JP6269702B2 - Method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a method for manufacturing a light emitting device.

  Light-emitting diodes (LEDs) that are attracting attention as next-generation light sources are extremely superior in energy saving compared to existing light sources and can be used for a long time. For this reason, application markets for backlights, automobiles, electrical boards, traffic signal lights, and other general illumination lamps are spreading throughout the industry.

As a light-emitting device using an LED, a device using a light-emitting element mounted on a mounting substrate having wiring is known (for example, Patent Document 1).
In such a light-emitting device, a light-emitting element is mounted on a single collective substrate having a size corresponding to a plurality of sizes, and the light-emitting element is covered with a resin member, and then the resin member and the collective substrate are cut into individual pieces. It can be efficiently manufactured by separating into pieces.

In Patent Document 1, in order to ensure high front luminance, a light-transmitting material containing a light emitting element on a substrate and a phosphor that is disposed above the light emitting element and converts the wavelength of light from the light emitting element is disclosed. A light emitting device including a phosphor layer made of a member and a reflective resin disposed adjacent to the side surface of the phosphor layer and the side surface of the light emitting element is described.
Patent Document 1 describes that a light emitting device is manufactured by the following procedure. First, a plurality of light emitting elements are arranged in a matrix on an aggregate substrate having a plurality of sizes, and a semiconductor element such as a protective element is disposed between the light emitting elements. Next, after arranging the phosphor layer on the light emitting element, the side surfaces of the light emitting element and the phosphor layer are covered with a reflective resin. Then, the light emitting device is separated into pieces by cutting the reflective resin and the collective substrate between the light emitting element and the semiconductor element. Further, in Patent Document 1, a reflective resin is formed by filling a liquid resin around a light emitting element, a phosphor layer, and a semiconductor element by using a resin discharge device, and then heating to cure the resin. It is described that.

JP 2014-112635 A

The method for manufacturing a light emitting device described in Patent Document 1 can be manufactured at low cost because it does not use a mold. However, in order to suppress the so-called “sink” that occurs due to curing shrinkage of the resin. A protective element is disposed between the light emitting elements.
However, there is a case where the semiconductor element cannot be arranged at an appropriate place for suppressing “sink” between the light emitting elements, such as a light emitting device that does not require a protective element. For this reason, it may be difficult to stably form the height of the reflective resin.
An object of an embodiment of the present invention is to provide a method for manufacturing a light emitting device capable of forming a resin member in a stable shape.

  A method of manufacturing a light emitting device according to an embodiment of the present invention includes a step of mounting a plurality of light emitting elements on a collective substrate, and at least one light transmissive member for each light emitting device on an upper surface of the plurality of light emitting elements. A first convex member surrounding the plurality of light emitting elements on the upper surface of the collective substrate, and a second convex shape between the plurality of light emitting elements on the upper surface of the collective substrate. After the step of arranging a member, the step of arranging the first convex member, and the step of arranging the second convex member, the second convex shape is formed in a region surrounded by the first convex member. A step of forming a covering member that covers an upper end of the member and a side surface of the light emitting element and the translucent member; and a position including the second convex member, the covering member, the second convex member, and the The light emitting device is separated into pieces by dividing the collective substrate. And the second convex member has an upper end lower than an upper end of the first convex member and higher than an upper surface of the light emitting element in a region surrounded by the first convex member. The second convex member is harder than the covering member.

  According to the method for manufacturing the light emitting device according to the embodiment of the present invention, the covering member that is a resin member can be formed in a stable shape.

It is a perspective view which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is a top view which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the IC-IC line of FIG. 1B. It is sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the ID-ID line | wire of FIG. 1B. It is a flowchart which shows the procedure of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a top view which shows the semiconductor element mounting process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the semiconductor element mounting process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the IIIB-IIIB line | wire of FIG. 3A. It is sectional drawing which shows the semiconductor element mounting process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the IIIC-IIIC line | wire of FIG. 3A. It is sectional drawing which shows the translucent member arrangement | positioning process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the position corresponded to the IIIB-IIIB line | wire of FIG. 3A. It is sectional drawing which shows the translucent member arrangement | positioning process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the position corresponded to the IIIC-IIIC line | wire of FIG. 3A. It is a top view which shows the convex member arrangement | positioning process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the convex member arrangement | positioning process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the VB-VB line | wire of FIG. 5A. It is sectional drawing which shows the convex member arrangement | positioning process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the VC-VC line of FIG. 5A. It is a top view which shows an example of the supply method of the uncured resin material used as the 1st convex member and the 2nd convex member in the convex member arrangement | positioning process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the underfill formation process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the position corresponded to the IIIB-IIIB line | wire of FIG. 3A. It is sectional drawing which shows the underfill formation process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the position corresponded to the IIIC-IIIC line | wire of FIG. 3A. It is sectional drawing which shows the coating | coated member formation process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the position corresponded to the IIIB-IIIB line | wire of FIG. 3A. It is sectional drawing which shows the coating | coated member formation process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the position corresponded to the IIIC-IIIC line | wire of FIG. 3A. It is a top view which shows an example of the supply method of the uncured resin material used as a coating | coated member in the coating | coated member formation process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a top view which shows the individualization process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the individualization process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the XB-XB line | wire of FIG. 10A. It is sectional drawing which shows the individualization process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the XC-XC line | wire of FIG. 10A. It is a perspective view which shows the structure of the light-emitting device which concerns on the modification of 1st Embodiment. It is a top view which shows the structure of the light-emitting device which concerns on the modification of 1st Embodiment. It is a top view which shows the structure of the light-emitting device which concerns on 2nd Embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on 2nd Embodiment, and shows the cross section in the XIIB-XIIB line | wire of FIG. 12A. It is sectional drawing which shows the underfill formation process in the manufacturing method of the light-emitting device which concerns on 2nd Embodiment, and shows the cross section in the position corresponded to the XIIB-XIIB line | wire of FIG. 12A. It is sectional drawing which shows the coating | coated member formation process in the manufacturing method of the light-emitting device which concerns on 2nd Embodiment, and shows the cross section in the position corresponded to the XIIB-XIIB line | wire of FIG. 12A.

  Hereinafter, a light emitting device according to an embodiment will be described with reference to the drawings. Note that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity. Moreover, the dimension and arrangement position of each member may not exactly match in the plan view and the corresponding sectional view. Further, in the following description, the same name and reference sign indicate the same or the same member in principle, and the detailed description is omitted as appropriate.

<First Embodiment>
[Configuration of light emitting device]
The configuration of the light emitting device according to the first embodiment will be described with reference to FIGS. 1A to 1D.
FIG. 1A is a perspective view showing the configuration of the light emitting device according to the first embodiment. FIG. 1B is a plan view showing the configuration of the light emitting device according to the first embodiment. FIG. 1C is a cross-sectional view showing the configuration of the light emitting device according to the first embodiment, and shows a cross section taken along the line IC-IC in FIG. 1B. FIG. 1D is a cross-sectional view showing the configuration of the light emitting device according to the first embodiment, and shows a cross section taken along the line ID-ID in FIG. 1B.

The light emitting device 100 according to the first embodiment includes a flat mounting substrate 1 that is substantially rectangular in plan view, and four light emitting elements 2 that are mounted on the upper surface side of the mounting substrate 1 and have a substantially rectangular shape in plan view. And four translucent members 3 having a substantially rectangular shape in plan view provided on the upper surface of each light emitting element 2, and side surfaces of the light emitting element 2 and the translucent member 3 provided on the upper surface of the mounting substrate 1. And a covering member 8 for covering the main body. The light emitting device 100 has a substantially rectangular parallelepiped shape, and a part of the upper surface of the mounting substrate 1 has a region where the covering member 8 is not provided, and the region is an external connection that is a terminal for connecting to an external power source. A portion 12a is provided.
In a plan view, a first convex member 61 is disposed on one side of the rectangular shape and a second convex member 62 is disposed on the other three sides at the outer edge of the substantially rectangular covering member 8. That is, in FIG. 1B, the first convex member 61 is disposed on the lower side of the outer edge of the substantially rectangular covering member 8, the second convex member 62a is disposed on the upper side, and the second convex member 62b is disposed on the right side and the left side. ing. The covering member 8 is formed using a light-shielding material, preferably a light-reflecting resin, and the upper surface of the translucent member 3 is a light extraction surface of the light emitting device 100 (that is, the light emitting surface of the light emitting device 100). .
The light emitting device 100 according to the first embodiment includes a plurality of light emitting elements 2, and further includes one translucent member 3 on each of the upper surfaces of the plurality of light emitting elements 2. That is, the light emitting device 100 includes a plurality of light emitting surfaces, and the covering member 8 is disposed between the plurality of translucent members 3 in plan view. Thereby, when the some light emitting element 2 is lighted separately, the light leakage between adjacent light emission surfaces can be suppressed.
Hereinafter, each member will be described in detail.

(Mounting board)
The mounting substrate 1 includes a flat plate-like support member 11 and wirings 12 arranged on the upper surface of the support member 11. The light-emitting element 2 and the protection element 4 are mounted, and a predetermined electric circuit is mounted. The wiring 12 is arranged so as to be configured. A part of the wiring 12 is exposed from the covering member 8, and the exposed part is an external connection part 12 a that is a terminal for connecting to the outside. In the present embodiment, five external connection parts 12a are provided, and by controlling the voltage applied to these external connection parts 12a, four light emitting elements 2 mounted on the mounting substrate 1 are individually provided. The wiring 12 is configured so that it can be driven.

The support member 11 is preferably made of an insulating material, and is preferably made of a material that hardly transmits light emitted from the light emitting element 2 or external light. Moreover, it is preferable to use a material having a certain degree of strength. Specific examples include ceramics such as alumina, aluminum nitride, and mullite, phenol resins, epoxy resins, polyimide resins, BT resin (bismaleimide triazine resin), polyphthalamide (PPA), and the like. Further, it is preferable that at least the region where the light emitting element 2 is mounted on the upper surface of the support member 11 has good light reflectivity. For example, a metal such as Ag or Al or a white resin containing a white pigment is used. A light reflection layer may be provided.
The wiring 12 is provided on the upper surface of the support member 11 and can be formed using, for example, a metal such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, Ni, or an alloy thereof. Such wiring 12 can be formed by electrolytic plating, electroless plating, vapor deposition, sputtering, or the like. Further, for example, when Au bumps are used for mounting the light emitting element 2, the bonding property with the light emitting element is improved by using Au for the outermost surface of the wiring.

  In addition, the number of the light emitting elements 2 mounted on the mounting substrate 1 may be one or more. In addition, the wiring 12 includes, for example, two external connection portions 12a as a pair of wiring patterns, and a plurality of wirings between the two external connection portions 12a, even when a plurality of light emitting elements 2 are mounted. The light emitting elements 2 may be connected in series or in parallel.

(Light emitting element)
The light emitting element 2 has, for example, a substantially rectangular shape in plan view, includes a translucent substrate and a semiconductor stacked body, and includes a pair of electrodes on the surface of the semiconductor stacked body.
The light emitting element 2 preferably has a pair of positive and negative electrodes on the same surface side. Thereby, the light emitting element 2 can be flip-chip mounted on the mounting substrate 1. In this case, a surface facing the surface on which the pair of electrodes is formed is a main light extraction surface of the light emitting element. When the light emitting element 2 is mounted face up on the mounting substrate 1, the surface on which the pair of electrodes are formed is the main light extraction surface of the light emitting element.

The light emitting element 2 can select the thing of arbitrary wavelengths. For example, the blue-green light-emitting element 2 can be selected from ZnSe, nitride semiconductors (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), and GaP. . As the red light-emitting element 2, a nitride semiconductor represented by GaAlAs and AlInGaP can be preferably used. Furthermore, a semiconductor light emitting element made of a material other than these can also be used. The composition, emission color, size, number, and the like of the light-emitting element 2 to be used can be appropriately selected according to the purpose.

(Translucent member)
The translucent member 3 is bonded to the upper surface of the light emitting element 2 by using a translucent bonding member 52. The translucent member 3 is made of a material that can transmit light emitted from the light emitting element 2 and extract the light to the outside. Further, the side surface of the translucent member 3 is covered with the covering member 8, and when the covering member 8 has light shielding properties, the upper surface of the translucent member 3 is the light extraction surface (light emitting surface) of the light emitting device 100. It becomes.
In the present embodiment, the translucent member 3 has a substantially rectangular shape larger than the light emitting element 2 in a plan view, and is disposed so as to include a region where the light emitting element 2 is disposed. The translucent member 3 may have a lens shape on the upper surface side, but preferably has a plate shape in which the covering member 8 covering the side surface is difficult to climb. A lens may be provided on the upper surface of the plate-like translucent member 3. Further, the light transmissive member may be smaller than the light emitting element 2 in plan view, for example.

The translucent member 3 may contain a light diffusing material or a wavelength converting substance (for example, a phosphor) that converts at least a part of light incident from the light emitting element 2 into light having a different wavelength. Specifically, as the translucent member 3 containing the wavelength converting substance, phosphor powder is contained in a resin, glass, other inorganic materials, etc., such as a phosphor sintered body or YAG glass. Things can be mentioned. The sintered body of the phosphor may be formed by sintering only the phosphor, or may be formed by sintering a mixture of the phosphor and the sintering aid. When sintering a mixture of a phosphor and a sintering aid, it is preferable to use an inorganic material such as silicon oxide, aluminum oxide, or titanium oxide as the sintering aid. Thereby, even if the light emitting element 2 has high output, discoloration and deformation of the sintering aid due to light and heat can be suppressed.
The translucent member 3 is more preferable as the transparency is higher. The thickness of the translucent member 3 is not particularly limited and can be appropriately changed. For example, the thickness of the translucent member 3 can be about 50 to 300 μm.

As the phosphor, a phosphor used in this field can be appropriately selected. For example, phosphors that can be excited by blue light emitting elements or ultraviolet light emitting elements include yttrium-aluminum-garnet phosphors activated with cerium (Ce: YAG), and lutetium-aluminum-garnet phosphors activated with cerium. (Ce: LAG), nitrogen-containing calcium aluminosilicate phosphors activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ), silicate phosphors activated with europium ((Sr, Ba) ₂ SiO ₄ ), β sialon phosphors, CASN phosphors, nitride phosphors such as SCASN phosphors, KSF phosphors (K ₂ SiF ₆ : Mn), sulfide phosphors, quantum dot phosphors Etc. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured. In the case of the light emitting device 100 capable of emitting white light, the light emitting device 100 is adjusted to be white depending on the type and concentration of the phosphor contained in the translucent member 3. The density | concentration of the fluorescent substance contained in the translucent member 3 is about 5-50 mass%, for example.
Examples of the light diffusing material that can be contained in the translucent member 3 include titanium oxide, barium titanate, aluminum oxide, and silicon oxide.

(Protective element)
The light emitting device 100 may include a semiconductor element (for example, a protective element) different from the light emitting element 2. The protection element 4 is provided to protect the light emitting element 2 from electrostatic discharge. A Zener diode can be suitably used for the protection element 4. One protective element 4 is provided corresponding to each light emitting element 2, but only one protective element 4 may be provided, and the protective element 4 may not be provided depending on the use of the light emitting device.

  When a semiconductor element other than the light emitting element 2 such as the protection element 4 or a transistor for driving and controlling the light emitting element 2 is provided on the mounting substrate 1, the other semiconductor element is connected to the light emitting element 2 and the second element. It is preferable to arrange between the first convex member 61 or the second convex member 62. In particular, when the covering member 8 is formed by disposing the translucent member 3 and the first convex member 61 or the second convex member 62 at the most distant place, the covering member 8 is formed. It is possible to more effectively suppress the liquid level of the uncured resin material to be formed.

(Joining member)
The joining member 51 is a conductive member for mechanically and electrically joining the light emitting element 2 to the wiring 12 provided on the upper surface of the mounting substrate 1.
When the light emitting element 2 is flip-chip mounted on the mounting substrate 1, a metal bump made of a metal material such as Au, Ag, Cu, Al, such as a wire bump or a plating bump, can be used as the bonding member 51. The metal bumps may be provided in advance to be bonded to the n-side electrode and the p-side electrode of the light emitting element 2 or each wiring 12 before the light emitting element 2 is bonded to the mounting substrate 1. In this case, the light emitting element 2 can be bonded to the mounting substrate 1 by an ultrasonic bonding method.
Further, as the bonding member 51, a solder such as an AuSn alloy or a Sn-based lead-free solder may be used. In this case, the light emitting element 2 can be bonded to the mounting substrate 1 by a reflow method.
Further, as the bonding member 51, a conductive adhesive in which conductive particles are contained in a resin can be used.
When the light emitting element 2 is mounted face-up on the mounting substrate 1, it is not always necessary to use a conductive member for joining the light emitting element 2 and the mounting substrate 1, and the light emitting element 2 is made of a light-transmitting material such as a silicone resin. It can be bonded onto the mounting substrate 1 using a resin. In this case, the pair of electrodes of the light emitting element 2 is electrically joined to the wiring 12 using a conductive wire or the like.

The bonding member 52 is a member for bonding the translucent member 3 to the upper surface of the light emitting element 2. The bonding member 52 preferably has translucency, and an organic adhesive such as a silicone resin or an epoxy resin, or an inorganic adhesive such as a low-melting glass can be used. Further, by arranging the bonding member 52 not only on the upper surface of the light emitting element 2 but also on the side surface of the light emitting element 2, light emitted from the side surface of the light emitting element 2 is transmitted through the bonding member 52. Therefore, the light extraction efficiency can be improved.
The light emitting element 2 and the translucent member 3 may be joined by direct joining such as pressure bonding, sintering, a hydroxyl group joining method, a surface activated joining method, and an atomic diffusion bonding method. .

(First convex member)
The first convex member 61 constitutes one side of the rectangular shape of the covering member 8 provided in a substantially rectangular shape in plan view on the upper surface of the mounting substrate 1. Specifically, the first convex member 61 is provided on the lower side of the covering member 8 provided in a substantially rectangular shape in plan view in FIG. 1B. As shown in FIGS. 1C and 1D, the first convex member 61 has a height position H3 at the upper end of the first convex member 61 higher than a height position H1 at the upper surface of the light emitting element 2, And it is formed so that it may become higher than the position H2 of the height direction in the upper end of the 2nd convex-shaped member 62. FIG. Moreover, it is preferable that the 1st convex-shaped member 61 is formed in the height where the position H3 of the height direction in an upper end is lower than the position H4 of the height direction in the upper surface of the translucent member 3. With the first convex member 61 having such a configuration, when the covering member 8 is disposed between the first convex member 61 and the translucent member 3, the covering member 8 is translucent member 3. It is possible to prevent the emission of light from getting on the upper surface of the light.

  The first convex member 61 can be formed using a resin material. As the resin material, a thermosetting resin such as an epoxy resin or a silicone resin can be used. The resin material forming the first convex member 61 may be a transparent resin, and a light-absorbing substance such as a white resin or a black pigment containing a light-reflecting substance such as a white pigment as a light-shielding substance. You may make it use the black resin containing this.

  In the method for manufacturing the light emitting device 100 to be described later, the first convex member 61 is disposed on the aggregate substrate that is an aggregate of the plurality of mounting substrates 1 so that the plurality of light emitting elements 2 are disposed and surround the region. Part of the frame. The first convex member 61 is used as a frame for blocking the spread of the uncured liquid resin material when the covering member 8 is formed, and is formed in close contact with the covering member 8.

(Second convex member)
As shown in FIG. 1B, the second convex member 62 is provided on the upper side, the right side, and the left side of the covering member 8 provided in a substantially rectangular shape in plan view on the upper surface of the mounting substrate 1. Yes. As shown in FIG. 1C and FIG. 1D, the second convex member 62 is configured such that the height direction position H2 at the upper end is higher than the height direction position H1 on the upper surface of the light emitting element 2, and the first convex member. The upper end of 61 is formed to be lower than the position H3 in the height direction.
The upper end of the second convex member 62 is covered with the covering member 8, and the second convex member 62 is formed to be harder than the covering member 8.
The resin used for the second convex member 62 is a resin different from that of the coating member 8 or the amount of filler contained in the resin is increased so that the viscosity of the second convex member 62 before curing is the coating member before curing. The viscosity is adjusted to be higher than 8. Thereby, the hardness of the 2nd convex member 62 after hardening can be made higher than the hardness of the coating | coated member 8 after hardening.
The second convex member 62 can use the above-described transparent resin, white resin, or black resin, similarly to the first convex member 61.

In the method for manufacturing the light emitting device 100 to be described later, the second convex member 62 is the first convex member 61 formed as the above-described frame body on the aggregate substrate that is an aggregate of the plurality of mounting substrates 1. It arrange | positions between the adjacent light emitting elements 2 via the boundary line which is a virtual line which divides the light-emitting device 100 in an area | region. By disposing the second convex member 62 between the adjacent light emitting elements 2 via the boundary lines of the plurality of light emitting devices 100, the covering member 8 is formed as compared with the case where the second convex member 62 is not disposed. In this case, it is possible to suppress the liquid level of the uncured resin material that is liquid. Further, the position of the upper surface of the covering member 8 can be increased by the arrangement of the second convex member 62, and the occurrence of dents (so-called “sink marks”) caused by the curing shrinkage of the resin material can be effectively suppressed. it can. In addition, when the light emitting device 100 is singulated, a part of the covering member 8 to be cut in the thickness direction is replaced with the second convex member 62 that is harder than the covering member 8, and thus more stable. Can be cut into shapes.
For example, when a resin material is used for the covering member 8 and the second convex member 62, the hardness of the covering member 8 and the second convex member 62 depends on the value of the Shore A hardness measured by the durometer type A and the durometer type D. Comparison can be made using the measured Shore D hardness value. For example, the Shore A hardness of the cured covering member 8 is A50 to A65, and the Shore A hardness of the second convex member 62 after curing is A70 to A85. In this case, it can be said that the second convex member 62 is harder than the covering member 8.

(Underfill)
The underfill 7 is filled to a space between the upper surface of the mounting substrate 1 and the lower surface of the light emitting element 2 and is provided up to a height that covers a part of the side surface of the light emitting element 2. The underfill 7 may be formed using a white resin that is provided with light reflectivity by incorporating particles of a light reflective material into a resin having good translucency such as a silicone resin or an epoxy resin. preferable. As the light reflective substance, for example, titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, glass filler and the like can be suitably used.

(Coating member)
The covering member 8 is a member that is provided in a region surrounded by the first convex member 61 and covers the side surface of the light emitting element 2 and the side surface of the translucent member 3. The covering member 8 seals the light emitting element 2 to protect the light emitting element 2 from external force, dust, gas, and the like, and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 2 and the like. Is provided.

The covering member 8 preferably has a light shielding property.
When the covering member 8 has light reflectivity as a light shielding property, the light transmissive member 3 that reflects the light emitted from the side surface of the light emitting element 2 and the side surface of the light transmissive member 3 and is the light emitting surface of the light emitting device. The light can be emitted from the upper surface. For this reason, the light extraction efficiency of the light emitting device 100 can be increased.
When the covering member 8 has light absorptivity as a light shielding property, the light emitted from the side surface of the light emitting element 2 and the side surface of the translucent member 3 is absorbed to suppress light extraction from other than the light emitting surface. it can. For this reason, the light-emitting device 100 with a clear luminance difference between the light-emitting portion (the light-emitting surface of the light-emitting device) and the non-light-emitting portion (the upper surface of the covering member 8) can be obtained.

  The covering member 8 is prone to generate cracks in the vicinity of the translucent member 3 made of YAG glass or the like if the difference in coefficient of thermal expansion between these members is large. Therefore, it is preferable to use a soft resin with relatively low elasticity and excellent shape followability for the covering member 8.

As a material of the covering member 8, a resin material having good permeability and insulation, for example, a thermosetting resin such as an epoxy resin and a silicone resin can be suitably used. Moreover, light reflectivity can be imparted by dispersing particles of a light-reflecting substance similar to that used in the above-described underfill 7 into a base resin to form a white resin. Moreover, light absorption can be imparted by dispersing particles of a light-absorbing substance such as carbon black or graphite in a base resin to obtain a black resin.
The covering member 8 preferably uses the same type of resin as the first convex member 61, the second convex member 62, and the underfill 7. By using the same type of resin as these members, the adhesion between the members can be enhanced.

[Method for Manufacturing Light Emitting Device]
Next, a method for manufacturing the light emitting device according to the first embodiment will be described with reference to FIGS.
In FIG. 3A, only the external connection portion 12 a is shown as the wiring 12, and a wiring pattern that extends from the external connection portion 12 a onto the support member 11 is omitted. In FIG. 3A to FIG. 10C, boundary lines BD1, BD2, and BD3, which are virtual lines that divide the formation scheduled regions of the plurality of light emitting devices 100, are indicated by broken lines. 6 and 9 show a part of the area on the collective substrate 10 in an extracted manner.

The light emitting device manufacturing method according to the present embodiment includes a collective substrate preparing step S11, a light emitting element mounting step S12, a translucent member arranging step S13, a convex member arranging step S14, an underfill forming step S15, The covering member forming step S16 and the individualizing step S17 are included.
Further, the convex member arrangement step S14 includes a first convex member arrangement step S141 and a second convex member arrangement step S142.

The collective substrate preparation step S11 is a step of preparing the collective substrate 10 on which the plurality of mounting substrates 1 are continuously formed. The collective substrate 10 can be manufactured by forming a predetermined pattern of wirings 12 on a flat support member 11 having an area equivalent to a plurality of light emitting devices.
The wiring 12 can be formed by attaching a metal foil such as Cu or Al, applying a paste of metal powder such as Cu or Ag, or plating such as Cu. The wiring 12 can be patterned by an etching method, a printing method, or the like.

  The collective substrate preparation step S11 is not limited to manufacturing the collective substrate 10 by the method as described above, but includes obtaining it by purchase or the like.

The light emitting element mounting step S <b> 12 is a process for mounting the plurality of light emitting elements 2 on the collective substrate 10. In the light-emitting element 2 of the present embodiment, metal bumps are provided in advance as bonding members 51 on the electrodes of the light-emitting element, and are flip-chip mounted at predetermined positions on the wiring 12 using an ultrasonic bonding method. In this step, the protection element 4 is also mounted on the collective substrate 10.
The mounting method is not particularly limited. For example, the light emitting element 2 may be mounted by a reflow method using a solder paste as the bonding member 51.

In the present embodiment, four light-emitting elements 2 and four protection elements 4 are mounted per formation planned area of one light-emitting device partitioned by the boundary line BD1, the boundary line BD2, and the boundary line BD3. Here, the boundary lines BD1 and BD2 define the longitudinal direction of the region where the light emitting device is to be formed, and the boundary line BD3 is a virtual line which defines the short direction of the region where the light emitting device is to be formed. As shown by the location of the external connection portion 12a of the wiring 12, the formation direction regions of the light emitting devices arranged in the short direction (vertical direction in FIG. 3A) are alternately oriented in the vertical direction for each row. It is arranged to change. That is, in the present embodiment, the region where the light emitting device is to be formed is arranged so as to be substantially line symmetric with respect to the boundary line BD2 in a plan view. For this reason, the light emitting elements 2 are arranged on the collective substrate 10 so as to be substantially line symmetric with respect to the boundary line BD2.
In the region where each light emitting device is to be formed, the four light emitting elements 2 having a substantially square shape in plan view are arranged in a line in the longitudinal direction at a substantially central portion in the short direction. The four protective elements 4 are substantially in the center of each light emitting element 2 in the longitudinal direction (lateral direction in FIG. 3A) and external to each light emitting element 2 in the short direction (vertical direction in FIG. 3A). It arrange | positions on the opposite side to the side in which the connection part 12a was provided.

Translucent member arrangement | positioning process S13 is a process of arrange | positioning the at least 1 translucent member 3 for every light-emitting device on the upper surface of the some light emitting element 2. As shown in FIG. The translucent member 3 is joined to the light emitting element 2 using a joining member 52 such as a resin having translucency.
In the case where one light transmissive member 3 is bonded to each of the plurality of light emitting elements 2, the light emitting element mounting step S12 and the light transmissive member arranging step S13 are respectively performed with a predetermined number of light emitting elements 2 and light transmitting members. It can carry out alternately until the optical member 3 is mounted. That is, each time one light emitting element 2 is mounted, the translucent member 3 may be bonded to the upper surface of the light emitting element 2. Thereby, the time from when the light emitting element 2 is mounted to when the translucent member 3 is bonded can be shortened, and the possibility that impurities such as dust are mixed into the upper surface of the light emitting element 2 can be reduced.

  The convex member arrangement step S <b> 14 is a step of arranging the first convex member 61 and the second convex member 62 in a predetermined region on the collective substrate 10. This step includes a first convex member arrangement step S141 and a second convex member arrangement step S142. When a plurality of first convex members 61 are arranged on one collective substrate 10, You may make it perform 1 convex member arrangement | positioning process S141 and 2nd convex member arrangement | positioning process S142 alternately.

The first convex member arrangement step S <b> 141 is a step of arranging the first convex member 61 surrounding the plurality of light emitting elements 2 arranged on the collective substrate 10 on the upper surface of the collective substrate 10. The first convex member 61 is disposed on the upper surface of the collective substrate 10 so as to surround the outer edge of the region where the light emitting element 2 is disposed.
The first convex member 61 is used for blocking the spread of the resin material on the upper surface of the collective substrate 10 when supplying an uncured resin material for forming the covering member 8 in the covering member forming step S16. It is provided as an outer frame.

With reference to the upper surface of the mounting substrate 1, the first convex member 61 is formed such that the upper end is higher than the upper surface of the light emitting element 2 and higher than the upper end of the second convex member 62. Accordingly, when the uncured resin material for forming the covering member 8 is supplied into the region surrounded by the first convex member 61, the liquid level of the resin material becomes higher than the upper surface of the light emitting element 2. Can be filled.
The first convex member 61 is preferably formed so that the upper end is lower than the upper surface of the translucent member 3 with respect to the upper surface of the mounting substrate 1. Thereby, when supplying the uncured resin material for forming the covering member 8, it is possible to suppress the resin material from climbing on the upper surface of the translucent member 3 and inhibiting light emission. Further, by making the first convex member 61 lower than the upper surface of the translucent member 3, unevenness in luminance due to the light emitted from the upper surface of the translucent member 3 being reflected by the upper surface of the covering member 8 is generated. Can be suppressed.

The first convex member 61 is disposed along the outer edge of the predetermined formation region of the covering member 8 for each predetermined formation region of the light emitting device 100.
As shown in FIG. 5A, in this embodiment, for each of the eight light emitting device 100 formation planned areas, four in the horizontal direction and two in the vertical direction, The first convex members 61 are arranged so as to surround the 32 light emitting elements 2 to be mounted. In the present embodiment, three first convex members 61 are arranged on the upper surface of one collective substrate 10.

  The first convex member 61 can be preferably formed using a thermosetting resin. In this case, first, by using a dispenser or the like, the resin material is arranged on the upper surface of the collective substrate 10 along the outer edge of the region composed of the region where the predetermined number of covering members 8 are to be formed. The uncured resin material used at this time is adjusted to have an appropriate viscosity according to the width and height so that the upper end of the resin material after the arrangement can be formed higher than the upper surface of the light emitting element 2. Then, the 1st convex member 61 is formed by heat-processing and hardening a resin material.

The viscosity of the uncured resin material can be adjusted by the amount of solvent used in the resin material or the appropriate amount of filler added.
Further, in the present step, the arrangement of the first convex member 61 includes a case where a resin material that is uncured or preferably temporarily cured is disposed, and is not limited only to the case where the first curing member 61 is completed. .

The second convex member arrangement step S142 is a step of arranging the second convex member 62 between the plurality of light emitting elements 2 on the upper surface of the collective substrate 10. The second convex members 62 are adjacent to each other via boundary lines BD2 and BD3 that divide the region where the light emitting device 100 is to be formed in the region where the first convex members 61 on the upper surface of the collective substrate 10 are disposed. Arranged between the light emitting elements 2.
The second convex member 62 is provided around the light emitting element 2 and the translucent member 3 when supplying an uncured resin material for forming the covering member 8 in the covering member forming step S16. It is provided in order to suppress a decrease in the liquid level of the resin material for forming the film. For this reason, the second convex member 62 is formed such that the upper end is higher than the upper surface of the light emitting element 2 and lower than the upper end of the first convex member 61.

As described above, the covering member 8 is made of a soft resin in order to prevent the occurrence of cracks. However, since the soft resin is soft and easily stretched, the shape of the cut surface may become unstable when the covering member 8 is cut in the singulation step S17.
Therefore, the second convex member 62 that is harder than the covering member 8 is disposed in a part of the covering member 8 in the thickness direction at the position where the covering member 8 is cut in the singulation step S17. Thereby, the stability of the shape of the cut surface can be improved.
In addition, by forming the second convex member 62 lower than the first convex member 61 that is the outer frame, the resin material for forming the covering member 8 is filled in the formation planned region of each light emitting device 100. Easy to do. That is, the covering member 8 can be collectively supplied to the plurality of light emitting devices 100 including the plurality of light emitting elements surrounded by the first convex member 61. This simplifies the manufacturing process.

Here, a specific example of the height of each member will be described.
With reference to the upper surface of the aggregate substrate 10, the height of the upper surface of the light emitting element 2 is set to 170 μm, and the height of the upper surface of the translucent member 3 is set to 350 μm. At this time, the height of the upper end of the first convex member 61 is preferably about 10 to 100 μm lower than the upper surface of the translucent member 3. In addition, the height of the upper end of the second convex member 62 is preferably higher by about 30 to 80 μm than the upper surface of the light emitting element 2. Thereby, it is possible to effectively suppress a decrease in the liquid level of the uncured resin material for forming the covering member 8.

Similarly to the first convex member 61, the second convex member 62 can be preferably formed using a thermosetting resin in the same manner and procedure.
In addition, since the 2nd convex-shaped member 62 is cut | disconnected with a dicing blade etc. in individualization process S17, it is formed so that it may have an appropriate width | variety. For this reason, the resin material is adjusted to an appropriate viscosity according to its width and height. Also, the resin material is adjusted so that the second convex member 62 after curing is selected so that the second convex member 62 is harder than the cured covering member 8 or the filler is contained at an appropriate content. Is done. The viscosity of the second convex member 62 before curing can be, for example, not less than 300 Pa · s and not more than 500 Pa · s.

The first convex member 61 and the second convex member 62a can be integrally formed using the same resin material. An example is shown in FIG.
First, starting from the position (left end side in FIG. 6) that becomes the contact point between the first convex member 61 and the second convex member 62a, the dispenser nozzle is circularly rotated in the order of arrows D1 to D5. The first convex member 61 is arranged by supplying the resin material while moving to. That is, the first convex member 61 is arranged by supplying uncured resin material so as to overlap the collective substrate 10 in two steps.
Then, the 2nd convex-shaped member 62a is arrange | positioned by supplying a resin material, moving the nozzle of a dispenser along the arrow D6 from the position used as the starting point of resin material supply. That is, when the uncured resin material is supplied in one step onto the collective substrate 10, the second convex member 62a having a lower height than the first convex member 61 in which the resin material is stacked in two steps is formed. Be placed.
By doing in this way, the 1st convex member 61 and the 2nd convex member 62a from which height differs can be formed integrally in the way of one-stroke writing, and the efficiency of a process is raised. Can do.
The supply of the resin material for forming the second convex member 62a includes the supply of the first step (that is, the first turn) and the supply of the second step (that is, the second turn) of the first protrusion member 61. Or may be performed before the first stage (that is, the first turn) of the first convex member 61 is supplied. Even if it does in this way, the 1st convex member 61 and the 2nd convex member 62a from which height differs can be continuously arranged in the way of one-stroke writing.
Then, the nozzle of a dispenser is moved and the 2nd convex member 62b is arrange | positioned by supplying the resin material on several boundary line BD3.

In the present embodiment, except for the outer edge portion of the covering member 8 provided with the first protruding member 61, the second protruding member 62a or the second protruding member 62a is formed in the region that becomes the outer edge portion of the covering member 8 in each light emitting device 100. Although the two convex members 62b are arranged, a part thereof may be omitted.
For example, when the translucent member 3 is disposed in the vicinity of the outer edge of the light emitting device 100, that is, when the interval between the translucent members 3 via the boundary line BD3 is narrow, in the covering member forming step S16, an uncured resin When supplying the material, the liquid level of the resin material between the translucent members 3 is hardly lowered. Therefore, for the purpose of ensuring a sufficient height of the covering member 8, the second convex member 62b may be omitted.

  Moreover, when using a thermosetting resin as a resin material of the 1st convex member 61 and the 2nd convex member 62, the 1st convex member 61 and the 2nd convex member 62 which should be provided on the collective substrate 10 are used. You may make it perform the heat processing for main-curing the 1st convex member 61 and the 2nd convex member 62 after arrange | positioning all. Further, when a thermosetting resin is used as the resin material of the covering member 8 to be described later, an uncured resin material for forming the covering member 8 is supplied into the region where the first convex member 61 is disposed. Later, the first convex member 61, the second convex member 62, and the covering member 8 may be combined and subjected to heat treatment for main curing. It is preferable to perform the heat treatment for the main curing in a batch because the process can be made more efficient and the adhesion between the members to be subjected to the main curing can be improved.

The underfill forming step S15 is a step of forming the underfill 7 so as to fill a space between the lower surface of the light emitting element 2 and the upper surface of the mounting substrate 1. The underfill 7 is preferably provided up to a height that covers a part of the side surface of the light emitting element 2, and is preferably provided so as to cover a region near the outside of the light emitting element 2 in plan view.
The underfill 7 can be formed by supplying a white resin that is preferably provided with a light reflecting property by containing a light reflecting material to a region around the light emitting element 2 with a dispenser or the like.
The underfill 7 may be omitted depending on the bonding method of the light emitting element 2 to the mounting substrate 1, but increases light extraction efficiency by returning light leaking from the lower surface side of the light emitting element 2 to the light emitting element 2. It is preferable to provide it.

  Moreover, although underfill formation process S15 may be performed before convex member arrangement | positioning process S14, it is preferable to carry out after convex member arrangement | positioning process S14. By performing the convex member arrangement step S14 first, the first convex member 61 and the second convex member 62 and the mounting substrate 1 can be more closely adhered without interposing the underfill 7. it can.

The covering member forming step S16 is a step of forming the covering member 8 in a region surrounded by the first convex member 61 after the convex member arranging step S14. The covering member 8 is formed so as to cover the side surface of the light emitting element 2 and the side surface of the translucent member 3.
The covering member 8 of the present embodiment is formed using a white resin in which particles of a light-reflecting substance are contained as a light-shielding substance in a light-transmitting resin, but depending on the purpose, the light-reflecting substance Instead of or in addition, a wavelength conversion substance and colored particles for adjusting the color tone, a filler for adjusting the viscosity, and other fillers may be contained. Alternatively, a black resin containing particles of a light absorbing material may be used.
As the resin, a thermosetting resin can be suitably used. In this case, an uncured resin material containing the above-described filler according to the purpose is supplied to the region where the first convex member 61 is disposed by using a suitable dispenser by a potting method, and heat treatment is performed. Then, the covering member 8 can be formed by curing the thermosetting resin.

  The uncured resin material for forming the covering member 8 is such that the resin material covers the side surface of the translucent member 3, preferably up to the upper end, covers the upper end of the second convex member 62, and is transparent. The viscosity and the supply amount are adjusted so as not to rise higher than the upper surface of the optical member 3 and so as not to overflow from the first convex member 61 which is an outer frame that regulates the spread of the resin material. The viscosity of the covering member 8 before curing can be, for example, 1 Pa · s or more and 20 Pa · s or less.

  The light-transmitting member 3 disposed at the end in the longitudinal direction (lateral direction) and the first convex member 61 as the outer frame (see FIG. 8A) or adjacent to the transversal direction (vertical direction). When the distance between the members that regulate the liquid level of the uncured resin material is long, such as between the optical members 3 (see FIG. 8B), the second convex member 62 (62a, 62b) is disposed. It is preferable to do. Accordingly, the liquid level of the uncured resin material disposed between the translucent members 3 can be prevented from being lower than the upper end of the second convex member 62.

  Further, when the light emitting device 100 includes a semiconductor element other than the light emitting element 2 having a certain height like the protection element 4, the other semiconductor element is disposed in the vicinity of the translucent member 3. It is preferable. As a result, a decrease in the liquid level of the resin material in the vicinity of the side surface of the translucent member 3 can be suppressed. In combination with the arrangement of the second convex members 62, another semiconductor element is arranged between the translucent members 3 having a large separation distance, thereby further effectively suppressing a decrease in the liquid level of the uncured resin material. be able to.

  Further, in the present embodiment, an uncured resin material for forming the covering member 8 is supplied from a region in the vicinity of the boundary line BD2 of the region where the light emitting device is scheduled to be partitioned adjacently in the vertical direction in FIG. To do. Thus, it is preferable that the uncured resin material is supplied from a position in the region where the first convex member 61 is disposed and away from any translucent member 3. This can prevent the resin material from adhering to the upper surface of the translucent member 3 when supplying the uncured resin material.

In addition, as indicated by an arrow in FIG. 9, meandering is performed across the planned formation regions of the light emitting devices on both sides of the second convex member 62 a disposed along the boundary line BD 2. It is preferable to supply the uncured resin material from above while moving the nozzle of the dispenser. Thus, the resin material can be continuously supplied to a plurality of regions via the boundary line BD2 by moving the nozzle so as to meander across the boundary line BD2 while supplying the resin material. It becomes. Since the position of the upper end of the second convex member 62a on the boundary line BD2 is lower than the position of the upper end of the first convex member 61, the uncured resin material for forming the covering member 8 is the second convex shape. The members 62 are embedded and are evenly arranged in the region surrounded by the first convex members 61. In this way, the resin material can be evenly supplied into the planned formation region of each light emitting device surrounded by the first convex member 61.
Further, the amount of movement of the nozzle of the dispenser can be reduced by supplying the uncured resin material along the direction (the extending direction of the boundary line BD2) in which more regions where light emitting devices are to be formed are partitioned. And the time for this step can be shortened.

  The singulation step S17 is a step of dividing the covering member 8, the second convex member 62, and the collective substrate 10 at a position including the second convex member 62. The light emitting device 100 can be divided preferably by cutting with a dicing blade. Since the second convex member 62 (62a, 62b) harder than the covering member 8 is provided in the lower layer portion of the covering member 8 in the cutting region, compared to the case where the covering member 8 alone is configured. , Can be divided in a stable shape.

When a material having a different property from resin, such as ceramics, is used as the support member 11 of the mounting substrate 1, the resin composed of the covering member 8 and the second convex member 62 when the light emitting device 100 is separated into pieces. The process may be divided into the layer cutting and the collective substrate 10 cutting, and dicing may be performed using a dicing blade suitable for each.
Further, it may be cut while leaving the end portion of the collective substrate 10. By doing so, the light emitting device 100 is connected until both the boundary lines BD1 and BD2 extending in the horizontal direction and the boundary line BD3 extending in the vertical direction are cut, so that the handling is easy. Become.
In this embodiment, the cutting order may be cut from any of the boundary lines BD1, BD2, and BD3. For example, a relatively soft material is used due to a difference in material or shape. It is preferable to divide the boundary line that is difficult to cut first, such as an area that is asymmetric with respect to the area or the boundary line. Thereby, it can divide | segment more accurately.
The light emitting device 100 can be manufactured by performing the above steps.

<Modification>
Next, a light emitting device according to a modification of the first embodiment will be described with reference to FIGS. 11A and 11B.
FIG. 11A is a perspective view illustrating a configuration of a light-emitting device according to a modification of the first embodiment. FIG. 11B is a plan view showing a configuration of a light emitting device according to a modification of the first embodiment.

  The light emitting device 100A according to the present modification is provided so as to coincide with the outer edge of the mounting substrate 1A on all sides (four sides) of the outer edge of the rectangular covering member 8A in plan view. For this reason, the 2nd convex-shaped member 62 (62a, 62b) is provided along all the sides of the outer edge of the mounting substrate 1A.

  Further, in the light emitting device 100A of the present modified example, the four light emitting elements 2 are arranged in a row as in the light emitting device 100, but the four light emitting elements 3 are replaced with the four light emitting elements 3. One horizontally long translucent member 3 </ b> A having a size including the entire upper surface of 2 is provided. As described above, the number of light-emitting elements and the number of translucent members may be different.

  When the external connection portion cannot be provided on the upper surface of the mounting substrate 1A as in this modification, the external connection portion of the mounting substrate 1A is provided so as to be exposed on the back surface side of the mounting substrate 1A, for example. it can. Wiring portions for mounting the light emitting element 2 and the protection element 4 can be provided in the same manner as the mounting substrate 1 described above. The wiring portion provided on the upper surface side of the mounting substrate 1A and the external connection portion provided on the lower surface side include, for example, a through hole that penetrates the support member in the thickness direction, and a metal is formed in the through hole. It can be configured to be filled with a conductive material such as a conductive material.

The light emitting device 100A according to the modification can be manufactured by changing the manufacturing method of the light emitting device 100 as described below.
In the collective substrate preparation step S11, a collective substrate in which the mounting substrates 1A having the above-described configuration are connected is prepared.
In the translucent member arranging step S <b> 13, one translucent member 3 </ b> A is bonded to the upper surface of a predetermined number (four) of the light emitting elements 2.
In the first convex member arrangement step S141, an area surrounded by the upper boundary line BD1 and the lower boundary line BD1, and the left boundary line BD3 and the right boundary line BD3 in FIG. 5A is further surrounded from the outside. The first convex member 61 is disposed. That is, one first convex member 61 is disposed as an outer frame of a region for supplying an uncured resin material for forming the covering member 8A. In the second convex member arranging step S142, the second convex member 62 is arranged along the boundary line BD1, the boundary line BD2, and the boundary line BD3 in the region where the first convex member 61 is arranged. To do. That is, the 2nd convex-shaped member 62 is arrange | positioned on all the boundary lines which divide the formation plan area | region of each light-emitting device.
In the singulation step S17, the light emitting device 100A is singulated by cutting the covering member 8A, the second convex member 62, and the mounting substrate 1 along the boundary line BD1, the boundary line BD2, and the boundary line BD3. .
The other steps are performed in the same manner as the method for manufacturing the light emitting device 100, whereby the light emitting device 100A can be manufactured.

Second Embodiment
[Configuration of light emitting device]
Next, a light emitting device according to a second embodiment will be described with reference to FIGS. 12A and 12B.
FIG. 12A is a plan view showing the configuration of the light emitting device according to the second embodiment. 12B is a cross-sectional view showing the configuration of the light emitting device according to the second embodiment, and shows a cross section taken along line XIIB-XIIB in FIG. 12A.
12A is substantially the same as the cross section of the light emitting device 100 shown in FIG. 1D.

The light emitting device 100B according to the second embodiment does not have the second convex member 62b at the end in the longitudinal direction (lateral direction in FIG. 12A) as compared with the light emitting device 100 according to the first embodiment. 7 is provided with an underfill 7B, and is provided with a covering member 8B instead of the covering member 8.
The underfill 7B and the covering member 8B can be formed using the same material as the underfill 7 and the covering member 8, respectively.

The second convex member 62B in the present embodiment is provided with a second convex member 62a at one end of the light emitting device 100B in the short direction (vertical direction in FIG. 12A). The second convex member 62b (see FIG. 1C) is not provided at the end in the direction.
As described above, the second convex members 62a and 62b are used in the covering member forming step S16 (see FIG. 2) at the time of manufacturing to suppress “sinking” of the resin. By narrowing the interval between the optical members 3, resin “sinking” can be suppressed even if omitted.
The light emitting device 100B according to the present embodiment has a second convex shape by narrowing the interval between the light emitting elements 2 and the translucent members 3 arranged across the lateral boundary line BD3 (see FIG. 13B). The member 62b is omitted.

For example, when the viscosity of the resin is about 1 to 20 Pa · s, the second convex shape is used when the distance between the translucent members 3 is about half or less of the length of one side of the translucent member 3 as a guide. The arrangement of the member 62b can be omitted.
More specifically, in order to omit the arrangement of the second convex members 62b, the interval between the translucent members 3 is preferably about 800 μm or less, and more preferably about 400 μm to 600 μm.

The underfill 7 </ b> B is filled in a space between the upper surface of the mounting substrate 1 and the lower surface of the light emitting element 2. The underfill 7 </ b> B is provided to a height that covers the vicinity of the upper end of the side surface of the translucent member 3 between the light emitting elements 2 and between the translucent members 3. Further, the underfill 7B is provided up to a height that covers the vicinity of the upper end of the side surface of the light emitting element 2 at the lateral end of the light emitting device 100B.
Note that, at the lateral end of the light emitting device 100 </ b> B, the underfill 7 </ b> B only needs to be filled in a space between the upper surface of the mounting substrate 1 and the lower surface of the light emitting element 2. You may make it provide to the height of the grade which covers a part.

The covering member 8B is a member that covers the side surface of the light emitting element 2 and the side surface of the translucent member 3, and seals the light emitting element 2 together with the underfill 7B. Further, the covering member 8B and the underfill 7B suppress light leakage from the side surfaces of one set of the light emitting element 2 and the translucent member 3 to the side surfaces of the other adjacent light emitting element 2 and the translucent member 3. can do.
The covering member 8B is disposed between the translucent members 3 so as to overlap the underfill 7B, and is provided up to a height that covers the side surface of the translucent member 3 to substantially the upper end. In this embodiment, since the 2nd convex-shaped member 62b is not provided in the edge part of the horizontal direction of the light-emitting device 100B, the coating | coated member 8B is from the upper surface of the mounting substrate 1 in the edge part of the horizontal direction of the light-emitting device 100B. The light-transmitting member 3 is provided up to a height that covers the substantially upper end of the side surface.
Note that an underfill 7B may be provided on the upper surface of the mounting substrate 1 at the lateral end of the light emitting device 100B. In that case, the covering member 8B is provided so as to overlap the underfill 7B.

  Further, in the light emitting device 100B according to the present embodiment, the first convex member 61 and the second convex member are formed at the longitudinal ends, similarly to the underfill 7 and the covering member 8 of the light emitting device 100 according to the first embodiment. An underfill 7B and a covering member 8B are provided in a region sandwiched between the convex members 62a.

The underfill 7 </ b> B and the covering member 8 </ b> B are both formed using a resin material, but are in contact with the light emitting element 2 and the translucent member 3 due to light and thermal stress from the light emitting element 2 and the translucent member 3. There is a risk of cracking. In particular, between the light emitting elements 2 and between the translucent members 3, light and heat from two directions are concentrated, so that cracks may be more likely to occur. In this embodiment, the underfill 7B which is the lower layer side is provided between the light emitting elements 2 and between the translucent members 3 so as to cover the side surfaces of the translucent member 3, and is the upper layer side coating. The member 8B covers the underfill 7B and is provided so as to be in contact with the vicinity of the upper end of the translucent member 3.
Here, a material interface is formed between the underfill 7B and the covering member 8B. For this reason, even if a crack occurs in the underfill 7B, the progress of the crack stops at the interface with the covering member 8B, so that it is difficult for the covering member 8B to generate a crack. In other words, since cracks hardly progress to the surface of the light emitting device 100B, the function as a sealing member or a light shielding member including the underfill 7B and the covering member 8B can be maintained.

Further, by providing the underfill 7B and the covering member 8B so as to have different refractive indexes, the underfill 7B and the covering member 8B are disposed between the translucent members 3 in the vicinity of the upper end of the translucent member 3. In between, an optical interface can be formed. Furthermore, in order to utilize capillary action when forming the underfill 7B, the interface is formed to be curved downward. For this reason, the light emitted from the side surface of one translucent member 3 and going through the underfill 7B in the lateral direction can be reflected downward at this interface.
That is, light emitted from the side surface of one translucent member 3 is difficult to propagate to the adjacent translucent member 3. For this reason, when the light emission control of the plurality of light emitting elements 2 is independently performed, the independence of the luminance of the light emitting surface can be enhanced.
Considering the above-described suppression of the progress of cracks and suppression of light leakage to adjacent light emitting surfaces, the underfill 7B is disposed between the light emitting elements 2 and between the light transmitting members 3 adjacent to each other. It is preferable to cover at least a part of each of the opposing side surfaces, and more preferably to a height that covers the vicinity of the upper end of the side surface of the translucent member 3. At this time, the interface between the underfill 7B and the covering member 8B is preferably a curved surface convex toward the mounting substrate 1 side.

Moreover, since the underfill 7B is provided in the lower part of the light emitting element 2, between the light emitting elements 2, and between the translucent members 3, it tends to produce thermal stress. For this reason, it is preferable that the underfill 7B has lower elasticity (softer) than the covering member 8B in order to suppress the occurrence of cracks.
Further, when cutting with a dicing blade or the like, resin burrs are more likely to occur as the elasticity of the resin is lower (softer). The underfill 7B and the covering member 8B disposed in the vicinity of the lateral end of the light emitting device 100B are cut in the singulation step S17 (see FIG. 2). For this reason, it is preferable not to arrange the underfill 7B in the vicinity of the end in the lateral direction. However, even if the underfill 7B is disposed in the vicinity of the end in the lateral direction with a thin film that does not substantially cause resin burrs during cutting. Good. Note that the thickness of such a thin film is, for example, about the same thickness as the wiring 12 of the mounting substrate 1, and more specifically, about 10 μm or less is preferable.

[Method for Manufacturing Light Emitting Device]
Next, a method for manufacturing the light emitting device 100B according to the second embodiment will be described with reference to FIGS. 2, 13A, and 13B.
FIG. 13A is a cross-sectional view showing an underfill forming step in the method for manufacturing a light emitting device according to the second embodiment, and shows a cross section at a position corresponding to the line XIIB-XIIB in FIG. 12A. FIG. 13B is a cross-sectional view showing the covering member forming step in the method for manufacturing the light emitting device according to the second embodiment, and shows a cross section at a position corresponding to the line XIIB-XIIB in FIG. 12A.

The light emitting device 100B according to the second embodiment can be manufactured by changing the method of manufacturing the light emitting device 100 according to the first embodiment shown in FIG. 2 as follows.
In the light emitting element mounting step S12 and the translucent member arranging step S13, the light emitting element 2 and the translucent member 3 sandwiching the boundary line BD3 are arranged at intervals at which the second convex member 62b can be omitted. Place on top.

In the convex member arranging step S14, the first convex member arranging step S141 and the second convex member arranging step S142 are performed. In the present embodiment, in the second convex member arranging step S142, the second convex member 62a is arranged on the boundary line BD2 on the upper surface of the collective substrate 10, and the second convex member 62b is arranged on the boundary line BD3. do not do.
Moreover, in 1st convex member arrangement | positioning process S141, as shown to FIG. 13A, the light emitting element 2 and the translucent member 3 which are arrange | positioned at the edge part of the horizontal direction of the aggregate substrate 10, and the 1st convex member 61 are included. The 1st convex member 61 is arrange | positioned so that the space | interval may become the space | interval which can be filled with uncured resin for forming the covering member 8B satisfactorily. This space | interval is comparable as the space | interval of the translucent members 3 on both sides of boundary line BD3.

  In the underfill formation step S15, an uncured resin serving as a material for the underfill 7B is filled between the light emitting elements 2 and the collective substrate 10, between the light emitting elements 2 and between the translucent members 3. By supplying an uncured resin adjusted to an appropriate viscosity around the light emitting element 2, the resin can be filled up to the vicinity of the upper end of the translucent member 3 in these spaces using a capillary phenomenon. . In addition, the space which provides the coating | coated member 8B is left in the uppermost part of these spaces. Then, underfill 7B can be formed by hardening resin by heat processing. The underfill forming step S15 is performed before the covering member forming step S16.

  Since the underfill 7B is filled between the light emitting element 2 and the mounting substrate 1, thermal stress due to heat from the light emitting element 2 is likely to occur. For this reason, in order to suppress the occurrence of cracks, the underfill 7B preferably uses a resin that is less elastic than the covering member 8B, that is, a soft resin. For example, when the Shore A hardness of the cured covering member 8B is A60, the Shore A hardness of the cured underfill 7B can be about A50.

  On the other hand, the lower the elasticity of the resin, the less the resin burrs are generated during the cutting by the dicing method or the like, and the shape of the cut surface becomes less stable. For this reason, it is preferable not to form the underfill 7B on the boundary line BD3 which is a cutting line. Further, even when the underfill 7B is formed on the boundary line BD3, it is preferable to use a thin film having a thickness equal to or less than the thickness of the wiring 12 as described above. As a result, problems such as the occurrence of resin burrs can be suppressed.

  In the covering member forming step S16, an uncured resin for forming the covering member 8B in the upper layer of the space between the light emitting elements 2 and between the translucent members 3 and the space sandwiching the boundary line BD3 Supply material. Thereafter, the covering member 8B can be formed by curing the resin by heat treatment.

In the separation step S17, the covering member 8B, the second convex member 62b, and the collective substrate 10 are cut along the boundary line BD2 (see FIG. 10A) and the boundary line BD3. Since the underfill 7B that is softer than the covering member 8B is not provided on the boundary line BD3, the boundary line BD3 can be cut in a stable shape. Moreover, since the 2nd convex-shaped member 62a harder than the coating | coated member 8B is provided on boundary line BD2 similarly to 1st Embodiment, it can cut | disconnect in a more stable shape.
By performing the above steps, the light emitting device 100B can be manufactured.

  The light emitting device and the method for manufacturing the same according to the present invention have been specifically described above by the embodiments for carrying out the invention. However, the gist of the present invention is not limited to these descriptions, and the scope of the claims is as follows. It must be interpreted widely based on the description. Needless to say, various changes and modifications based on these descriptions are also included in the spirit of the present invention.

  A light emitting device according to an embodiment of the present disclosure includes various lighting devices such as LED bulbs and spotlights, a backlight light source of a liquid crystal display, a large display, various display devices such as an advertisement and a destination guide, a digital video camera, a facsimile It can be used for various light sources such as an image reading device in a copying machine, a scanner, a projector device, and the like.

DESCRIPTION OF SYMBOLS 1,1A Mounting board 10 Collective board 11 Support member 12 Wiring 12a External connection part 2 Light emitting element 3,3A Translucent member 4 Protection element (semiconductor element different from a light emitting element)
51 Joining member 52 Joining member 61 First convex member 62, 62B, 62a, 62b Second convex member 7, 7B Underfill 8, 8A, 8B Cover member 100, 100A, 100B Light emitting device BD1, BD2, BD3 Boundary line H1 Upper surface position of light-emitting element H2 Upper end position of second convex member H3 Upper end position of first convex member H4 Upper surface position of translucent member

Claims (16)

Mounting a plurality of light emitting elements on the collective substrate;
Disposing at least one translucent member for each light emitting device on the top surface of the plurality of light emitting elements;
Disposing a first convex member surrounding the plurality of light emitting elements on the upper surface of the collective substrate;
Disposing a second convex member between the plurality of light emitting elements on the upper surface of the collective substrate;
After the step of disposing the first convex member and the step of disposing the second convex member, an upper end of the second convex member and the light emitting element are disposed in a region surrounded by the first convex member. And a step of forming a covering member that covers the side surface of the translucent member;
Dividing the light emitting device into pieces by dividing the covering member, the second convex member, and the collective substrate at a position including the second convex member;
Including
The second convex member is formed in a region surrounded by the first convex member such that the upper end is lower than the upper end of the first convex member and higher than the upper surface of the light emitting element.
The method for manufacturing a light emitting device, wherein the second convex member is harder than the covering member.   The method of manufacturing a light emitting device according to claim 1, wherein the first convex member is formed such that an upper end thereof is lower than an upper surface of the translucent member.   The light emitting device manufacturing method according to claim 1, wherein the first convex member is formed using a resin material.   The method of manufacturing a light emitting device according to claim 1, wherein the second convex member is formed using a resin material.   5. The method for manufacturing a light emitting device according to claim 1, wherein the first convex member and the second convex member are integrally formed. 6. In the step of forming the first convex member, the first convex member is formed by supplying an uncured resin material so as to overlap two layers on the collective substrate,
6. The step of forming the second convex member, wherein the second convex member is formed by supplying an uncured resin material in one step onto the aggregate substrate. The manufacturing method of the light-emitting device of one term | claim. The first convex member, the second convex member and the covering member are formed using a thermosetting resin,
The method for manufacturing a light-emitting device according to claim 1, wherein the resin material is formed by heating and curing the resin material after disposing an uncured resin material.   The method for manufacturing a light emitting device according to any one of claims 1 to 7, wherein a step of arranging the second convex member is performed after the step of arranging the first convex member. In the step of forming the covering member,
The light emitting device manufacturing method according to claim 1, wherein the covering member is formed using a resin material containing a light reflective substance.   10. The method for manufacturing a light emitting device according to claim 1, wherein the translucent member contains a wavelength conversion material that converts light emitted from the light emitting element into light having a different wavelength. 11. In the step of forming the covering member,
11. The covering member is formed by supplying and curing an uncured resin material from above the second convex member while meandering across the top of the second convex member. The manufacturing method of the light-emitting device as described in any one of these. For the pair of light emitting devices formed adjacent to each other on the aggregate substrate,
In the step of mounting the light emitting element,
In a plan view, the light emitting elements are arranged so that the pair of light emitting devices are substantially line symmetric with respect to a boundary line adjacent to each other,
In the step of forming the second convex member,
The method of manufacturing a light emitting device according to claim 1, wherein the pair of light emitting devices forms the second convex member on a boundary line adjacent to each other. Before the step of forming the covering member,
In each of the pair of light emitting devices, a semiconductor element different from the light emitting element is disposed between the light emitting element and a boundary line adjacent to the pair of light emitting devices.
In the step of forming the covering member,
The method for manufacturing a light emitting device according to claim 12, wherein the covering member is formed so as to cover an upper end of the semiconductor element. In the step of arranging the translucent member,
The method for manufacturing a light-emitting device according to claim 1, wherein one light-transmitting member is disposed in each of the plurality of light-emitting elements. Before the step of forming the covering member,
The method for manufacturing a light emitting device according to claim 1, further comprising a step of filling an underfill between an upper surface of the collective substrate and a lower surface of the light emitting element. The light emitting device manufacturing method according to claim 15, wherein the underfill has light reflectivity.

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