583777 五、發明說明（1) 一、發明所屬之技術領域583777 V. Description of the invention (1) 1. Technical field to which the invention belongs
P 傳統發光二極體（LED )之封裝，係將LED晶粒 )固置於基板或金屬支架上再打線，並用透明樹脂1 μ 型，其中LED分有燈型（Lamp )與表面黏著型（SMD )破$ 種。本發明係在LED晶粒上採用網印方式塗佑 兩 裝成型。 师螢先粉並封 二、先前技術 目前白光發光二極體的白色光形成有1^、G、8二 發光二極體（LED)晶粒共同混光形成，或採用藍::色 線光（UV)LED晶粒配合螢光粉組合而成（如第一” )。 布 圃所示 一般白光發光二極體利用激發螢光粉方 都採用點膠、拉膠和模鑄等方式，將含 踉=丄大 於LED晶粒上’製作成白光發光二極體愛Μ之膠體塗佈 其中點膠與拉膠製作方式（如第二圖 :粉與環氧樹脂以-定比率相混合後；职口螢 膠方式將含螢光粉之膠體塗佈於LED晶粒上·，條拉 量不易精確的控制，易造成白光光色-邊先粉膠 置不易控制易偏位等問題。 風次偏貫及膠體位 而模鑄法其製作方式（如第三圖所干、 模鑄用膠餅依―定比率充分相混再光粉與 ㈣用;勝…，然後鑛鱗機及模P The packaging of traditional light-emitting diodes (LEDs) consists of LED chips) fixed on a substrate or metal bracket and then wired, and 1 μ type of transparent resin. LEDs are divided into lamp type and surface adhesion type ( SMD) broke $ species. The invention uses screen printing on the LED die to form two packages. The first fluorescent powder is sealed and sealed. In the prior art, the white light of the current white light emitting diode is formed by 1 ^, G, 8 two light emitting diode (LED) crystal grains mixed with light, or blue :: color line light (UV) LED grains are combined with fluorescent powder (such as the first one). The general white light emitting diodes shown in the cloth garden use fluorescent powder to excite the fluorescent powder. Containing 踉 = 丄 is greater than the LED die 'coated with a white light-emitting diode AM, which is made by dispensing and drawing (such as the second picture: powder and epoxy resin are mixed at a fixed ratio; The fluorescent glue method is used to apply the colloid containing fluorescent powder on the LED die. The strip drawing amount is not easy to accurately control, and it is easy to cause problems such as the white light color-the edge of the powder is not easy to control and easy to shift. Biased and colloidal position and die casting method (as dried in the third picture, the die-casting gelatin cake is fully mixed at a fixed ratio and then light powder is used; then ...
第5頁 583777 五、發明說明（2) 膠餅成型於LED晶粒上，其中雖然可均句控制膠量，但是 螢光粉若含量較高或含螢光粉之膠體厚度較薄、體積較小 時’則易發生生產不容易及易造成基板與膠體剝離問題。 另外於現有台灣專利申請案號：9 0 2 1 1 3 1 8「白光發光 二極體及其晶粒」中（如第四圖、第五圖所示），以塗佈 螢光劑於晶圓表面，經影像轉移形成後再行切割晶圓，使 形成晶粒表面塗佈有一層螢光劑，然後作F 1 i p - c h i p覆晶 製程’如此形成之白光發光二極體於側面因切割面未有螢 光劑覆蓋因此會有偏藍之現象發生，因氮化鎵（GaN)LED晶 粒為一透明體所以若僅表面塗佈時，其GaN晶粒透明體側 邊仍會發出藍光或UV光使得光色不均勻。 三、發明内容 為了解決上述困擾，本發明乃突破傳統之生產方法， 而採用網版或鋼版以塗佈方式將含螢光粉之膠體均勻的塗 佈於LED晶粒表面及四周，將使白光更加均勻且更加容易 衣作’以覆晶技術（F π p - c h i p )應用於白光發光二極體 封裝中，一般氮化鎵為基材之藍光或uv光1^])晶體其可將p 極與N極兩正負電極製作在同一平面上，因此UD晶粒適用 於覆晶技術（Flip-chip )，將LED晶粒採用本發明人台灣 發明專利第1 291 91証書「氮化鎵基發光二極體 ^法」，咖晶粒反貼黏於基板上（銲接///)的^ ，溫迴銲方式將LED晶粒電極與基板電極作熔銲接合，因 氮化鎵LED晶粒發光面朝上其銲接面朝下，沒有使^金線Page 583777 V. Description of the invention (2) The gel cake is formed on the LED die. Although the amount of glue can be controlled uniformly, if the content of the fluorescent powder is higher or the colloid containing the fluorescent powder is thinner and more bulky When it is small, it is easy to produce problems that are not easy to produce and easy to cause substrate and colloid peeling. In addition, in the existing Taiwan patent application number: 9 0 2 1 1 3 1 8 "White light emitting diode and its crystal grains" (as shown in Fig. 4 and Fig. 5), a fluorescent agent is coated on the crystal Round surface, after the image transfer is formed, the wafer is cut, so that the surface of the formed crystal grains is coated with a layer of phosphor, and then the F 1 ip-chip flip-chip process is performed. The white light-emitting diode thus formed is cut on the side due to cutting. The surface is not covered with phosphor, so the phenomenon of bluishness occurs. Because the gallium nitride (GaN) LED grain is a transparent body, if only the surface is coated, the side of the GaN grain transparent body will still emit blue light. Or UV light makes the light color uneven. III. Summary of the Invention In order to solve the above-mentioned problems, the present invention is a breakthrough in the traditional production method, and the screen or steel plate is used to uniformly coat the colloid containing fluorescent powder on the surface of the LED crystal grains and around it. White light is more uniform and easier to dress. 'F π p-chip is used in white light emitting diode packaging. Generally, blue or uv light with gallium nitride as the substrate can be used. The positive and negative electrodes of p-pole and N-pole are made on the same plane, so the UD die is suitable for flip-chip technology. The LED die adopts the Taiwan Inventor's Patent No. 1 291 91 certificate "Gallium Nitride-based “Light-emitting diode method”, the crystal grains are pasted on the substrate (soldering //), and the LED chip electrode and the substrate electrode are fusion-bonded by the temperature reflow method. The light emitting side is facing up and its soldering side is facing down, without making ^ gold wire
第6頁 583777 五、發明說明（3) 作為基板連結，所以於塗伟時可非常便利的將網板戒鋼板 套於LED晶粒上，並且塗佈後不會發生金線連接所造成之 爬膠現象，且所塗覆含螢光粉之膠體具有覆晶技術 (Flip-chip )中有固定及加強晶粒與基板間黏著力的功 用〇 四、實施方式 為了使本發明「白光發光二極體的製作方法」更清楚 說明，配合圖示說明舉一製作實例： 本發明「白光發光二極體的製作方法」之表面黏著型 (SMD)白光發光二極體的製作流程（如第六圖所示），首先 將LED晶粒1利用覆晶技術（F 1 ip-ch ip )使LED晶粒電極2 與基板5之基板電極6相銲接結合，然後放置於具有網板孔 洞之網板（鋼板）下方，使網板與基板5相疊合，並於定 位完成後將依一定比率調配含螢光粉之膠體7倒於網框 内，此時以塗佈刮刀來回塗覆，將使含螢光粉之膠體7注 入於網板孔洞中，如此可得定量含螢光粉之膠體7，缺後 取出網板，此時含螢光粉之膠體7已完全包覆整個LED晶粒 1，將已塗覆之基板5經過烘烤，使含螢光粉之膠體7烘乾 再經模鑄法以透明膠體8封裝成表面黏著型發光二極體 (如第七圖所示）’最後採用切割方式將基板5裁切 一表面黏著型發光二極體個體。 由以上實施例說明，本發明「白光發光二極體的 方法」採用網印方式更加快头# 奋麻〜口 又刀敗生產速度穂疋品質，改善傳統Page 583777 V. Description of the invention (3) As a substrate connection, it is very convenient to coat the screen or steel plate on the LED die when Tu Wei, and the crawling caused by the gold wire connection will not occur after coating. Glue phenomenon, and the coated colloid containing phosphor has the function of fixing and strengthening the adhesive force between the crystal grains and the substrate in the flip-chip technology. Fourth, the embodiment is to make the "white light emitting diode The method of making a body "is more clearly explained, and an example of the production is given with reference to the illustration: The production process of the surface-adhesive (SMD) white light emitting diode of the" production method of a white light emitting diode "according to the present invention (see FIG. 6) (Shown), the LED die 1 is firstly bonded with the LED die electrode 2 and the substrate electrode 6 of the substrate 5 by using a flip-chip technology (F 1 ip-ch ip), and then placed on a stencil with a stencil hole ( Under the steel plate), the screen and the substrate 5 are superimposed, and after the positioning is completed, the colloid 7 containing the fluorescent powder is poured into the screen frame at a certain ratio. The colloid 7 of the fluorescent powder is injected into the holes of the stencil, This can obtain a certain amount of colloid 7 containing fluorescent powder, and the stencil is taken out after the absence. At this time, the colloid 7 containing fluorescent powder has completely covered the entire LED die 1, and the coated substrate 5 is baked to The colloid 7 of the fluorescent powder is dried, and then the transparent colloid 8 is encapsulated into a surface-adhesive light-emitting diode by a molding method (as shown in the seventh figure). Finally, the substrate 5 is cut by a cutting method and a surface-adhesive light-emitting diode 2 is cut. Polar body individual. According to the above embodiments, the "method of white light emitting diode" of the present invention uses screen printing to speed up the head #
第7頁 583777 五、發明說明（4) 點膠和拉膠方式不易控制膠量製程，與模鑄方式比較則有 超薄且小型化，更沒有模鑄方式由於應力問題，所造成 FI ip-chip覆晶之LED晶粒1剝落和分離，反而利用含螢光 粉之膠體將LED晶粒1與基板5作更加之黏合及保護之功 能；另本發明之製作成品由於四周及表面皆有含螢光粉之 膠體，所以其白光光色也較為均勻，沒有偏藍之現象。 如此本發明「白光發光二極體的製作方法」實有數項 上述之優點，且具有實質之功效，更符合專利申請要件。Page 7 583777 V. Description of the invention (4) Dispensing and drawing methods are not easy to control the amount of glue. Compared with the die casting method, it is ultra-thin and miniaturized, and there is no die casting method due to stress problems. FI ip- The chip-covered LED die 1 is peeled off and separated, but the colloid containing fluorescent powder is used to more closely bond and protect the LED die 1 and the substrate 5. In addition, the finished product of the present invention contains The colloid of the fluorescent powder, so its white light color is relatively uniform, there is no blueish phenomenon. In this way, the "manufacturing method of white light emitting diode" of the present invention has several advantages as described above, and has substantial effects, which is more in line with the requirements of patent applications.
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圖示部份： 第一圖 第二圖 第三圖 第四圖 第五圖 苐六圖 第七圖 係傳 係傳 拉膠 係傳 法封 係專 晶粒 係專 晶粒 係本 圖 係本 型後 =螢光粉激光白光發光二極體封襞圖示。 、古面黏著型SMD白光發光二極體之點膠和 式封裝結構剖面圖。 f表面黏著型SMD白光發光二極體之模鑄方 #結構剖面圖。 利申請案號90 2 1 1 3 1 8「白光發光二極體及其 」製作流程圖。 中請案號9 0 2 1 1 3 1 8「白光發光二極體及其 」封裝成品剖面圖。 I明「白光發光二極體的製作方法」製作流 〇 f明「白光發光二極體的製作方法」烘乾成 模鑄封裝剖面圖。 圖號部分： 1. L E D晶粒 2 · L E D晶粒電極 3. 金線The part shown in the figure: the first picture, the second picture, the third picture, the fourth picture, the fifth picture, the sixth picture, and the seventh picture Back = phosphor laser white light emitting diode seal icon. Sectional view of the dispensing and packaging structure of ancient surface-adhesive SMD white light-emitting diodes. fSurface-adhesive SMD white light-emitting diode die casting square #Structural cross-sectional view. Lee's application No. 90 2 1 1 3 1 8 "White light emitting diode and its" production flow chart. Case No. 9 0 2 1 1 3 1 8 "White Light Emitting Diode and its" package cross-sectional view. I. "Making method of white light emitting diode" production flow. 0 "Ming" method of making white light emitting diode "is dried to form a cross-sectional view of a mold package. Drawing number part: 1. L E D grain 2 · L E D grain electrode 3. Gold wire
4. 電極接點 5. 基板 6 ·基板電極 7·含螢光粉之膠體 8 ·透明;膠體4. Electrode contact 5. Substrate 6 · Substrate electrode 7 · Colloid with fluorescent powder 8 · Transparent; colloid
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