TWM263624U - Improved white-light LED structure - Google Patents

Improved white-light LED structure Download PDF

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Publication number
TWM263624U
TWM263624U TW93213815U TW93213815U TWM263624U TW M263624 U TWM263624 U TW M263624U TW 93213815 U TW93213815 U TW 93213815U TW 93213815 U TW93213815 U TW 93213815U TW M263624 U TWM263624 U TW M263624U
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TW
Taiwan
Prior art keywords
fluorescent
cover
light
white light
emitting diode
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TW93213815U
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Chinese (zh)
Inventor
Tian-Yu Chen
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Tian-Yu Chen
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Publication date
Application filed by Tian-Yu Chen filed Critical Tian-Yu Chen
Priority to TW93213815U priority Critical patent/TWM263624U/en
Publication of TWM263624U publication Critical patent/TWM263624U/en
Priority to JP2005004902U priority patent/JP3114129U/en

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M263624 四、創作說明(1) 【新型所屬之技術領域】 本創作係有關發光二極體之結構改良,尤指一種利 用螢光罩體配合L E D晶粒,而可製得高亮度,色光均 勻之白光發光二極體者。 【先前技術】 一按,傳統欲製作白光L E D,需利用紅藍綠三個不 同顏色之發光晶粒共同封裝在一起,且須同時固晶打線 較複雜,又因不同晶粒所需之驅動電壓亦不同,故在設 冲電路時』對每—L E D晶粒加不同之驅動電流以調整 亮度及顏色,為其缺點。 現在較新之製法,如我國公告第5 8 3 7 7 7號「 白光發光二極體的製作方法」發明專利案,係以覆晶技 ip — chip)將GaN氮化鎵發光二極體 晶粒與基板作結合後利用具有孔洞之網板,將含有螢光 粉之膠體採用印刷塗佈法,使含螢光粉之膠體均勻的包 覆於發光一極體晶粒四周及表面上,經烘烤使含螢光粉 之膠體硬化,再經模鑄法將透明膠體模鑄成型,後經切 割方式切割成表面黏著型白光發光二極體。 一其係採用單顆藍色L E D晶粒,在其晶粒表面塗覆 二層螢光膠體經烘烤使其硬化,藉由發光晶粒產生之藍 光激發榮光膠體,使產生不同波長之光,再與原發光晶 粒所發出光之顏色混合以產生白光,具體之作法可用藍 光L E ^晶粒,加上γ a G黃色螢光粉,或是以紫外光 L E D晶粒,加紅、黃、綠三基色螢光粉來達成。M263624 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to the structural improvement of light-emitting diodes, especially a kind of fluorescent cover with LED chips, which can produce high brightness and uniform color. White light emitting diode. [Previous technology] One-click, traditionally, to make white LED, three red, blue and green light-emitting chips with different colors are packaged together. At the same time, solid-state bonding is more complicated, and the driving voltage required by different chips. It is also different, so when setting the punch circuit, add different driving current to each LED chip to adjust the brightness and color, which is its disadvantage. Newer manufacturing methods, such as China ’s Announcement No. 5 8 3 7 7 7 “Method for Making White Light-Emitting Diodes” invention patent case, is based on flip-chip technology (IP — chip) to GaN gallium nitride light-emitting diodes. After the particles are combined with the substrate, a stencil with holes is used, and the colloid containing the fluorescent powder is printed and coated, so that the colloid containing the fluorescent powder is uniformly coated around and around the surface of the light-emitting polar crystal grains. Baking hardens the colloid containing fluorescent powder, and then molds the transparent colloid through the die-casting method, and then cuts into a surface-adhesive white light-emitting diode by a cutting method. One is the use of a single blue LED die, coated with two layers of fluorescent colloid on the surface of the die and baked to harden, and the blue colloid produced by the light-emitting die excites the glorious colloid to produce light with different wavelengths. It is then mixed with the color of the light emitted by the original light-emitting crystal grains to produce white light. The specific method can be blue light LE ^ crystal grains, plus γ a G yellow phosphor, or ultraviolet LED crystal grains, red, yellow, Green tri-color phosphors to achieve.

P93146.ptd 第5頁 M263624 、創作說明(2) 惟不論 印將螢光粉 十分不易, D亮度及色 有鑑於 解決螢光膠 偏黃、偏藍 失深入加以 創作之產生 本創作之目 本創作 L E D晶粒 極體者。 新型内容】 或網 制上 L Ε ,為 色光 述缺 有本 酉己合 光二 、:ί製作方法’其都是以塗覆點膠 故:ί!體塗覆在晶^,其在定量控 生色光偏藍或偏黃之現象,導致 光不均之缺點。 上述習用製作白光L E D所存在之缺點 體塗佈不均,所造成之白光亮度不均, 等不均勻之問題,本案創作人乃針對上 研究、設計,經多方實驗改良後,終於 〇 的】 之主要目的,在設計一種利用螢光罩體 ’而可製得咼壳度’色光均勻之白光發 為達到前述之目的,本創作所設計之一種白光發光 二極體結構改良,主要係以不同配比之螢光粉,加又耐 溫工程塑膠内,如PC (聚碳酸樹脂),射出成型為— 螢光罩(套),再將螢光罩注膠蓋在發光L E D晶粒上 面,經烘烤使其結合,再將此植入模粒製作L E D,或 以模缚方法封裝白光SMD發光一極體或L E D顯示 ,依據不同之L E D製作方式,相對不同之晶粒,而用 不同之發光角度、不同之螢光粉,設計適合之螢光罩, 取得厚度一致,螢光粉均勻分佈之螢光罩,經激發所得 高亮度色光均勻之白光發光二極體。P93146.ptd Page 5 M263624, creation instructions (2) However, no matter how difficult it is to print fluorescent powder, D brightness and color have been created in order to solve the problem of yellowish and blueish fluorescent glue. LED die polar body. New content] or L Ε on the net, which is lacking in color and light, and there are two basic methods: ί Production method 'It's all coated with glue. Therefore: !! The body is coated on the crystal ^, which is in quantitative control. The phenomenon that the color light is bluish or yellowish leads to the disadvantage of uneven light. The disadvantages of the above-mentioned conventional white LED production are uneven coating, resulting in uneven white light brightness, and other unevenness. The author of this case is aimed at the above research and design, and has been improved through various experiments. The main purpose is to design a kind of white light with uniform color and light that can be made by using the fluorescent cover body. In order to achieve the aforementioned purpose, the structure of a white light-emitting diode designed in this creation is mainly modified with different components. Compared with fluorescent powder, it is added into a temperature-resistant engineering plastic, such as PC (polycarbonate resin), and is injection-molded into a-fluorescent cover (set), and then the fluorescent cover is glued on top of the light-emitting LED die. Bake and combine them, and then implant the implanted pellets to make LEDs, or package white light SMD light-emitting poles or LED displays in a mold-binding method. According to different LED production methods, relatively different crystal grains, and different light emitting angles Different fluorescent powders, suitable fluorescent covers are designed to achieve a uniform thickness and a uniformly distributed fluorescent powder. The white light-emitting diodes with high brightness and uniform color are obtained after excitation.

P93146.ptd 第6頁 M263624 四、創作說明(3) 【實施方式】 為使能 茲舉本創作 下所述。 如第一 二極體結構 一螢光 塑膠(1 2 聚碳酸樹脂 一開口(1 藉此, 分佈,而且 激發所得高 如第一 )可為空心 )並可依據 不同之發光 層(3 ), 如第四 係以不同配 膠(1 2 ) 為一螢光罩 蓋在發光晶 相結合,再 進一步瞭解本創作之構成内容及其他特點, 較具體之實施例,並配合附圖詳細說明如以 〜四圖所示,本創作所設計之一種白光發光 改良,其主要包括: 罩(1),其係以螢光粉(11)混合透光 )所製成,該透光塑膠(12)可為PC ( )等相類似之材質,又該螢光罩(1 )具有 3 )可蓋覆在L E D發光晶粒(2 )上; 使螢光罩(1)内含螢光粉(1 1)可均勻 罩體各部厚度亦可取得一致,製造組合後經 亮度色光均勻之白光發光二極體。 〜四圖所示,本創作實施時,該螢光罩(1 之方塊形或圓拱形· ··等,其螢光罩 不同之晶粒(2 ),而具有不同之螢光粉及 角度,且其與晶粒(2 )間可設有烘烤膠合 使兩者可緊密結合成一體。 圖及第五圖所示,本創作之具體製作方法, 比之螢光粉(1 1 ),加入耐溫工程透光塑 内,如P C (聚碳酸樹脂),再經射出成型 (1)(或套),再於螢光罩(1)内注膠 粒(2 )上面,經烘烤成膠合層(3 )達到 依不同需求,將此植入模粒製作L e d,或P93146.ptd Page 6 M263624 IV. Creation Instructions (3) [Implementation] To enable, I will give you the following creation. For example, the first diode structure is a fluorescent plastic (1 2 polycarbonate resin-an opening (1 through which the distribution and the excitation result is as high as the first) can be hollow) and can be based on different light emitting layers (3), such as The fourth is a combination of different glues (1 2) as a fluorescent cover on the light-emitting crystal, and further understands the composition and other characteristics of this creation. More specific examples, and the detailed description with the accompanying drawings, such as ~ As shown in the four figures, a white light emission improvement designed by this creation mainly includes: a cover (1), which is made of fluorescent powder (11) mixed with light transmission), and the light-transmitting plastic (12) can be PC () and other similar materials, and the fluorescent cover (1) has 3) can be covered on the LED light emitting die (2); so that the fluorescent cover (1) contains fluorescent powder (1 1) can The thickness of each part of the uniform cover can also be consistent. After the combination, the white light emitting diode with uniform brightness and color light is manufactured. As shown in the four figures, when this creative implementation was carried out, the fluorescent cover (1 square or arch shape ...), the fluorescent cover has different crystal grains (2), but has different fluorescent powders and angles. And, it can be provided with baking glue between it and the crystal grain (2) so that the two can be tightly combined into one. As shown in the figure and the fifth figure, the specific production method of this creation is compared with the fluorescent powder (1 1), Add in temperature-resistant engineering transparent plastic, such as PC (polycarbonate resin), and then injection molding (1) (or cover), and then inject the rubber particles (2) into the fluorescent cover (1), and bake into The glue layer (3) can be used to make L ed into this implant mold according to different needs, or

P93146.ptd 第7頁 M263624 四、創作說明(4) ~一'~-一^ 以模鑄方法封裝白光31^〇發光二極體或L e D顯示器 ο 製作時並可依據不同之LED製作方式,針對不同 之晶粒(2)而有不同之發光角及不同之螢光粉(11 ),來没計適合之螢光罩(1),並利用模塑罩體内含 螢光粉(1 1 )而可均勻分佈,而且各部厚度可獲得一 致’使經激發即可達到高亮度色光均勻之白光發光二極 體0 綜上所述,本創作利用螢光罩體配合L e D晶粒, 而可製得高亮度’色光均勻之白光發光二極體,其在製 作方法及結構上之設計可解決習知結構組裝及應用上之 缺點,功效遠勝於習式者,具進步性及產業利用價值, 爰依法提出新型專利之申請。 惟上述之具體實施例是用來詳細說明本創作之目的 、特徵及功效,僅為本創作之部分實施例,當不能以此 限定本創作之實施範圍,凡熟悉此類技藝之人士根據上 述說明,及以下所述申請專利範圍所載之結構特徵及功 效上所作部分之變換及修改,其本質未脫離出本創作之 精神範疇者,皆應包含在本創作之專利權範圍。P93146.ptd Page 7 M263624 IV. Creative Instructions (4) ~ 一 '~-一 ^ Encapsulating white light 31 ^ 〇 light emitting diode or LED display by mold casting method ο Can be produced according to different LED production methods For different crystal grains (2), there are different luminous angles and different fluorescent powders (11), so the suitable fluorescent cover (1) is not counted, and the molding cover contains fluorescent powder (1 1) It can be evenly distributed, and the thickness of each part can be consistent, so that white light-emitting diodes with high brightness and uniform color light can be achieved upon excitation. In summary, this creation uses a fluorescent cover to match the LED grains. The white light emitting diode with high brightness and uniform color light can be produced. Its manufacturing method and structure design can solve the shortcomings of the conventional structure assembly and application, and its efficiency is far better than that of the conventional one. It has progress and industry. Utilize the value, apply for a new patent in accordance with the law. However, the above specific embodiments are used to describe the purpose, features and effects of this creation in detail, and are only part of the embodiments of this creation. When the scope of implementation of this creation cannot be limited in this way, those who are familiar with such skills will follow the above description. , And the changes and modifications to the structural features and effects contained in the scope of the patent application described below, whose essence does not depart from the spirit of this creation, shall be included in the scope of patent rights of this creation.

P93146.ptd 第8頁 M263624 圖式簡單說明 【圖式簡單說明】 第一圖:係本創作之立體外觀圖。 第二圖:係本創作之平面圖。 第三圖:係本創作另一實施例之立體外觀圖。 第四圖:係本創作應用於各種不同L E D製法之示意圖P93146.ptd Page 8 M263624 Simple illustration of the drawing [Simplified illustration of the drawing] The first picture: a three-dimensional appearance of the creation. The second picture: is the floor plan of this creation. The third figure is a three-dimensional appearance diagram of another embodiment of this creation. Figure 4: Schematic diagram of this creative application to various LED manufacturing methods

ο 1 3 \Jy 圖 T—H r-H CO Μ, ((( 流 作 罩膠粒 製 光塑晶 之1榮· · 作 M· · · 創說· · · 本!#u· · · 係#· · · ••件· > · 圖元 2 五要 1 1 2 第ic c C 螢光粉 •開口 膠合層 1^1 P93146.ptd 第9頁ο 1 3 \ Jy Figure T—H rH CO Μ, ((((flowing hood rubber granules made of light plastic crystal 1) · · •• pieces · > · Picture 2 Wu Yao 1 1 2 ic c C Fluorescent Powder • Open Glue Layer 1 ^ 1 P93146.ptd Page 9

Claims (1)

M263624 五、申請專利範圍 1 · 一種白光發光二極體結構改良,其主要係由一螢光罩 (套)及L E D發光晶粒所構成,其改良特徵在於: 其中,該螢光罩(套),係以螢光粉混合透光塑 膠所製成,該罩體具有一開口可蓋覆在LED發光晶 粒,藉此,可獲得螢光粉均勻分佈之螢光罩,經激發 所得高亮度色光均勻之白光發光二極體者。 2 ·如申請專利範圍第1項所述之白光發光二極體結構改 良,其中,該透光塑膠係為P C (聚碳酸樹脂)等中 之一種者。 3 ·如申請專利範圍第1項所述之白光發光二極體結構改 良,其中,該螢光罩各部厚度一致,且與晶粒間設有 烘烤膠合層者。 4 ·如申請專利範圍第1項所述之白光發光二極體結構改 良,其中,該螢光罩依據不同之晶粒造形,而具有不 同之螢光粉及不同之發光角度者。 5 ·如申請專利圍第1項所述之白光發光二極體結構改良 ,其中,該螢光罩為空心之方塊形者。 6 ·如申請專利範圍第1項所述之白光發光二極體結構改 良,其中,該螢光罩為空心之圓拱形者。M263624 V. Application scope 1 · An improved structure of white light-emitting diodes, which is mainly composed of a fluorescent cover (set) and LED light-emitting crystals. The improvement features are as follows: Among them, the fluorescent cover (set) It is made of fluorescent powder mixed with light-transmitting plastic. The cover has an opening to cover the LED light-emitting crystals, so that a fluorescent cover with uniformly distributed fluorescent powder can be obtained. Uniform white light emitting diode. 2. The structure of the white light-emitting diode is improved as described in item 1 of the scope of patent application, wherein the light-transmitting plastic is one of PC (polycarbonate resin) and the like. 3. The structure of the white light-emitting diode according to item 1 of the scope of the patent application is improved, wherein the thickness of each part of the fluorescent cover is the same, and a baking glue layer is provided between the fluorescent cover and the crystal grains. 4 · The structure of the white light emitting diode is improved as described in item 1 of the scope of the patent application, wherein the fluorescent cover is formed according to different crystal grains, and has different fluorescent powders and different light emitting angles. 5. The structure improvement of the white light emitting diode as described in the first item of the patent application, wherein the fluorescent cover is a hollow square shape. 6. The structure of the white light-emitting diode is improved as described in item 1 of the scope of patent application, wherein the fluorescent cover is a hollow arc-shaped one. P93146.ptd 第10頁P93146.ptd Page 10
TW93213815U 2004-08-31 2004-08-31 Improved white-light LED structure TWM263624U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW93213815U TWM263624U (en) 2004-08-31 2004-08-31 Improved white-light LED structure
JP2005004902U JP3114129U (en) 2004-08-31 2005-06-27 White light emitting diode

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Application Number Priority Date Filing Date Title
TW93213815U TWM263624U (en) 2004-08-31 2004-08-31 Improved white-light LED structure

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Publication number Priority date Publication date Assignee Title
JP4204058B2 (en) * 2005-09-20 2009-01-07 パナソニック電工株式会社 LED lighting fixtures
JP3952075B2 (en) * 2005-09-20 2007-08-01 松下電工株式会社 Light emitting device
CN100594623C (en) 2005-09-20 2010-03-17 松下电工株式会社 LED lighting equipment
JP3948483B2 (en) * 2005-09-20 2007-07-25 松下電工株式会社 Light emitting device
JP3992059B2 (en) * 2005-11-21 2007-10-17 松下電工株式会社 Method for manufacturing light emitting device
JPWO2010023992A1 (en) * 2008-08-27 2012-01-26 富士高分子工業株式会社 Light emitting device and manufacturing method thereof
CN117414984B (en) * 2023-12-18 2024-02-23 四川华体照明科技股份有限公司 LED fluorescent glue coating device

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