KR20140096847A

KR20140096847A - Light Emitting Diode modules

Info

Publication number: KR20140096847A
Application number: KR1020130009972A
Authority: KR
Inventors: 이병덕
Original assignee: 엘지이노텍 주식회사
Priority date: 2013-01-29
Filing date: 2013-01-29
Publication date: 2014-08-06

Abstract

The present invention relates to a light emitting device module, and more particularly, to a light emitting device module that mounts a light emitting device on a printed circuit board.
A light emitting device module of an embodiment of the present invention includes: a printed circuit board having electrodes; A light emitting element disposed on an upper surface of the printed circuit board; And a cover disposed on the upper surface of the printed circuit board and guiding light emitted by the light emitting device, wherein the cover has a plurality of reflection surfaces, a reflection surface disposed on a side of the light emitting device among the plurality of reflection surfaces, , And the cross-sectional angle formed by the reflection surface disposed on the upper portion of the light-emitting element is 90 degrees or more and 135 degrees or less.

Description

[0001] Light Emitting Diode modules [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device module, and more particularly, to a light emitting device module that mounts a light emitting device directly on a printed circuit board.

Light Emitting Diode (LED) is a device that converts electrical signals into light by using the characteristics of compound semiconductors. It is widely used in household appliances, remote control, electric signboard, display, and various automation devices. There is a trend.

Nitride semiconductors have attracted great interest in the development of optical devices and high output electronic devices due to their high thermal stability and wide band gap energy. Particularly, blue light emitting devices, green light emitting devices, ultraviolet (UV) light emitting devices, and the like using nitride semiconductors have been commercialized and widely used.

The light emitting device package is manufactured by manufacturing a light emitting device on a printed circuit board, separating the light emitting device chip by dieseparation, which is a sawing process, and then dicing the light emitting device chip into a package body diebonding, wire bonding, molding, and so on.

The surface of the lead frame may be oxidized by foreign matter inserted from the outside of the light emitting device package, and defects such as deterioration or discoloration due to heat generated in the chip may occur. These defects may be a problem of lowering the luminance of the light emitting device package.

Accordingly, it is an object of the present invention to provide a light emitting device module having sufficient heat resistance and thermal conductivity.

A light emitting device module of an embodiment of the present invention includes: a printed circuit board having electrodes; A light emitting element disposed on an upper surface of the printed circuit board; And a cover disposed on the upper surface of the printed circuit board and guiding light emitted by the light emitting device, wherein the cover has a plurality of reflection surfaces, a reflection surface disposed on a side of the light emitting device among the plurality of reflection surfaces, , And the cross-sectional angle formed by the reflection surface disposed on the upper portion of the light-emitting element is 90 degrees or more and 135 degrees or less.

The light emitting device module of one embodiment of the present invention can simplify the process procedure and minimize the defects that may occur in the manufacturing process.

In the light emitting device module according to an embodiment of the present invention, the light emitting device and the printed circuit board are directly connected to each other, so that the heat emitting path generated from the light emitting device can be simplified.

1 to 3 are cross-sectional views illustrating a light emitting device module according to an exemplary embodiment.
4 to 6 are front views of a light emitting device module according to an exemplary embodiment of the present invention.
7 is a front view of a light emitting device module according to an embodiment.
8 is a plan view of a light emitting device module according to an embodiment.
9 is a perspective view illustrating a liquid crystal display device including a light emitting device module according to an embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3 are cross-sectional views illustrating a light emitting device module according to an exemplary embodiment.

Referring to FIG. 1, a light emitting device module 100 according to an exemplary embodiment of the present invention includes a printed circuit board 110 having electrodes, a light emitting device 110 mounted on a top surface of a printed circuit board 110, And a cover 150 disposed on the upper surface of the printed circuit board 110 and guiding the light emitted by the light emitting device 120. [

The light emitting device module 100 of one embodiment may include a printed circuit board 110, a light emitting device 120, a filler 140, and a cover 150.

The light emitting device module 100 according to an embodiment of the present invention may have a light emitting device 120 disposed on a top surface of a printed circuit board 110. The printed circuit board 110 and the light emitting device 120 may be electrically connected. The printed circuit board 110 and the light emitting device can be directly connected.

The printed circuit board 110 may include a substrate and an electrode pattern formed of a material having electrical conductivity on the substrate. The substrate may include, but is not limited to, an insulating plate such as phenol or epoxy or a metallic material.

The light emitting device 120 is directly mounted on the upper surface of the printed circuit board 110 to emit light.

The light emitting device 120 may be directly mounted on the upper surface of the printed circuit board 110 by a wire bonding method, a flip chip method, or a die bonding method to be electrically connected.

The light emitting device 120 may be directly mounted on the upper surface of the printed circuit board 110. For example, the light emitting device 120 may be a light emitting device that emits light such as red, green, blue, or white, or a UV (Ultra Violet) But it is not limited thereto.

The filler material 140 may be filled between the cover 150 and the printed circuit board 110. The filler 140 may be disposed to surround the light emitting device 120.

The filler 140 may cover the light emitting device 120. The filler material 140 may include a phosphor. The filler material 140 may be formed of transparent silicone, epoxy, and other resin materials. The filler 140 may be formed by filling the light emitting device 120 with ultraviolet rays or thermosetting.

The phosphor (not shown) may emit blue light, green light, fluorescent light, yellow light emitting fluorescent material, yellow light emitting fluorescent material, orange light emitting fluorescent material, and red light emitting material, depending on the wavelength of light emitted from the light emitting element 120 One of the phosphors may be applied. The phosphor (not shown) may be selected according to the wavelength of the light emitted from the light emitting device 120 so that the light emitting device module 100 can realize white light.

The phosphor (not shown) may generate the second light by the light having the first light emitted from the light emitting device 120. For example, when the light emitting element 120 is a blue light emitting diode and the phosphor (not shown) is a yellow phosphor, the yellow phosphor may emit yellow light by blue light, and blue light and blue light The light emitting device module 100 can provide white light.

The phosphor (not shown) may mix the light emitting element 120, which is a green light emitting diode, with a bright independent phosphor or a blue and red phosphor (not shown). The phosphor (not shown) may mix the blue light-emitting element 120, which is a red light emitting diode, with the blue phosphor or the blue phosphor.

The phosphor (not shown) may be formed of a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride, phosphate or the like. Not.

The cover 150 may be installed on one side of the printed circuit board 110. The cover 150 may be disposed to face the upper surface and one side surface of the light emitting element 120. The lid 150 is installed on the upper surface of the printed circuit board 110 on which the light emitting device 120 is mounted to guide the light emitted by the light emitting device 120.

The cover 150 may be opened at one side in a direction parallel to the upper surface of the printed circuit board 110. The lid 150 may be spaced apart from at least a portion of the outside of the light emitting device 120.

The cover 150 may include a reflective surface that reflects light of the light emitting device 120. The lid 150 may be bent in one area of the surface facing the light emitting device 120. The cover 150 may have a slope in one area of the surface facing the light emitting device 120.

The lid 150 may reflect the light emitted from the light emitting device 120 to the reflecting surface. The lid 150 can control the inclination of the bent portion to adjust the directivity angle of the light emitting device module 100.

The lid 150 can protect the internal light emitting device 120 from foreign substances or the like. The cover 150 prevents glare due to light generated in the light emitting device 120 and uniformly emits light to the outside.

And may have heat resistance to withstand the heat generated by the light emitting device 120. The cover 150 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (SPS), a metal material, sapphire (Al2O3), beryllium oxide (BeO), and ceramics.

Silicon has very little change due to short-wavelength light such as yellowing and high refractive index, and has excellent optical properties. Silicon maintains the gel or elastomer state even after the curing operation, so that the light emitting device 120 can be more stably protected from heat stress, vibration and external impact.

The cover 150 may have a folded shape in one area. For example, the cover 150 may be configured to cover one side surface and the upper surface of the light emitting device 120. [

Referring to FIG. 2, the lid 150 may have a cross-sectional angle (a) formed by folding an area of 90 degrees or more and 135 degrees or less. The light emitting diode module 100 may adjust the angle of incidence of light emitted from the light emitting diode module 100 by adjusting the cross section angle a of the cover 150.

When the cross section angle a of the cover 150 is less than 90 degrees, the directivity angle of the light emitting device module 100 may be excessively small. When the cross section angle 500b is more than 135 degrees, The amount of overlap of the light emitted by the light sources 100 may be reduced and the uniformity of the linear light source may not be obtained.

The light emitting device module 100 obtains high uniformity light when the cross section angle a of the lid 150 is 90 degrees or more and 135 degrees or less and uniformly mixes light between neighboring light emitting devices to minimize color deviation can do.

Referring to FIG. 3, the light emitting device module 100 includes a printed circuit board 110, a light emitting device 120, a filler 140, a cover 150, and a reflective layer 130.

The reflective layer 130 may be disposed between the lid 150 and the light emitting device 120. The lid 150 may be coated with a material having high reflectivity on the inner wall adjacent to the light emitting device 120. The lid 150 is coated with a material having a high reflectivity on the inner wall, so that light emitted by the light emitting device 120 can be reflected.

The reflective layer 130 may be disposed inside the cover 150. The reflective layer 130 may be formed of a material such as silver (Ag) and aluminum (Al) to improve light extraction efficiency, but is not limited thereto. The reflective layer 130 may reflect the light emitted from the light emitting device 120 and emit the light to the outside.

The lid 150 may reflect light emitted from the light emitting device 120. The cover 150 is opened at one side in a direction parallel to the upper surface of the printed circuit board 110 to reflect the light emitted from the light emitting device 120. The lid 150 may reflect light emitted from the light emitting device 120 to have a directivity angle.

4 to 6 are front views of a light emitting device module according to an exemplary embodiment of the present invention.

Referring to FIG. 4, the lid 150 may be disposed to cover the plurality of light emitting devices 120. A filler 140 may be disposed between the lid 150 and the light emitting device 120.

The lid 150 may extend laterally of the light emitting device 120 disposed at the outermost of the plurality of light emitting devices 120. The lid 150 can be opened at one side of the long axis. The cover 150 may have a rectangular shape when viewed from the open side, but is not limited thereto.

Referring to FIG. 5, the lid 150 may form at least one cavity 160. The lid 150 may form a cavity 160 that is the same as the number of the light emitting devices 120.

The light emitting device 120 may be disposed in the cavity 160. The cavity 160 may be circular, square, polygonal, elliptical, or the like, but is not limited thereto.

The cavity 160 may be formed as a boundary between the reflective surface reflecting light of the light emitting device 120 and the upper surface of the printed circuit board 110. The cover 150 may include a plurality of reflecting surfaces.

A reflective layer (not shown) may be provided on the inner surface of the cover 150 forming the cavity 160. The reflective layer (not shown) may be formed of a material such as silver (Ag) or aluminum (Al), but is not limited thereto. The reflective layer (not shown) reflects the light emitted from the light emitting device 120 and emits the light to the outside of the light emitting device module 100.

The filler 140 may be filled in the cavity 160. The filler may include a phosphor. The filler material 140 may be formed of transparent silicone, epoxy, and other resin materials. The filling material 140 may be filled in the cavity 160 and then formed in a manner of ultraviolet ray or thermal curing.

The cover 150 may cover at least one or more of the light emitting devices 120 provided in the cavity 160 and filled with the filler material 140.

Referring to FIG. 6, the cover 150 may be a plurality of covers.

The cover 150 may have the same number as the plurality of light emitting devices 120. The cover 150 may be disposed on one side of each light emitting device 120. The lid 150 may form the cavity 160 with the printed circuit board 110. The light emitting device 120 may be disposed in the cavity 160 formed by the lid 150 and the printed circuit board 110.

The filler 140 may be filled in the cavity 160 formed by the boundary between the cover 150 and the printed circuit board 110. The cover 150 may be formed as shown in Figure 6 It may be elliptical in shape, but it is not limited thereto and may have various forms. For example, the cover 150 may be rectangular when viewed from an open side.

The lid 150 may reflect light emitted from the light emitting device 120. The lid 150 may reflect the light emitted from the light emitting device 120 and emit the light to the outside. The lid 150 may reflect light emitted from the light emitting device 120 to have a directivity angle.

The cover 150 may be circular, square, polygonal, elliptical, or the like, as viewed from above, but may be a curved inner surface, but is not limited thereto.

FIG. 7 is a front view of a light emitting device module according to an embodiment, and FIG. 8 is a plan view of a light emitting device module according to an embodiment.

Referring to FIGS. 7 and 8, the lid 150 may form a plurality of cavities 160. The cavity 160 may be formed with an inner surface of the cover 150 as a boundary. The plurality of inner surfaces of the cover 150 may have a slope.

The cover 150 may include three reflective surfaces on the side of the light emitting device. The inclination of the two reflecting surfaces on the sides of the connected lids can be 90 to 150 degrees.

If the inclination (b) formed by the two reflecting surfaces connected to each other on the side of the cover 150 is less than 90 degrees, the directivity angle becomes excessively narrow, the light emitting element module may not perform its original function, , The directivity angle is excessively increased, and the linearity of the wavelength of the light can be lost.

9 is a perspective view illustrating a liquid crystal display device including a light emitting device module according to an embodiment.

9, the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510 in an edge-light manner.

The liquid crystal display panel 510 can display an image using the light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal therebetween.

The color filter substrate 512 can realize the color of an image to be displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to a printed circuit board 518 on which a plurality of circuit components are mounted via a driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518. [

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 includes a light emitting device module 520 for outputting light, a light guide plate 530 for changing the light provided from the light emitting module 520 into a surface light source to provide the light to the liquid crystal display panel 510, A plurality of films 550, 560, and 564 that uniformly distribute the luminance of light provided from the light guide plate 530 and improve vertical incidence, and a reflective sheet (not shown) that reflects light emitted to the rear of the light guide plate 530 to the light guide plate 530 540).

The light emitting device module 520 may include a printed circuit board (not shown) so that a plurality of light emitting devices (not shown) and a plurality of light emitting devices (not shown) are mounted to form a module. The light emitting device module 520 may be disposed on a printed circuit board (not shown), and may further include a cover for guiding light emitted from the light emitting device (not shown) toward the light guide plate.

The backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510 and a prism film 550 for enhancing vertical incidence by condensing the diffused light And may include a protective film 564 for protecting the prism film 550.

The light emitting device module according to the embodiment is not limited to the configuration and method of the embodiments described above but the embodiments may be modified such that all or some of the embodiments are selectively combined .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

100: Light emitting device module
110: printed circuit board
120: Light emitting element
150: cover

Claims

A printed circuit board having electrodes;
A light emitting element disposed on an upper surface of the printed circuit board; And
And a cover disposed on an upper surface of the printed circuit board to guide light emitted from the light emitting device,
Wherein the cover has a plurality of reflecting surfaces,
Wherein a cross section angle formed by a reflection surface disposed on a side of the light emitting element among the plurality of reflection surfaces and a reflection surface disposed on an upper portion of the light emitting element is 90 degrees or more and 135 degrees or less.

The method according to claim 1,
Wherein the cover is open at one side in a direction parallel to the upper surface of the printed circuit board.

The method according to claim 1,
Wherein the lid is disposed inside and includes a reflective layer including aluminum (Al) or silver (Ag).

The method according to claim 1,
The plurality of light emitting elements are provided on the printed circuit board,
Wherein the number of the lids is equal to the number of the plurality of light emitting elements.

The method according to claim 1,
Wherein the cover has a curved cross section of the reflection surface.

The method according to claim 1,
Wherein the cover and the printed circuit board form a cavity,
And a filler disposed in the cavity.

The method according to claim 1,
Wherein the cover comprises a plurality of reflective surfaces,
Wherein the inclined angle formed by the two connected reflective surfaces disposed laterally of the light emitting device among the plurality of reflective surfaces is 90 degrees or more and 150 degrees or less.