KR100978566B1 - Side view light emitting diode package and fabrication method thereof - Google Patents

Abstract

The present invention relates to a side emitting LED package, two electrode patterns spaced apart from each other; An LED chip formed in the separation region; A wire connecting the LED chip and an electrode pattern; And a molding material covering the electrode pattern, the LED chip, and the wire; and providing a side emitting LED package and a manufacturing method thereof.

LED, side emission, heat deformation, thinning, miniaturization

Description

Side release LED package and its manufacturing method {SIDE VIEW LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF}

The present invention relates to a side emitting LED package, and more particularly, by using a plate electrode instead of a lead frame as an electrode pattern, and by replacing the molding material with the package body, the side emitting LED that can improve the quality and miniaturization A package and a method of manufacturing the same.

Small LCDs such as mobile phones and PDAs use side-by-side LEDs as the light source for their backlight devices. Such side type LEDs are typically mounted on a backlight device as shown in FIG. 1.

Referring to FIG. 1, in the backlight device 50, a flat light guide plate 54 is disposed on a substrate 52, and a plurality of side type LEDs 10 are disposed in an array form on the side of the light guide plate 54. The light L incident from the LED 1 to the light guide plate 54 is reflected upwardly by a minute reflection pattern or a reflective sheet 56 provided on the bottom surface of the light guide plate 54 and exited from the light guide plate 54, and then the light guide plate ( 54) The backlight is provided to the upper LCD panel 58.

2 is a cross-sectional view showing an example of the LED package 10 of the prior art as shown in FIG.

As shown in the figure, the LED package 10 includes a package body 11, a pair of lead frames 13 and 15 disposed in the package body 11, and an LED mounted on the lead frame 13. And a chip 17.

The package body 11 is usually formed by molding a high reflectance resin, and can be divided into a front half portion 11a and a second half portion 11b around the lead frames 13 and 15.

The first half 11a has a groove A inclined upward, and the LED chip 17 is mounted on the lead frame 13 exposed through the groove A.

Meanwhile, the LED chip 17 is electrically connected to the lead frames 13 and 15 by wires 18, and some of the lead frames 13 and 15 extend outside the package body 11 to provide external terminals. Form.

In addition, a molding material 19 is filled in the groove A to seal the LED chip 17 and the wire 18 from the outside.

The molding material 19 is made of a transparent resin, and contains a fluorescent material for converting light or ultraviolet rays generated by the LED chip 17 into, for example, white light.

The conventional side emitting LED package 10 configured as described above is manufactured through the following process.

First, the package main body 11 having the groove A is formed by injection molding in a state in which the lead frame 13 is placed in a synthetic resin, and then the LED is placed on the lead frame 13 exposed through the groove A. The chip 17 is mounted, and the LED chip 17 and the lead frame 13 are electrically connected through wire bonding.

Subsequently, the transparent resin and the phosphor are mixed and injected into the groove portion A of the first half of the package body 11a. Then, the transparent resin is cured by exposure at high temperature for a long time.

After the transparent resin is cured, each unit package is cut and one light emitting device is manufactured.

At this time, since the package main body 11 is made of a synthetic resin material, high heat is applied in the curing process of the transparent resin, resulting in thermal deformation of the package main body 11.

As the thermal deformation of the package body 11 occurs, peeling occurs between the molding material 19, the package body 11, and the lead frames 13 and 15, thereby degrading the quality of the light emitting device.

In addition, in the conventional LED package, since the LED chip 17 is mounted on the lead frame 13, there is a limit in reducing the thickness of the LED package.

In addition, since the LED chip 17 is mounted in the groove A of the package body 11, wire bonding between the LED chip 17 and the lead frames 13 and 15 is performed. ) Must be secured to a certain level. Therefore, due to the workability of the wire bonding, it is difficult to reduce the size of the groove portion to a certain level or less, thereby limiting the miniaturization of the package.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to eliminate the problem of peeling between components such as molding materials, LED chips and lead frames by removing the package body causing thermal deformation. It is to provide a side emitting LED package and a method of manufacturing the same that can solve.

Another object of the present invention is to provide a side emitting LED package and a method of manufacturing the same, which can reduce the size of a light emitting device by using a plate electrode instead of a lead frame and replacing the molding material with a package body.

In order to achieve the above object, the present invention, two electrode patterns spaced apart from each other; An LED chip formed in the separation region; A wire connecting the LED chip and an electrode pattern; And a molding material covering the electrode pattern, the LED chip, and the wire.

In this case, the electrode pattern may further include a phosphor layer formed on the back surface of the LED chip, and holes may be formed in the electrode pattern, thereby further improving adhesion to the phosphor layer.

The molding material includes a reflective material, and all light emitted from the LED chip toward the molding material is reflected and directed upward.

In addition, the present invention comprises the steps of preparing a sheet (sheet) having an adhesive; Attaching plate electrodes spaced at regular intervals on the sheet; Attaching the LED chips to the spaced areas of the plate electrodes on the sheet at regular intervals; Wire bonding the plate electrode with an LED chip; And forming a molding material on a sheet including the plate electrode and the LED chip.

The forming of the molding material may include molding a molding material including a reflective material to a predetermined thickness; And temporarily curing the molding material.

The method may further include forming a phosphor layer on the plate electrode and the LED chip on which the sheet is removed after the sheet is removed, and the forming of the phosphor layer may include mixing a fluorescent material mixed with a transparent resin. The material is made by molding on top of the plate electrode and the LED chip.

In addition, the present invention further comprises the step of hardening the mixture comprising the molding material and the fluorescent material comprising the reflective material. Through the present curing step, the molding material and the phosphor layer is completed, and further comprises the step of separating the plate electrode formed on both sides of the molding material and phosphor layer, separated into a unit package.

As described above, the present invention not only miniaturizes the light emitting device by using the plate electrode instead of the lead frame, but also reduces the size of the light emitting device by replacing the molding material with the package body, and conventionally, the molding material, It solves the problem of separation between components such as LED chip and lead frame.

The present invention can solve the peeling problem between components such as the molding material, LED chip and lead frame by removing the package body that causes thermal deformation, it is possible to further improve the quality of the device.

In addition, according to the present invention, the lead frame is removed and the plate electrode is used as the electrode pattern, whereby the light emitting element can be thinned and downsized.

Hereinafter, the side-emitting LED package and a method of manufacturing the same according to the present invention through the accompanying drawings to be described in detail.

3 illustrates a unit package of the side-emitting LED according to the present invention, FIG. 3A illustrates a structure of a light emitting device package before a phosphor layer is formed, and FIG. 3B illustrates a light emitting device package in which a phosphor layer is formed. 4 is a cross-sectional view of II ′ of FIG. 3A.

As shown in the figure, the side-emitting LED package 100 according to the present invention, the electrode pattern 130 formed to be spaced apart from each other, the LED chip 120 disposed in the separation region of the electrode pattern 130, the electrode The pattern 130 and the molding material 110 formed on the rear surface of the LED chip 120 is configured to include.

The molding member 110 is made of an insulating material such as resin such as epoxy or silicon, and electrode patterns 130 are formed on both sides thereof. Therefore, the two electrode patterns 130 are insulated by the molding material 110 filled therebetween.

In addition, the electrode pattern 130 is electrically connected to an electrode (not shown) of the LED chip 120 through a wire 160, and is formed of a plate electrode.

In addition, the phosphor layer 150 is formed on the molding material 110 including the electrode pattern 130 and the LED chip 120.

The phosphor layer 150 is formed by mixing a phosphor in a resin, and the resin is any one of epoxy, silicone, modified silicone, urethane resin, oxetane resin, acrylic, polycarbonate, and polyimide having high refractive index and high light transmittance. It includes, and the phosphor includes a phosphor for converting the wavelength to any one of yellow, red and green.

Therefore, since the phosphor converts the light generated from the LED chip 120 to implement white light, the phosphor is determined according to the emission wavelength of the LED chip 120. For example, when the LED chip 120 is a blue device, the phosphor uses a yellow light emitting phosphor.

The phosphor layer 150 may be formed on the entire surface of the molding material 110 on which the electrode pattern 130 and the LED chip 120 are located, or may be locally formed on the LED chip 120. have.

On the other hand, when the phosphor layer 150 is formed on the entire surface of the molding material 110, the phosphor layer to form a hole 140 in the electrode pattern 130 to improve the adhesion with the molding material. You may.

The molding material 110 and the phosphor layer 150 directly contact through the hole 140 formed in the electrode pattern 130.

In addition, the LED chip 120 may include at least one or more of LED chips generating blue, red, green, and UV wavelengths. For example, a blue light emitting device alone Or a blue and a red light emitting device may be configured together.

However, the present invention is not limited to these examples and may be constituted alone or in any combination as long as it generates blue, red, green and UV wavelengths.

Meanwhile, the molding material 110 formed under the LED chip 120 and the electrode pattern 130 may be any one of epoxy, silicone, modified silicone, urethane resin, oxetane resin, acrylic, polycarbonate, and polyimide. It may include.

The molding member 110 not only protects the LED chip 120, the wire 150, and the electrode pattern 130 from the outside, but also serves as a conventional package body.

In addition, the molding material 110 includes a material having a reflective function, that is, titanium oxide (TiO 2), aluminum (Al), silver (Ag), and the like, and also serves as a reflective layer.

That is, the molding material 110 reflects the light generated from the LED chip 120 and directed downward, so that the molding material 110 is directed toward the upper direction of the LED chip 120.

In the light emitting device package of the present invention configured as described above, since the package body made of synthetic resin is omitted, and the molding material functions as the package body, the conventional problem due to thermal deformation can be solved.

In other words, in the related art, due to thermal deformation of a package body made of synthetic resin, an LED chip, a lead frame, etc. contacting the package body is peeled off from the package body, thereby degrading device quality.

However, in the present invention, since the molding material replaces the package main body, the problem due to thermal deformation can be solved.

Further, in the present invention, since the lead frame is removed and the plate electrode is used as the electrode pattern, the present invention can be thinner and smaller in size. That is, in the related art, since the LED chip is mounted on the lead frame, there is a limit in reducing the thickness of the package. In order to facilitate the operation of wire bonding connecting the LED chip to the lead frame (electrode pattern) of the package main body Since the groove area formed to surround the LED chip must be secured, there is a limit in miniaturization of the device.

However, in the present invention, the LED chip 120 is mounted on the same plane (molding material) as the electrode pattern 130, not the stacked structure of the electrode pattern 130 and the LED chip 120. As a result, the thickness of the package can be reduced.

Furthermore, since the package main body provided with the groove portion is removed and the periphery of the LED chip is open, the size of the device can be reduced in size without regard to the bonding operation.

As described above, the light emitting device package of the present invention does not have a conventional package body, and uses a plate electrode as an electrode pattern instead of a lead frame, and an LED chip is mounted on the same plane as the electrode pattern. According to the light emitting device package according to the present invention, after preparing an adhesive sheet, attaching a plate electrode and an LED chip on the sheet, performing wire bonding therebetween, forming a molding material thereon, and then removing the adhesive sheet. Then, it can manufacture by forming a phosphor layer in the area | region from which the adhesive sheet was removed.

5A to 5E are process plan views for explaining a method of manufacturing a side emitting LED package according to the present invention.

First, as shown in FIG. 5A, an adhesive sheet 101 is prepared. An adhesive material is formed on the surface of the sheet 101, and a film for protecting the adhesive material may be separately provided on the surface of the adhesive layer. When a film is provided on the adhesive material, the sheet 101 is prepared by removing the film.

On the sheet 101, a plate electrode 130a having an electrode pattern 130 is attached. In this case, the electrode patterns 130 are regularly arranged at regular intervals, and holes 140 are formed in each electrode pattern 130.

Subsequently, as shown in FIG. 5B, the LED chips 120 are arranged at regular intervals in the separation region of the electrode pattern 130. At this time, the interval for arranging the LED chip 120 will vary depending on the specifications and process conditions of the product. In addition, since the adhesive sheet is attached to the plate electrode 130a, the LED chip 120 is mounted on the sheet 101.

Subsequently, as shown in FIG. 5C, the LED chip 120 and the electrode pattern 130 are connected through wire bonding. Reference numeral 160 is a wire for electrically connecting the LED chip 120 and the electrode pattern 130.

Then, after filling a molding material containing a reflective material on the structure, by molding the molding material, thereby forming a molding material (110). Since FIG. 5C is a plan view, the molding member 110 is not well represented, and thus, the molding member 110 illustrated in FIG. 4 is referred to.

In this case, the molding material is titanium oxide (TiO 2), aluminum (Al) or silver (resin) of a resin containing any one of epoxy, silicone, modified silicone, urethane resin, oxetane resin, acrylic, polycarbonate, and polyimide ( It is formed by mixing reflective materials such as Ag).

On the other hand, although not shown in detail in the drawings, the molding member 110 may be formed using a molding member forming frame provided separately, the molding member forming frame is surrounded on all sides by a wall, wire bonding is After placing the sheet of the completed structure on the bottom surface of the mold, by filling a liquid resin inside the mold, it will be possible to form the molding member 110 by curing it. When the curing is completed, the mold for forming the molding material is removed.

When the molding member 110 is formed as described above, the sheet 101 provided on the plate electrode 130a and the LED chip 120 is removed.

Subsequently, in the region where the sheet 101 is removed, a resin mixed with phosphors is filled and cured to form a phosphor layer 150 (see FIG. 5D).

In this case, the resin of the phosphor layer 150 is in direct contact with the molding material 110 formed on the rear surface of the electrode pattern 130 by the holes 140 formed in the electrode pattern 130, and the phosphor layer 150. In the step of curing), the molding material 110 is the main curing, the bonding force between these (phosphor layer and the molding material) is further improved.

Meanwhile, the phosphor layer 150 may be formed directly on the LED chip 120 in a film form. That is, after removing the sheet, it may be attached directly to the fluorescent film on the LED chip 120.

When attaching the phosphor layer in the form of a film, the hole of the electrode pattern does not need to be formed.

When the phosphor layer 150 is completed as described above, as shown in FIG. 5E, the structure is cut along the cutting line 180 to be separated for each unit package.

The side-emitting LED package of the present invention manufactured through the process as described above, by removing the existing package body, and replacing the molding material with the package body, to prevent deterioration due to thermal deformation, thinning and miniaturization of the device It is possible to use, regardless of the structure of the LED chip, if the plate electrode is used as the electrode pattern, and the electrode pattern and the LED chip is formed on the same plane, including a molding material surrounding all of them, all will be included in the present invention will be.

Accordingly, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims also belong to the scope of the present invention.

1 is a cross-sectional view of a backlight device using a side emitting LED package.

2 is a cross-sectional view of a conventional side emitting LED package.

3 is a unit package of the side-emitting LED according to the present invention, Figures 3a and 3b is a view showing the front and rear of the LED package, respectively.

4 is a cross-sectional view taken along the line II ′ of FIG. 3A;

5a to 5e is a process plan view showing a manufacturing process of the package of the LED according to the present invention.

<Description of the symbols for the main parts of the drawings>

100: side emitting LED package 101: sheet

110: molding material 120: LED chip

130a: plate electrode 130: electrode pattern

140: hole 150: phosphor layer

160: wire 180: cutting line

Claims (12)

Two electrode patterns spaced apart from each other; An LED chip formed in a spaced area of the electrode pattern and having an electrode formed on one surface thereof; A wire connecting one surface of an electrode pattern and an electrode of the LED chip; A molding material covering one surface of the electrode pattern, one surface of the LED chip, and a wire; And A phosphor layer formed on the other surface of the electrode pattern and the other surface of the LED chip; Side emission LED package configured to include. delete The method of claim 1, The molding material, the side-emitting LED package, characterized in that containing a reflective material. The method of claim 3, The reflective material is titanium oxide (TiO 2), aluminum (Al) or silver (Ag) side emitting LED package, characterized in that one of. The method of claim 1, Side emission LED package, characterized in that a hole is formed in the electrode pattern. Preparing an adhesive sheet; Attaching plate electrodes having electrode patterns spaced at regular intervals on the sheet; Attaching LED chips having electrodes formed on one surface to a spaced area of the electrode pattern on the sheet at a predetermined interval; Wire-bonding one surface of the electrode pattern and an electrode of the LED chip; Forming a molding material on a sheet including the electrode pattern, the LED chip, and the wire; Removing the sheet; And Forming a phosphor layer on the other surface of the plate electrode from which the sheet is removed and the other surface of the LED chip; Method for producing a side-emitting LED package comprising a. The method of claim 6, Forming the molding material, Molding a molding material having a reflective material mixed with the resin to a predetermined thickness; And Method of manufacturing a side-emitting LED package, characterized in that the step of temporarily curing the molding material. The method of claim 7, wherein The method of manufacturing a side-emitting LED package, characterized in that further comprising the step of curing the molding material. The method of claim 6, Forming the phosphor layer, A method of manufacturing a side-emitting LED package, characterized in that for molding the mixture of the fluorescent material mixed with the transparent resin on the other surface of the plate electrode and the other surface of the LED chip. 10. The method of claim 9, Method for producing a side-emitting LED package, characterized in that further comprising the step of curing the mixture. The method of claim 6, The forming of the phosphor layer may include attaching a fluorescent film to the other surface of the plate electrode and the other surface of the LED chip. The method of claim 6, And cutting the plate electrodes formed on both surfaces of the molding material and the phosphor layer, and separating the plate electrodes into unit packages.

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