CN109296987B

CN109296987B - Light source module and vehicle lamp

Info

Publication number: CN109296987B
Application number: CN201810827497.2A
Authority: CN
Inventors: 铃木哲也; 时田主
Original assignee: Koito Manufacturing Co Ltd
Current assignee: Koito Manufacturing Co Ltd
Priority date: 2017-07-25
Filing date: 2018-07-25
Publication date: 2023-04-07
Anticipated expiration: 2038-07-25
Also published as: JP2019029057A; CN208735547U; CN109296987A

Abstract

Provided are a light source module and a vehicle lamp, which can mount light emitting elements with high density and suppress the generation of glare. The light source module (40) includes: a plurality of light emitting elements (43 c); a plurality of metal wires (45 a) for supplying power to the light-emitting elements (43 c); a light-reflective resin section (43 d) that seals at least a portion of the side surface of the light-emitting element (43 c); and a light absorbing resin portion (45) for sealing the metal wire (45 a).

Description

Light source module and vehicle lamp

Technical Field

The present invention relates to a light source module and a vehicle lamp, and more particularly to a light source module and a vehicle lamp in which a plurality of light emitting diodes are provided on a surface of an element mounting substrate.

Background

The vehicular lamp is generally capable of switching between a low beam and a high beam. The low beam illuminates the near area with a predetermined illuminance, and the light distribution is determined so as not to cause glare to oncoming vehicles or leading vehicles, and is mainly used when driving in urban areas. On the other hand, the high beam illuminates a wide area ahead and a far area at a relatively high illuminance, and is mainly used when traveling on a road with few oncoming vehicles or leading vehicles at high speed. Therefore, the high beam is better visible to the driver than the low beam, but has problems in that: glare is given to a driver of a vehicle and a pedestrian present in front of the vehicle.

In recent years, an ADB (Adaptive Driving Beam) technique has been proposed which dynamically and adaptively controls a light distribution pattern of a high Beam based on a state around a vehicle. The ADB technique detects whether there is a preceding vehicle, an oncoming vehicle, or a pedestrian in front of the vehicle, dims an area corresponding to the vehicle or the pedestrian, and the like, and reduces glare given to the vehicle or the pedestrian. In such an ADB technique, an LED in which a plurality of Light Emitting elements such as LEDs (Light Emitting diodes) are mounted in a row on a substrate and an area corresponding to a vehicle or a pedestrian is turned off has been proposed (for example, patent document 1).

Further, in recent years, it has been proposed to arrange a plurality of light emitting elements two-dimensionally on a substrate, and selectively switch turning-off and turning-on of the light emitting elements to control the light distribution pattern of high beam in more detail. In such a vehicle lamp in which the two-dimensional light emitting elements are arranged, in order to favorably irradiate a two-dimensional light distribution pattern, it is necessary to increase the mounting density of the light emitting elements and to increase the accuracy of the mounting positions. When LEDs are used as light emitting elements, surface mount type packages are used, and high density mounting is performed by adopting a structure in which individual LEDs are positioned and mounted on lands formed on a substrate.

Fig. 10 is a schematic plan view showing a light source module 1 using the ADB technique proposed in the related art. As shown in fig. 10, a conventional light source module 1 has a connector 3 mounted on a substrate 2 for electrical connection to the outside, a wiring pattern 4 formed on the surface of the substrate 2 so as to extend from the connector 3, and a plurality of LEDs 5 mounted on the wiring pattern 4. In the light source module 1, the vicinity of the portion of the wiring pattern 4 on which the LED5 is mounted is formed to be large, and is used as a heat dissipation pattern for dissipating heat generated by the LED5 emitting light well.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2015-016773

Disclosure of Invention

Problems to be solved by the invention

Such a conventional light source module 1 has problems that: in order to secure the area of the heat dissipation pattern, the interval between the LEDs 5 is large, and high-density mounting is difficult, and since the LEDs 5 are surface-mounted with individual packages, high-density mounting is also difficult in terms of positional alignment accuracy of surface mounting. In order to solve this problem, by mounting a plurality of LED chips on 1 package and electrically connecting the LED chips to a wiring layer on a substrate by wire bonding, both the positional alignment accuracy of surface mounting and high-density mounting of the LED chips can be achieved.

However, since the metal wire used for wire bonding reflects light from the LED and generates stray light, there are problems in that: the illumination light from the vehicle lamp may cause glare. In the ADB technology, since it is necessary to precisely control the irradiation region and the non-irradiation region of light, the problem of glare due to stray light is a serious problem compared to a general vehicle lamp.

Accordingly, an object of the present invention is to provide a light source module and a vehicle lamp, which can mount light emitting elements at high density and suppress the generation of glare.

Means for solving the problems

In order to solve the above problem, a light source module according to the present invention includes: a plurality of light emitting elements; a plurality of metal wires for supplying power to the light emitting elements; a light-reflective resin section sealing at least a part of a side surface of the light-emitting element; and a light absorbing resin portion sealing the metal wire.

In the light source module of the present invention, the light extraction efficiency is improved by sealing the periphery of the light emitting element with the light reflective resin portion, and the light emitting element can be mounted with high density and the generation of glare can be suppressed by sealing the metal wire with the light absorptive resin portion.

In one aspect of the present invention, the light-reflective resin portion is filled between the adjacent light-emitting elements, and side surfaces of a predetermined number of the light-emitting elements are collectively sealed.

In one aspect of the present invention, the light absorbing resin portion seals a predetermined number of the metal wires at a time.

In one aspect of the present invention, the light emitting device includes a sub-mount having a sub-mount wiring formed on one surface thereof, the light emitting element is mounted on the sub-mount wiring along a first direction of the sub-mount, and the metal wire is connected to the sub-mount wiring.

In one aspect of the present invention, a plurality of the subassemblies are arranged in a first row extending in the first direction.

In one aspect of the present invention, the plurality of subassemblies are arranged adjacent to the first row as a second row extending in the first direction.

In order to solve the above problem, a vehicular lamp according to the present invention includes the light source module described above, and is characterized by selectively supplying power to the plurality of metal wires and the plurality of light emitting elements.

In the vehicular lamp of the present invention, the light emitting elements can be mounted with high density and the occurrence of glare can be suppressed.

ADVANTAGEOUS EFFECTS OF INVENTION

The present invention can provide a light source module and a vehicle lamp that can mount light emitting elements at high density and suppress the occurrence of glare.

Drawings

Fig. 1 is an exploded perspective view showing a lamp 100 for a vehicle of a first embodiment.

Fig. 2 is a schematic perspective view illustrating the light source module 40 of the first embodiment.

Fig. 3 is a schematic plan view showing a mounting substrate 41 according to the first embodiment.

Fig. 4 is a diagram illustrating the structure of the mounting substrate 41 of the first embodiment in detail, fig. 4 (a) is an exploded perspective view, and fig. 4 (b) is a schematic cross-sectional view.

Fig. 5 is a schematic plan view of the light source module 40 showing a state where each component is mounted on the mounting substrate 41.

Fig. 6 is an enlarged perspective view enlarging and showing the sub-assembly 43.

Fig. 7 is a partially enlarged sectional view showing a state where the sub-mount 43 is mounted on the light emitting section mounting region 49.

Fig. 8 is an enlarged plan view showing the periphery of the light emitting unit mounting region 49 in an enlarged manner.

Fig. 9 is a graph showing the combined luminance from the adjacent light emitting elements 43c in the second embodiment, fig. 9 (a) shows an example in which the distance of the light emitting elements 43c is long and the combined luminance is insufficient, and fig. 9 (b) shows an example in which the distance of the light emitting elements 43c is short and the combined luminance is sufficient.

Fig. 10 is a schematic plan view showing a light source module 1 using the ADB technique proposed in the related art.

Description of the indicia

100 … vehicle lamp

10 … lens

20 … lens holder

30 … reflector

40 … light source module

50 … radiator

60 … cooling fan

11 … mounting substrate

41 … mounting substrate

41a … metal plate

41b … adhesive sheet

41c … glass epoxy layer

42 … Wiring Pattern

43 … subassembly

43a … submount substrate

43b … sub-assembly wiring

43c … light emitting element

43d … light-reflective resin portion

44 … power supply connector

44a … power supply connector mounting part

45 … light-absorbing resin portion

45a … wire

46 … resist layer

47 … optical component mounting area

48 … optical component fixing part

49 … light emitting part mounting region

49a, 49b … opening

Detailed Description

(first embodiment)

Embodiments of the present invention will be described in detail below with reference to the drawings. The same or equivalent constituent elements, components, and processes shown in the respective drawings are denoted by the same reference numerals, and overlapping descriptions are omitted as appropriate. Fig. 1 is an exploded perspective view showing a lamp 100 for a vehicle according to the present embodiment. The lamp 100 for a vehicle includes a lens 10, a lens holder 20, a reflector 30, a light source module 40, a heat sink 50, and a cooling fan 60, and the respective members are positioned with each other and fixed by a fixing unit not shown.

The lens 10 is made of a translucent material and is a member for irradiating the light from the light source module 40 forward so as to have a predetermined light distribution. The lens holder 20 is a member for holding the lens 10 in a state of maintaining the relative positional relationship between the light source module 40 and the reflector 30. The reflector 30 is a member that is disposed in front of the light source module 40 and reflects light from the light source module 40 forward, and corresponds to an optical member of the present invention.

The light source module 40 emits light in response to power and signals supplied from the outside of the vehicle lamp 100, and will be described in detail later. The heat sink 50 is a member having good thermal conductivity disposed in contact with the light source module 40 on the back surface of the light source module 40, and the cooling fan 60 having heat radiating fins formed on the back surface side is a member disposed on the back surface side of the heat sink 50 and generating an air flow by supplying electric power.

In the lamp 100 for a vehicle, when power and a signal are supplied from the outside, the light source module 40 emits light in accordance with the power and the signal, and light reflected forward by the reflector 30 is irradiated forward through the inside of the lens holder 20 and the lens 10. The heat generated by the light source module 40 emitting light is dissipated to the air through the heat sink 50, and is cooled by the air blown from the cooling fan 60.

Fig. 2 is a schematic perspective view showing the light source module 40 of the present embodiment. The light source module 40 includes a mounting substrate 41, a wiring pattern 42, a sub-mount 43, a power supply connector 44, a metal wire 45a, a light absorbing resin portion 45, and a resist layer 46, an optical component mounting area 47 is formed on the mounting substrate 41, and an optical component fixing portion 48 is formed in the optical component mounting area 47.

The mounting substrate 41 is a substantially flat plate-shaped member made of a material having good thermal conductivity, and has a wiring pattern 42 formed on one surface thereof, and a plurality of sub-assemblies 43 and a power supply connector 44 are mounted thereon. A resist layer 46 is formed to cover the wiring pattern 42. The material constituting the mounting substrate 11 is not limited, but a metal having good thermal conductivity such as copper or aluminum is preferably used.

As the mounting substrate 41, a composite substrate in which an insulating substrate is bonded to a conductive substrate may be used, and for example, a glass epoxy layer is bonded to a metal substrate. When the mounting substrate 41 is formed of a metal substrate, it is preferable to form an oxidation preventing film on the back surface side of the mounting substrate 41 in order to prevent a decrease in thermal conductivity due to oxidation of the metal material. The method of forming the oxidation preventing film may be a preflux treatment or an Au plating treatment, but from the viewpoint of improving heat dissipation, an Au plating treatment is preferable.

The wiring pattern 42 is a conductive pattern formed on the surface of the mounting substrate 41, and is used to ensure electrical connection from the terminal of the power supply connector 44 to the sub-mount 43. When a conductive material is used as the mounting substrate 41, an insulating layer is formed between the wiring pattern 42 and the mounting substrate 41.

The sub-mount 43 is mounted on the surface of the mounting substrate 41, is electrically connected to the wiring pattern 42 by a metal wire 45a, and emits light in accordance with power supplied through the metal wire 45 a. The detailed construction of subassembly 43 will be described later.

The power supply connector 44 is a member mounted on the surface of the mounting substrate 41 to ensure electrical connection with the outside, and a plurality of terminals are electrically connected to the wiring pattern 42. The shape of the power feeding connector 44 is an approximately rectangular parallelepiped element shown in fig. 2, but the shape, the terminal shape, and the like are not limited as long as they can be connected to a known cable harness.

The metal wire 45a is a member for connecting a terminal provided on the sub-mount 43 and the wiring pattern 42 formed on the mounting substrate 41, and is a conductive member made of metal that can be realized by a known wire bonding technique. The material constituting the metal line 45a is not limited, and gold, copper, aluminum, or the like can be used, but gold is preferably used.

The light absorbing resin portion 45 is a resin member in which an inorganic filler and a light absorbing material are mixed with a base resin, and covers and seals the metal wires 45 a. The sealing of the metal wires 45a by the light absorbing resin portion 45 may be performed by individually sealing the metal wires 45a one by one, but it is preferable to seal a plurality of metal wires 45a collectively. The base resin of light-absorbing resin portion 45 is preferably a curable resin composition having high heat resistance, light resistance, and light transmittance and being excellent in handling, and examples thereof include known sealing materials such as epoxy resins and silicone resins. In particular, in order to prevent the light absorbing resin portion 45 from being deformed or broken by applying stress to the metal wires 45a due to expansion and contraction of the metal wires due to heat, it is preferable to use a silicone resin having a low elastic coefficient after curing as the base resin. The light absorbing material mixed into the matrix resin may, for example, be a carbon filler.

In the light source module 40 of the present embodiment, the metal wires 45a are covered and sealed with the light absorbing resin portion 45, so that it is possible to prevent conductive foreign matter from adhering to the metal wires 45a and causing short circuits. Further, since the light absorbing material is mixed into the light absorbing resin portion 45, the light from the sub-mount 43 reaches the metal wire 45a and is reflected, and can be prevented from being irradiated to the outside of the vehicular lamp 100 as stray light. In particular, when the light emitting elements included in the sub-mount 43 are selectively turned on using the ADB technique, stray light reflected by the metal wires 45a can be prevented from reaching the non-irradiation region, and the light emitting elements can be mounted with high density, thereby suppressing the occurrence of glare.

In forming the light absorbing resin portion 45, a base resin obtained by kneading an inorganic filler and a light absorbing material is supplied onto the metal wire 45a by a dispenser or the like, and then cured. The viscosity and thixotropy after kneading the light absorbing material can be arbitrarily adjusted by adjusting the material selection of the base resin and the addition amount of the inorganic filler in consideration of moldability after coating and stress to the power feeding line. The thixotropy is preferably 2.0 to 3.5 (viscosity of 0.5 rpm)/(viscosity of 5 rpm) at 23 ℃, viscosity of 0.5rpm and viscosity of 5rpm of an E-type viscometer in terms of ejection property of a dispenser and moldability after coating, from the viewpoint of handling. When the thixotropy is set in this range, the fluidity of the matrix resin is appropriately maintained, and even if the periphery of the sub-assembly 43 is not surrounded by a dam member or the like, the resin is prevented from flowing out and the metal wires 45a are exposed, and the generation of voids in the gaps between the metal wires 45a and the lower portion is prevented.

The resist layer 46 is an insulating film-like member formed by covering the wiring pattern 42 on the front surface side of the mounting substrate 41. The material constituting the resist layer 46 is not limited, but in order to suppress stray light caused by a difference in light reflection between the surface of the mounting substrate 41 and the wiring pattern 42, it is preferable to use a light reflective material or a light absorptive material so as to make the light reflectance uniform in the region where the resist layer 46 is formed.

The optical component mounting region 47 is a region on the surface of the mounting substrate 41 for mounting the reflector 30, which is an optical component, and is a region where the resist layer 46 is not formed and the surface of the mounting substrate 41 is exposed. The optical component mounting area 47 is located on both sides of the mounting substrate 41 with the sub-mount 43 mounted therebetween, and the reflector 30 can be disposed over the sub-mount 43 by abutting and fixing the reflector 30 to the optical component mounting area 47.

The optical component fixing portion 48 is a through hole provided in the optical component mounting region 47. The reflector 30 is brought into contact with the optical component mounting region 47, and a fixing member such as a screw is inserted into the optical component fixing portion 48 from the front surface side of the mounting substrate 41, thereby fixing the mounting substrate 41 and the reflector 30 to the heat sink 50. The positions where the optical component fixing portions 48 are formed will be described in detail later, but the sub-assemblies 43 are arranged between 2 optical component fixing portions 48.

Fig. 3 is a schematic plan view showing the mounting substrate 41 of the present embodiment. As shown in fig. 2, a wiring pattern 42 is formed on the mounting substrate 41, and a resist layer 46 is formed so as to cover the wiring pattern 42. As shown in fig. 3, a resist layer 46 is formed in a region other than the optical component mounting region 47, the light emitting portion mounting region 49 on which the sub-mount 43 is mounted, the portion of the bonding metal wire 45a, the power supply connector mounting portion 44a on which the power supply connector 44 is mounted, and the portion to which the terminal of the power supply connector 44 is connected.

The light emitting unit mounting region 49 is a region where the plurality of sub-assemblies 43 are mounted as described above, and can be formed by arranging the sub-assemblies 43 in two rows with the left-right direction in the drawing as the longitudinal direction. A line L1 connecting the centers of the optical component fixing portions 48 is in a positional relationship crossing the approximate center of the light emitting section mounting region 49 along the longitudinal direction.

Fig. 4 is a diagram illustrating the structure of the mounting substrate 41 of the present embodiment in detail, fig. 4 (a) is an exploded perspective view, and fig. 4 (b) is a schematic cross-sectional view. As shown in fig. 4 (a), the mounting substrate 41 has a laminated structure of a metal plate 41a, an adhesive sheet 41b, and a glass epoxy resin layer 41 c.

Openings

49b and 49c having shapes corresponding to the light emitting section mounting region 49 are formed in the adhesive sheet 41b and the glass epoxy resin layer 41c, respectively, and the positions of the

openings

49b and 49c are aligned. The

openings

49b and 49c may be formed in advance in predetermined regions of the adhesive sheet 41b and the glass epoxy resin layer 41c and bonded so as to be aligned with each other, or the

openings

49b and 49c may be formed collectively by cutting after the metal plate 41a and the glass epoxy resin layer 41c are bonded to each other with the adhesive sheet 41 b.

As shown in fig. 4 (b), an adhesive sheet 41b and a glass epoxy layer 41c are laminated around the light-emitting-section mounting region 49, and a wiring pattern 42 and a resist layer 46 are formed on the glass epoxy layer 41 c. Inside the light emitting unit mounting region 49, the surface of the metal plate 41a is partially exposed in regions corresponding to the

openings

49b and 49c. Since the resist layer 46 is not formed in the optical component mounting region 47 as described above, the glass epoxy resin layer 41c is exposed in the optical component mounting region 47.

In the light source module 40 of the present embodiment, the resist layer 46 is not formed in the optical component mounting region 47, and the reflector 30 as an optical component is directly mounted on and fixed to the glass epoxy resin layer 41 c. This suppresses positional deviation between the reflector 30 and the sub-mount 43 due to variation in the film thickness of the resist layer 46, and enables precise positional alignment of the relative positional relationship between the optical member and the light-emitting element 43c, and light irradiation with good light distribution characteristics. Further, by bonding the glass epoxy resin layer 41c to the metal plate 41a using the adhesive sheet 41b, it is not necessary to form an insulating layer containing a high thermal conductive filler on the metal plate 41a, and the manufacturing process and the manufacturing cost can be reduced.

Fig. 5 is a schematic plan view of the light source module 40 showing a state where each component is mounted on the mounting substrate 41. Solder is applied to the power supply connector mounting portion 44a and the terminal connecting portion of the mounting substrate 41 shown in fig. 4, and the surface-mount power supply connector 44 is mounted by solder reflow. The rear surface of the sub-mount 43 is fixed to the metal plate 41a exposed in the light emitting section mounting region 49 with an adhesive, and after the sub-mounts 43 are arranged in two rows along the longitudinal direction, the sub-mount 43 and the wiring pattern 42 are electrically connected by the wire bonding wires 45 a. Finally, the plurality of metal wires 45a are coated with the light absorbing resin portion 45 with a dispenser and cured. As described above, the line L1 connecting the centers of the optical component fixing portions 48 is located approximately at the center in the longitudinal direction of the sub-assemblies 43 arranged in two rows.

Fig. 6 is an enlarged perspective view enlarging and showing the sub-assembly 43. The sub-mount 43 has a plurality of sub-mount wiring lines 43b formed on a sub-mount substrate 43a, a plurality of light emitting elements 43c mounted on the sub-mount wiring lines 43b, and a light reflective resin portion 43d collectively sealing side surfaces of the plurality of light emitting elements 43 c. The light-reflective resin portion 43d is not formed in a part of the sub-mount substrate 43a, and the surface of the sub-mount substrate 43a and the sub-mount wiring 43b are exposed. The light emitting element 43c is flip-chip mounted inside the light reflective resin portion 43d across the adjacent sub-mount wirings 43 b.

The submount substrate 43a is a substantially rectangular flat plate-like member made of a material having excellent insulation and thermal conductivity, and is made of, for example, si, alN, or the like. The sub-mount wiring 43b is a conductive pattern formed on one surface of the sub-mount substrate 43a, is electrically connected to the light emitting element 43c, and the metal wire 45a is wire-bonded.

The light emitting element 43c is electrically connected to the 2 metal wires 45a, and emits light when a voltage is applied between the metal wires 45a, and is formed by a combination of an LED chip and a phosphor material. As the LED chip, a known compound semiconductor material such as GaN system that emits primary light having a wavelength of blue, violet, or ultraviolet light can be used. As the phosphor material, a known material that is excited by primary light and is irradiated with desired secondary light may be used, and an element that obtains white by mixing color with the primary light from the LED chip or an element that obtains white by mixing color of a plurality of secondary lights using a plurality of phosphor materials may be used.

The light-reflective resin portion 43d is a member in which light-reflective fine particles are mixed in a matrix resin, and for example, a white resin in which fine particles such as titanium oxide are mixed is used to favorably reflect light emitted from the light-emitting element 43 c. The light-reflective resin section 43d is filled with a side surface sealed so as to surround the light-emitting element 43c, and reflects light irradiated from the side surface of the light-emitting element 43c toward the inside of the light-emitting element 43 c. Thus, light emitted from the light emitting element 43c does not leak laterally from the side surface of the light emitting element 43c, and is favorably irradiated from the upper surface of the light emitting element 43c to the outside.

As shown in fig. 6, among the plurality of light emitting elements 43c arranged in the longitudinal direction of the sub-mount 43, the distance between the side surfaces of the adjacent light emitting elements 43c is d1, and the distance between the centers of the light emitting elements 43c is d2. As shown in fig. 2, the plurality of sub-assemblies 43 are arranged in two upper and lower rows to constitute the light source section, extend in the longitudinal direction, are arranged adjacent to each other in the plurality of sub-assembly substrates 43a to constitute a first row, and are arranged adjacent to the first row in the plurality of sub-assembly substrates 43a in the second row.

Fig. 7 is a partially enlarged cross-sectional view showing a state where the sub-mount 43 is mounted on the light-emitting-section mounting area 49. The submount substrate 43a is fixed with an adhesive to the metal plate 41a exposed in the light emitting section mounting region 49, and the side surface of the light emitting element 43c on the submount substrate 43a is sealed with the light reflective resin section 43 d. In a region of the sub-mount substrate 43a where the light reflective resin portion 43d is not formed, one end of the metal wire 45a is wire-bonded.

In the light source module 40 of the present embodiment, a plurality of light emitting elements 43c are mounted on a submount 43a, and wires 45a are wire-bonded to submount wiring 43b formed on the surface of the submount 43a to supply power. Thus, compared to mounting the light emitting elements 43c directly on the wiring patterns 42 using solder, a large current can be supplied by the metal wires 45a having a high melting point, and the luminance of the light source module 40 can be improved. In addition, by mounting the sub-mount substrate 43a on the metal plate 41a exposed in the light emitting section mounting region 49 and fixing it with an adhesive having a high heat-resistant temperature, the heat-resistant temperature can be set higher than the mounting of the light emitting element 43c using solder, and a large current supply and high luminance can be achieved.

As shown in fig. 7, the wiring pattern 42 formed on the glass epoxy layer 41c is covered with the resist layer 46, but the resist layer 46 is not formed at the position where the other end of the metal wire 45a is wire-bonded. The entire metal wire 45a is sealed by the light absorbing resin portion 45, and the wire bonding positions at both ends of the metal wire 45a and the upper and lower portions of the metal wire 45a are filled. The light-absorbing resin portion 45 is formed adjacent to the light-reflecting resin portion 43d at the wire bonding position of the sub-mount substrate 43a. In fig. 7, the adhesive sheet 41b is not illustrated.

As described above, the sub-mount 43 is mounted on the metal plate 41a in the light-emitting section mounting region 49 without the glass epoxy layer 41c, and the height dimension of the light-emitting element of the sub-mount 43 is larger than the thickness dimension of the glass epoxy layer 41 c. Here, the height dimension of the light emitting element of the sub-mount 43 is a distance from the bottom surface of the sub-mount substrate 43a to the upper surface of the light emitting element 43c, and is, for example, about 1.3 mm.

In the light source module 40 of the present embodiment, since the height of the submount 43 is larger than the thickness of the glass epoxy layer 41c, the light-emitting element 43c, which is the light extraction surface of the submount 43, has an upper surface located above the glass epoxy layer 41 c. This prevents light emitted from the sub-assembly 43 from entering the side surface of the glass epoxy resin layer 41c and being blocked, and thus light can be extracted well and irradiated with desired light distribution characteristics.

In the light source module 40 of the present embodiment, after the metal plate 41a and the glass epoxy resin layer 41c are bonded to each other with the adhesive sheet 41b, the optical component fixing portion 48 is formed by press working from the back surface side of the mounting substrate 41. When the thickness of the glass epoxy layer 41c is 0.05mm to 0.2mm, preferably 0.075mm to 0.15mm, burrs generated on the metal plate 41a during press working are suppressed by the glass epoxy layer 41c, and the reflector 30 as an optical component can be precisely positioned and fixed.

Fig. 8 is an enlarged plan view showing the periphery of the light emitting unit mounting region 49 in an enlarged manner. As shown in fig. 8, the light-absorbing resin portion 45 collectively seals the plurality of metal wires 45a, covers the wire bonding positions of the sub-mount 43 from the wire bonding positions of the wiring patterns 42, and is formed to a position adjacent to the light-reflecting resin portion 43 d. The sub-assemblies 43 are arranged in a plurality in the left-right direction and are arranged adjacent to each other in two rows in the up-down direction, and constitute the light source unit of the present invention.

In the light source unit in which the sub-assemblies 43 are arranged in two upper and lower rows, the light emitting elements 43c are also arranged in two rows, and a line L2 shown in fig. 8 is a light emission center line showing a middle position of the light emitting elements 43c in the two rows. The light emission center line L2 substantially coincides with a line L1 connecting the centers of the optical component fixing portions 48 shown in fig. 5, and the reflector 30 as an optical component is fixed to an extension line of the light emission center lines L2 of the plurality of light emitting elements 43 c.

In the light source module 40 of the present embodiment, since the line L1 connecting the centers of the optical component fixing portions 48 substantially coincides with the light emission center line L2 of the sub-mount 43, even when the mounting substrate 41 is warped, the warping can be reduced by joining the reflector 30 to the light emission center line L2, and the positional relationship between the light source portion and the optical component can be appropriately set. When the mounting substrate 41 and the reflector 30 are collectively joined together including the heat sink 50, the back surface side of the light-emitting-section mounting region 49 can be brought into close contact with the heat sink, and the same heat dissipation characteristics as those of the mounting substrate 41 without warpage can be obtained.

The wiring pattern 42 has wire bonding positions along the upper and lower sides of the light emitting section mounting region 49, and wire bonds the metal wire 45a from above in the drawing with respect to the submount 43 on the upper column in the drawing, and wire bonds the metal wire 45a from below in the drawing with respect to the submount 43 on the lower column in the drawing. Therefore, the first and second columns of light emitting elements 43c are located between the metal line 45a connected to the first column and the metal line 45a connected to the second column.

In the vehicle lamp 100 of the present invention, power is selectively supplied to the light emitting elements 43c from the outside via the power supply connector 44, the wiring pattern 42, the metal wires 45a, and the sub-mount wiring 43b, and the light emitting elements 43c are turned on. In the plurality of sub-assemblies 43 constituting the light source unit, the selected light emitting elements 43c are turned on to determine the light distribution of the entire light source unit, and a two-dimensional light distribution pattern is irradiated forward of the vehicle lamp 100 by the ADB technique via the reflector 30 and the lens 10.

(second embodiment)

Next, a second embodiment of the present invention will be described with reference to fig. 2. The description of the same contents as those of the first embodiment will be omitted. This embodiment can be applied to a case where the ADB technique is not used. The configuration of the vehicular lamp 100 and the configuration of the light source module 40 are the same as those of the first embodiment, and the description thereof is omitted.

Fig. 9 is a graph showing the combined luminance from the adjacent light emitting elements 43c in the present embodiment, fig. 9 (a) is an example showing that the distance of the light emitting elements 43c is long and the combined luminance is insufficient, and fig. 9 (b) is an example showing that the distance of the light emitting elements 43c is short and the combined luminance is sufficient. The horizontal axis in the figure shows the position along the long side direction of the sub-assembly 43, and the vertical axis shows the luminance. The dotted line in the figure shows the luminance of light irradiated from 1 light emitting element 43c, and the solid line in the figure shows the combined luminance of light irradiated from 2 adjacent light emitting elements 43 c.

When the distance d1 between the side surfaces of the adjacent light emitting elements 43c shown in fig. 6 exceeds 0.6mm, the peak value of the combined luminance is small as shown in fig. 9 (a), and the luminance is improved by about several% as compared with the luminance irradiated from 1 light emitting element 43 c. By setting the distance d1 between the side surfaces to 0.6mm or less, as shown in fig. 9 (b), the peak of the combined luminance is increased, and the luminance can be improved by 20% or more as compared with the luminance irradiated from 1 light-emitting element 43 c. In particular, when the ADB technique is applied, since the light emitting element 43c is selectively turned on and off and the irradiation region and the non-irradiation region are precisely controlled, it is preferable that the contrast between the non-irradiation region and the irradiation region can be improved when the combined luminance of the irradiation region is high.

When the distance d1 between the side surfaces is less than 0.1mm, the light-reflective resin portion 43d filling the side surface of the light-emitting element 43c has an insufficient thickness, and light leaks from the side surface, and the luminance of light emitted from 1 light-emitting element 43c itself decreases. In addition, light leaks from the side, resulting in a decrease in the combined brightness. In particular, when the ADB technique is applied to selectively turn on the light emitting elements 43c, light leaking from the side surface may be irradiated in the same manner as light emitted from the unlit light emitting elements 43c, and it may be difficult to irradiate a desired two-dimensional light distribution pattern.

Table 1 shows relationships between the distances between the light emitting elements 43c and the combined luminance between the case where a plurality of light emitting elements 43c are included in the sub-mount 43 as the light source module 40 of the present embodiment and the case where one conventional LED chip is used as a Chip Size Package (CSP). The combined luminance when the conventional chip size package was used and the light emitting element pitch was set to 0.6mm was 100, showing a relative value.

[ Table 1]

As shown in table 1, in the conventional chip size package, the light emitting element interval was 0.6mm, the composite luminance was 100, the interval was 0.2mm, and the composite luminance was 119. On the other hand, in the sub-mount 43 of the present embodiment, the distance d1 between the side surfaces of the light emitting elements 43c is 0.6mm, the combined luminance is 112, the pitch is 0.2mm, the combined luminance is 140, the pitch is 0.1mm, and the combined luminance is 147.

Therefore, in the light source module 40 of the present embodiment, the distance d1 between the side surfaces of the light emitting element 43c is preferably in the range of 0.1mm to 0.6mm. The interval between the light emitting elements 43c of the plurality of sub-assemblies 43 is also preferably in the range of 0.1mm to 0.6mm. By setting the distance d1 between the side surfaces in this range, light leakage from the side surfaces can be prevented and the combined luminance can be improved. In addition, when the ADB technique is applied, it is possible to improve the contrast between the irradiation region and the non-irradiation region and to satisfactorily irradiate a desired two-dimensional light distribution pattern.

The present invention is not limited to the above embodiments, and various modifications can be made within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments are also included in the technical scope of the present invention.

Claims

1. A light source module, comprising:

a plurality of light emitting elements;

a plurality of metal wires for supplying power to the light emitting elements;

a light-reflective resin section sealing at least a part of a side surface of the light-emitting element; and

a light absorbing resin portion sealing the metal wire,

wherein the light absorbing resin part is formed by mixing a carbon filler as a light absorbing material into a silicone resin as a base resin, and sealing a predetermined number of the metal wires together, and

wherein the carbon filler is added in an amount such that thixotropy is in the following range with respect to the silicone resin before curing: the viscosity at 0.5 rpm/the viscosity at 5rpm of the E-type viscometer is 2.0 to 3.5 at 23 ℃ and the viscosity at 0.5rpm and the viscosity at 5 rpm.

2. The light source module of claim 1,

the light-reflective resin portion is filled between the adjacent light-emitting elements, and collectively seals side surfaces of a predetermined number of the light-emitting elements.

3. The light source module of claim 1 or 2,

including a sub-assembly having sub-assembly wiring formed on one surface,

and mounting a plurality of the light emitting elements on the sub-mount wiring along a first direction of the sub-mount, the metal wire being connected to the sub-mount wiring.

4. The light source module of claim 3,

a plurality of the subassemblies are arranged in a first column extending in the first direction.

5. The light source module of claim 4,

further, a plurality of the subassemblies are arranged adjacent to the first column as a second column extending in the first direction.

6. The light source module of claim 1 or claim 2,

the distance between the side surfaces of the adjacent light-emitting elements ranges from 0.1mm to 0.6mm.

7. A lamp for a vehicle is characterized in that,

comprising the light source module of any one of claims 1 to 5,

and selectively supplying power to the plurality of metal wires and the plurality of light emitting elements.