JP5155539B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device using an LED chip (light emitting diode chip).

  Conventionally, an LED chip, a mounting substrate made of a circuit board on which the LED chip is mounted, a metal (for example, aluminum) frame surrounding the LED chip on the mounting surface side of the LED chip on the mounting substrate, There has been proposed a light emitting device including a sealing portion made of a transparent resin (for example, an epoxy resin, a silicone resin, etc.) filled with an LED chip and a bonding wire connected to the LED chip inside the frame. (For example, see Patent Documents 1 and 2). Here, the frames described in Patent Documents 1 and 2 are formed in a shape in which the opening area gradually increases as the distance from the mounting substrate increases, and the inner side surface is a mirror surface, which is emitted from the LED chip. It also serves as a reflector that reflects light.

Further, in Patent Document 2, a blue phosphor that emits blue light is used as an LED chip, and a yellow phosphor that emits light when excited by light emitted from the blue LED chip on a transparent resin that seals the blue LED chip. There has been proposed a light-emitting device capable of obtaining an emission spectrum of white light by dispersing.
JP 2001-85748 A JP 2001-148514 A

  By the way, in the above-described light emitting device using an epoxy resin as the material of the sealing portion, when a heat cycle test (temperature cycle test) in which a low temperature period of −40 ° C. and a high temperature period of 80 ° C. are alternately performed is performed. The bonding wire sometimes breaks due to the thermal expansion of the conductor pattern of the mounting board at a high temperature. Moreover, the thing using an epoxy resin as a material of a sealing part had the malfunction that a weather resistance was low compared with the thing using a silicone resin.

  On the other hand, in the above light emitting device using a silicone resin as the material of the sealing part, the sealing part is gel-like and elastic, and the bonding wire is disconnected at a high temperature in the heat cycle test. However, the linear expansion coefficient of the silicone resin that is the material of the sealing portion is a value that is 10 times or more that of the aluminum that is the material of the frame, and the difference between the linear expansion coefficients of the two Due to the above, there is a problem that voids are generated in the sealing portion at a low temperature in the heat cycle test.

  Further, in the above light emitting device, the inner surface of the frame body is used as a mirror surface so that light from the LED chip is efficiently extracted to the outside of the sealing portion. There was a problem that light loss sometimes occurred.

  The present invention has been made in view of the above-described reasons, and an object of the present invention is to provide a light emitting device capable of improving reliability and improving light output.

The invention of claim 1 includes a LED chip, a mounting substrate on which the LED chip is mounted, a frame body of the LED chip enclose cylindrical in mounting surface of the LED chip in the mounting substrate, a transparent inside the frame member An LED chip formed by filling a resin material and electrically connected to each electrode of the LED chip, and a sealing part having elasticity and a lens arranged to overlap the sealing part And a light emitting surface of the lens on the mounting surface side of the mounting substrate formed of a phosphor and a transparent material that is excited by light emitted from the LED chip and emits light of a color different from the emission color of the LED chip And a dome-shaped color conversion member disposed in a form in which an air layer is formed between the outer surface of the frame body, and the mounting substrate is made of a heat conductive material and is mounted with an LED chip. The board, A lead pattern that is electrically connected to each electrode of the LED chip is provided on the surface opposite to the heat plate side, and a window hole that exposes the mounting surface of the LED chip on the heat transfer plate is provided to be fixed to the heat transfer plate. Each of the electrodes of the LED chip is formed on one surface side, and the stress acting on the LED chip due to the difference in linear expansion coefficient between the LED chip and the heat transfer plate is relieved. submount member through the other surface in heat transfer plate is mounted in a manner opposing, each of the electrodes being electrically connected different lead pattern and with each other via a bonding wire, the frame is, the sealing portion of the transparent resin has been formed by the transparency resin is translucent material having a linear expansion coefficient equivalent to the linear expansion coefficient of the material, characterized by comprising fixed to the mounting substrate.

  According to this invention, the sealing part which seals the bonding wire formed by filling the inside of the frame body with the transparent resin material and electrically connected to each electrode of the LED chip and having elasticity Since the frame body is formed of a transparent resin, the difference in linear expansion coefficient between the frame body and the sealing portion can be reduced as compared with the case where the frame body is formed of a metal material as in the prior art. It is possible to suppress the generation of voids in the sealing part at low temperatures in the heat cycle test, so that the reliability can be improved and the occurrence of light reflection loss in the frame can be suppressed. As a result, the light output can be improved. In addition, the color conversion member is disposed on the mounting surface side of the mounting substrate so that an air layer is formed between the light emitting surface of the lens and the outer surface of the frame, and the color conversion member is in close contact with the lens. Therefore, it is possible to suppress a decrease in yield due to the dimensional accuracy and positioning accuracy of the color conversion member, and stress generated in the color conversion member when an external force is applied to the color conversion member through the lens and the sealing portion. Advantage of being able to suppress transmission to the LED chip and each bonding wire, and light emitted from the LED chip and incident on the color conversion member through the sealing portion and the lens and scattered by the phosphor particles in the color conversion member The advantage of being able to reduce the amount of light scattered to the lens side and passing through the lens and improving the light extraction efficiency to the outside as a whole device, Min there is an advantage that is less likely to reach the LED chip. In addition, since an air layer is formed between the color conversion member and the light emitting surface of the lens and the outer surface of the frame, it is possible to suppress heat generated in the phosphor of the color conversion member from being transferred to the LED chip. There is an advantage that you can.

  In the invention of claim 1, there is an effect that the reliability can be enhanced and the light output can be improved.

(Embodiment 1)
Hereinafter, the light-emitting device of this embodiment will be described with reference to FIGS.

  The light emitting device 1 of the present embodiment includes an LED chip 10, a mounting substrate 20 on which the LED chip 10 is mounted, a frame body 40 that surrounds the LED chip 10 on the mounting surface side of the LED chip 10 on the mounting substrate 20, and a frame body. The LED chip 10 and bonding wires 14 and 14 formed by filling a transparent resin material inside 40 and electrically connected to each electrode (not shown) of the LED chip 10 are sealed and elastic. A sealing unit 50, a lens 60 disposed on the sealing unit 50, a phosphor that is excited by light emitted from the LED chip 10 and emits light of a color different from the emission color of the LED chip 10, and An air layer 80 is formed between the light emitting surface 60 b and the outer surface of the frame 40 on the light emitting surface 60 b side of the lens 60 so as to cover the lens 60. And a dome-shaped color conversion member 70 which is arranged in the form.

  The light-emitting device 1 of the present embodiment is used as a light source of a lighting fixture, for example. For example, a resin sheet (for example, fused silica) containing a filler made of a filler such as silica or alumina and having a low viscosity when heated. Is bonded to the instrument body 100 made of metal (for example, a metal having high thermal conductivity such as Al or Cu) through an insulating layer 90 formed of an organic green sheet such as an epoxy resin sheet highly filled with Since the heat resistance from the LED chip 10 to the fixture body 100 can be reduced, the heat dissipation is improved, and the temperature rise of the junction temperature of the LED chip 10 can be suppressed, the input power can be increased, and the light output can be increased. Can be realized. Here, when used as a light source of a lighting fixture, a plurality of light emitting devices 1 are mounted on the fixture main body 100 so that a desired light output is obtained, and the plurality of light emitting devices 1 are connected in series or in parallel. You can do it.

  The mounting substrate 20 is made of a heat conductive material and has a rectangular plate-like heat transfer plate 21 on which the LED chip 10 is mounted, and a rectangular plate-like shape fixed to one surface side (the upper surface side in FIG. 1) of the heat transfer plate 21. A rectangular window hole 24 that exposes the mounting surface (a part of the one surface) of the LED chip 10 in the heat transfer plate 21 is formed at the center of the wiring substrate 22. 10 is mounted on the heat transfer plate 21 via a submount member 30 disposed inside the window hole 24. Therefore, the heat generated in the LED chip 10 is transferred to the heat transfer plate 21 via the submount member 30 without passing through the wiring substrate 22. In this embodiment, Cu, which is a metal having high thermal conductivity, is adopted as the heat conductive material of the heat transfer plate 21 (that is, a metal plate is adopted as the heat transfer plate 21). The conductive material is not limited to Cu, and for example, other metals having high thermal conductivity such as Al or nonmetals having high thermal conductivity like these metals may be adopted.

  The above-mentioned wiring board 22 has a pair of power supply lead patterns 23 electrically connected to each electrode (not shown) of the LED chip 10 on one surface side of an insulating base material 22a made of a glass epoxy board. 23 is provided. Each lead pattern 23, 23 is composed of a laminated film of a Cu film, a Ni film, and an Au film, and the portion inside the frame body 40 in the plan view constitutes the inner lead portions 23a, 23a, and color conversion is performed. Sites outside the member 70 constitute outer lead portions 23b and 23b. The heat transfer plate 21 and the wiring board 22 are fixed via a fixing sheet 25 made of an insulating sheet-like adhesive film. In addition, the material of the insulating base material 22a is not limited to a glass epoxy resin such as FR4, and may be, for example, a polyimide resin or a phenol resin.

  The LED chip 10 is a GaN-based blue LED chip that emits blue light, and is formed of a GaN-based compound semiconductor material on the main surface side of a crystal growth substrate 11 made of a sapphire substrate and has, for example, a stacked structure having a double hetero structure. The light emitting portion 12 composed of a portion is grown by an epitaxial growth method (for example, MOVPE method). Further, the LED chip 10 has a cathode electrode (n electrode) which is a cathode side electrode (not shown) and an anode electrode (p electrode) which is an anode side electrode (not shown) formed on one surface side. The cathode electrode and the anode electrode are composed of a laminated film of a Ni film and an Au film, but the material of the cathode electrode and the anode electrode is not particularly limited, and a material capable of obtaining good ohmic characteristics For example, Al or the like may be employed. In the present embodiment, the light emitting portion 12 of the LED chip 10 is mounted on the heat transfer plate 21 in such a form that it is on the side farther from the heat transfer plate 21 than the crystal growth substrate 11 (that is, the LED chip 10 is And mounted face-up on the mounting substrate 20).

  The LED chip 10 is formed on the above-described heat transfer plate 21 in a rectangular plate shape larger than the chip size of the LED chip 10, and is caused by a difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21. It is mounted via a submount member 30 that relieves stress acting on the LED chip 10. The submount member 30 has not only a function of relieving the stress but also a heat conduction function of transferring heat generated in the LED chip 10 to a range wider than the chip size of the LED chip 10 in the heat transfer plate 21. Yes. In the present embodiment, AlN having a relatively high thermal conductivity and insulation is employed as the material of the submount member 30. In the LED chip 10, each of the cathode electrode and the anode electrode is a thin metal wire (for example, The lead patterns 23 and 23 are electrically connected to each other through bonding wires 14 and 14 made of a gold fine wire, an aluminum fine wire, or the like. The LED chip 10 and the submount member 30 may be bonded using, for example, solder such as SnPb, AuSn, SnAgCu, silver paste, epoxy resin, or the like, but lead-free solder such as AuSn, SnAgCu, or silver Bonding using a paste is preferable from the viewpoint of thermal conductivity and environmental protection. In addition, the submount member 30 is formed with a reflective film (not shown) that reflects light emitted from the LED chip 10 around the bonding portion of the LED chip 10. Here, the reflective film may be formed of a laminated film of a Ni film and an Ag film, for example.

  The material of the submount member 30 is not limited to AlN, and may be any material that has a linear expansion coefficient that is relatively close to that of sapphire that is the material of the crystal growth substrate 11 and a relatively high thermal conductivity. For example, composite SiC, Si Etc. may be adopted.

  In the light emitting device 1, the outer peripheral shape of each of the LED chip 10 and the submount member 30 in a plan view is a square shape, and the outer peripheral line of the LED chip 10 is located on the inner side of the outer peripheral line of the submant member 30 in the plan view. In addition, the LED chip 10 is joined to the central portion of the submount member 30 so that the outer peripheral lines are not parallel to each other, and the diagonal line of the LED chip 10 and the diagonal line of the submount member 30 are not parallel. More specifically, the LED chip 10 is joined to the central portion of the sub-mant member 30 so that the angle formed by the diagonal line of the LED chip 10 and the diagonal line of the sub-mount member 30 is approximately 45 degrees.

  Therefore, compared with the case where the LED chip 10 and the submount member 30 are in a positional relationship such that the outer peripheral lines of the LED chip 10 and the submount member 30 are parallel to each other, one diagonal line of the LED chip 10 is obtained without reducing the planar size of the submount member 30. A linear distance between both ends of each bonding wire 14, 14 extending in the direction along the line (that is, each electrode on one surface of the LED chip 10 is electrically connected to each electrode via the bonding wire 14, 14. The distance between the lead patterns 23 and 23 and the inner lead portions 23a and 23a) can be shortened, and a decrease in light extraction efficiency due to the bonding wires 14 and 14 can be suppressed. The overall size of the device 1 can be reduced. In short, it is possible to suppress a decrease in light extraction efficiency due to the bonding wires 14 and 14 without reducing the heat conduction function of the submount member 30 and to reduce the size of the frame body 40 and the light emitting device 1 as a whole. be able to.

  Although the silicone resin is used as the transparent resin material of the sealing portion 50 described above, not only the silicone resin but also an acrylic resin may be used.

  On the other hand, the frame body 40 has a cylindrical shape and is formed of a transparent resin (in the present embodiment, formed of a transparent resin molded product), but forms the frame body 40. A silicone resin is used as the transparent resin. In short, in the present embodiment, the frame body 40 is formed of a translucent material having a linear expansion coefficient equivalent to that of the transparent resin material of the sealing portion 50. Here, in this embodiment, after the frame body 40 is fixed to the mounting substrate 20, the sealing resin 50 is formed by filling (potting) the transparent resin material inside the frame body 40 and thermosetting the same. is there. In the case where an acrylic resin is used instead of the silicone resin as the transparent resin material, it is desirable that the frame body 40 be formed of an acrylic resin (for example, formed of an acrylic resin molded product).

  The lens 60 is composed of a biconvex lens in which each of the light incident surface 60a and the light emitting surface 60b on the sealing portion 50 side is formed in a convex curved surface shape. Here, the lens 60 is formed of silicone (in the present embodiment, it is formed of a molded product of silicone), and the refractive index is the same as that of the sealing portion 50. Not only silicone but also acrylic resin may be used, for example.

  By the way, the lens 60 has a light emitting surface 60b formed in a convex curved surface shape that does not totally reflect the light incident from the light incident surface 60a at the boundary between the light emitting surface 60b and the air layer 80 described above. Here, the lens 60 is disposed so that the optical axis of the lens 60 is positioned on the center line of the light emitting unit 12 along the thickness direction of the LED chip 10. The light emitted from the side surface of the LED chip 10 propagates through the sealing portion 50 and the air layer 80 to reach the color conversion member 70 and does not excite the phosphor of the color conversion member 70 or collide with the phosphor. Or the color conversion member 70 is transmitted.

  The color conversion member 70 is a molded article made of a mixture of a transparent material such as silicone and a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10. It is configured. Therefore, in the light emitting device 1 of the present embodiment, the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor are emitted through the outer surface 70b of the color conversion member 70, and white light is obtained. Can do. The transparent material used as the material of the color conversion member 70 is not limited to silicone, but, for example, acrylic resin, epoxy resin, glass, organic / inorganic hybrid in which organic components and inorganic components are mixed and bonded at the nm level or molecular level. Materials etc. may be adopted. Further, the phosphor mixed with the transparent material used as the material of the color conversion member 70 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor.

  Here, the color conversion member 70 has an inner surface 70 a formed in a shape along the light emitting surface 60 b of the lens 60. Therefore, the distance between the light emitting surface 60b and the inner surface 70a of the color conversion member 70 in the normal direction is a substantially constant value regardless of the position of the light emitting surface 60b of the lens 60. In addition, the color conversion member 70 is shape | molded so that the thickness along a normal line direction may become uniform irrespective of a position. The color conversion member 70 may be bonded to the mounting substrate 20 using, for example, an adhesive (for example, a silicone resin, an epoxy resin, or the like) on the periphery of the opening.

  In the light emitting device 1 of the present embodiment described above, the LED chip 10 and the bonding wires 14 and 14 that are formed by filling the inside of the frame body 40 with a transparent resin material and electrically connected to the LED chip 10 are sealed. Since the frame body 40 is formed of a transparent resin and has a sealing portion 50 that stops and has elasticity, the frame body 40 and the frame 40 are sealed as compared to the conventional case where the frame body is formed of a metal material. The linear expansion coefficient difference with the part 50 can be reduced, and voids can be prevented from being generated in the sealing part 50 at the low temperature of the heat cycle test. And since it can suppress that the reflection loss of light arises in the frame 40, the improvement of a light output can be aimed at.

  Further, in the light emitting device 1 of the present embodiment, the color conversion member 70 may be disposed in such a manner that an air layer 80 is formed between the light emitting surface 60b of the lens 60 and the outer surface of the frame body 40. Since the conversion member 70 does not need to be in close contact with the lens 60 and the frame body 40, it is possible to suppress a decrease in yield due to the dimensional accuracy and positioning accuracy of the color conversion member 70. Further, in the light emitting device 1 of the present embodiment, since the assembly of the color conversion member 70 is the final process at the time of assembly, the color conversion member 70 in which the blending of the phosphor with respect to the transparent material is adjusted according to the emission wavelength of the LED chip 10. By using, color variations can be reduced.

  Further, in the light emitting device 1 of the present embodiment, since the air layer 80 is formed between the color conversion member 70 and the lens 60 as described above, the color conversion member when an external force acts on the color conversion member 70. The possibility that the lens 70 is deformed and abutted against the lens 60 is reduced, and the stress generated in the color conversion member 70 due to the external force is transmitted to the LED chip 10 and the bonding wires 14 and 14 through the lens 60 and the sealing portion 50. Therefore, there is an advantage that reliability is improved because fluctuations in the light emission characteristics of the LED chip 10 due to the external force and disconnection of the bonding wires 14 and 14 are less likely to occur. Further, since the air layer 80 is formed between the color conversion member 70 and the lens 60, the moisture in the external atmosphere hardly reaches the LED chip 10, and the phosphor of the color conversion member 70 There is an advantage that it is possible to suppress the heat generated by the heat transfer to the LED chip.

  In addition, since the air layer 80 is formed between the color conversion member 70 and the lens 60, the color conversion member 70 is emitted from the LED chip 10 and enters the color conversion member 70 through the sealing portion 50 and the lens 60. Among the light scattered by the yellow phosphor particles in 70, there is an advantage that the amount of light scattered to the lens 60 side and transmitted through the lens 60 can be reduced, and the light extraction efficiency to the outside as the entire apparatus can be improved. is there.

  Here, as shown in FIGS. 4A and 4B, the optical axis of the color conversion member 70 and the optical axis of the LED chip 10 coincide with each other, and the central position of the color conversion member 70 in the optical axis direction. It is assumed that the blue light from the LED chip 10 is scattered in all directions by P, the total reflection angle at the interface between the color conversion member 70 and the air layer 80 is φa, and the color conversion member 70 and the outside of the color conversion member 70 are outside. The total reflection angle at the interface with air, which is the medium, is φb, the light scattered at the position P is 2θa, the spread angle of the escape cone ECa on the inner surface 70a side of the color conversion member 70, and the color is scattered with respect to the light scattered at the position P If the spread angle of the escape cone ECb on the outer surface 70b side of the conversion member 70 is 2θb, as shown in FIG. 4A, when the total reflection angles φa and φb are 40 °, 2θa = 60 ° and 2θb = 98 °. , The total reflection angle as shown in FIG. When φa and φb are 50 °, 2θa = 76 ° and 2θb = 134 °.

Here, if the refractive index of the transparent material used for the color conversion member 70 is n and the maximum emission efficiency of blue light scattered at the position P and emitted through the escape cone ECa on the inner surface 70a is η, η = ( ¼n ² ) × 100 [%], so that when silicone resin is used as the transparent material as described above, η≈13% when n = 1.4. Therefore, when the air layer 80 is not formed between the color conversion member 70 and the lens 60, 50% of the blue light scattered at the position P returns to the lens 60, whereas the air layer Since 80 is formed, only 13% of the blue light scattered at the position P returns to the lens 60, so that deterioration of the sealing portion 50 due to the blue light can be suppressed. In order to reduce the blue light emitted through the escape cone ECa, it is desirable to increase the thickness of the color conversion member 70.

  Further, in the light emitting device 1 according to the present embodiment, the thickness dimension of the submount member 30 is set so that the surface of the submount member 30 is further away from the heat transfer plate 21 than the surface of the wiring substrate 22. It is possible to prevent the light radiated laterally from 10 from being absorbed by the wiring substrate 22 through the inner peripheral surface of the window hole 24 of the wiring substrate 22 and the light radiated laterally from the LED chip 10. The light can be prevented from being emitted through the joint portion between the color conversion member 70 and the mounting substrate 20. In addition, as described above, the reflection film that reflects the light emitted from the LED chip 10 is formed around the bonding portion of the LED chip 10 in the submount member 30, so that the LED chip 10 is laterally formed. It is possible to prevent the emitted light from being absorbed by the submount member 30 and to increase the light extraction efficiency to the outside.

(Embodiment 2)
Hereinafter, the light emitting device of the present embodiment will be described with reference to FIGS.

  The basic configuration of the light emitting device 1 of the present embodiment is substantially the same as that of the first embodiment, except that the lens 60 and the frame body 40 are integrally formed of the same transparent resin (for example, silicone). . In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Further, in the wiring board 22 in the present embodiment, the lead patterns 23 and 23 and the lead patterns 23 and 23 are formed in the insulating base material 22a on the surface side opposite to the heat transfer plate 21 side in the insulating base material 22a. A resist layer 26 (see FIG. 5 and FIG. 7) made of a white resin covering a portion that is not present is laminated. Therefore, the light emitted from the side surface of the LED chip 10 and incident on the surface of the resist layer 26 is reflected by the surface of the resist layer 26, so that the light emitted from the LED chip 10 is connected to the heat transfer plate 21 side in the wiring substrate 22. Can be prevented from being absorbed through the opposite surface, and the light output can be improved by improving the light extraction efficiency to the outside.

  Here, the resist layer 26 is formed with circular opening windows 26 a that expose the inner lead portions 23 a and 23 a of the lead patterns 23 and 23 in the vicinity of the window holes 24 of the wiring substrate 22. Are formed with circular opening windows 26b and 26b for exposing the outer lead portions 23b and 23b of the conductor patterns 23 and 23, respectively.

  Further, the lens 60 in the present embodiment is formed in a plano-convex lens shape in which the light incident surface 60a on the sealing portion 50 side is formed in a flat shape and the light emitting surface 60b is formed in a convex curved surface shape.

  Here, as described above, the lens 60 and the frame body 40 are integrally formed of the same transparent resin (for example, silicone) (in other words, the lens 60 and the frame body 40 are continuously formed integrally. In other words, the sealing portion 50 has the same refractive index and linear expansion coefficient. The lens 60 and the frame body 40 may be formed of a transparent resin that does not fall below the refractive index and elastic modulus of the transparent resin material of the sealing portion 50. For example, when the sealing resin is an acrylic resin, the lens 60 and the frame 40 may be integrally formed of acrylic resin. The transparent resin employed as the material of the lens 60 and the frame body 40 only needs to have a linear expansion coefficient equivalent to that of the transparent resin material of the sealing portion 50.

  In the light emitting device of the present embodiment, the LED chip 10 is disposed at a position separated from the plane including the outermost surface (the surface of the resist layer 26) of the mounting substrate 20 in the normal direction of the plane. The space surrounded by the lens 60 and the frame body 40 in the lens block constituted by the frame body 40 constitutes a housing recess for housing the LED chip 10.

  As a method for manufacturing the light emitting device of this embodiment, as shown in FIG. 9, after the LED chip 10 and the bonding wires 14 and 14 are electrically connected, the space surrounded by the lens 60 and the frame body 40 is described above. A mounting substrate in which the frame 40 is interposed between the lens 60 and the mounting substrate 20 after injecting a liquid transparent resin material (for example, a sealing resin made of silicone resin) 50c to be the sealing portion 50 A manufacturing method is conceivable in which the sealing portion 50 is formed by placing the transparent resin material 50c opposite to the substrate 20 and curing the transparent resin material 50c. However, in such a manufacturing method, a void may occur in the sealing portion 50 during the manufacturing process.

  Therefore, in manufacturing the light emitting device 1 of the present embodiment, as shown in FIG. 8, after the LED chip 10 is mounted on the mounting substrate 20 and the LED chip 10 and the bonding wires 14 and 14 are electrically connected, The LED chip 10 and the bonding wires 14 and 14 are covered with a liquid first transparent resin material (for example, a sealing resin made of silicone resin) 50a that becomes a part of the sealing portion 50, and then the lens 60 and the frame body 40 are covered. A liquid second transparent resin material (for example, a sealing resin made of silicone resin) 50b made of the same material as the first transparent resin material 50a and serving as another part of the sealing portion 50 is injected into the space surrounded by Thereafter, the transparent resin materials 50a and 50b are cured by disposing the lens 60 opposite to the mounting substrate 20 with the frame body 40 interposed between the lens 60 and the mounting substrate 20. And so as to form the sealing portion 50. According to such a manufacturing method, it is difficult to generate a void in the sealing portion 50 during the manufacturing process, and it is possible to provide the light emitting device 1 with high reliability and high light output. Here, if the first transparent resin material 50a is cured before injecting the second transparent resin material 50b, the viscosity of the first transparent resin material 50a is lowered and trapped in the storage recess. There is an advantage that voids are easily removed. In the present embodiment, the inner diameter of the circular opening window 26a formed in the central portion of the resist layer 26 of the mounting substrate 20 is set to be slightly larger than the maximum outer diameter of the color conversion member 70. When the first transparent resin material 50a is potted, the first transparent resin material 50a that has flowed to the vicinity of the inner peripheral surface of the opening window 26a is used as an adhesive that joins the color conversion member 70 and the mounting substrate 20. .

  In the light emitting device 1 of the present embodiment described above, since the lens 60 and the frame body 40 are integrally formed of the same transparent resin, the number of parts is larger than when the lens 60 and the frame body 40 are separate members. And a decrease in light output due to the deviation of the optical axis between the LED chip 10 and the lens 60 can be prevented.

(Embodiment 3)
Hereinafter, the light-emitting device 1 of this embodiment is demonstrated based on FIG.

  The basic configuration of the light emitting device 1 of the present embodiment is substantially the same as that of the second embodiment, and the inner diameter of the opening window 26a at the center of the resist layer 26 is set slightly smaller than the maximum inner diameter of the color conversion member 70. The difference is that the edge of the color conversion member 70 on the mounting substrate 20 side and the peripheral portion of the opening window 26a in the resist layer 26 are joined together by a joint portion 75 made of an adhesive over the entire circumference. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted.

  Therefore, in manufacturing the light emitting device 1 of the present embodiment, as in the second embodiment, the LED chip 10 is mounted on the mounting substrate 20 and the LED chip 10 and the bonding wires 14 and 14 are electrically connected as shown in FIG. After the connection, the LED chip 10 and the bonding wires 14 and 14 are covered with a liquid first transparent resin material (for example, a sealing resin made of silicone resin) 50a which becomes a part of the sealing portion 50, In a space surrounded by the lens 60 and the frame body 40, a liquid second transparent resin material (for example, a seal made of silicone resin) made of the same material as the first transparent resin material 50a and forming the other part of the sealing portion 50 is used. (Stopping resin) 50b is injected, and then the lens 60 is disposed opposite to the mounting substrate 20 with the frame body 40 interposed between them and the transparent resin materials 50a, 5 And so as to form a sealing portion 50 formed by curing the b. Here, in manufacturing the light emitting device 1 of the present embodiment, the resist layer 26 prevents the first transparent resin material 50a from flowing out to the joint portion of the color conversion member 70. Since the edge on the mounting substrate 20 side and the mounting substrate 20 are bonded with an adhesive, the thickness of the bonding portion 75 interposed between the color conversion member 70 and the mounting substrate 20 can be easily controlled, and the color The reliability of joining between the conversion member 70 and the mounting substrate 20 is improved. In addition, it is desirable to use the same material as the color conversion member 70 as the adhesive of the joint portion 75.

  By the way, in each of the above-described embodiments, a blue LED chip whose emission color is blue is adopted as the LED chip 10 and a sapphire substrate is adopted as the crystal growth substrate 11. A substrate, a GaN substrate, or the like may be used. Further, the light emission color of the LED chip 10 is not limited to blue, and may be, for example, red or green. That is, the material of the light-emitting portion 12 of the LED chip 10 is not limited to the GaN-based compound semiconductor material, and a GaAs-based compound semiconductor material, a GaP-based compound semiconductor material, or the like may be employed according to the emission color of the LED chip 10. The crystal growth substrate 11 is not limited to the sapphire substrate, and may be appropriately selected from, for example, a SiC substrate, a GaN substrate, a GaAs substrate, and a GsP substrate according to the material of the light emitting unit 12.

1 is a schematic cross-sectional view of a light emitting device according to Embodiment 1. FIG. It is a general | schematic disassembled perspective view in which the light emitting device same as the above was partially broken. It is a principal part schematic plan view of a light-emitting device same as the above. It is principal part explanatory drawing of a light-emitting device same as the above. 6 is a schematic cross-sectional view of a light emitting device according to Embodiment 2. FIG. It is a general | schematic disassembled perspective view in which the light emitting device same as the above was partially broken. It is a schematic plan view of the wiring board in the above light emitting device. It is explanatory drawing of the manufacturing method of a light-emitting device same as the above. It is explanatory drawing of the manufacturing method of a light-emitting device same as the above. 6 is a schematic cross-sectional view of a light emitting device according to Embodiment 3. FIG. It is explanatory drawing of the manufacturing method of a light-emitting device same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 LED chip 14 Bonding wire 20 Mounting board 21 Heat-transfer board 22 Wiring board 22a Insulating base material 23 Lead pattern 30 Submount member 40 Frame body 50 Sealing part 60 Lens 70 Color conversion member 80 Air layer

Claims (1)

An LED chip, a mounting substrate on which the LED chip is mounted, formed by filling a frame body of the LED chip enclose cylindrical in mounting surface of the LED chip in the mounting substrate, a transparent resin material on the inside of the frame The LED chip and the bonding wire electrically connected to each electrode of the LED chip are sealed and elastically sealed, a lens disposed on the sealed part, and emitted from the LED chip. The light emitting surface of the lens and the outer surface of the frame on the mounting surface side of the mounting substrate are formed of a phosphor and a transparent material that is excited by the light and emits light of a color different from the emission color of the LED chip. A dome-shaped color conversion member disposed in such a manner that an air layer is formed between the heat transfer plate and the heat transfer plate on which the LED chip is mounted made of a heat conductive material and the heat transfer plate side Opposite A lead pattern that is electrically connected to each electrode of the LED chip is provided on the surface, and a window hole that exposes the LED chip mounting surface on the heat transfer plate is provided, and the wiring board is fixed to the heat transfer plate. In the LED chip, each electrode is formed on one surface side, and is transmitted through a submount member that relieves stress acting on the LED chip due to a difference in linear expansion coefficient between the LED chip and the heat transfer plate. It is mounted on the heat plate with the other surface facing each other, and each electrode is electrically connected to a different lead pattern via a bonding wire, and the frame is equivalent to the linear expansion coefficient of the transparent resin material of the sealing part of a translucent material having a linear expansion coefficient has been formed by the transparency resin, the light emitting device characterized by comprising fixed to the mounting substrate.

Images