CN106033789A - Phosphor powder substrate and manufacturing method thereof, and composite luminescence LED and manufacturing method thereof - Google Patents

Phosphor powder substrate and manufacturing method thereof, and composite luminescence LED and manufacturing method thereof Download PDF

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Publication number
CN106033789A
CN106033789A CN201510119044.0A CN201510119044A CN106033789A CN 106033789 A CN106033789 A CN 106033789A CN 201510119044 A CN201510119044 A CN 201510119044A CN 106033789 A CN106033789 A CN 106033789A
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Prior art keywords
phosphor substrate
led
manufacture method
substrate
phosphor powder
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CN201510119044.0A
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Inventor
齐继航
陈爽
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BYD Co Ltd
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BYD Co Ltd
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Priority to CN201510119044.0A priority Critical patent/CN106033789A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

The invention discloses a phosphor powder substrate manufacturing method. The manufacturing method comprises the following steps of providing a phosphor powder, a phosphor powder substrate die, silica gel or an epoxy resin solvent; using a preset proportion to carry out glue preparation so as to uniformly mixing the phosphor powder and the silica gel or uniformly mixing the phosphor powder and the epoxy resin solvent; injecting mixed colloid after glue preparation into the phosphor powder substrate die; carrying out baking solidification on the mixed colloid in the phosphor powder substrate die; and separating the solidified mixed colloid from the phosphor powder substrate die so as to form a phosphor powder substrate. By using the phosphor powder substrate manufacturing method, luminescence efficiency can be increased and cost is low. The invention also discloses the phosphor powder substrate manufactured through using the above manufacturing method, and a composite luminescence LED and a manufacturing method thereof.

Description

Phosphor substrate and preparation method thereof and recombination luminescence LED and preparation method thereof
Technical field
The invention belongs to light emitting device technologies field, particularly relate to a kind of phosphor substrate and preparation method thereof, and a kind of multiple Close emitting led and preparation method thereof.
Background technology
Correlation technique discloses a kind of by combining glass-ceramic flux and phosphor material powder, and glass, pottery can be applied to On substrate, and then prepare a kind of manufacture method being applied to white LED light source luminescence component.Wherein, a kind of have fluorescent material The manufacture method of substrate, including: a fluorescent material and a flux are provided, and make it uniformly mix；Upside down firing is mixed, and this is glimmering Light powder and this flux become a vitreous body of fritting shape；This vitreous body is ground to form a fluorescent glass powder body, and is coated with This fluorescent material glass powder is on a substrate；And heat this glass powder and make it become a fluorescent film on this substrate.Another open A kind of manufacture method of white light LED light source component, including: a fluorescent material and a flux are provided, and make it uniformly mix； Upside down firing this fluorescent material mixed and this flux become a vitreous body of fritting shape；This vitreous body is ground to form a fluorescence Powder glass powder, and it is coated with this fluorescent glass powder body on a substrate；Heat this fluorescent material glass powder and become a fluorescence Film is on this substrate；This substrate of cutting tool fluorescent film becomes preliminary dimension and is combined into white light LEDs with a LED chip.
Above-mentioned phosphor substrate introducing pottery (Al2O3 or AlN) material is as support, due to ceramic material high index (1.8 Above), usually require that phosphor powder layer refractive index, about 1.52, thus results in overall structure and largely do not meets ideal Optical design requirements, be substantially reduced the light extraction efficiency of LED.It addition, above-mentioned phosphor substrate manufacture uses fluorescent material and Flux is formed in 700-1000 DEG C of upside down firing technique, the most greatly destroys the service life of fluorescent material And luminous efficiency, the operating temperature of usual LED component or ambient temperature not can exceed that 200 DEG C.Foregoing invention is the most not mentioned glimmering The building process of light powder substrate and LED chip, i.e. cannot ensure positional precision and later stage recoverability that phosphor substrate installs.
Summary of the invention
It is contemplated that one of technical problem solved the most to a certain extent in correlation technique.To this end, the one of the present invention Purpose is to propose a kind of phosphor substrate manufacture method, and this manufacture method can improve luminous efficiency, low cost.
Further object is that a kind of phosphor substrate using above-mentioned manufacture method of proposition.
Another object of the present invention is to propose a kind of recombination luminescence LED and preparation method thereof.
For reaching above-mentioned purpose, an aspect of of the present present invention embodiment proposes a kind of phosphor substrate manufacture method, this manufacture method Comprise the following steps: fluorescent material, phosphor substrate mould, silica gel or epoxy resin solvent are provided；Carry out with preset ratio Join glue to be mixed homogeneously with described silica gel by described fluorescent material, or described fluorescent material is mixed all with described epoxy resin solvent Even；Colloid mixture after joining glue injects in described phosphor substrate mould；To the mixing in described phosphor substrate mould Colloid carries out baking-curing；And separate to form fluorescent material base with described phosphor substrate mould by the colloid mixture after solidification Plate.
Phosphor substrate manufacture method according to embodiments of the present invention, by by fluorescent material and silica gel or by fluorescent material and ring Epoxy resins solvent is with preset ratio mix homogeneously, and it is interior through baking-curing with from film formation fluorescence to inject phosphor substrate mould Powder substrate, phosphor substrate is only the mixture of silica gel and the mixture of fluorescent material or epoxy resin solvent and fluorescent material, Largest refractive index can regulate to about 1.52, it is easier to meets optimal optical design requirements, introduces in correlation technique Ceramic substrate makees to support that refractive index is bigger than normal compares, and can be greatly improved the luminous efficiency of material, it addition, manufacture method is simple, with Conventional point adhesive process process is compared, and can reduce human and material resources cost.
For reaching above-mentioned purpose, another aspect of the present invention embodiment proposes a kind of phosphor substrate, and this phosphor substrate is by above-mentioned Manufacture method described in aspect embodiment is formed.
Phosphor substrate according to embodiments of the present invention, is formed by the manufacture method of above-mentioned aspect embodiment, with correlation technique Comparing, be more prone to meet preferable optical design requirements, luminous efficiency is greatly improved, and processing technology is simple, and cost reduces, This phosphor substrate uses the shipment mode of similar LED chip, has started brand-new supply of material pattern.
For reaching above-mentioned purpose, another aspect of the invention embodiment proposes the manufacture method of a kind of recombination luminescence LED, this making Method comprises the following steps: by above-mentioned fluorescent material manufacture method to obtain phosphor substrate；LED chip is provided；Described LED chip by die bond, bonding wire and sealing to form LED；The crystal-bonding adhesive that spot printing can be degraded by UV on described LED is with by institute State phosphor substrate die bond on institute LED；Described phosphor substrate and LED are baked under preset temperature and are cured to form again Close emitting led.
The manufacture method of recombination luminescence LED according to embodiments of the present invention, the die bond can degraded by UV by spot printing on LED Glue with by phosphor substrate die bond on LED, and then baking-curing formed recombination luminescence LED, lost efficacy it at phosphor substrate After, can directly carry out repairing and change, it is not necessary to whole device is scrapped, and reduces expense, it addition, use similar chip die bond Mode, it is ensured that precision and production efficiency.
Based on above-described embodiment, further aspect of the present invention embodiment proposes a kind of recombination luminescence LED, described recombination luminescence LED Above-mentioned manufacture method is used to be formed.
Recombination luminescence LED according to embodiments of the present invention, the crystal-bonding adhesive can degraded by UV by spot printing on LED is with by fluorescence Powder substrate die bond is on LED, and then baking-curing forms recombination luminescence LED, after phosphor substrate lost efficacy, and Ke Yijin Row is repaired and is changed, it is not necessary to whole device is scrapped, and expense reduces, it addition, precision and production efficiency are improved.
Accompanying drawing explanation
Fig. 1 is the flow chart of the basic manufacture method of fluorescent material according to an embodiment of the invention；
Fig. 2 is the flow chart of the manufacture method of the phosphor substrate of a specific embodiment according to the present invention；
Fig. 3 is the flow chart of the manufacture method of recombination luminescence LED according to an embodiment of the invention；
(1) and (2) in Fig. 4 be a specific embodiment according to the present invention by phosphor substrate die bond in LED core The schematic diagram of sheet；
Fig. 5 is the schematic diagram of the recombination luminescence LED of another specific embodiment according to the present invention；And
Fig. 6 is the flow chart of the manufacturing process of the recombination luminescence LED of a specific embodiment according to the present invention.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most identical Or similar label represents same or similar element or has the element of same or like function.Retouch below with reference to accompanying drawing The embodiment stated is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
Describe phosphor substrate manufacture method according to embodiments of the present invention with reference to the accompanying drawings and use the method to be formed The manufacture method of phosphor substrate and recombination luminescence LED (Light Emitting Diode, light emitting diode) and Use the recombination luminescence LED that the method is formed.
The first-selected phosphor substrate manufacture method to the embodiment of the present invention illustrates.
Fig. 1 is the flow chart of the phosphor substrate manufacture method according to one embodiment of the present of invention, as it is shown in figure 1, This manufacture method comprises the following steps:
S1, it is provided that fluorescent material, phosphor substrate mould, silica gel or epoxy resin solvent.
Wherein, silica gel or epoxy resin solvent meet optical design, and the refractive index of silica gel or epoxy resin solvent can be About 1.51-1.53, such as refractive index are 1.52, and the excitation wavelength of fluorescent material is controlled, size tunable.
In one embodiment of the invention, it is provided that the excitation wavelength of fluorescent material can be at the scope of 380-780nm, fluorescence Powder material can be to include a yellow yttrium-aluminium-garnet (YAG), yellow terbium aluminium garnet (TAG), a yellow silicate (Silicate), monosulfide (Sulfate) and mononitride (Nitrate) or the combination in any of above-mentioned fluorescent material. There is provided silica gel or epoxy resin solvent, refractive index is about 1.52, wherein, silica gel or epoxy resin solvent all containing A, Two kinds of compositions of B glue, water white transparency, viscosity is suitable fixed, possesses resistance to UV and high-temperature behavior.
S2, carries out joining glue to be mixed homogeneously with silica gel by fluorescent material with preset ratio, or by fluorescent material and epoxy resin solvent Mix homogeneously.
Specifically, during joining glue, A, B composition in A, B component or epoxy resin solvent in silica gel can root Be adjusted according to concrete condition, such as the A in silica gel or epoxy resin solvent, the mass ratio of B component are 1:1, fluorescence The mass ratio of the mass ratio of powder and silica gel or fluorescent material and epoxy resin solvent in specifying claimed range, typically smaller than 10%. Joining glue process and mainly comprise stirring and vacuum defoamation two kinds operation, finally make fluorescent material mix homogeneously with peptizer, bubble-free is residual Stay.
S3, injects joining the colloid mixture after glue in phosphor substrate mould.
In an embodiment, phosphor substrate mould can be the mould of a kind of flat board approximating drawer type or electric baking pan, mould table Face material has through special coating film treatment, can facilitate from film.Specifically, centrifugal coating whirl coating or spraying can be used to be coated with Glue or use Multi-head spot gluing machine point glue or use the mode injecting glue such as planographic, will fluorescent material and silica gel or epoxy resin The colloid mixture of solvent injects in phosphor substrate mould, and wherein, injecting glue THICKNESS CONTROL is at below 10mm, or according to appointment Requirement is controlled.
Wherein, during traditional some glue, often there is problems with, such as, fluorescent material there will be during a glue Deposited phenomenon, the color coordinates distribution thus resulting in same batch products is not concentrated, and then is reduced production yield and shipment yield. The most such as, the ratio of 20% is at least occupied in conventional point glue post in the hardware investment that production line is built, and causes investor and product The cost pressure of product, and the phosphor substrate manufacture method of the embodiment of the present invention occurs during can avoiding above-mentioned conventional point glue Problem.
Preferably, before joining in the colloid mixture injection phosphor substrate mould after glue, i.e. before mould injecting glue, glimmering Spraying separation agent in light powder substrate die, separation agent contributes to the phosphor substrate after molding and the intact disengaging of mould contact surface.
S4, carries out baking-curing to the colloid mixture in phosphor substrate mould.
Specifically, the programmable baking box multistage can be used to rise gentle constant temperature baking-curing, when carrying out baking-curing, baking Temperature is generally below 150 DEG C, and baking time is within 5h, or adjusts according to the character of glue.
S5, separates to form phosphor substrate with phosphor substrate mould by the colloid mixture after solidification.
Phosphor substrate mould at room temperature die sinking after being baked, it is intended that the phosphor substrate of thickness at room temperature cools down also Under the auxiliary of separation agent etc., with phosphor substrate mould from film, thus obtain phosphor substrate.
By the thickness of phosphor substrate of manufacture method formation of above-described embodiment, excitation wavelength, phosphor's density, thin film Hardness can require to pre-adjust according to encapsulating products size, final photoelectric properties.Meanwhile, the most key requirement is fluorescence Powder substrate index parameter is maximized to be met and optical condition, it is to avoid have a negative impact LED luminous efficiency.
It can be seen that the manufacture method of the phosphor substrate of the embodiment of the present invention, by by fluorescent material and silica gel or by glimmering Light powder is mixed homogeneously with preset ratio with epoxy resin solvent, and it is interior through baking-curing with from film to inject phosphor substrate mould Forming phosphor substrate, phosphor substrate is only silica gel and the mixture of fluorescent material or epoxy resin solvent and fluorescent material Mixture, largest refractive index can regulate to about 1.52, it is easier to meets optimal optical design requirements, to relevant skill Art introduces ceramic substrate and makees to support that refractive index is bigger than normal compares, the luminous efficiency of material can be greatly improved, it addition, manufacture method Simply, compared with conventional point adhesive process process, human and material resources cost can be reduced.
Further, as in figure 2 it is shown, after forming phosphor substrate, this manufacturing process also includes:
S6, is cut to phosphor substrate unit to phosphor substrate.
Preferably, before cutting phosphor substrate, cutting film at phosphor substrate surface mount UV, this UV cuts Cut film and there is high viscosity, not only when cutting, phosphor substrate is provided a supporting role, it is also ensured that when next step overturns Can be realized easily by UV dispergation.Specifically, stent size can be specified to use the form of diamant cutting according to client, Cut into the independent phosphor substrate unit of specified size.Visible, use the cutting of ceramic substrate of support in correlation technique Cutting and compare, cutting mode and the technique of the phosphor substrate of the embodiment of the present invention are simpler.
S7, by phosphor substrate unit upset to packaging material.
Specifically, phosphor substrate and UV are cut film and is pasted on the such as blue film of packaging material, wherein, UV (ultraviolet) Cutting film and packaging material lay respectively at the both sides of phosphor substrate；And then by UV dispergation machine that optical source wavelength is 365nm The UV cutting film back side is irradiated, UV is cut film viscosity and is down to minimum, phosphor substrate can be transferred to solar energy In selective absorbing vacuum coating, surface can cover one layer of release paper.
By in phosphor substrate upset to blue film, use the blue film packaging of similar LED chip, every little fluorescent powder film substrate Independent, individual blue film can accommodate specified quantity such as 5000pcs, has started a kind of brand-new mode of supplly.
Put it briefly, the manufacture method of the phosphor substrate of the embodiment of the present invention, by preprepared silica gel or Epoxy resin solvent and fluorescent material are mixed together uniformly, then by the way of a kind of centrifugal coating, spraying or planographic It is injected in the molding phosphor substrate mould formulated, needs before injection to spray separation agent in a mold.By to finger Fixed mould carries out stage Baking out, makes phosphor substrate solidification and from film.Phosphor substrate after solidification Pad pasting on UV cutting film, and use mode that diamond blade cut it is anticipated that size carry out cutting separation, The most again the phosphor substrate upset after cutting on blue film.
Phosphor substrate manufacture method based on above-mentioned aspect embodiment, another aspect of the present invention embodiment also proposes a kind of fluorescence Powder substrate, this phosphor substrate is formed by the manufacture method of above-mentioned aspect embodiment.
The phosphor substrate of the embodiment of the present invention, is formed by the manufacture method of above-mentioned aspect embodiment, compared with correlation technique, Being more prone to meet preferable optical design requirements, luminous efficiency is greatly improved, and processing technology is simple, and cost reduces, and this is glimmering Light powder substrate uses the shipment mode of similar LED chip for example with blue film packaging, has started brand-new supply of material pattern.
The manufacture method of the recombination luminescence LED that embodiment proposes according to a further aspect of the present invention is described with reference to the accompanying drawings.
Fig. 3 is the flow chart meeting emitting led manufacture method according to one embodiment of the present of invention.As it is shown on figure 3, This manufacture method comprises the following steps:
S10, it is thus achieved that phosphor substrate.
Required phosphor substrate is formed by the fluorescent material manufacture method of above-mentioned aspect embodiment.
S20, it is provided that LED chip.
S30, LED chip by die bond, bonding wire and sealing to form LED.
Specifically, by existing LED chip, it is fixed in the support specified by existing die bond mode, and completes bonding wire Operation, and then by the LED chip of bonding wire and support, carry out transparent glue sealing, transparent adhesive tape according to existing some glue form Water can be silica gel or epoxy resin, and refractive index is about 1.52, and baking-curing, and the LED chip after encapsulation is formed LED。
S40, the crystal-bonding adhesive that spot printing can be degraded by UV in LED chip with by phosphor substrate die bond on LED.
Specifically, the LED by sealing but not being cut retransfers die bond post, first on transparent glue surface before die bond The transparent crystal-bonding adhesive that the appointed thickness of spot printing one plane can be degraded by UV, then by the acquired fluorescent material being packaged on blue film Substrate carries out expanding crystalline substance and in LED chip rack surface die bond, as shown in Fig. 4 (1) and (2), wherein, phosphor substrate 60, Blue film 70, LED chip 10.Phosphor substrate uses the mode of similar chip die bond, not only in terms of precision and production efficiency It is guaranteed, has started a kind of brand-new making form.
S50, phosphor substrate and LED carry out baking-curing to form recombination luminescence LED under preset temperature.
And then, at high temperature carrying out baking-curing, usual baking temperature is within 150 DEG C, within baking time is 3 hours, Ultimately forming by LED chip luminous, LED chip luminescence excitated fluorescent powder substrate is luminous, two kinds of light wave complementations, is formed compound Emitting led, as shown in Figure 5.
It should be noted that traditional LED finished product in use due to long-time under the working environment of higher temperature, Generally this fluorescent material all can lose efficacy, and causes whole lamp to lose efficacy and serious customer complaint problem, but the production method in correlation technique by It is fused into one in chip, fluorescent material glue and support, it is impossible to repair.And the phosphor substrate of the embodiment of the present invention with LED interface can the glue of UV degraded be bonded by a kind of, when phosphor substrate lost efficacy, and need to be through optical source wavelength 365nm The UV dispergation machine of left and right irradiates, and can complete the stripping of phosphor substrate, then by manufacturing step S40-S50, can complete The reparation of LED, it is not necessary to whole component exhaustion.
As specific embodiment, as shown in Figure 6, the manufacturing process of recombination luminescence LED include phosphor substrate manufacturing process with And by phosphor substrate and the recombination process of LED, specifically include following steps:
S100, it is provided that fluorescent material, silica gel or epoxy resin.
S110, joins glue, will fluorescent material and silica gel or mixed with epoxy resin by fluorescent material.
S120, phosphor substrate mould injecting glue.
Such as by centrifugal coating, spraying, planographic or Multi-head spot gluing machine point glue.
S130, colloid baking-curing.
S140, phosphor substrate molding with from film.
S150, phosphor substrate cuts.
S160, phosphor substrate overturns.
S170, LED chip die bond.
S180, LED support sealing.
S190, phosphor substrate die bond.
S200, recombination luminescence LED molding.
The manufacture method of recombination luminescence LED according to embodiments of the present invention, the die bond can degraded by UV by spot printing on LED Glue with by phosphor substrate die bond on LED, and then baking-curing formed recombination luminescence LED, lost efficacy it at phosphor substrate After, can directly carry out repairing and change, it is not necessary to whole device is scrapped, and reduces expense, it addition, use similar chip die bond Mode, it is ensured that precision and production efficiency.
The manufacture method of recombination luminescence LED based on above-mentioned aspect embodiment, another aspect of the invention embodiment also proposes one Plant recombination luminescence LED, as it is shown in figure 5, this recombination luminescence LED is formed by the manufacture method of above-mentioned aspect embodiment, should Recombination luminescence LED include LED chip 10, LED bonding wire 20, LED chip support 30, LED transparent enclosure glue 40, can UV The transparent crystal-bonding adhesive 50 of degraded and phosphor substrate 60.
The recombination luminescence LED of the embodiment of the present invention, the crystal-bonding adhesive can degraded by UV by spot printing on LED is with by fluorescent material base Plate die bond is on LED, and then baking-curing forms recombination luminescence LED, after phosphor substrate lost efficacy, can repair Multiple replacing, it is not necessary to whole device is scrapped, expense reduces, it addition, precision and production efficiency are improved.
In flow chart or at this, any process described otherwise above or method description are construed as, and represent and include one Or the module of code, fragment or the part of the executable instruction of the more step for realizing specific logical function or process, And the scope of the preferred embodiment of the present invention includes other realization, wherein can not press order that is shown or that discuss, Including according to involved function by basic mode simultaneously or in the opposite order, performing function, this should be by the present invention's Embodiment person of ordinary skill in the field understood.
Represent in flow charts or the logic described otherwise above at this and/or step, for example, it is possible to be considered as reality The sequencing list of the executable instruction of existing logic function, may be embodied in any computer-readable medium, for instruction Execution system, device or equipment (system such as computer based system, including processor or other can perform from instruction System, device or equipment instruction fetch also perform the system instructed) use, or combine these instruction execution systems, device or set Standby and use.For the purpose of this specification, " computer-readable medium " can be any can to comprise, store, communicate, propagate Or transmission procedure for instruction execution system, device or equipment or combines these instruction execution systems, device or equipment and uses Device.The more specifically example (non-exhaustive list) of computer-readable medium includes following: have one or more cloth The electrical connection section (electronic installation) of line, portable computer diskette box (magnetic device), random access memory (RAM), read-only Memorizer (ROM), erasable read only memory (EPROM or flash memory) of editing, fiber device, and portable Compact disc read-only memory (CDROM).It addition, computer-readable medium can even is that the paper that can print described program thereon Or other suitable media, because then can carry out editing, solving such as by paper or other media are carried out optical scanning Translate or be processed to electronically obtain described program with other suitable methods if desired, be then stored in computer In memorizer.
Should be appreciated that each several part of the present invention can realize by hardware, software, firmware or combinations thereof.In above-mentioned reality Execute in mode, software that multiple steps or method in memory and can be performed by suitable instruction execution system with storage or Firmware realizes.Such as, if realized with hardware, with the most the same, available well known in the art under Any one or their combination in row technology realize: have the logic gates for data signal realizes logic function Discrete logic, there is the special IC of suitable combination logic gate circuit, programmable gate array (PGA), existing Field programmable gate array (FPGA) etc..
Those skilled in the art are appreciated that realizing all or part of step that above-described embodiment method carries is can Completing instructing relevant hardware by program, described program can be stored in a kind of computer-readable recording medium, This program upon execution, including one or a combination set of the step of embodiment of the method.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed Or implicitly include at least one this feature.In describing the invention, " multiple " are meant that at least two, such as two Individual, three etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can Being that the first and second features directly contact, or the first and second features are by intermediary mediate contact.And, the One feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or Oblique upper, or it is merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be fisrt feature immediately below second feature or obliquely downward, or it is special to be merely representative of first Levy level height less than second feature.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show Example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material or Feature is contained at least one embodiment or the example of the present invention.In this manual, the schematic representation to above-mentioned term Necessarily it is directed to identical embodiment or example.And, the specific features of description, structure, material or feature are permissible One or more embodiment in office or example combine in an appropriate manner.Additionally, in the case of the most conflicting, ability The feature of the different embodiments described in this specification or example and different embodiment or example can be entered by the technical staff in territory Row combines and combination.
Although above it has been shown and described that embodiments of the invention, it is to be understood that above-described embodiment is exemplary, Being not considered as limiting the invention, those of ordinary skill in the art within the scope of the invention can be to above-described embodiment It is changed, revises, replaces and modification.

Claims (10)

1. a phosphor substrate manufacture method, it is characterised in that including:
Fluorescent material, phosphor substrate mould, silica gel or epoxy resin solvent are provided；
Carry out joining glue to be mixed homogeneously with described silica gel by described fluorescent material with preset ratio, or by described fluorescent material with described Epoxy resin solvent mix homogeneously；
Colloid mixture after joining glue injects in described phosphor substrate mould；
Colloid mixture in described phosphor substrate mould is carried out baking-curing；And
Separate to form phosphor substrate with described phosphor substrate mould by the colloid mixture after solidification.
2. phosphor substrate manufacture method as claimed in claim 1, it is characterised in that described silica gel or asphalt mixtures modified by epoxy resin liposoluble The refractive index of agent is 1.51-1.53.
3. phosphor substrate manufacture method as claimed in claim 2, it is characterised in that when carrying out baking-curing, baking Temperature is less than 150 DEG C, and the time is less than or equal to 5 hours.
4. phosphor substrate manufacture method as claimed in claim 1, it is characterised in that the colloid mixture after glue will be joined Before injecting in described phosphor substrate mould, also include:
Separation agent is sprayed in described phosphor substrate mould.
5. phosphor substrate manufacture method as claimed in claim 1, it is characterised in that formed described phosphor substrate it After, also include:
Described phosphor substrate is cut to phosphor substrate unit；And
By in described phosphor substrate unit upset to packaging material.
6. phosphor substrate manufacture method as claimed in claim 5, it is characterised in that described phosphor substrate is being carried out Before cutting, also include:
Film is cut at described phosphor substrate surface mount UV.
7. phosphor substrate manufacture method as claimed in claim 6, it is characterised in that described phosphor substrate unit is turned over Go to, on packaging material, specifically include:
Described phosphor substrate and described UV are cut film be pasted on described packaging material, wherein, described UV cutting film and Described packaging material lay respectively at the both sides of described phosphor substrate；And
It is irradiated being transferred on described packaging material described phosphor substrate to described UV cutting film by UV dispergation machine.
8. a phosphor substrate, it is characterised in that formed by the manufacture method described in any one of claim 1-7.
9. the manufacture method of a recombination luminescence LED, it is characterised in that comprise the following steps:
Fluorescent material manufacture method as described in any one of claim 1-7 is to obtain phosphor substrate；
LED chip is provided；
Described LED chip by die bond, bonding wire and sealing to form LED；
The crystal-bonding adhesive that spot printing can be degraded by UV on described LED with by described phosphor substrate die bond on described LED；
Described phosphor substrate and described LED are baked under preset temperature and are cured to form recombination luminescence LED.
10. a recombination luminescence LED, it is characterised in that use manufacture method as claimed in claim 9 to be formed.
CN201510119044.0A 2015-03-18 2015-03-18 Phosphor powder substrate and manufacturing method thereof, and composite luminescence LED and manufacturing method thereof Pending CN106033789A (en)

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CN109619751A (en) * 2018-12-29 2019-04-16 莆田市城厢区福瑞科技电子有限公司 A kind of packaging method of shoes lamp
CN110112129A (en) * 2019-06-05 2019-08-09 福建天电光电有限公司 A kind of emitting semiconductor manufacture craft of glass flourescent sheet
CN112113682A (en) * 2020-09-23 2020-12-22 苏州光格设备有限公司 Manufacturing method of optical fiber temperature measuring probe of oil immersed transformer

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Cited By (12)

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CN107195760A (en) * 2017-04-26 2017-09-22 安徽欧瑞特照明有限公司 A kind of LED packaging technologies
CN107195760B (en) * 2017-04-26 2020-01-17 安徽欧瑞特照明有限公司 LED packaging process
CN107275460A (en) * 2017-07-12 2017-10-20 惠州市聚飞光电有限公司 A kind of luminous LED component of one side and method for packing
WO2019010865A1 (en) * 2017-07-12 2019-01-17 惠州市聚飞光电有限公司 Single-sided illuminating led component and packaging method
CN108807221A (en) * 2018-04-25 2018-11-13 四川省欧玛科技有限公司 LED fluorescent powder spraying method
CN108807647A (en) * 2018-06-14 2018-11-13 中国计量大学 A kind of manufacturing method of LED structure fluorescent film
CN109004094A (en) * 2018-07-20 2018-12-14 苏州大学 A kind of flexible white light device
CN109619751A (en) * 2018-12-29 2019-04-16 莆田市城厢区福瑞科技电子有限公司 A kind of packaging method of shoes lamp
CN109619751B (en) * 2018-12-29 2021-03-02 莆田市城厢区福瑞科技电子有限公司 Packaging method of shoe lamp
CN110112129A (en) * 2019-06-05 2019-08-09 福建天电光电有限公司 A kind of emitting semiconductor manufacture craft of glass flourescent sheet
CN110112129B (en) * 2019-06-05 2024-04-02 福建天电光电有限公司 Manufacturing process of luminous semiconductor of glass fluorescent sheet
CN112113682A (en) * 2020-09-23 2020-12-22 苏州光格设备有限公司 Manufacturing method of optical fiber temperature measuring probe of oil immersed transformer

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Application publication date: 20161019