CN207049819U - Vehicular illumination device and lamps apparatus for vehicle - Google Patents

Abstract

The utility model provides a kind of Vehicular illumination device and lamps apparatus for vehicle that can improve the bond strength between heat transfer part and lamp socket.Vehicular illumination device involved by embodiment possesses：Lamp socket, it has the recess in a side end face opening of the lamp socket；Substrate, it is provided with light-emitting component；Heat transfer part, its is plate-like, and the heat transfer part is arranged between the bottom surface of the recess of the substrate and the lamp socket；First adhesive portion, it is arranged between the bottom surface of the recess and the heat transfer part；Convex portion, it is arranged on the bottom surface of the recess, and the maintaining part that the convex portion is remained set on the first sidepiece and the second sidepiece relative with first sidepiece of the heat transfer part.

Description

Vehicular illumination device and lamps apparatus for vehicle

Technical field

Embodiment of the present utility model is related to a kind of Vehicular illumination device and lamps apparatus for vehicle.

Background technology

There is a kind of Vehicular illumination device to possess lamp socket and illuminating part, the illuminating part is arranged on a side end of lamp socket and tool There is light emitting diode (LED：Light Emitting Diode).

Also, the heat transfer part of the tabular made of aluminium etc. is additionally provided between lamp socket and illuminating part sometimes.Generally, in lamp The layer being made up of heat-conducting silicone grease is provided between seat and heat transfer part.Also, the sidepiece of heat transfer part is provided with fixed part.Fixed part With the stationary plane that lamp base part is more leaned on positioned at the upper surface than heat transfer part.Moreover, lamp socket is provided with convex portion, and by convex The leading section in portion carries out ultrasonic wave melting, the leading section of convex portion is contacted with the stationary plane of fixed part.That is, the periphery quilt of heat transfer part The convex portion for being arranged on lamp socket is kept.

Also, the layer being made up of bonding agent or heat-conducting silicone grease etc. is provided between heat transfer part and illuminating part.

If setting heat transfer part between lamp socket and illuminating part, caused heat is easily transferred to lamp socket in illuminating part.So And to set the layer being made up of heat-conducting silicone grease between lamp socket and heat transfer part and keeping passing using the convex portion for being arranged on lamp socket The periphery in hot portion, then need to set the larger fixed part of planar dimension in heat transfer part, thus the area of the upper surface of heat transfer part subtracts Few amount equivalent to fixed part.That is, the contact area between heat transfer part and illuminating part diminishes.Therefore, it is possible to it can cause to light The thermal diffusivity in portion reduces.

Now, if heat transfer part is adhered into lamp socket, the area of the upper surface of heat transfer part can be increased.However, only make biography Hot portion is adhered to lamp socket, it is possible to the bond strength between heat transfer part and lamp socket can be caused to decline.

On the other hand, connecing between heat transfer part and lamp socket can also be improved even if heat transfer part is bonded in into lamp socket by expecting that research and development are a kind of Close the technology of intensity.

Patent document 1：Japanese Unexamined Patent Publication 2013-247062 publications

The content of the invention

The technical problems to be solved in the utility model is to provide a kind of engagement that can be improved between heat transfer part and lamp socket The Vehicular illumination device and lamps apparatus for vehicle of intensity.

Vehicular illumination device involved by embodiment possesses：Lamp socket, it has opens in a side end face of the lamp socket The recess of mouth；Substrate, it is provided with light-emitting component；Heat transfer part, its is plate-like, and the heat transfer part is arranged on the substrate and institute Between the bottom surface of the recess for stating lamp socket；First adhesive portion, it is arranged between the bottom surface of the recess and the heat transfer part； Convex portion, it is arranged on the bottom surface of the recess, and the convex portion remain set at the heat transfer part the first sidepiece and with institute State the maintaining part on the second relative sidepiece of the first sidepiece.

Wherein, the maintaining part on the 3rd sidepiece intersected with first sidepiece of the heat transfer part is arranged at is at least In a part, first adhesive portion is also equipped with.

Wherein, the maintaining part be arranged to its thickness with towards the outside of the heat transfer part and it is thinning.

Wherein, the surface of the substrate-side of the maintaining part is arranged on the surface of the substrate-side than the heat transfer part More lean on the bottom surface side of the recess.

Wherein, the Vehicular illumination device is also equipped with the second adhesive portion, and second adhesive portion is arranged on the substrate Between the heat transfer part, second adhesive portion includes the resin identical resin included with first adhesive portion.

Wherein, second adhesive portion includes the filler phase being made up of inorganic material included with first adhesive portion Same filler.

Lamps apparatus for vehicle involved by embodiment possesses：Above-mentioned Vehicular illumination device；Framework, shone for the vehicle Bright device installation.

According to embodiment of the present utility model, it is strong that a kind of engagement that can be improved between heat transfer part and lamp socket can be provided The Vehicular illumination device and lamps apparatus for vehicle of degree.

Brief description of the drawings

Fig. 1 is illustrative for the schematic isometric of the Vehicular illumination device 1 involved by present embodiment.

Fig. 2 is the signal exploded view of Vehicular illumination device 1.

Fig. 3 is the line A-A sectional view of Vehicular illumination device 1 in Fig. 1.

Fig. 4 is the signal enlarged drawing in the B portions in Fig. 3.

Fig. 5 is illustrative for the schematic isometric of the maintaining part 40f involved by other embodiment.

Fig. 6 is illustrative for the schematic sectional view of the maintaining part 40g involved by other embodiment.

Fig. 7 is illustrative for the schematic isometric of the maintaining part 40g involved by other embodiment.

Fig. 8 (a) to Fig. 8 (c) is illustrative for the schematic isometric of the maintaining part 40h involved by other embodiment.

Fig. 9 is illustrative for convex portion 11c schematic diagram.

Figure 10 is illustrative for convex portion 11c schematic diagram.

Figure 11 is illustrative for convex portion 11e schematic isometric.

Figure 12 is illustrative for the diagrammatic cross-section fragmentary of lamps apparatus for vehicle 100.

In figure：1- Vehicular illumination devices, 10- lamp sockets, 10c- adhesive portions, 10d- adhesive portions, 10e- vestiges portion, 10f- glue Socket part, 11- installation portions, 11a- recesses, 11a1- bottom surfaces, 11b- recesses, 11c- convex portions, 11e- convex portions, 12- engaging pins, 20- hairs Light portion, 21- substrates, 22- light-emitting components, 30- power supplies, 31- power supply terminals, 40- heat transfer parts, 40a- sidepieces, 40b- protuberances, 40c- hole portions, 40d- sidepieces, 40e- sidepieces, 40f~40h- maintaining parts, 100- lamps apparatus for vehicle, 101- frameworks.

Embodiment

Hereinafter, embodiment is illustrated referring to the drawings.In addition, in the drawings, identical constitutive requirements are marked Identical symbol and appropriate detailed description will be omitted.

(Vehicular illumination device)

Vehicular illumination device 1 involved by present embodiment is such as can be arranged at automobile or rail vehicle.As The Vehicular illumination device 1 of automobile is arranged at, such as front combination lamp can be used in (for example, daytime running lamps (DRL： Daytime Running Lamp), side-marker lamp, the appropriately combined Assembled lamp together such as steering indicating light), rear combination lamp is (for example, stop The appropriately combined Assembled lamp together such as car light, taillight, steering indicating light, back-up lamp, fog lamp) etc..But Vehicular illumination device 1 Purposes be not only defined in this.

Fig. 1 is illustrative for the schematic isometric of the Vehicular illumination device 1 involved by present embodiment.

Fig. 2 is the signal exploded view of Vehicular illumination device 1.

Fig. 3 is the line A-A sectional view of Vehicular illumination device 1 in Fig. 1.

Fig. 4 is the signal enlarged drawing in the B portions in Fig. 3.

As shown in Figures 1 to 4, Vehicular illumination device 1 is provided with lamp socket 10, illuminating part 20, power supply 30 and heat transfer part 40。

Lamp socket 10 has installation portion 11, engaging pin 12, flange 13 and fin 14.

Installation portion 11 be arranged at flange 13 with being provided with the surface of side opposite side of fin 14.Installation portion 11 Outer shape can be column.The outer shape of installation portion 11 for example can be cylindric.Installation portion 11 have with flange The recess 11a of the end face opening of 13 side opposite side.

Also, installation portion 11 as shown in Figures 1 and 2, is provided with least one otch 11d.Otch 11d runs through installation portion Between 11 outer surface and the inner surface (recess 11a side wall 11a2) of installation portion 11.Also, otch 11d side End face opening with flange 13 side opposite side of the end in installation portion 11.At the otch 11d angle for being internally provided with substrate 21 Portion.Sizes (width dimensions) of the otch 11d in the circumference of installation portion 11 is more slightly larger than the size in the corner of substrate 21.Therefore, lead to The inside that the corner of substrate 21 is inserted in otch 11d is crossed, substrate 21 can be positioned.

Also, by setting otch 11d, the flat shape of substrate 21 can be increased.Substrate is installed on therefore, it is possible to increase The quantity of element on 21.Or the appearance and size of installation portion 11 can be reduced, it is thus possible to realize the small-sized of installation portion 11 Change, and then the miniaturization of Vehicular illumination device 1 can be realized.

The outer surface of installation portion 11 is provided with multiple engaging pins 12.Multiple engaging pins 12 are to Vehicular illumination device 1 It is protruding outside.Multiple engaging pins 12 stand facing each other with flange 13.Vehicular illumination device 1 is being installed on vehicle by multiple engaging pins 12 Used during with the framework 101 of light fixture 100.Multiple engaging pins 12 are used as twistlock.

Flange 13 is plate-like.Flange 13 for example can be in discoideus.The outer surface of flange 13 is located at than engaging pin 12 Outer surface more leans on the outside of Vehicular illumination device 1.

Multiple fin 14 are provided with the surface of the side opposite side with being provided with installation portion 11 of flange 13.It is more Individual fin 14 can be arranged parallel to each other.Multiple fin 14 can be in tabular.

Also, lamp socket 10 is provided with hole 10a and the hole 10b connected with hole 10a.In hole, 10a's is internally provided with Insulation division 32.Connector 105 with seal member 105a is inserted in hole 10b.Therefore, hole 10b cross sectional shape corresponds to tool There is the cross sectional shape of seal member 105a connector 105.

Caused heat is mainly delivered to fin via heat transfer part 40, installation portion 11 and flange 13 in illuminating part 20 14.The heat for being delivered to fin 14 mainly discharges from fin 14 to outside.

Accordingly, it is considered to to transmit caused heat in illuminating part 20 to outside, preferably by the higher material of thermal conductivity factor Lamp socket 10 is made.The higher material of thermal conductivity factor is such as can use high-termal conductivity resin.High-termal conductivity resin for example, exists Mixing is by inorganic in the resin such as PET (Polyethylene terephthalate/ polyethylene terephthalates) or nylon The resin that the filler that material is formed forms.The filler being made up of inorganic material can be for example used by the higher oxidation of thermal conductivity factor The filler of the composition such as aluminium or carbon.If making lamp socket 10 using high-termal conductivity resin, can effectively discharge in illuminating part 20 Caused heat, and lightweight can be realized.

Wrapping resiniferous lamp socket 10 can be molded by injection molding method.However, due to being added in high-termal conductivity resin There is the filler being made up of inorganic material, thus its mobility declines sometimes.Therefore, if being included using injection molding method to be formed The lamp socket 10 of high-termal conductivity resin, it is likely that it is bad that the shaping such as lack of fill or contraction can be produced.If in recess 11a bottom surface 11a1 produces contraction, then easily produces space between heat transfer part 40 and recess 11a bottom surface 11a1, this can cause thermal conductivity Decline, and then the radiating that may result in illuminating part 20 is substantially hindered.

Now, if making high-termal conductivity resin from metal die, equivalent to recess 11a the bottom surface 11a1's of injection molding Part is flowed into metal die, then can suppress to produce contraction in recess 11a bottom surface 11a1.But with being arranged on injection Vestige portion 10e will be produced on the position of cast gate connection on the metal die of shaping.That is, produced in recess 11a bottom surface 11a1 Raw vestige portion 10e.Vestige portion 10e is projection, recess, shaggy region etc..If trace be present in recess 11a bottom surface 11a1 Mark portion 10e, it is likely that the undesirable conditions such as the inclination of heat transfer part 40 occur.Although vestige portion can be removed using machining etc. 10e, still, the increase of manufacturing cost can be caused by removing vestige portion 10e.

Therefore, recess 11b is set in recess 11a bottom surface 11a1, and vestige portion 10e is arranged on to recess 11b bottom surface. The region openings that are provided with heat transfer part 40 of the recess 11b in bottom surface 11a1.Recess 11b inside is filled with bonding agent.In recess The 11b part for being internally provided with adhesive portion 10c (equivalent to one of the first adhesive portion).That is, in recess 11a bottom surface Between 11a1 and heat transfer part 40 and in recess 11b inside, adhesive portion 10c is provided with.If setting recess 11b, can add Bond strength between big recess 11a bottom surface 11a1 and heat transfer part 40.

Here, due to being filled with bonding agent in recess 11b inside, therefore, the recess on recess 11a bottom surface 11a1 The thermal conductivity of the part of 11b openings gets lower than the thermal conductivity for the part for being not provided with recess 11b.Therefore, the meeting when that will be powered The configurations such as light-emitting component 22, resistance 23 and the control element 24 of heating on the base plate (21 when, preferably by these element configurations into It is not overlapping with recess 11b during vertical view.That is, when recess 11b is arranged on vertical view not on the position overlapping with light-emitting component 22.Recess When 11b is arranged on vertical view not on the position overlapping with resistance 23 and control element 24.

In addition, recess 11b shape, size, quantity etc. are not limited to illustrate, can suitably be changed.

Illuminating part 20 has substrate 21, light-emitting component 22, resistance 23, control element 24, frame portion 25 and sealing 26.

As shown in figure 3, substrate 21 is arranged on heat transfer part via adhesive portion 10d (equivalent to one of the second adhesive portion) 40.That is, substrate 21 is adhered to the surface of the side of substrate 21 of heat transfer part 40.Substrate 21 is in tabular.The flat shape example of substrate 21 It such as can be quadrangle.The material or structure of substrate 21 are simultaneously not particularly limited.For example, can by ceramics (for example, aluminum oxide or Aluminium nitride etc.) etc. the organic material such as inorganic material, paper phenol or glass epoxide etc. substrate 21 is made.Also, substrate 21 can also It is the substrate formed with Ins. ulative material clad metal plate surface.In addition, in the feelings with Ins. ulative material clad metal plate surface Under condition, Ins. ulative material can be the Ins. ulative material being made up of organic material or the insulation being made up of inorganic material Property material.It is preferably higher using thermal conductivity factor from the angle of radiating in the case where the caloric value of light-emitting component 22 is higher Material substrate 21 is made.The material higher as thermal conductivity factor, can include the ceramics such as aluminum oxide or aluminium nitride, high-termal conductivity Resin, the material formed with Ins. ulative material clad metal plate surface etc..Also, substrate 21 can be that single layer structure can also be Sandwich construction.

Also, the surface of substrate 21 is provided with Wiring pattern 21a.Wiring pattern 21a for example can be by being main with silver The material of composition is formed.Wiring pattern 21a can for example be formed by silver or silver alloy.But Wiring pattern 21a material is not only It is limited to the material using silver as main component.Wiring pattern 21a as using copper as the material of main component such as can also form.

Light-emitting component 22 is arranged on the side opposite with recess 11a bottom surface 11a1 sides of substrate 21.Light-emitting component 22 is set Put on the base plate (21.The Wiring pattern 21a on surface of the light-emitting component 22 with being arranged at substrate 21 is electrically connected.Light-emitting component 22 is for example Can be light emitting diode, Organic Light Emitting Diode, laser diode etc..Light-emitting component 22 can be provided with multiple.Multiple hairs Optical element 22 can be serially connected.Also, light-emitting component 22 is connected in series with resistance 23.

Light-emitting component 22 can be the light-emitting component of shaped like chips.The light-emitting component 22 of shaped like chips can utilize COB (Chip On Board/ chip on boards) technology is packaged.Consequently, it is possible to more light-emitting components 22 can be set in narrow region. Therefore, it is possible to realize the miniaturization of illuminating part 20, and then the miniaturization of Vehicular illumination device 1 can be realized.Light-emitting component 22 Electrically connected via distribution 21b with Wiring pattern 21a.For example, terminal conjunction method can be utilized by light-emitting component 22 and Wiring pattern 21a is electrically connected.

In addition, light-emitting component 22 can be the light-emitting component of surface installing type or the luminous member with leaded bullet cut Part.

Resistance 23 is arranged on the side opposite with recess 11a bottom surface 11a1 sides of substrate 21.Resistance 23 is arranged at substrate On 21.The Wiring pattern 21a on surface of the resistance 23 with being arranged at substrate 21 is electrically connected.Resistance 23 for example can be surface installing type Resistor, with leaded resistor (metal-oxide film resistor), by silk screen print method etc. and formed membranaceous electricity Hinder device etc..In addition, the resistance 23 illustrated in Fig. 1 and Fig. 2 is membranaceous resistor.

The material of membranaceous resistor can for example use ruthenium-oxide (RuO₂).For example, can utilize silk screen print method and Calcination method forms membranaceous resistor.If resistance 23 is membranaceous resistor, can increase between resistance 23 and substrate 21 Contact area, therefore thermal diffusivity can be improved.Also, multiple resistance 23 can be formed by singlepass.Therefore, it is possible to carry High production rate, and there is deviation in the resistance value that can suppress multiple resistance 23.

Here, there is fluctuation in the forward voltage characteristic of light-emitting component 22, therefore, if by between anode terminal and ground terminal Application voltage be set to constant, then brightness (luminous flux, brightness, luminous intensity, the photograph of the light irradiated from light-emitting component 22 Degree) fluctuation can be produced.Therefore, the value for the electric current for flowing through light-emitting component 22 is adjusted in defined scope by resistance 23, from And make the light that light-emitting component 22 irradiated brightness fall into as defined in scope.Now, by changing the resistance value of resistance 23, It can will flow through the value control of the electric current of light-emitting component 22 within the limits prescribed.

In the case where resistance 23 is for the resistor of surface installing type or with leaded resistor etc., according to light-emitting component 22 forward voltage characteristic selects the resistance 23 with proper resistor value.In the case where resistance 23 is membranaceous resistor, By removing a part for resistance 23, resistance value can be increased.For example, by irradiating laser to resistance 23, can easily remove A part for resistance 23.The quantity of resistance 23, size, configuration etc. are not limited to illustrate, can be according to the number of light-emitting component 22 Appropriate quantity, size, configuration for changing resistance 23 such as amount or specification etc..

Control element 24 is arranged on the side opposite with recess 11a bottom surface 11a1 sides of substrate 21.Control element 24 is set Put on the base plate (21.The Wiring pattern 21a on surface of the control element 24 with being arranged on substrate 21 is electrically connected.Control element 24 is set Purpose be, do not allow backward voltage to be applied to light-emitting component 22 and do not allow reverse impulsive noise to put on light-emitting component 22。

Control element 24 for example can be diode.Control element 24 for example can be diode, the band of surface installing type Leaded diode etc..The control element 24 illustrated in Fig. 1 and Fig. 2 is the diode of surface installing type.

In addition, in order to detect the broken string of light-emitting component 22 or in order to prevent mistake from lighting, pull down resistor can also be set. Also, the covering portion of covering Wiring pattern 21a or membranaceous resistor etc. can also be set.Covering portion can for example include glass Material.

In the case where light-emitting component 22 is the light-emitting component of shaped like chips, frame portion 25 and sealing 26 can be set.

Frame portion 25 is arranged on the side opposite with recess 11a bottom surface 11a1 sides of substrate 21.Frame portion 25 is arranged on substrate On 21.Frame portion 25 is adhered to substrate 21.With annular shape, multiple luminous members are for example configured with the inner side of frame portion 25 for frame portion 25 Part 22.That is, frame portion 25 surrounds multiple light-emitting components 22.Frame portion 25 is formed from a resin.Resin can for example use PBT (polybutylene terephthalate/ polybutylene terephthalate (PBT)s), PC (polycarbonate/ makrolon), PET, nylon (Nylon), PP (polypropylene/ polypropylene), PE (polyethylene/ polyethylene), PS Thermoplastic resins such as (polystyrene/ polystyrene).

And it is possible to the particle of mixed oxidization titanium etc. is so as to improving to the anti-of the light emitted by light-emitting component 22 in resin Penetrate rate.In addition, mixture is not limited solely to the particle of titanium oxide, as long as mixing to the light emitted by light-emitting component 22 with higher The particle of the material of reflectivity.Also, frame portion 25 can also for example be made up of white resin.

The internal face of frame portion 25 is set to inclined plane, and the inclination is towards with the center from substrate 21 away from and away from frame portion 25 The direction of axle tilts.Therefore, a part for the light projected from light-emitting component 22 can be by the internal face reflection of frame portion 25 and towards car Projected with the front of lighting device 1.That is, frame portion 25 can have the function and speculum of the forming range for determining sealing 26 concurrently Function.

Sealing 26 is arranged on the inner side of frame portion 25.Sealing 26 in a manner of covering the inner side of frame portion 25 to set.That is, it is close Envelope portion 26 is arranged on the inner side of frame portion 25, and covering luminous element 22 and distribution 21b etc..Sealing 26 is by with translucency Material is formed.Sealing 26 for example can be by forming in the inner side potting resin of frame portion 25.The filling of resin for example can be with Use the device for discharging fixed quantity of liquid such as point gum machine.The resin of filling is such as can use silicone resin.

Also, sealing 26 can include fluorophor.Fluorophor for example can be fluorophor (yttrium-aluminium-garnet system of YAG systems Fluorophor).But it is also possible to suitably change the species of fluorophor, so that purposes according to Vehicular illumination device 1 etc. obtains institute Desired illuminant colour.

Also, frame portion 25 can also be not provided with and sealing 26 is only set.In the case where only setting sealing 26, in base Dome-type sealing 26 is provided with plate 21.

Power supply 30 has power supply terminal 31 and insulation division 32.

Power supply terminal 31 can be clava.Power supply terminal 31 protrudes from recess 11a bottom surface 11a1.Power supply terminal 31 is set It is equipped with multiple.Multiple power supply terminals 31 can be along prescribed direction spread configuration.Multiple power supply terminals 31 are arranged on insulation division 32 It is internal.Insulation division 32 is arranged between power supply terminal 31 and lamp socket 10.Multiple power supply terminals 31 extend in the inside of insulation division 32, And protruded from the end face of the end face of the side of illuminating part 20 of insulation division 32 and the side of fin 14 of insulation division 32.Multiple power supply terminals The end of 31 side of illuminating part 20 electrically connects and mechanically connected with being arranged at the Wiring pattern 21a of substrate 21.That is, power supply terminal 31 A side end be brazed in Wiring pattern 21a.The end of the side of fin 14 of multiple power supply terminals 31 is interior exposed to hole 10b's Portion.Connector 105 is entrenched in multiple power supply terminals 31 exposed to hole 10b inside.Power supply terminal 31 is conductive.Power supply Terminal 31 such as can the metal as copper alloy be made.In addition, the quantity of power supply terminal 31, shape, configuration, material etc. not only limit In illustration, can suitably be changed.

As described above, it is preferred to lamp socket 10 is made by the higher material of thermal conductivity factor.However, the higher material of thermal conductivity factor has When it is conductive.For example, high-termal conductivity resin comprising the filler being made up of carbon etc. is conductive.Therefore, in order to supply Insulation is kept between electric terminal 31 and conductive lamp socket 10 and insulation division 32 is set.Also, insulation division 32, which also has, to be protected Hold the function of multiple power supply terminals 31.In addition, in lamp socket 10 by the high-termal conductivity resin with insulating properties (for example, comprising by making pottery High-termal conductivity resin of filler etc. that porcelain is formed) made of in the case of, it is convenient to omit insulation division 32.Now, kept by lamp socket 10 Multiple power supply terminals 31.

Insulation division 32 has insulating properties.Insulation division 32 can be formed by the resin with insulating properties.Insulation division 32 for example may be used To be formed by PET or nylon etc..Insulation division 32 can be for example pressed into being arranged in the hole 10a of lamp socket 10, or can be adhered to Hole 10a inwall.

Heat transfer part 40 is arranged between substrate 21 and recess 11a bottom surface 11a1.Heat transfer part 40 is set via adhesive portion 10c On recess 11a bottom surface 11a1.That is, heat transfer part 40 is adhered to recess 11a bottom surface 11a1.

Adhesive portion 10c and above-mentioned adhesive portion 10d can be by being solidified to form bonding agent.The species of bonding agent not by It is particularly limited to, it is preferred that using the higher bonding agent of thermal conductivity factor.For example, bonding agent can be to be mixed with by inorganic material structure Into filler bonding agent.Inorganic material is preferably using the higher material of thermal conductivity factor (for example, aluminum oxide or aluminium nitride etc. are made pottery Porcelain).The thermal conductivity factor of bonding agent can for example be set to more than 0.5W/ (mK) and 10W/ (mK) below.Also, form bonding The bonding agent used during portion 10c preferably uses the bonding agent identical bonding agent used during with forming adhesive portion 10d.By using Identical bonding agent, adhesive portion 10c include the resin identical resin included with adhesive portion 10d.Adhesive portion 10c is included with gluing The filler identical filler that what socket part 10d was included be made up of inorganic material.

By using identical bonding agent, can in a painting process coating adhesive.Also, bonding can also be made The condition (for example, hardening time, solidification temperature etc.) of the curing process of agent is identical.Thereby, it is possible to realize the raising of productivity ratio.

It is in order that caused heat is transmitted as readily to lamp socket 10 in illuminating part 20 to set heat transfer part 40.Therefore, heat transfer part 40 are preferably made up of the higher material of thermal conductivity factor.Heat transfer part 40 is such as can the metal system as aluminium, aluminium alloy, copper, copper alloy Into.

As shown in Fig. 2 heat transfer part 40 is plate-like.Sidepiece 40a in the side of power supply terminal 31 of heat transfer part 40 can be provided with Protuberance 40b.Protuberance 40b protrudes from the sidepiece 40a of heat transfer part 40.In the sidepiece 40a shapes by protuberance 40b and heat transfer part 40 Into space in be provided with multiple power supply terminals 31.Now, heat transfer part 40 does not contact with multiple power supply terminals 31.

If setting protuberance 40b, the contact area between substrate 21 and heat transfer part 40 can be increased, and can increase Contact area between recess 11a bottom surface 11a1 and heat transfer part 40.Therefore, caused heat is transmitted as readily in illuminating part 20 Lamp socket 10.Now, when that will be powered the resistance 23 that can generate heat and the configuration of the grade of control element 24 on the base plate (21 when, preferably by resistance 23 and control element 24 at least one party be arranged on position overlapping with protuberance 40b during vertical view.For example, illustrated in Fig. 2 Control element 24 is arranged on position overlapping with protuberance 40b during vertical view.Consequently, it is possible to even if by resistance 23 or control element 24 Etc. the periphery for the side of power supply terminal 31 for being arranged on substrate 21, caused heat also easily transmits in resistance 23 or the grade of control element 24 To lamp socket 10.Thereby, it is possible to improve the configuration free degree of resistance 23 or the grade of control element 24.

Also, as it appears from the above, a side end of power supply terminal 31 is brazed in the Wiring pattern 21a for being arranged on substrate 21.This When, if substrate 21 is brazed flatiron pressing and bent to recess 11a bottom surface 11a1 sides, occur that soldering is bad.By setting Put protuberance 40b, protuberance 40b can supporting substrates 21, therefore can suppress to produce soldering bad.

Protuberance 40b quantity can be more than one, still, if setting multiple protruding portion 40b, be produced in illuminating part 20 Raw heat is easier to be delivered to lamp socket 10.Also, as shown in Fig. 2 if the both sides of multiple power supply terminals 31 when overlooking are set Protuberance 40b is put, then easily suppresses substrate 21 and is bent to recess 11a bottom surface 11a1 sides, and then can easily suppress to produce pricker Weld bad.

And it is possible to hole portion 40c is set in heat transfer part 40.Thickness directions of the hole portion 40c along heat transfer part 40 is (with heat transfer part 40 The vertical direction of interarea) run through heat transfer part 40.Bonding agent is filled with hole portion 40c inside.For example, it is coated with by bonding agent In recess 11a bottom surface 11a1 and when heat transfer part 40 is placed on the bonding agent having been coated with, bonding agent is filled in hole portion 40c's It is internal.Or when bonding agent is coated on heat transfer part 40, bonding agent is filled in hole portion 40c inside.By making bonding agent Solidification, formation adhesive portion 10c and adhesive portion 10d, and adhesive portion 10c and adhesive portion 10d are via formation in hole portion 40c inside Adhesive portion 10f and link together.That is, an adhesive portion 10f side end is connected with adhesive portion 10c.Adhesive portion 10f's is another Side end is connected with adhesive portion 10d.

Also, in the case of the filler being made up of inorganic material is mixed with bonding agent, adhesive portion 10c, adhesive portion 10d And adhesive portion 10f includes resin and the filler being made up of inorganic material.

If setting hole portion 40c, adhesive portion 10c and adhesive portion 10d can be made to be linked together via adhesive portion 10f, because This can increase the bond strength between recess 11a bottom surface 11a1 and heat transfer part 40.Therefore, even if not to the week of heat transfer part 40 Edge is kept, and can also be suppressed heat transfer part 40 and is stripped.Further, it is possible to the planar dimension of heat transfer part 40 is easily increased, thus The thermal diffusivity of illuminating part 20 can be improved.

If increasing hole portion 40c quantity or increasing hole portion 40c size (sectional area), bond strength can be increased.But It is that, if hole portion 40c quantity is excessive or hole portion 40c size is excessive, caused heat in illuminating part 20 may be suppressed and passed It is delivered to lamp socket 10.Therefore, hole portion 40c quantity or big can be suitably determined according to desired bond strength and thermal conductivity It is small.For example, can be by being tested or model test suitably determines hole portion 40c quantity or size.

Also, due to being filled with bonding agent, thus the portion for being provided with hole portion 40c of heat transfer part 40 in hole portion 40c inside The thermal conductivity divided gets lower than the thermal conductivity of the part for being not provided with hole portion 40c of heat transfer part 40.Therefore, will can sent out when being powered The configuration such as light-emitting component 22, resistance 23 and control element 24 of heat on the base plate (21 when, preferably by these element configurations into bowing Apparent time is not overlapping with hole portion 40c.

Also, hole portion 40c sectional dimension can be set to constant, the section of the hole portion 40c side of substrate 21 can also be set to The sectional dimension of bottom surface 11a1 side of the size more than hole portion 40c.For example, as shown in figure 4, hole portion 40c can be set to its section Size gradually increases with the surface towards the side of substrate 21 of heat transfer part 40.If the sectional dimension of the hole portion 40c side of substrate 21 It is larger, then easily suppress heat transfer part 40 and be stripped.

And it is possible to heat transfer part 40 and power supply terminal 31 side opposite side sidepiece 40d (equivalent to the 3rd sidepiece One), the sidepiece 40e that intersects with sidepiece 40d (equivalent to one of the first sidepiece and the second sidepiece) and protuberance 40b side Maintaining part 40f is set at least one sidepiece in portion.

For example, as shown in Figures 3 and 4, maintaining part 40f can be arranged on sidepiece 40d and sidepiece 40e.Also, maintaining part 40f can be rake.Be set to the maintaining part 40f of rake thickness with towards the outside of heat transfer part 40 and it is thinning.Protecting Hold and be provided with adhesive portion 10c at least a portion of portion 40f inclined plane (side surface).

By setting maintaining part 40f, the surface of the bottom surface 11a1 sides of heat transfer part 40 can be made to be more than the substrate of heat transfer part 40 The surface of 21 sides.Thereby, it is possible to increase the bond strength between recess 11a bottom surface 11a1 and heat transfer part 40.Also, by Adhesive portion 10c is set in maintaining part 40f inclined plane, heat transfer part 40 can be suppressed and be stripped.

Fig. 5 is illustrative for the schematic isometric of the maintaining part 40f involved by other embodiment.

The maintaining part 40f illustrated in Fig. 3 and Fig. 4 is protruded laterally from the sidepiece of heat transfer part 40, still, as shown in figure 5, protecting The portion 40f of holding can also be arranged on the more inner side position of ratio sidepiece of heat transfer part 40.Now, maintaining part 40f inclined plane can be set Put on a part of region of the sidepiece of heat transfer part 40, in the whole region for the sidepiece that heat transfer part 40 can also be arranged on.Also, Multiple maintaining part 40f can also be set in a sidepiece of heat transfer part 40.

Fig. 6 is illustrative for the schematic sectional view of the maintaining part 40g involved by other embodiment.

It can be set at least one sidepiece in the sidepiece 40d of heat transfer part 40, sidepiece 40e and protuberance 40b sidepiece Put maintaining part 40g.

As shown in fig. 6, the surface of the maintaining part 40g side of substrate 21 is arranged on the surface of the side of substrate 21 than heat transfer part 40 more By recess 11a bottom surface 11a1 sides.Adhesive portion is provided with least a portion in the surface of the maintaining part 40g side of substrate 21 10c。

By setting maintaining part 40g, the surface of the bottom surface 11a1 sides of heat transfer part 40 can be made to be more than the substrate of heat transfer part 40 The surface of 21 sides.Thereby, it is possible to increase the bond strength between recess 11a bottom surface 11a1 and heat transfer part 40.Also, by Adhesive portion 10c is set on the surface of the maintaining part 40g side of substrate 21, heat transfer part 40 can be suppressed and be stripped.

Fig. 7 is illustrative for the schematic isometric of the maintaining part 40g involved by other embodiment.

The surface of the maintaining part 40g illustrated in Fig. 6 bottom surface 11a1 sides is arranged on and the bottom surface 11a1 sides of heat transfer part 40 Surface identical position.In contrast, the surface of the maintaining part 40g illustrated in Fig. 7 bottom surface 11a1 sides is then arranged on than heat transfer The side of substrate 21 is more leaned on the surface of the bottom surface 11a1 sides in portion 40.That is, maintaining part 40g can be from the convex of the sidepiece protrusion of heat transfer part 40 Portion.Now, maintaining part 40g can be arranged on a part of region of the sidepiece of heat transfer part 40, can also be arranged on heat transfer part 40 Sidepiece whole region on.Also, multiple maintaining part 40g can also be set in a sidepiece of heat transfer part 40.

Furthermore it is possible to which the leading section of the convex portion to being arranged on recess 11a bottom surface 11a1 carries out ultrasonic wave melting, make convex The leading section in portion contacts with maintaining part 40f, 40g, so that heat transfer part 40 is held in convex portion.If however, melted using ultrasonic wave, The inside insertion to recess 11a is then needed to be called loudspeaker (horn) resonator.Therefore, in order to avoid the base of heat transfer part 40 The surface of the side of plate 21 is with horn contact, it is necessary to reduce the surface of the side of substrate 21 of heat transfer part 40.

If in contrast, adhesive portion 10c is set at least a portion of maintaining part 40f, 40g, regardless of heat transfer Contact of the surface of the side of substrate 21 in portion 40 with loudspeaker, therefore the surface of the side of substrate 21 of heat transfer part 40 can be increased.For example, can So that the size on the surface of the side of substrate 21 of heat transfer part 40 is set into identical with the size of substrate 21.Now, as described above, can also The surface of the bottom surface 11a1 sides of heat transfer part 40 is increased, therefore caused heat is transmitted as readily to lamp socket 10 in illuminating part 20.

Fig. 8 (a) to Fig. 8 (c) is illustrative for the schematic isometric of the maintaining part 40h involved by other embodiment.

As shown in Fig. 8 (a) to Fig. 8 (c), maintaining part 40h can also be provided in the recess of the sidepiece of heat transfer part 40.Protecting Hold and adhesive portion 10c is provided with least a portion of portion 40h inside.

Now, as shown in Fig. 8 (a), maintaining part 40h can be that the direction intersected along the thickness direction with heat transfer part 40 extends Groove.As shown in Fig. 8 (b), maintaining part 40h can be provided in the hole of the sidepiece of heat transfer part 40.As shown in Fig. 8 (c), maintaining part 40h can be the groove along the thickness direction extension of heat transfer part 40.Also, maintaining part 40h can be arranged on the sidepiece of heat transfer part 40 A part of region on, in the whole region for the sidepiece that heat transfer part 40 can also be arranged on.Also, can also be in heat transfer part 40 One sidepiece sets multiple maintaining part 40h.When setting multiple maintaining part 40h, multiple maintaining parts can be configured regularly 40h, multiple maintaining part 40h can also be irregularly configured, and size or the mutually different maintaining part of shape can also be set 40h。

By setting maintaining part 40h, the surface of bottom surface 11a1 sides and the substrate of heat transfer part 40 of heat transfer part 40 can be increased The surface of 21 sides.Therefore, it is possible to increase the bond strength between recess 11a bottom surface 11a1 and heat transfer part 40.Also, illuminating part Caused heat is transmitted as readily to lamp socket 10 in 20.If, can moreover, be internally provided with adhesive portion 10c in maintaining part 40h Suppress heat transfer part 40 to be stripped.

In addition, heat transfer part 40 has sidepiece 40d, sidepiece 40e and protuberance 40b sidepiece, and maintaining part 40f~40h is only It is arranged at least one sidepiece in these sidepieces.Now, if being provided with the number of maintaining part 40f~40h sidepiece Quantitative change is more, then is easier suppression heat transfer part 40 and is stripped.If also, set on sidepiece relative to each other maintaining part 40f~ 40h, then it is more prone to suppression heat transfer part 40 and is stripped.

Here, during bonding agent is solidified to form adhesive portion 10c, the position of heat transfer part 40 changes sometimes.Due to Power supply terminal 31 is provided near heat transfer part 40, therefore, if the position of heat transfer part 40 changes, it is likely that can cause Conductive heat transfer part 40 contacts with power supply terminal 31 and produces short circuit.

Therefore, in the present embodiment, the side wall 11a2 and insulation division of bottom surface 11a1, recess 11a in recess 11a At least one upper setting convex portion 11c in 32 side of illuminating part 20.

In addition, when convex portion 11c is arranged on into insulation division 32, end set that can be in the side of substrate 21 of insulation division 32 is convex Portion 11c, the side of substrate 21 of insulation division 32 can also be made prominent from recess 11a bottom surface 11a1 and form convex portion 11c.

When making the side of substrate 21 of insulation division 32 form convex portion 11c from recess 11a bottom surface 11a1 protrusions, can make absolutely The end of the side of substrate 21 of edge 32 protrudes from recess 11a bottom surface 11a1, and makes its side of power supply terminal 31 with heat transfer part 40 It is opposed.The side of the side of heat transfer part 40 of insulation division 32 can be located at the side of the side of heat transfer part 40 than power supply terminal 31 more by heat transfer The side of portion 40.The end of the side of substrate 21 of insulation division 32 can be located at the surface of the bottom surface 11a1 sides of the recess 11a than heat transfer part 40 More lean on the side of substrate 21.

Convex portion 11c is opposed with the side of power supply terminal 31 of heat transfer part 40.The side of the convex portion 11c side of heat transfer part 40 is located at than supplying The side of heat transfer part 40 is more leaned in the side of the side of heat transfer part 40 of electric terminal 31.The end of the convex portion 11c side of substrate 21 is located at than heat transfer part The side of substrate 21 is more leaned on the surface of 40 recess 11a bottom surface 11a1 sides.

Above-mentioned adhesive portion 10d is arranged between substrate 21 and heat transfer part 40 and substrate 21 and convex portion the 11c side of substrate 21 End between.

When making the side of substrate 21 of insulation division 32 form convex portion 11c from recess 11a bottom surface 11a1 protrusions, above-mentioned bonding Portion 10d is arranged between the end of between the substrate 21 and heat transfer part 40 and side of substrate 21 of substrate 21 and insulation division 32.

Hereinafter, as one, 11c situations about being arranged on recess 11a bottom surface 11a1 in convex portion are illustrated.

Fig. 9 and Figure 10 is illustrative for convex portion 11c schematic diagram.

As shown in FIG. 9 and 10, convex portion 11c is arranged on recess 11a bottom surface 11a1.Convex portion 11c is from recess 11a bottom Face 11a1 is protruded.Convex portion 11c be arranged on when convex portion 11c contacts with heat transfer part 40 can power supply terminal 31 and heat transfer part 40 it Between produce gap position on.

Now, if convex portion 11c to be arranged on to the position opposed with the protuberance 40b of heat transfer part 40, it is likely that Wu Fashi The miniaturization of existing installation portion 11, and then the miniaturization of Vehicular illumination device 1 can not be realized.It is therefore preferable that convex portion 11c is set The opposed position of sidepiece 40a in the side of power supply terminal 31 with heat transfer part 40.

If also, the position of the end of the convex portion 11c side of substrate 21 is set to the surface with the side of the substrate of heat transfer part 40 21 Position it is roughly the same, then can when the end of power supply terminal 31 is brazed on the Wiring pattern 21a for be arranged on substrate 21 Make convex portion 11c supporting substrates 21.That is, it can make convex portion 11c that there is the above-mentioned protuberance 40b function of supporting substrates 21.Therefore, As shown in figure 9, protuberance 40b can be omitted.

If forming the heat transfer part 40 with protuberance 40b by punch process etc., protuberance 40b is sometimes to pressurization Direction is bent.If protuberance 40b is bent, it is likely that when carrying out soldering, substrate 21 is bent and to produce soldering bad.

In contrast, because convex portion 11c is molded by injection molding method, therefore, it is possible to make convex portion 11c substrate The position of the end of 21 sides is stable.Therefore, by setting convex portion 11c, it can suppress to produce short circuit and soldering is bad.

Convex portion 11c quantity, shape are simultaneously not particularly limited, and can suitably be changed.

For example, the convex portion 11c illustrated in Fig. 9 is arranged on hole 10a one side, but convex portion 11c can also be arranged on hole 10a Both sides.In the case that 11c is arranged on hole 10a both sides in convex portion, the heat transfer part 40 without protuberance 40b can be used. If using the heat transfer part 40 without protuberance 40b, the flat shape of heat transfer part 40 can become simple (for example, quadrangle), Therefore the manufacture of heat transfer part 40 becomes easy.

If as described above, convex portion 11c to be arranged on to the position opposed with the side of the power supply terminal of heat transfer part 40 31, can press down System produces short circuit.Moreover, even if shorten the distance between sidepiece 40a and power supply terminal 31 of the side of power supply terminal 31 of heat transfer part 40 Also it can suppress to produce short circuit, therefore the planar dimension of heat transfer part 40 can be increased.Thereby, it is possible to suppress heat transfer part 40 to be shelled From, and caused heat is easily transferred to lamp socket 10 in illuminating part 20.

Also, convex portion 11e can also be set in recess 11a bottom surface 11a1.

Figure 11 is illustrative for convex portion 11e schematic isometric.

As shown in figure 11, convex portion 11e protrudes from recess 11a bottom surface 11a1.As long as convex portion 11e sets more than one i.e. Can, however, it is preferred to set multiple convex portions.Now, convex portion 11e can be arranged on the position opposed with the sidepiece 40e of heat transfer part 40. Also, more than one convex portion 11e can be set for a sidepiece 40e of heat transfer part 40.For example, as shown in figure 11, can be with Set and a convex portion 11e that a sidepiece 40e is opposed and opposed with (relative with sidepiece 40e) another sidepiece 40e Another convex portion 11e.Now, as shown in figure 11, two convex portion 11e opposite each other can be set, and convex portion 11e with it is convex Heat transfer part 40 is set between portion 11e.Convex portion 11e can contact with the sidepiece 40e of heat transfer part 40, or in convex portion 11e and heat transfer There may also be small gap between the sidepiece 40e in portion 40.

Also, the raised part 11c and convex portion 11e opposed with the sidepiece 40d of heat transfer part 40 can also be set simultaneously.May be used also To set and two opposed convex portion 11e of sidepiece 40e of heat transfer part 40 and the convex portion opposed with the sidepiece 40d of heat transfer part 40 simultaneously 11e。

By setting convex portion 11e, the position of the heat transfer part 40 during bonding agent is solidified to form adhesive portion 10c can be suppressed Put and change.

Also, in the case where being provided with maintaining part 40f, 40g, it can melt convex portion 11e front end, make convex portion 11e Front end contacted with maintaining part 40f, 40g, or set between convex portion 11e front end and maintaining part 40f, 40g it is small between Gap.That is, convex portion 11e is made to remain set at a sidepiece 40e of heat transfer part 40 and another sidepiece relative with sidepiece 40e Maintaining part 40f, 40g on 40e.It is stripped consequently, it is possible to which heat transfer part 40 can be suppressed before bonding agent solidification.

In addition, convex portion 11e quantity, size, shape and being not particularly limited, can suitably be changed.

(lamps apparatus for vehicle)

Then, lamps apparatus for vehicle 100 is illustrated.

In addition, the situation that lamps apparatus for vehicle 100 is the front combination lamp for being arranged at automobile is illustrated as one below. But lamps apparatus for vehicle 100 is not limited to be arranged at the front combination lamp of automobile.Lamps apparatus for vehicle 100 can be disposed on vapour The lamps apparatus for vehicle of car or rail vehicle etc..

Figure 12 is illustrative for the diagrammatic cross-section fragmentary of lamps apparatus for vehicle 100.

As shown in figure 12, lamps apparatus for vehicle 100 is provided with Vehicular illumination device 1, framework 101, cover 102, optical element Portion 103, seal member 104 and connector 105.

Framework 101 keeps installation portion 11.Framework 101 is in the box-like of an end side opening.Framework 101 for example can be by not Resin of printing opacity etc. is made.It is provided with the bottom surface of framework 101 partial insertion for being provided with engaging pin 12 for installation portion 11 Mounting hole 101a.The recess inserted for the engaging pin 12 for being arranged at installation portion 11 is provided with mounting hole 101a periphery.In addition, Although tool can also be set in framework 101 exemplified with the situation that mounting hole 101a is directly set in framework 101 herein There is mounting hole 101a installing component.

When Vehicular illumination device 1 is installed on into lamps apparatus for vehicle 100, installation portion 11 is provided with engaging pin 12 In partial insertion mounting hole 101a, and rotate Vehicular illumination device 1.Consequently, it is possible to engaging pin 12, which is maintained at, is arranged at peace In the fitting portion for filling hole 101a periphery.This installation method is referred to as twistlock.

Cover 102 is arranged to cover the opening of framework 101.Cover 102 can be made up of resin with translucency etc..Cover 102 There can also be the function of lens etc..

The light projected from Vehicular illumination device 1 is incident in optical element portion 103.Optical element portion 103 is shone vehicle Light emitted by bright device 1 is reflected, spread, guide-lighting, light harvesting, and light distribution patterns etc. as defined in formation.For example, in Figure 12 The optical element portion 103 of illustration is speculum.Now, optical element portion 103 is carried out to the light emitted by Vehicular illumination device 1 Reflection, so as to form defined light distribution patterns.

Seal member 104 is arranged between flange 13 and framework 101.Seal member 104 can be annular in shape.Seal member 104 can be made up of the flexible material such as rubber or silicone resin.

In the case where Vehicular illumination device 1 is installed on lamps apparatus for vehicle 100, seal member 104 be clipped in flange 13 with Between framework 101.Therefore, the inner space of the closed framework 101 of seal member 104 is passed through.In addition, pass through seal member 104 Elastic force, engaging pin 12 is pressed on into framework 101.Come off therefore, it is possible to suppress Vehicular illumination device 1 from framework 101.

Connector 105 is chimeric with the end of multiple power supply terminals 31 exposed to hole 10b inside.In the electricity of connector 105 It is connected with power supply (not shown) etc..Therefore, by the way that connector 105 to be embedded in the end of power supply terminal 31, by electricity (not shown) Source etc. electrically connects with light-emitting component 22.In addition, connector 105 has step part.Also, seal member 105a is installed on step Part.Seal member 105a is set to prevent water from immersing hole 10b inside.In the connection with seal member 105a In the case that device 105 is inserted in hole 10b, hole 10b is confined to watertight.Seal member 105a can be annular in shape.Seal member 105a can be made up of the flexible material such as rubber or silicone resin.Connector 105 is such as can also be by bonding agent And it is adhered on the important document of the side of lamp socket 10.

More than, some embodiments of the present utility model are illustrated, but these embodiments are merely illustrative, The intention of utility model scope is not limited.These new embodiments can by it is other it is various in a manner of implement, do not departing from In the range of the utility model aims, various omissions, displacement, change etc. can be carried out.These embodiments or its variation belong to In in the scope of the utility model or objective, and it is also contained in the utility model described in technical scheme and its equivalent scope It is interior.In addition, above-mentioned each embodiment can also be mutually combined implementation.

Claims (7)

1. a kind of Vehicular illumination device, it is characterised in that possess：

Lamp socket, it has the recess in a side end face opening of the lamp socket；

Substrate, it is provided with light-emitting component；

Heat transfer part, its is plate-like, and the heat transfer part is arranged between the bottom surface of the recess of the substrate and the lamp socket；

First adhesive portion, it is arranged between the bottom surface of the recess and the heat transfer part；

Convex portion, it is arranged on the bottom surface of the recess, and the convex portion remain set at the heat transfer part the first sidepiece and Maintaining part on the second sidepiece relative with first sidepiece.

2. Vehicular illumination device according to claim 1, it is characterised in that

In at least a portion for the maintaining part being arranged on the 3rd sidepiece intersected with first sidepiece of the heat transfer part, It is also equipped with first adhesive portion.

3. Vehicular illumination device according to claim 1 or 2, it is characterised in that

The maintaining part be arranged to its thickness with towards the outside of the heat transfer part and it is thinning.

4. Vehicular illumination device according to claim 1 or 2, it is characterised in that

The surface of the substrate-side of the maintaining part is arranged on the surface of the substrate-side than the heat transfer part more by described The bottom surface side of recess.

5. Vehicular illumination device according to claim 1 or 2, it is characterised in that

The Vehicular illumination device is also equipped with the second adhesive portion, and second adhesive portion is arranged on the substrate and the heat transfer Between portion,

Second adhesive portion includes the resin identical resin included with first adhesive portion.

6. Vehicular illumination device according to claim 5, it is characterised in that

Second adhesive portion includes the filler identical filler being made up of inorganic material included with first adhesive portion.

7. a kind of lamps apparatus for vehicle, it is characterised in that possess：

The Vehicular illumination device described in any one in claim 1 to 6；

Framework, installed for the Vehicular illumination device.