CN100592538C - Encapsulation method for high-brightness white light LED - Google Patents
Encapsulation method for high-brightness white light LED Download PDFInfo
- Publication number
- CN100592538C CN100592538C CN200610029856A CN200610029856A CN100592538C CN 100592538 C CN100592538 C CN 100592538C CN 200610029856 A CN200610029856 A CN 200610029856A CN 200610029856 A CN200610029856 A CN 200610029856A CN 100592538 C CN100592538 C CN 100592538C
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- light
- emitting diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200610029856A CN100592538C (en) | 2006-08-09 | 2006-08-09 | Encapsulation method for high-brightness white light LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610029856A CN100592538C (en) | 2006-08-09 | 2006-08-09 | Encapsulation method for high-brightness white light LED |
Publications (2)
Publication Number | Publication Date |
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CN101123284A CN101123284A (en) | 2008-02-13 |
CN100592538C true CN100592538C (en) | 2010-02-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN200610029856A Active CN100592538C (en) | 2006-08-09 | 2006-08-09 | Encapsulation method for high-brightness white light LED |
Country Status (1)
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CN (1) | CN100592538C (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102544260A (en) * | 2011-12-31 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | Method for coating fluorescent glue on surface of LED (light-emitting diode) flip chip |
CN102569611A (en) * | 2011-12-31 | 2012-07-11 | 深圳市瑞丰光电子股份有限公司 | Method for coating surface of horizontal-structure wafer of LED with fluorescent glue |
CN102569610A (en) * | 2011-12-31 | 2012-07-11 | 深圳市瑞丰光电子股份有限公司 | Method for coating surface of vertical-structure wafer of LED with fluorescent glue |
US20130288408A1 (en) * | 2012-04-27 | 2013-10-31 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing led |
Families Citing this family (21)
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---|---|---|---|---|
CN101887909A (en) * | 2010-06-24 | 2010-11-17 | 深圳市阳光富源科技有限公司 | LED module and manufacturing method thereof |
CN102062367A (en) * | 2010-10-30 | 2011-05-18 | 象山中翔电子科技有限公司 | Led lamp panel and manufacturing method thereof |
CN102610703A (en) * | 2011-01-20 | 2012-07-25 | 陈惠美 | Encapsulating method for photoelectric elements |
CN102157665A (en) * | 2011-03-22 | 2011-08-17 | 湘能华磊光电股份有限公司 | Light-emitting diode (LED) chip packaging structure and packaging method thereof |
CN102403422A (en) * | 2011-11-17 | 2012-04-04 | 深圳市天电光电科技有限公司 | Processing method of LED packaging structure and LED packaging structure |
CN102437271A (en) * | 2011-12-12 | 2012-05-02 | 秦会斌 | Cache-on-board (COB) technology-based integrated light emitting diode (LED) packing method |
CN102569605A (en) * | 2012-02-07 | 2012-07-11 | 潮州三环(集团)股份有限公司 | Chip light-emitting diode (LED) ceramic packaging base |
CN102569606A (en) * | 2012-02-23 | 2012-07-11 | 中国科学院半导体研究所 | Method for packaging light emitting diode of wafer-level vertical structure |
CN103311381A (en) * | 2012-03-13 | 2013-09-18 | 展晶科技(深圳)有限公司 | Production method for packaging structures of light-emitting diode |
CN103390700B (en) * | 2012-05-10 | 2016-08-03 | 展晶科技(深圳)有限公司 | Light-emittingdiode encapsulation procedure and encapsulating structure thereof |
CN104347785A (en) * | 2013-08-07 | 2015-02-11 | 广州众恒光电科技有限公司 | Die-method fluorescent powder adhesive layer coating process |
CN103567130B (en) * | 2013-11-14 | 2015-07-08 | 南通皋鑫电子股份有限公司 | Method for controlling film thickness of adhesive coating layer on high-voltage diode chip |
CN103681988B (en) * | 2013-12-05 | 2016-09-07 | 西安神光皓瑞光电科技有限公司 | A kind of LED standard square sheet and preparation method thereof |
CN104752588A (en) * | 2013-12-31 | 2015-07-01 | 晶能光电(江西)有限公司 | Fluorescent glue coating method for flip chip |
CN104600183B (en) * | 2014-12-25 | 2017-06-13 | 常州银河世纪微电子股份有限公司 | The preparation method of LED white light-emitting diodes |
CN106033789A (en) * | 2015-03-18 | 2016-10-19 | 比亚迪股份有限公司 | Phosphor powder substrate and manufacturing method thereof, and composite luminescence LED and manufacturing method thereof |
CN105655261A (en) * | 2016-03-11 | 2016-06-08 | 导装光电科技(深圳)有限公司 | Preparation technology of white-light flip chip |
CN109727935A (en) | 2016-04-08 | 2019-05-07 | Oppo广东移动通信有限公司 | A kind of chip-packaging structure, terminal device and method |
CN107146789B (en) * | 2017-05-27 | 2019-08-02 | 惠州雷曼光电科技有限公司 | LED encapsulation method and LED display |
CN108133670B (en) * | 2017-11-27 | 2020-09-18 | 长春希达电子技术有限公司 | Integrated packaging LED display module packaging method and LED display module |
CN112467008A (en) * | 2020-11-13 | 2021-03-09 | 中山市聚明星电子有限公司 | Light-emitting device manufacturing method and light-emitting device |
-
2006
- 2006-08-09 CN CN200610029856A patent/CN100592538C/en active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102544260A (en) * | 2011-12-31 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | Method for coating fluorescent glue on surface of LED (light-emitting diode) flip chip |
CN102569611A (en) * | 2011-12-31 | 2012-07-11 | 深圳市瑞丰光电子股份有限公司 | Method for coating surface of horizontal-structure wafer of LED with fluorescent glue |
CN102569610A (en) * | 2011-12-31 | 2012-07-11 | 深圳市瑞丰光电子股份有限公司 | Method for coating surface of vertical-structure wafer of LED with fluorescent glue |
CN102544260B (en) * | 2011-12-31 | 2015-04-29 | 深圳市瑞丰光电子股份有限公司 | Method for coating fluorescent glue on surface of LED (light-emitting diode) flip chip |
CN102569610B (en) * | 2011-12-31 | 2015-05-27 | 深圳市瑞丰光电子股份有限公司 | Method for coating surface of vertical-structure wafer of LED with fluorescent glue |
CN102569611B (en) * | 2011-12-31 | 2015-08-19 | 深圳市瑞丰光电子股份有限公司 | A kind of in the method for LED horizontal structure wafer surface coating fluorescent glue |
US20130288408A1 (en) * | 2012-04-27 | 2013-10-31 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing led |
US8828754B2 (en) * | 2012-04-27 | 2014-09-09 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing LED |
Also Published As
Publication number | Publication date |
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CN101123284A (en) | 2008-02-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20080509 Address after: Nanhai West End of Sha Chau Bridge, Nanhai District, Foshan Applicant after: Guangdong Shaoxin Opto-electrical Technology Co., Ltd. Address before: Room 500, No. 309 blue wave road, Zhangjiang, Shanghai Applicant before: Liu Sheng |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hunan Yiyuan Photoelectric Technology Co., Ltd. Assignor: Guangdong Shaoxin Opto-electrical Technology Co., Ltd. Contract record no.: 2011430000048 Denomination of invention: Encapsulation method for high-brightness white light LED Granted publication date: 20100224 License type: Exclusive License Open date: 20080213 Record date: 20110421 |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210813 Address after: 528200 unit 601, floor 6, block a, Jingu Zhichuang industrial community, No. 2, Yong'an North Road, Dawei community, Guicheng Street, Nanhai District, Foshan City, Guangdong Province Patentee after: GUANGDONG REAL FAITH LIGHTING TECHNOLOGY Co.,Ltd. Address before: Pingzhou shaweiqiao industrial West Zone, Nanhai District, Foshan City Patentee before: GUANGDONG REAL FAITH OPTO-ELECTRONIC Co.,Ltd. |