CN109296989A - Light source module and Vehicular lamp - Google Patents
Light source module and Vehicular lamp Download PDFInfo
- Publication number
- CN109296989A CN109296989A CN201810829803.6A CN201810829803A CN109296989A CN 109296989 A CN109296989 A CN 109296989A CN 201810829803 A CN201810829803 A CN 201810829803A CN 109296989 A CN109296989 A CN 109296989A
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- CN
- China
- Prior art keywords
- light
- subassembly
- emitting component
- light source
- source module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
- F21S41/37—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors characterised by their material, surface treatment or coatings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
- F21W2102/10—Arrangement or contour of the emitted light
- F21W2102/13—Arrangement or contour of the emitted light for high-beam region or low-beam region
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
Light-emitting component can be installed to high-density and improve brightness by providing one kind, the light source module and Vehicular lamp for preventing light from leaking.It include: to be formed with the subassembly (43a) of subassembly wiring on a surface；The a plurality of light-emitting elements (43c) carried along a first direction in subassembly wiring；The light reflective resin portion (43d) for being filled between adjacent light-emitting component (43c) and sealing the side of light-emitting component (43c), the light source module of the side distance between the surface (d1) of adjacent light-emitting component (43c) in the range of 0.1mm~0.6mm.
Description
Technical field
The present invention relates to light source modules and Vehicular lamp, in particular to the surface of device mounting board are provided with multiple light
The light source module and Vehicular lamp of diode.
Background technique
Vehicular lamp is generally possible to switching dipped beam and distance light.Dipped beam with scheduled illumination to nearby illuminating, advise by light distribution
Surely it is decided to be not to opposite car, first drives a vehicle and bring dazzle, mainly used in the case where urban district travels.On the other hand, distance light
With a wide range of of relatively high illumination illumination front and at a distance, the feelings that mainly vehicle, few road of first driving a vehicle are run at high speed over there
It is used under condition.So distance light, compared with dipped beam, the visibility of driver is preferable, but having a problem in that can be to being present in vehicle
Driver, the pedestrian of the vehicle in front bring dazzle.
In recent years it has been proposed that the state based on vehicle periphery, the ADB with optical mode of dynamic, Adaptive Control distance light
(Adaptive Driving Beam, adaptive high beam) technology.Whether there is or not first drivings, opposite in the front of ADB technology detection vehicle
Vehicle, pedestrian, will perhaps the corresponding region of pedestrian dims etc. to reduce and brings vehicle or the dazzle of pedestrian with vehicle.Such
In ADB technology, propose light-emitting components such as multiple LED (Light Emitting Diode, light emitting diode) on substrate
It is carried with column-shaped, extinguishes the LED (such as patent document 1) in region corresponding with vehicle, pedestrian.
Further, it also proposed in recent years by a plurality of light-emitting elements two-dimensional arrangement on substrate, selectivity switching shines
It the extinguishing of element and lights, so that control distance light in more detail matches optical mode.In such arrangement for carrying out two-dimentional light-emitting component
Vehicular lamp in, it is two-dimensional with optical mode in order to irradiate well, need to improve the packing density of light-emitting component, and improve
The precision of installation site.In the case where using LED as light-emitting component, using the packaging part of surface installing type, using in shape
At the construction for positioning each LED and installation in the terminal pad on substrate and carry out high-density installation.
Figure 10 is the schematic plan view for showing the light source module 1 for the ADB technology for having used previous proposition.As shown in Figure 10,
Previous light source module 1 is on a substrate 2 equipped with for the connector 3 with external electrical connections, on the surface of substrate 2 from connector
3 are prolongedly formed with wiring pattern 4, equipped with multiple LED 5 on wiring pattern 4.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2015-016773 bulletin
Summary of the invention
The problem of present invention is to be solved
For such previous light source module 1 in order to ensure the area of radiating pattern, the mutual interval LED 5 is greatly, it is difficult to high
Density installation, and since LED 5 is mounted on surface with individual packaged types, the aligned in position precision installed from face
From the aspect of, it is also difficult to high-density installation.When the mutual interval LED 5 is big as a result, the problem is that: it is difficult to improve phase
Brightness adjacent LED 5 whole obtained from lighting.In addition, in ADB technology, due to making LED singly selective point
It is bright, the light that is critically controlled according to bright area is irradiated, therefore luminous from LED needs to leak.
Therefore, light-emitting component can be installed the purpose of the present invention is to provide one kind to high-density and improves brightness, simultaneously
The light source module and Vehicular lamp for preventing light from leaking.
The solution to the problem
To solve the above problems, light source module of the invention is characterised by comprising: subassembly is formed on a surface
There is subassembly wiring；A plurality of light-emitting elements are carried along a first direction in subassembly wiring；And light reflective resin
Portion is filled between the adjacent light-emitting component, and the side of the light-emitting component is sealed, the adjacent light-emitting component
Range of the side distance between the surface in 0.1mm~0.6m.
In such light source module of the invention, due to will be filled out between adjacent light-emitting component with light reflective resin portion
It fills and seals, therefore range of the side distance between the surface of light-emitting component in 0.1mm~0.6mm can install the member that shines to high-density
Part simultaneously improves brightness, prevents the leakage of light.
In addition, in a form of the invention, multiple subassemblies are arranged as extend in the first direction the
One column.
In addition, further, multiple subassemblies are used as to be extended in the first direction in a form of the invention
Secondary series and be adjacent to arrangement with the first row.
In addition, in a form of the invention, with each corresponding metal wire of light-emitting component and the subassembly cloth
Line connection, the light-emitting component of the first row and the secondary series be located at be connected to the metal wire of the first row with
It is connected between the metal wire of the secondary series.
In addition, to solve the above problems, Vehicular lamp of the invention is characterised by comprising any of Claims 1-4
Light source module described in, selectively supplies electric power multiple light-emitting components.
In such Vehicular lamp of the invention, light-emitting component can be installed to high-density and improve brightness, prevent light
Leakage.
The effect of invention
In the present invention, light-emitting component can be installed to high-density and improve brightness by being capable of providing one kind, while prevent light
The light source module and Vehicular lamp of leakage.
Detailed description of the invention
Fig. 1 is the exploded perspective view for showing the Vehicular lamp 100 of first embodiment.
Fig. 2 is the schematic isometric for showing the light source module 40 of first embodiment.
Fig. 3 is the schematic plan view for showing the mounted board 41 of first embodiment.
Fig. 4 is the figure that the construction of mounted board 41 of first embodiment is described in detail, and Fig. 4 (a) is exploded perspective view, figure
4 (b) be schematic sectional view.
Fig. 5 is the schematic plan view for showing the light source module 40 of the state equipped with each component on mounted board 41.
Fig. 6 is the amplification stereogram for amplifying and showing subassembly 43.
Fig. 7 is to show to carry the enlarged partial sectional view of state of the region 49 equipped with subassembly 43 in illumination region.
Fig. 8 is the amplification view that amplification shows that illumination region carries 49 periphery of region.
Fig. 9 is the chart for showing the synthesis brightness of adjacent light-emitting component 43c in second embodiment, and Fig. 9 (a) is
The distance for showing light-emitting component 43c is remote and synthesize the inadequate example of brightness, Fig. 9 (b) be show light-emitting component 43c distance it is close and
Synthesize the sufficient example of brightness.
Figure 10 is the schematic plan view for showing the light source module 1 for the ADB technology for having used previous proposition.
The explanation of label
100 ... Vehicular lamps
10 ... lens
20 ... lens holders
30 ... reflectors
40 ... light source modules
50 ... radiators
60 ... cooling fans
11 ... mounted boards
41 ... mounted boards
41a ... metal plate
41b ... adhesive sheet
41c ... glass epoxy layer
42 ... wiring patterns
43 ... subassemblies
43a ... subassembly substrate
The wiring of 43b ... subassembly
43c ... light-emitting component
43d ... light reflective resin portion
44 ... power-feed connectors
44a ... power-feed connector equipped section
45 ... light absorption resin portions
45a ... metal wire
46 ... resist layers
47 ... optical components carry region
48 ... optical component fixed parts
49 ... illumination regions carry region
The opening portion 49a, 49b ...
Specific embodiment
(first embodiment)
In the following, the embodiment that present invention will be described in detail with reference to the accompanying.It is identical or equivalent shown in the drawings
Constituent element, component, processing are labelled with identical appended drawing reference, and appropriate the repetitive description thereof will be omitted.Fig. 1 is to show present embodiment
Vehicular lamp 100 exploded perspective view.Vehicular lamp 100 includes lens 10, lens holder 20, reflector 30, light source module
40, radiator 50, cooling fan 60, each component are mutually located, and are fixed by fixed cell (not shown).
Lens 10 are made of translucent material, be for make the light from light source module 40 become it is scheduled with light distribution
The component irradiated forwards.Lens holder 20 is for the relative position to maintain lens 10 Yu light source module 40 and reflector 30
The component that the state of relationship is kept.Reflector 30 is disposed on the front of light source module 40 and will be from light source module 40
The component that light reflects forwards is equivalent to optical component of the invention.
Light source module 40 is according to the luminous component from the electric power externally supplied and signal of Vehicular lamp 100, in detail
It is aftermentioned.Radiator 50 is the good component of heat conductivity contiguously configured at the back side of light source module 40 and light source module 40,
The cooling fan 60 that overleaf side is formed with radiating fin is disposed on the back side of radiator 50, and is produced and supplying electric power
The component of raw air stream.
In Vehicular lamp 100, when being externally supplied electric power and signal, light source module 4 shines according to electric power and signal,
Light after being reflected forwards by reflector 30 is irradiated via in lens holder 2 with lens 10 forwards.In addition, with light source module
40 luminous heats reject heat in air via radiator 50, cooling by the air-supply from cooling fan 60.
Fig. 2 is the schematic isometric for showing the light source module 40 of present embodiment.Light source module 40 include mounted board 41,
Wiring pattern 42, subassembly 43, power-feed connector 44, metal wire 45a, light absorption resin portion 45 and resist layer 46, are taking
Carried base board 41 is formed with optical component and carries region 47, carries in region 47 in optical component and is formed with optical component fixed part
48。
Mounted board 41 is the component of the approximate slab shape formed by the good material of heat conductivity, is formed on a surface
There is wiring pattern 42, and equipped with multiple subassemblies 43 and power-feed connector 44.In addition, covering 42 ground of wiring pattern is formed with
Resist layer 46.The material for constituting mounted board 41 does not limit, but it is preferred that using the good gold of the heat conductivities such as copper, aluminium
Belong to.
In addition, the composite substrate that insulative substrate is fitted on conductive board can be used as mounted board 41,
Such as the substrate for being pasted with glass epoxy layer on metallic substrates can be enumerated.Mounted board 41 is being constituted with metal substrate
In the case where, thermal conductivity caused by the oxidation of metal material declines in order to prevent, preferably at the back side of mounted board 41
Side forms oxidation-resistant film.As the forming method of oxidation-resistant film, pre- solder flux processing, Au plating can be enumerated, but from raising
From the viewpoint of thermal diffusivity is such, preferably Au plating.
Wiring pattern 42 is formed at the conductive pattern on the surface of mounted board 41, for ensuring from power-feed connector 44
Electrical connection of the terminal to subassembly 43.In the case where using conductive material as mounted board 41, in wiring pattern 42
Insulating layer is formed between mounted board 41.
Subassembly 43 is to be mounted in the surface of mounted board 41, and be electrically connected with wiring pattern 42 using metal wire 45a,
It supplies electric power to carry out the component to shine corresponding with electric power via metal wire 45a.The detailed configuration of aftermentioned subassembly 43.
Power-feed connector 44 be mounted in 41 surface of mounted board for ensuring component with external electrical connections, Duo Geduan
Son is electrically connected with wiring pattern 42.As the shape of power-feed connector 44, the shape of approximate cuboid is shown in FIG. 2, but only
Want can it is corresponding with known cable looms and connect, shape, terminal shape etc. do not limit.
Metal wire 45a be for by be arranged in subassembly 43 terminal and the wiring pattern 42 being formed on mounted board 41
The component of connection is the metal electroconductive component that can be realized with known Wire Bonding Technology.Constitute metal wire 45a's
Material does not limit, and gold, copper, aluminium etc. can be used, but it is preferred that using gold.
Light absorption resin portion 45 is to be mixed into the resin component of inorganic filler and light absorption material in matrix resin,
Covering metal wire 45a is simultaneously sealed.The sealing for the metal wire 4a that light absorption resin portion 45 is carried out can be other by metal wire 45a
Ground seals one by one, but it is preferred that multiple metal wire 45a are sealed together.As the matrix resin in light absorption resin portion 45,
The preferably good hardening resin composition of processing with high-fire resistance, light resistance, translucency, can enumerate asphalt mixtures modified by epoxy resin
Sealing material known to rouge, silicone resin etc..In particular, in order to prevent due to because of light absorption resin portion 45 caused by heat
Expansion is shunk to metal wire 45a application stress to deform, be broken, preferably as matrix resin, after solidification
The low silicone resin of coefficient of elasticity.As the light absorption material being mixed into matrix resin, carbon filler etc. can be enumerated.
In the light source module 40 of present embodiment, by covering metal wire 45a and close with light absorption resin portion 45
Envelope, so as to prevent from adhering to foreign conducting matter and short circuit in metal wire 45a.In addition, since light absorption resin portion 45 is mixed into
There is light absorption material, therefore, can prevent the light from subassembly 43 from reaching metal wire 45a and then reflect and as spuious
Light is irradiated to the outside of Vehicular lamp 100.In particular, in the light-emitting component choosing for making subassembly 43 be included using ADB technology
In the case that selecting property is lighted, it can prevent the stray light reflected by metal wire 45a from reaching non-irradiated region, can pacify to high-density
Dress light-emitting component and the generation for inhibiting dazzle.
When forming light absorption resin portion 45, will be kneaded has the matrix resin of inorganic filler and light absorption material use
Distributor etc. is supplied on metal wire 45a, is then solidified.Viscosity and thixotropy after mixing light absorption material can
In view of after coating mouldability, to the stress of supply lines, by adjusting matrix resin material it is selected, inorganic filler add
Dosage carrys out any adjustment.Thixotropy is according to the mouldability after injection/coating of distributor, in 23 DEG C, revolving speed of E type viscosimeter
When the viscosity of 0.5rpm and the viscosity of revolving speed 5rpm, (viscosity of 0.5rpm)/(viscosity of 5rpm) be 2.0 or more and 3.5 with
Under, it is preferred from the viewpoint of processing.When thixotropy is set in the range, the appropriate mobility for keeping matrix resin,
It is surrounded around subassembly 43 even without stop member etc., can also prevent resin outflow and metal wire 45a exposes, prevent
Gap is generated in the mutual gap metal wire 45a, lower part.
Resist layer 46 is the membranaceous portion of the surface side covering wiring pattern 42 in mounted board 41 and the insulating properties of formation
Part.The material for constituting resist layer 46 does not limit, but in order to inhibit the surface in mounted board 41 and the light of wiring pattern 42
Stray light caused by reflection is different, makes the light reflectivity in the region for being formed with resist layer 46 with uniforming
With light reflective material or light absorption material.
It is the region for carrying 41 surface of mounted board of the i.e. reflector 30 of optical component that optical component, which carries region 47,
It is the region of the surface exposing of not formed resist layer 46 and mounted board 41.Optical component carries region 47 and clips equipped with son
The regional situation of assembly 43 carries region in the two sides of mounted board 41, by abutting reflector 30 and being fixed on optical component
47, so as to configure reflector 30 across subassembly 43.
Optical component fixed part 48 is the through hole being arranged in optical component carrying region 47.It is connected to reflector 30
Optical component carries region 47, and the fixation members such as screw are inserted into optical component fixed part from the surface side of mounted board 41
48, mounted board 41 and reflector 30 are fixed on radiator 5.The forming position of optical component fixed part 48 is described in detail hereinafter, but
Subassembly 43 is arranged between 2 optical component fixed parts 48.
Fig. 3 is the schematic plan view for showing the mounted board 41 of present embodiment.As shown in Fig. 2, on mounted board 41
It is formed with wiring pattern 42, covering 42 ground of wiring pattern is formed with resist layer 46.As shown in figure 3, being taken in addition to optical component
Carry region 47, the illumination region carrying region 49 for carrying subassembly 43, the part of bond wire line 45a, carrying power-feed connector 44
The part that is connected with by the terminal of power-feed connector 44 power-feed connector equipped section 44a except region be formed with resist layer
46。
It is as described above the region for carrying multiple subassemblies 43 that illumination region, which carries region 49, can make left and right directions in figure
It is formed for longitudinal direction and by two column of the arrangement of subassembly 43.In addition, the line L1 that the center of optical component fixed part 48 is connected
For the crosscutting positional relationship of the approximate center that illumination region is carried region 49 along longitudinal direction.
Fig. 4 is the figure that the construction of mounted board 41 of present embodiment is described in detail, and Fig. 4 (a) is exploded perspective view, Fig. 4
It (b) is schematic sectional view.As shown in Fig. 4 (a), mounted board 41 is by metal plate 41a, adhesive sheet 41b and glass epoxy resin
The lit-par-lit structure of layer 41c is constituted.Adhesive sheet 41b and glass epoxy layer 41c be formed with respectively with illumination region pickup zone
Opening portion 49b, 49c of the corresponding shape in domain 49, the position consistency of opening portion 4b, 49c.It can be in adhesive sheet 41b and glass
The presumptive area of epoxy resin layer 41c is pre-formed opening portion 49b, 49c, pastes to location matches, and can also use adhesive sheet
After 41b pastes metal plate 41a and glass epoxy layer 41c, opening portion 49b, 49c are formed together using machining etc..
As shown in Fig. 4 (b), is carried around region 49 in illumination region, be laminated with adhesive sheet 41b and glass epoxy resin
Layer 41c, is formed with wiring pattern 42 and resist layer 46 on glass epoxy layer 41c.Region 49 is carried in illumination region
Partially expose in region corresponding with opening portion 49b, 49c on the surface of inside, metal plate 41a.In addition, due to as described above
Region 47 being carried in optical component, resist layer 46 being not formed, therefore, glass epoxy layer 41c is in optical component pickup zone
Expose in domain 47.
In the light source module 40 of present embodiment, the not formed resist layer 46 in region 47 is carried in optical component, by light
Department of the Chinese Academy of Sciences's part, that is, reflector 30 is directly mounted in glass epoxy layer 41c and fixation.Inhibit as a result, due to 46 film thickness of resist layer
Deviation and the position of the reflector 30 that generates and subassembly 43 is deviateed, can be by the opposite of optical component and light-emitting component 43c
Positional relationship critically aligned in position and with good light distribution characteristic carry out light irradiation.In addition, viscous by being used in metal plate 41a
Contact pin material 41b pastes glass epoxy layer 41c, fills without being formed on metal plate 41a containing high thermal conductivity
The insulating layer of object, can reduce manufacturing process and manufacturing cost.
Fig. 5 is the schematic plan view for showing the light source module 40 of the state equipped with each component on mounted board 41.?
The power-feed connector equipped section 44a and terminal connecting portion of mounted board 41 shown in Fig. 4 are coated with solder, using solder reflux come
The power-feed connector 44 of mounting surface mount type.In addition, region is carried in illumination region in the back side of subassembly 43 with bonding agent
The metal plate 41a exposed in 49 is fixed, and after multiple subassemblies 43 are arranged as two column along longitudinal direction, utilizes wire bonding
Subassembly 43 is electrically connected with wiring pattern 42 with metal wire 45a.It is inhaled finally, applying lighting to multiple metal wire 45a with distributor
The property received resin portion 45 simultaneously solidifies.As described above, by line L1 that the center of optical component fixed part 48 connects along being arranged as two column
The longitudinal direction of subassembly 43 be located at approximate center.
Fig. 6 is the amplification stereogram for amplifying and showing subassembly 43.Subassembly 43 forms multiple on subassembly substrate 43a
Subassembly is routed 43b, carries a plurality of light-emitting elements 43c on subassembly wiring 43b, light reflective resin portion 43d is by multiple hairs
The side of optical element 43c is sealed together.In addition, a part of not formed light reflective resin on subassembly substrate 43a
Portion 43d, the surface of subassembly substrate 43a and subassembly wiring 4b expose.Light-emitting component 43c is light reflective resin portion 43d's
Inside is routed between 43b across adjacent subassembly and is installed with flip-chip.
Subassembly substrate 43a is the approximate rectangular flat-shaped part formed by insulating properties, the good material of heat conductivity,
Such as it is made of Si, AlN etc..Subassembly wiring 43b is formed at the electric conductivity figure on a surface of subassembly substrate 43a
Case is electrically connected with light-emitting component 43c, and metal wire 45a is wire-bonded.
Light-emitting component 43c is electrically connected with 2 metal line 45a, applies component luminous when voltage between metal wire 45a,
It is made of the combination of LED chip and fluorescent material.As LED chip, can be used by blue, purple, ultraviolet light wavelength
Compound semiconductor materials known to gaN series gone out as a light emission etc..As fluorescent material, can be used by primary light
The known materials for exciting and irradiating desired secondary light can be used and obtain and with primary light colour mixture from LED chip
The element of white obtains the element of white using multiple fluorescent materials using the colour mixture of multiple secondary lights.
Light reflective resin portion 43d is to be mixed into the component of light reflective particle in matrix resin, such as can enumerate mixed
The white resin for entering to have the particles such as titanium oxide reflects the light projected by light-emitting component 43c well.In addition, light reflective tree
Side is sealed and filled with by rouge portion 43d with surrounding light-emitting component 43c, and the light irradiated from the side of light-emitting component 43c is reflexed to
Light-emitting component 43c internal direction.It will not be leaked out as a result, from the side light-emitting component 43c to side in shining for light-emitting component 43c,
It is irradiated well from the upper surface of light-emitting component 43c to outside.
As shown in fig. 6, along subassembly 43 longitudinal direction arrange a plurality of light-emitting elements 43c in, adjacent luminous member
The mutual side distance between the surface of part 43c is d1, and the mutual distance between centers of light-emitting component 43c is d2.As shown in Fig. 2, multiple sub- dresses
It is arranged as two arranging and constitute light source portion up and down with 43, extends in longitudinal direction and multiple subassembly substrate 43a are configured adjacently and structure
At first row, and it is adjacent to the subassembly substrate 43a configured with secondary series with first row.
Fig. 7 is to show to carry the enlarged partial sectional view of state of the region 49 equipped with subassembly 43 in illumination region.It is sending out
Light portion is carried on the metal plate 41a that region 49 is exposed, and fixes subassembly substrate 43a with bonding agent, the hair on subassembly substrate 43a
The side of optical element 43c is sealed by light reflective resin portion 43d.Light reflective tree is not formed on subassembly substrate 43a
The region of rouge portion 43d, one end of metal wire 45a are wire-bonded.
In the light source module 40 of present embodiment, a plurality of light-emitting elements 43c is mounted on subassembly substrate 43a, phase
Subassembly for being formed in the surface subassembly substrate 43a is routed 43b, by metal wire 45a wire bonding and supplies electric power.By
This can use the high metal wire 45a of fusing point compared with using solder that light-emitting component 43c is directly mounted on wiring pattern 42
High current is supplied, can be improved the brightness of light source module 40.In addition, by subassembly substrate 43a relative in illumination region pickup zone
The metal plate 41a exposed in domain 49 is carried, and is fixed using the high bonding agent of heat resisting temperature, thus with the light-emitting component that uses solder
The installation of 43c is compared, and heat resisting temperature can be set to height, can further realize high current supply and high brightness.
As shown in fig. 7, the wiring pattern 42 being formed on glass epoxy layer 41c is covered by resist layer 46, but
By the not formed resist layer 46 in the position of the other end wire bonding of metal wire 45a.Metal wire 45a is whole by light absorption resin
Portion 45 seals, and is filled in the wire bonding position at the both ends of metal wire 45a and the top and lower part of metal wire 45a.Light absorption
Resin portion 45 is adjacent to be formed with light reflective resin portion 43d in the wire bonding position of subassembly substrate 43a.It is saved in Fig. 7
The slightly diagram of adhesive sheet 41b.
It is not mounted in via glass epoxy layer 41c as described above, subassembly 43 is carried in region 49 in illumination region
Metal plate 41a, the height dimension of the light-emitting component of subassembly 43 are greater than the thickness of glass epoxy layer 41c.Herein, sub
Assembly 43 light-emitting component height dimension refer to from the bottom surface of subassembly substrate 43a to the upper surface of light-emitting component 43c away from
From e.g. 1.3mm or so.
In the light source module 40 of present embodiment, since the height of subassembly 43 is greater than glass epoxy layer 41c's
Thickness, therefore, the light of subassembly 43 take out the top that face, that is, upper surface light-emitting component 43c is located at glass epoxy layer 41c.By
This, can prevent the light irradiated from subassembly 43 to be injected into the side of glass epoxy layer 41c and be blocked, can be well
It takes out light and light irradiation is carried out with desired light distribution characteristic.
In the light source module 40 of present embodiment, with adhesive sheet 41b by metal plate 41a and glass epoxy layer
After 41c fitting, optical component fixed part 48 is formed from the back side punch process of mounted board 41.Glass epoxy layer
When the thickness of 41c is 0.05mm~0.2mm, preferably 0.075mm~0.15mm, generated in metal plate 1a when punch process
Flash can be inhibited by glass epoxy layer 41c, can be by critically aligned in position and the fixation of optical component, that is, reflector 30.
Fig. 8 is the amplification view that amplification shows that illumination region carries 49 periphery of region.As shown in figure 8, light absorption resin
Portion 45 seals multiple metal wire 45a together, and the lead key of subassembly 43 is covered from the wire bonding position of wiring pattern 42
Coincidence is set, and is formed and is arrived the position adjacent with light reflective resin portion 43d.In addition, subassembly 43 is multiple along left and right directions arrangement,
And two column are adjacent to configuration in above-below direction, constitute light source portion of the invention.
In the light source portion that subassembly 43 is arranged in upper and lower two column, light-emitting component 43c is also arranged as two column, shown in Fig. 8
Line L2 is the illuminated centerline for showing the middle position of two column light-emitting component 43c.Illuminated centerline L2 with by light shown in fig. 5
The line L1 for learning the center connection of component fixing section 48 is roughly the same, in the extension of the illuminated centerline L2 of a plurality of light-emitting elements 43c
On line, it is fixed with optical component i.e. reflector 30.
In the light source module 40 of present embodiment, due to the line L1 and son for connecting the center of optical component fixed part 48
The illuminated centerline L2 of assembly 43 is roughly the same, therefore, even if inferior the case where mounted board 41 generates warpage, by sending out
Reflector 30 is engaged on light center line L2 to reduce warpage, can suitably set the positional relationship of light source portion and optical component.
In addition, illumination region can be made to carry region when engaging mounted board 41 and reflector 30 including comprising radiator 50 together
49 back side is close to radiator, can obtain heat dissipation characteristics same as the mounted board 41 of not warpage.
The wire bonding position of wiring pattern 42 carries upper following setting in the figure in region 49 along illumination region, relative to figure
In above-listed subassembly 43 top is by metal wire 45a wire bonding from figure, relative to subassembly 43 following in figure from figure
Lower section is by metal wire 45a wire bonding.So first row and secondary series light-emitting component 43c are located at the metal connecting with first row
Between line 45a and the metal wire 45a being connect with secondary series.
In Vehicular lamp 100 of the invention, via power-feed connector 44, wiring pattern 42, metal wire 45a, subassembly
It is routed 43b, light-emitting component 43c is selectively supplied electric power from outside, light-emitting component 43c is lighted.Constituting the multiple of light source portion
In subassembly 43, the light-emitting component 43c selected is lighted, thus determine light source portion it is whole with light distribution, via reflector 30
It is two-dimensional with optical mode to irradiating in front of Vehicular lamp 100 using ADB technology with lens 10.
(second embodiment)
Next, illustrating second embodiment of the present invention using Fig. 2.It is omitted with the duplicate content of first embodiment
Explanation.In the present embodiment, it can be also applicable in the case where not using ADB technology.The composition and light source of Vehicular lamp 100
The composition of module 40 is same as first embodiment, omits the description.
Fig. 9 is the chart for showing the synthesis brightness of adjacent light-emitting component 43c in second embodiment, and Fig. 9 (a) is
The distance for showing light-emitting component 43c is remote and synthesize the inadequate example of brightness, Fig. 9 (b) be show light-emitting component 43c distance it is close and
Synthesize the sufficient example of brightness.Horizontal axis in figure shows the position of the longitudinal direction along subassembly 43, and the longitudinal axis shows brightness.Figure
In dotted line the brightness from 1 light-emitting component 43c light irradiated is shown, the solid line in figure is shown from 2 adjacent light-emitting components
The synthesis brightness of the light of 43c irradiation.
In the case that the side distance between the surface d1 of adjacent light-emitting component 43c shown in Fig. 6 is more than 0.6mm, such as Fig. 9 (a)
Shown, the peak value for synthesizing brightness is small, and several % or so are improved compared with the brightness irradiated from 1 light-emitting component 43c.By making side
Distance between the surface d1 is 0.6mm hereinafter, as shown in Fig. 9 (b), and the peak value for synthesizing brightness increases, and irradiates with from 1 light-emitting component 43c
Brightness compare, can be improved 20% or more.In particular, in the case where applicable ADB technology, due to selecting light-emitting component 43c
Selecting property is lighted to be lighted with non-, and critically controls irradiation area and non-irradiated region, and therefore, the synthesis brightness of irradiation area is high
When, it can be improved the contrast with non-irradiated region, be preferred.
In the case that distance between the surface d1 is less than 0.1mm in side, the light reflective resin portion of the side of light-emitting component 43c is filled
The thickness low LCL of 43d, light lead to brightness itself decline from 1 light-emitting component 43c light irradiated from side leakage.Separately
Outside, light causes synthesis brightness that can also decline from side leakage.In particular, lighting light-emitting component in the applicable ADB choice of technology
In the case where 43c, it is possible to cause from the light of side leakage in the same manner as luminous from non-lit up light-emitting component 43c according to
It penetrates, it is difficult to irradiate desired two-dimensional with optical mode.
By the case where including a plurality of light-emitting elements 43c in subassembly 43 as the light source module 40 of present embodiment and
A previous LED chip as distance between the light-emitting component 43c in the case where chip size package (CSP) and is synthesized bright
The relationship of degree is as shown in table 1.Using previous chip size package and the case where light-emitting component interval is set as 0.6mm
Under synthesis brightness be 100, relative value is shown.
[table 1]
As shown in table 1, it is 100 that 0.6mm is divided into previous chip size package, between light-emitting component, synthesizes brightness,
Between be divided into 0.2mm, synthesis brightness be 119.On the other hand, in the subassembly of present embodiment 43, the side of light-emitting component 43c
Between distance d1 be 0.6mm, synthesis brightness is 112, is divided into 0.2mm, synthesis brightness is 140, be divided into 0.1mm, synthesis brightness
It is 147.
So the side distance between the surface d1 of light-emitting component 43c preferably exists in the light source module 40 of present embodiment
The range of 0.1mm~0.6mm.The mutual interval the mutual light-emitting component 43c of multiple subassemblies 43 similarly preferably 0.1mm~
The range of 0.6mm.Side distance between the surface d1 by be in the range, so as to prevent light from side leakage and improve synthesis it is bright
Degree.In addition, can be improved the contrast of irradiation area and non-irradiated region, and good in the case where applying ADB technology
Ground irradiation is desired two-dimensional with optical mode.
The present invention is not limited to above-mentioned each embodiments, can make various changes in the range shown in claim,
Different embodiments embodiment obtained from disclosed technical solution is appropriately combined respectively is also contained in technology of the invention
In range.
Claims (5)
1. a kind of light source module characterized by comprising
Subassembly is formed with subassembly wiring on a surface；
A plurality of light-emitting elements are carried along a first direction in subassembly wiring；And
Light reflective resin portion is filled between the adjacent light-emitting component, and the side of the light-emitting component is sealed,
Range of the side distance between the surface of the adjacent light-emitting component in 0.1mm~0.6mm.
2. light source module as described in claim 1, which is characterized in that
Multiple subassemblies are arranged as the first row extended in the first direction.
3. light source module as claimed in claim 2, which is characterized in that
Further, multiple subassemblies are adjacent to row with the first row as the secondary series extended in the first direction
Column.
4. light source module as claimed in claim 3, which is characterized in that
It is connected with each corresponding metal wire of light-emitting component and subassembly wiring,
The light-emitting component of the first row and the secondary series is located at the metal wire and the company for being connected to the first row
It is connected between the metal wire of the secondary series.
5. a kind of Vehicular lamp, which is characterized in that
Described in any item light source modules including Claims 1-4,
Multiple light-emitting components are selectively supplied electric power.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2017143551A JP7053184B2 (en) | 2017-07-25 | 2017-07-25 | Vehicle lighting |
| JP2017-143551 | 2017-07-25 |
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| CN201810829803.6A Pending CN109296989A (en) | 2017-07-25 | 2018-07-25 | Light source module and Vehicular lamp |
| CN201821192281.5U Active CN208901314U (en) | 2017-07-25 | 2018-07-25 | Light source module and Vehicular lamp |
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| CN201821192281.5U Active CN208901314U (en) | 2017-07-25 | 2018-07-25 | Light source module and Vehicular lamp |
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| CN (2) | CN109296989A (en) |
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| CN112071828A (en) * | 2019-06-10 | 2020-12-11 | 联嘉光电股份有限公司 | Fine line type LED light-emitting device |
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| EP3883071A4 (en) | 2019-02-21 | 2022-01-26 | Fujikura Ltd. | Fiber laser device |
| WO2021002158A1 (en) | 2019-07-04 | 2021-01-07 | 日亜化学工業株式会社 | Method for manufacturing light emitting device and method for manufacturing light emitting module, and light emitting device and light emitting module |
| JP7037078B2 (en) * | 2019-07-04 | 2022-03-16 | 日亜化学工業株式会社 | Manufacturing method of light emitting device and manufacturing method of light emitting module, as well as light emitting device and light emitting module |
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Also Published As
| Publication number | Publication date |
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| JP7053184B2 (en) | 2022-04-12 |
| CN208901314U (en) | 2019-05-24 |
| JP2019029366A (en) | 2019-02-21 |
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