and FIG. 9B shows an example. Shows an example in which the distance between the light emitting elements 43c is short and the combined luminous intensity is sufficient. It is a schematic plan view which shows the light source module 1 using the ADB technique which has been proposed conventionally.

(First Embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent components, members, and processes shown in the drawings are designated by the same reference numerals, and duplicate description thereof will be omitted as appropriate. FIG. 1 is an exploded perspective view showing a vehicle lamp 100 according to the present embodiment. The vehicle lamp 100 includes a lens 10, a lens holder 20, a reflector 30, a light source module 40, a heat sink 50, and a cooling fan 60, and each member is positioned with each other and fixed by a fixing means (not shown). ing.

The lens 10 is made of a translucent material and is a member for irradiating the light from the light source module 40 forward so as to have a predetermined light distribution distribution. The lens holder 20 is a member for holding the lens 10 in a state where the relative positional relationship between the light source module 40 and the reflector 30 is maintained. The reflector 30 is a member arranged in front of the light source module 40 and reflecting light from the light source module 40 forward, and corresponds to an optical member in the present invention.

The light source module 40 is a member that emits light in response to electric power and a signal supplied from the outside of the vehicle lamp 100, and the details will be described later. The heat sink 50 is a member having good thermal conductivity arranged in contact with the light source module 40 on the back surface of the light source module 40, and the cooling fan 60 having heat radiation fins formed on the back surface side is the back surface side of the heat sink 50. It is a member that is arranged in a heat sink and is supplied with electric power to generate an air flow.

In the vehicle lamp 100, when electric power and a signal are supplied from the outside, the light source module 40 emits light according to the electric power and the signal, and the light reflected forward by the reflector 30 is inside the lens holder 20 and through the lens 10. Illuminated forward. Further, the heat associated with the light emission of the light source module 40 is dissipated into the air through the heat sink 50, and is cooled by the air blown from the cooling fan 60.

FIG. 2 is a schematic perspective view showing the light source module 40 in the present embodiment. The light source module 40 includes a mounting board 41, a wiring pattern 42, a submount 43, a power supply connector 44, a metal wire 45a, a light absorbing resin portion 45, and a resist layer 46. An optical member mounting region 47 is formed, and an optical member fixing portion 48 is formed in the optical member mounting region 47.

The mounting board 41 is a substantially flat plate-shaped member made of a material having good thermal conductivity, and a wiring pattern 42 is formed on one surface thereof, and a plurality of submounts 43 and a power feeding connector 44 are mounted. There is. Further, the resist layer 46 is formed so as to cover the wiring pattern 42. The material constituting the mounting substrate 11 is not limited, but it is preferable to use a metal having good thermal conductivity such as copper or aluminum.

Further, as the mounting substrate 41, a composite substrate in which an insulating substrate is bonded on a conductive substrate may be used, and examples thereof include a board in which a glass epoxy resin layer is bonded on a metal substrate. When the mounting substrate 41 is made of a metal substrate, it is preferable to form an antioxidant film on the back surface side of the mounting substrate 41 in order to prevent a decrease in thermal conductivity due to oxidation of the metal material. Examples of the method for forming the antioxidant film include preflux treatment and Au plating treatment, but Au plating treatment is preferable from the viewpoint of improving heat dissipation.

The wiring pattern 42 is a conductive pattern formed on the surface of the mounting board 41, and is for ensuring an electrical connection from the terminal of the power supply connector 44 to the submount 43. When a conductive material is used as the mounting board 41, an insulating layer is formed between the wiring pattern 42 and the mounting board 41.

The submount 43 is mounted on the surface of the mounting board 41 and is electrically connected to the wiring pattern 42 by the metal wire 45a, and is supplied with electric power via the metal wire 45a to emit light according to the electric power. Is. The detailed structure of the submount 43 will be described later.

The power supply connector 44 is a member for ensuring an electrical connection with the outside mounted on the surface of the mounting board 41, and a plurality of terminals are electrically connected to the wiring pattern 42. Although the shape of the power supply connector 44 is shown to be a substantially rectangular parallelepiped in FIG. 2, the outer shape, terminal shape, and the like are not limited as long as they can be connected to a known cable harness.

The metal wire 45a is a member for connecting a terminal provided on the submount 43 and a wiring pattern 42 formed on the mounting board 41, and is a metal conductive member that can be realized by a known wire bonding technique. be. The material constituting the metal wire 45a is not limited, and gold, copper, aluminum and the like can be used, but it is preferable to use gold.

The light-absorbing resin portion 45 is a resin member in which an inorganic filler and a light-absorbing material are mixed in a base resin, and covers and seals the metal wire 45a. The metal wires 45a may be sealed individually by the light-absorbing resin portion 45, but it is preferable to seal the plurality of metal wires 45a at once. As the base resin of the light-absorbing resin portion 45, a curable resin composition having high heat resistance, light resistance, and light permeability and good handling is preferable, and known sealing materials such as epoxy resin and silicone resin are mentioned. Be done. In particular, in order to prevent the metal wire 45a from being deformed or broken due to stress applied to the metal wire 45a due to expansion or contraction of the light absorbing resin portion 45 due to heat, it is necessary to use a silicone resin having a low elastic modulus after curing as the base resin. preferable. Examples of the light-absorbing material mixed in the base resin include carbon fillers and the like.

In the light source module 40 of the present embodiment, by covering the metal wire 45a with the light absorbing resin portion 45 and sealing the metal wire 45a, it is possible to prevent a conductive foreign substance from adhering to the metal wire 45a and causing a short circuit. Further, since the light-absorbing resin portion 45 contains a light-absorbing material, the light from the submount 43 reaches the metal wire 45a and is reflected, and is irradiated to the outside of the vehicle lamp 100 as stray light. Can be prevented. In particular, when the light emitting element included in the submount 43 is selectively turned on by using ADB technology, it is possible to prevent the stray light reflected by the metal wire 45a from reaching the non-irradiated region, and the light emitting element can be emitted at a high density. It is possible to suppress the occurrence of glare while implementing.

When forming the light-absorbing resin portion 45, the base resin obtained by kneading the inorganic filler and the light-absorbing material is supplied onto the metal wire 45a by a dispenser or the like and then cured. The viscosity and chixo property after kneading the light-absorbing material can be arbitrarily adjusted by selecting the material of the base resin and adjusting the amount of the inorganic filler added in consideration of the moldability after application and the stress on the feeding wire. It is possible. Due to the ejection property of the dispenser / the moldability after application, the viscosity is (0.5 rpm viscosity) / (5 rpm viscosity) at 23 ° C., 0.5 rpm viscosity, and 5 rpm viscosity in the E-type viscometer. Viscosity) is preferably 2.0 or more and 3.5 or less from the viewpoint of handling. When the thixo property is set in this range, the fluidity of the base resin is maintained appropriately, and even if the submount 43 is not surrounded by a dam member or the like, the resin flows out and the metal wire 45a is exposed, and the metal wire 45a is exposed. It is possible to prevent gaps between the two and gaps in the lower part.

The resist layer 46 is an insulating film-like member formed on the surface side of the mounting substrate 41 so as to cover the wiring pattern 42. The material constituting the resist layer 46 is not limited, but the light reflectance in the region where the resist layer 46 is formed is uniform in order to suppress stray light due to the difference in light reflection between the surface of the mounting substrate 41 and the wiring pattern 42. It is preferable to use a light-reflecting material or a light-absorbing material so as to form a light-reflecting material.

The optical member mounting region 47 is a region on the surface of the mounting substrate 41 for mounting the reflector 30 which is an optical member, and is a region where the resist layer 46 is not formed and the surface of the mounting substrate 41 is exposed. The optical member mounting area 47 is located on both sides of the mounting board 41 with the area on which the submount 43 is mounted, and the reflector 30 is brought into contact with the optical member mounting area 47 and fixed to the submount. The reflector 30 can be arranged across the 43.

The optical member fixing portion 48 is a through hole provided in the optical member mounting area 47. The reflector 30 is brought into contact with the optical member mounting area 47, and a fixing member such as a screw is inserted into the optical member fixing portion 48 from the surface side of the mounting board 41 to fix the mounting board 41 and the reflector 30 to the heat sink 50. The formation position of the optical member fixing portion 48 will be described in detail later, but the submount 43 is arranged between the two optical member fixing portions 48.

FIG. 3 is a schematic plan view showing the mounting substrate 41 in the present embodiment. As shown in FIG. 2, a wiring pattern 42 is formed on the mounting board 41, and a resist layer 46 is formed so as to cover the wiring pattern 42. As shown in FIG. 3, the optical member mounting area 47, the light emitting unit mounting area 49 on which the submount 43 is mounted, the portion for bonding the metal wire 45a, the power supply connector mounting portion 44a on which the power supply connector 44 is mounted, and the power supply A resist layer 46 is formed in a region excluding a portion connecting the terminals of the connector 44.

As described above, the light emitting portion mounting area 49 is a region for mounting a plurality of submounts 43, and is formed so that the submounts 43 can be arranged in two rows with the left-right direction in the drawing as the longitudinal direction. Further, the line L1 connecting the centers of the optical member fixing portions 48 has a positional relationship so as to cross substantially the center of the light emitting portion mounting region 49 along the longitudinal direction.

4A and 4B are views for explaining the structure of the mounting substrate 41 in the present embodiment in detail, FIG. 4A is an exploded perspective view, and FIG. 4B is a schematic cross-sectional view. As shown in FIG. 4A, the mounting substrate 41 is composed of a laminated structure of a metal plate 41a, an adhesive sheet 41b, and a glass epoxy resin layer 41c. The adhesive sheet 41b and the glass epoxy resin layer 41c are formed with openings 49b and 49c having a shape corresponding to the light emitting portion mounting region 49, respectively, and the positions of the openings 49b and 49c are the same. The openings 49b and 49c may be formed in advance in the predetermined areas of the adhesive sheet 41b and the glass epoxy resin layer 41c and attached in alignment with each other. The metal plate 41a and the glass epoxy resin layer 41c may be attached by the adhesive sheet 41b. After that, the openings 49b and 49c may be collectively formed by cutting or the like.

As shown in FIG. 4B, the adhesive sheet 41b and the glass epoxy resin layer 41c are laminated around the light emitting portion mounting region 49, and the wiring pattern 42 and the resist layer 46 are formed on the glass epoxy resin layer 41c. There is. Inside the light emitting portion mounting region 49, the surface of the metal plate 41a is partially exposed in the region corresponding to the openings 49b and 49c. Further, as described above, since the resist layer 46 is not formed in the optical member mounting region 47, the glass epoxy resin layer 41c is exposed in the optical member mounting region 47.

In the light source module 40 of the present embodiment, the resist layer 46 is not formed in the optical member mounting region 47, and the reflector 30 which is an optical member is directly mounted and fixed on the glass epoxy resin layer 41c. As a result, the positional deviation between the reflector 30 and the submount 43 caused by the variation in the film thickness of the resist layer 46 is suppressed, and the relative positional relationship between the optical member and the light emitting element 43c is precisely aligned to provide good light distribution characteristics. It is possible to irradiate with light. Further, by attaching the glass epoxy resin layer 41c to the metal plate 41a using the adhesive sheet 41b, it is not necessary to form an insulating layer containing a high thermal conductive filler on the metal plate 41a, which reduces the manufacturing process and manufacturing cost. It is possible to reduce the amount.

FIG. 5 is a schematic plan view showing a light source module 40 in a state where each member is mounted on the mounting board 41. Solder is applied to the power supply connector mounting portion 44a and the terminal connection portion of the mounting board 41 shown in FIG. 4, and the surface mount type power supply connector 44 is mounted by solder reflow. Further, the back surface of the submount 43 and the metal plate 41a exposed in the light emitting portion mounting area 49 are fixed with an adhesive, and a plurality of submounts 43 are arranged in two rows along the longitudinal direction, and then metal wires are formed by wire bonding. The submount 43 and the wiring pattern 42 are electrically connected by 45a. Finally, the light-absorbing resin portion 45 is applied to the plurality of metal wires 45a with a dispenser and cured. As described above, the line L1 connecting the centers of the optical member fixing portions 48 is located substantially in the center along the longitudinal direction of the submounts 43 arranged in two rows.

FIG. 6 is an enlarged perspective view showing the submount 43 in an enlarged manner. In the submount 43, a plurality of submount wirings 43b are formed on the submount substrate 43a, a plurality of light emitting elements 43c are mounted on the submount wiring 43b, and the side surfaces of the plurality of light emitting elements 43c are collectively light-reflecting. The resin portion 43d is sealed. Further, the light reflective resin portion 43d is not formed on a part of the submount substrate 43a, and the surface of the submount substrate 43a and the submount wiring 43b are exposed. The light emitting element 43c is flip-chip mounted inside the light-reflecting resin portion 43d so as to straddle between adjacent submount wirings 43b.

The submount substrate 43a is a substantially rectangular flat plate-shaped member made of a material having good insulating properties and good thermal conductivity, and is made of, for example, Si, AlN, or the like. The submount wiring 43b is a conductive pattern formed on one surface of the submount substrate 43a, and is electrically connected to the light emitting element 43c and the metal wire 45a is wire-bonded.

The light emitting element 43c is a member that is electrically connected to two metal wires 45a and emits light when a voltage is applied between the metal wires 45a, and is composed of a combination of an LED chip and a phosphor material. .. As the LED chip, a known compound semiconductor material such as a GaN system that emits a wavelength of blue, purple, or ultraviolet light as primary light can be used. As the phosphor material, a known material that is excited by the primary light and irradiates a desired secondary light can be used, and a material that obtains white color by mixing with the primary light from the LED chip or a plurality of phosphor materials can be used. It is possible to use a substance that obtains white color by mixing a plurality of secondary lights.

The light-reflecting resin portion 43d is a member in which light-reflecting fine particles are mixed in a base resin, and examples thereof include a white resin in which fine particles such as titanium oxide are mixed, and the light emitted by the light emitting element 43c is satisfactorily reflected. Further, the light-reflecting resin portion 43d surrounds the light-emitting element 43c and is filled by sealing the side surface thereof, and reflects the light emitted from the side surface of the light-emitting element 43c toward the inside of the light-emitting element 43c. As a result, the light emitted from the light emitting element 43c does not leak laterally from the side surface of the light emitting element 43c, and is satisfactorily irradiated to the outside from the upper surface of the light emitting element 43c.

As shown in FIG. 6, in the plurality of light emitting elements 43c arranged along the longitudinal direction of the submount 43, the distance between the side surfaces of the adjacent light emitting elements 43c is d1, and the distance between the centers of the light emitting elements 43c is d1. It is d2. As shown in FIG. 2, a plurality of submounts 43 are arranged in two rows above and below to form a light source unit, and a plurality of submount substrates 43a extending in the longitudinal direction are arranged adjacent to each other to form the first row. In addition to the configuration, the submount substrate 43a in the second row is arranged adjacent to the first row.

FIG. 7 is a partially enlarged cross-sectional view showing a state in which the submount 43 is mounted in the light emitting portion mounting area 49. The submount substrate 43a is fixed on the metal plate 41a exposed in the light emitting portion mounting region 49 with an adhesive, and the side surface of the light emitting element 43c on the submount substrate 43a is sealed with the light reflecting resin portion 43d. One end of the metal wire 45a is wire-bonded to the region on the submount substrate 43a where the light-reflecting resin portion 43d is not formed.

In the light source module 40 of the present embodiment, a plurality of light emitting elements 43c are mounted on the submount substrate 43a, and a metal wire 45a is wire-bonded to the submount wiring 43b formed on the surface of the submount substrate 43a to generate electric power. Supply. As a result, a large current can be supplied by the metal wire 45a having a higher melting point than when the light emitting element 43c is directly mounted on the wiring pattern 42 by using solder, and the luminous intensity of the light source module 40 can be increased. .. Further, by mounting the submount substrate 43a on the exposed metal plate 41a in the light emitting portion mounting area 49 and fixing it with an adhesive having a high heat resistant temperature, it is possible to mount the light emitting element 43c using solder. The heat-resistant temperature can be set high, and a large current can be supplied and the luminosity can be increased.

As shown in FIG. 7, the wiring pattern 42 formed on the glass epoxy resin layer 41c is covered with the resist layer 46, but the resist layer 46 is formed at a position where the other end of the metal wire 45a is wire-bonded. Not. The entire metal wire 45a is sealed with a light-absorbing resin portion 45, and is filled at the wire bond positions at both ends of the metal wire 45a and at the upper and lower portions of the metal wire 45a. The light-absorbing resin portion 45 is formed adjacent to the light-reflecting resin portion 43d at the wire bond position of the submount substrate 43a. In FIG. 7, the adhesive sheet 41b is not shown.

As described above, the submount 43 is mounted on the metal plate 41a in the light emitting portion mounting area 49 without passing through the glass epoxy resin layer 41c, and the height dimension of the light emitting element in the submount 43 is the glass epoxy resin layer 41c. Greater than the thickness dimension of. Here, the height dimension of the light emitting element in the submount 43 is the distance from the bottom surface of the submount substrate 43a to the upper surface of the light emitting element 43c, and is, for example, about 1.3 mm.

In the light source module 40 of the present embodiment, since the height of the submount 43 is larger than the thickness of the glass epoxy resin layer 41c, the upper surface of the light emitting element 43c, which is the light extraction surface of the submount 43, is above the glass epoxy resin layer 41c. Located in. As a result, it is possible to prevent the light emitted from the submount 43 from being incident on the side surface of the glass epoxy resin layer 41c and being blocked, and it is possible to satisfactorily extract the light and irradiate the light with desired light distribution characteristics.

In the light source module 40 of the present embodiment, after the metal plate 41a and the glass epoxy resin layer 41c are bonded to each other with the adhesive sheet 41b, the optical member fixing portion 48 is formed by punching from the back surface side of the mounting substrate 41. When the thickness dimension of the glass epoxy resin layer 41c is 0.05 mm to 0.2 mm, preferably 0.075 mm to 0.15 mm, burrs generated on the metal plate 41a during punching are suppressed by the glass epoxy resin layer 41c, and optical The reflector 30 which is a member can be precisely aligned and fixed.

FIG. 8 is an enlarged plan view showing the periphery of the light emitting unit mounting area 49 in an enlarged manner. As shown in FIG. 8, the light-absorbing resin portion 45 collectively seals a plurality of metal wires 45a, covers from the wire bond position of the wiring pattern 42 to the wire bond position of the submount 43, and has light reflectivity. It is formed up to a position adjacent to the resin portion 43d. Further, a plurality of submounts 43 are arranged along the left-right direction, and two rows are arranged adjacent to each other in the up-down direction to form the light source unit of the present invention.

In the light source unit in which the submounts 43 are arranged in two upper and lower rows, the light emitting elements 43c are also arranged in two rows, and the line L2 shown in FIG. 8 is a light emitting center line indicating an intermediate position of the two rows of light emitting elements 43c. .. The light emitting center line L2 substantially coincides with the line L1 connecting the centers of the optical member fixing portions 48 shown in FIG. 5, and is an optical member on an extension line of the light emitting center line L2 of the plurality of light emitting elements 43c. The reflector 30 is fixed.

In the light source module 40 of the present embodiment, the line L1 connecting the centers of the optical member fixing portions 48 and the light emitting center line L2 of the submount 43 substantially coincide with each other, so that the mounting substrate 41 is warped. In addition, by fastening the reflector 30 on the light emitting center line L2, the warp can be reduced and the positional relationship between the light source unit and the optical member can be appropriately set. Further, when the mounting board 41 including the heat sink 50 and the reflector 30 are fastened together, the back surface side of the light emitting portion mounting area 49 can be brought into close contact with the heat sink, and the heat dissipation characteristics are the same as those of the mounting board 41 without warping. Can be obtained.

The wire bond position of the wiring pattern 42 is provided along the upper and lower sides in the figure of the light emitting portion mounting area 49, and the metal wire 45a is wire-bonded to the submount 43 in the upper row in the figure from the upper part in the figure. A metal wire 45a is wire-bonded to the submount 43 in the lower row in the figure from the lower part in the figure. Therefore, the light emitting elements 43c in the first row and the second row are located between the metal wire 45a connected to the first row and the metal wire 45a connected to the second row.

In the vehicle lamp 100 of the present invention, electric power is selectively supplied to the light emitting element 43c from the outside via the power supply connector 44, the wiring pattern 42, the metal wire 45a, and the submount wiring 43b, and the light emitting element 43c is lit. do. The light distribution of the entire light source unit is determined by lighting the selected light emitting element 43c among the plurality of submounts 43 constituting the light source unit, and the light distribution for the vehicle is determined by the ADB technology via the reflector 30 and the lens 10. A two-dimensional light distribution pattern is irradiated 100 forward.

(Second Embodiment)
Next, the second embodiment of the present invention will be described with reference to FIG. The description of the contents overlapping with the first embodiment will be omitted. In this embodiment, it can be applied even when the ADB technique is not used. The configuration of the vehicle lamp 100 and the configuration of the light source module 40 are the same as those of the first embodiment, and the description thereof will be omitted.

FIG. 9 is a graph showing the combined luminous intensity from adjacent light emitting elements 43c in the present embodiment, and FIG. 9A shows an example in which the distance between the light emitting elements 43c is long and the combined luminous intensity is insufficient, and FIG. (B) shows an example in which the distance between the light emitting elements 43c is short and the combined luminous intensity is sufficient. In the figure, the horizontal axis indicates the position along the longitudinal direction of the submount 43, and the vertical axis indicates the luminous intensity. The broken line in the figure shows the luminous intensity of the light emitted from one light emitting element 43c, and the solid line in the figure shows the combined luminous intensity of the light emitted from two adjacent light emitting elements 43c.

When the distance d1 between the side surfaces of the adjacent light emitting elements 43c shown in FIG. 6 exceeds 0.6 mm, the peak of the combined luminous intensity is small as shown in FIG. 9A, and the light is emitted from one light emitting element 43c. It is only a few percent better than the luminosity. By setting the side-to-side distance d1 to 0.6 mm or less, the peak of the combined luminous intensity becomes large as shown in FIG. 9B, and the luminous intensity can be improved by 20% or more from the luminous intensity emitted from one light emitting element 43c. can. In particular, when the ADB technology is applied, the light emitting element 43c is selectively turned on and off to precisely control the irradiated area and the non-irradiated area. Therefore, the higher the combined luminous intensity of the irradiated area, the contrast with the non-irradiated area. Can be enhanced, which is preferable.

When the distance d1 between the side surfaces is less than 0.1 mm, the thickness of the light reflecting resin portion 43d filling the side surface of the light emitting element 43c becomes insufficient, and light leaks from the side surface to one light emitting element 43c. The luminosity itself of the light emitted from is lowered. In addition, the combined luminous intensity is lowered due to the leakage of light from the side surface. In particular, when the light emitting element 43c is selectively turned on by applying the ADB technology, the light leaked from the side surface may be irradiated in the same manner as the light emitted from the non-lighting light emitting element 43c, which is desired. It becomes difficult to irradiate a two-dimensional light distribution pattern.

The distance between the light emitting elements 43c and the combined luminous intensity when the light source module 40 of the present embodiment includes a plurality of light emitting elements 43c as the submount 43 and when one conventional LED chip is a chip size package (CSP). The relationships are shown in Table 1. The relative value is shown with the combined luminous intensity as 100 when the distance between the light emitting elements is 0.6 mm in the conventional chip size package.

As shown in Table 1, in the conventional chip size package, the light emitting element spacing is 0.6 mm and the combined luminous intensity is 100, and 0.2 mm and the combined luminous intensity is 119. On the other hand, in the submount 43 of the present embodiment, the distance d1 between the side surfaces of the light emitting element 43c is 0.6 mm and the combined luminous intensity is 112, 0.2 mm and the combined luminous intensity is 140, and 0.1 mm and the combined luminous intensity is 147. be.

Therefore, in the light source module 40 of the present embodiment, the distance d1 between the side surfaces of the light emitting element 43c is preferably in the range of 0.1 mm to 0.6 mm. Similarly, the distance between the light emitting elements 43c among the plurality of submounts 43 is preferably in the range of 0.1 mm to 0.6 mm. When the distance d1 between the side surfaces is within this range, it is possible to improve the combined luminous intensity while preventing light leakage from the side surfaces. Further, when the ADB technique is applied, the contrast between the irradiated area and the non-irradiated area can be enhanced, and a desired two-dimensional light distribution pattern can be satisfactorily irradiated.

The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention.

100 ... Vehicle optics 10 ... Lens 20 ... Lens holder 30 ... Reflector 40 ... Light source module 50 ... Heat sink 60 ... Cooling fan 11 ... Mounting board 41 ... Mounting board 41a ... Metal plate 41b ... Adhesive sheet 41c ... Glass epoxy resin layer 42 ... Wiring pattern 43 ... Submount 43a ... Submount board 43b ... Submount wiring 43c ... Light source 43d ... Light reflective resin part 44 ... Power supply connector 44a ... Power supply connector mounting part 45 ... Light absorbing resin part 45a ... Metal wire 46 ... Resist layer 47 ... Optical member mounting area 48 ... Optical member fixing portion 49 ... Light source mounting area 49a, 49b ... Opening

Claims (4)

A submount with submount wiring formed on one surface,
A plurality of light emitting elements mounted along the first direction on the submount wiring, and
A light-reflecting resin portion that is filled between the adjacent light-emitting elements and seals the side surface of the light-emitting element is provided.
The width of the light-reflecting resin portion filled between the adjacent light emitting elements is in the range of 0.1 mm to 0.6 mm.
A vehicle lamp that selectively supplies electric power to a plurality of the light emitting elements. The vehicle lamp according to claim 1.
A vehicle lamp in which a plurality of the sub-mounts are arranged as a first row extending in the first direction. The vehicle lamp according to claim 2.
Further, a vehicle lighting fixture in which a plurality of the sub-mounts are arranged adjacent to the first row as a second row extending in the first direction. The vehicle lamp according to claim 3.
A metal wire corresponding to each light emitting element is connected to the submount wiring, and the metal wire is connected to the submount wiring.
The light emitting elements in the first row and the second row are characterized to be located between the metal wire connected to the first row and the metal wire connected to the second row. Vehicle lighting equipment.

Images