CN108807647A - A kind of manufacturing method of LED structure fluorescent film - Google Patents
A kind of manufacturing method of LED structure fluorescent film Download PDFInfo
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- CN108807647A CN108807647A CN201810614837.3A CN201810614837A CN108807647A CN 108807647 A CN108807647 A CN 108807647A CN 201810614837 A CN201810614837 A CN 201810614837A CN 108807647 A CN108807647 A CN 108807647A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000843 powder Substances 0.000 claims description 56
- 239000000084 colloidal system Substances 0.000 claims description 39
- 239000012528 membrane Substances 0.000 claims description 24
- 238000002955 isolation Methods 0.000 claims description 21
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 15
- 239000000499 gel Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000000693 micelle Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 4
- 230000001105 regulatory effect Effects 0.000 abstract description 4
- 230000007812 deficiency Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 239000003086 colorant Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000001124 body fluid Anatomy 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000035479 physiological effects, processes and functions Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
Abstract
The invention discloses a kind of preparation methods of LED structure fluorescent film, technical problem to be solved is to provide a kind of preparation method of structured fluorescent film, the method overcome existing technological deficiencies, pass through corresponding manufacture craft, the structured fluorescent film prepared is arranged in pairs or groups with array blue-light LED chip, the different luminous zone of two groups of colour temperatures can be obtained, regulated and controled by the current ratio to two groups of luminous zones, finally realize photochromic adjustable purpose.It is beneficial to the heat dissipation of LED using structured fluorescent film, is conducive to the consistency for improving LED product, is used cooperatively with array blue-light LED chip and can reach photochromic adjustable purpose.
Description
Technical field
The present invention relates to field of photoelectric technology, and in particular to a kind of LED structure fluorescence membrane preparation method.
Background technology
For a long time, white light LEDs receive people's concern, wherein photochromic adjustable LED is then the trend developed at present, for light
Color is adjustable, and its maximum advantage realizes secondary energy-saving, and LED can be adjusted according to the physiology of people, the various situations such as psychology,
People is given with the light environment of the most comfortable.Hereby it is achieved that it is photochromic accurate continuously adjustable, be conducive to the development in LED technology field.It passes
The photochromic adjustable LED of system includes mainly 5 kinds of schemes：1, white light is generated by RGB monochromatic LED mixed lights；2, using multi-chip
Integrated white light LED realizes adjustable color by chip portfolio and current regulation；3, by adjust white light LEDs, 3 blue-ray LEDs and
Adjustable color is realized in the brightness of three branches of red-light LED；4, adjustable color is realized using white light and yellow light LED combination；5, by
Low color temperature white light LED and high color temperature white light LEDs mixed light and brightness regulation realize adjustable color, i.e. changes in temperature white light colour mixture.However
The above dimming mode is all the adjusting to LED progress colour temperature and brightness using the photochromic LED mixing of two or more differences, and with
Raising photochromic mode, systematic comparison is complicated without exception, and integrated level is not high.
Current fluorescent film preparation process is that the fluorescent powder colloid formed is uniformly mixed with phosphor raw material by transparent colloid,
Then it uses printing technology by fluorescent powder colloid even print in support light transmission grinding, and is thermally dried and fluorescence is made
Film.But just current fluorescent film preparation process only accounts for solving light emission rate, luminous effect by preparing fluorescent film without exception
The problems such as rate and uniformity, there is no consider the preparation process by fluorescent film finally to realize that LED light color is adjustable.
Invention content
For the above technical deficiency, technical problem to be solved by the present invention lies in provide a kind of system of structured fluorescent film
Preparation Method, the method overcome existing technological deficiencies, by corresponding manufacture craft, the same battle array of structured fluorescent film prepared
Row blue-light LED chip is arranged in pairs or groups, and the different luminous zone of two groups of colour temperatures can be obtained, and is regulated and controled by the current ratio to two groups of luminous zones,
Finally realize photochromic adjustable purpose.
To solve the above-mentioned problems, the technical solution used in the present invention is：
A kind of manufacturing method of LED structure fluorescent film, it is characterised in that：Include the following steps：
（1）The transparent colloids such as the same epoxy resin of fluorescent powder original powder, silica gel are mixed, is hydrolyzed, is condensed chemical reaction, through old
Gradually it polymerize between change micelle, forms fluorescent powder colloid；
（2）The fluorescent powder colloid prepared is poured into chessboard trellis structure mold, by the phosphor gel between each isolation
Body obtains certain thickness fluorescent film using dry-pressing mode；
（3）It is finally dried, cures and be removed from the molds together with support transparent membrane, make structured fluorescent film.
Further, step（1）Described in the form of structured fluorescent film include a, two kinds of fluorescent powder alternating structures
Fluorescent film, b, thickness structure fluorescent film.
Further, step（1）Used in fluorescent powder original powder be YAG yellow fluorescent powders, fluorescence original powder and transparent colloid
The ratio of 1%-10% mixes.
Further, in step（2）Described in chessboard trellis structure mold include：Between the isolation of chessboard trellis（1）And support
Transparent membrane（2）；Wherein between the isolation of chessboard trellis（1）It is placed in support transparent membrane（2）Top, the two can fit closely；Chessboard
Be length and width dimensions it is n × n between trellis isolation, is highly h, between a × a isolation, the length and width dimensions between being each isolated is equal for inside
It is highly h for b × b, inner hollow between isolation is divided into high color temperature block region and low color temperature block region, and two groups between isolation
Region is arranged alternately, and support transparent membrane length and width dimensions are m × m, and m >=n, thickness is g mm, supports transparent membrane and gridiron pattern
Between shape isolation（1）It is bonded and can freely take out.
Further, two kinds of fluorescent powder alternating structure fluorescent films use following steps：It is prepared by two kinds
Two kinds not the fluorescent colloid of concentration or different component be poured into respectively in chessboard trellis structure mold, by low concentration fluorescent powder colloid
It is poured into high color temperature block region, phosphor concentration is a mol/L；High concentration fluorescent powder colloid is poured into low color temperature module
Area, phosphor concentration are b mol/L, a<B is poured into the highly consistent of the fluorescent powder colloid of two groups of block regions.
Further, the thickness structure fluorescent film uses following steps：Fluorescent powder colloid is poured to chessboard trellis respectively
In structure mold, prepared fluorescent powder colloid is poured into high color temperature block region, glimmering phosphor gel body liquid level is c
Mm, by prepared fluorescent powder colloid is poured into low color temperature block region in advance, fluorescent powder colloid liquid level is d mm, low
Fluorescent powder colloid height in colour temperature block region is higher than fluorescent powder colloid height in high color temperature block region, c>d.
The good effect that the present invention has on the basis of the above is：
1. a kind of LED structure fluorescence membrane preparation method provided by the invention, using structured fluorescent film far from LED chip surface
Packaged type, far from LED chip heat source, ensure that the organic material of phosphor film layer will not be because of temperature compared with traditional handicraft
The raising of degree and explain aging, improve the bloom efficiency of LED.
2. a kind of LED structure fluorescence membrane preparation method provided by the invention, with the identical a × a of quantity between same isolation
A array blue-light LED chip sends out blue light excitation yellow light structure fluorescent film, generates the different white light area of two groups of colour temperatures, a high color
Warm white light area and a low color temperature white light area control the current ratio in two groups of regions respectively, realize photochromic adjustable.
Description of the drawings
Fig. 1 is the chessboard trellis structure mold schematic diagram of the present invention.
Fig. 2 present invention makes the process flow chart of LED structure fluorescent film.
Fig. 3 is that invention prepares two kinds of fluorescent powder alternating structure fluorescent film schematic diagrames.
Fig. 4 is two kinds of fluorescent powder alternating structure fluorescent film schematic diagrames of the present invention.
Fig. 5 be the present invention prepare thickness structure fluorescent film schematic diagram.
Fig. 6 is the thickness structure fluorescent film schematic diagram of the present invention.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, technical scheme of the present invention is made with reference to specific embodiment
It is further described and illustrates.
As shown in Figure 1, a kind of chessboard trellis structure mold schematic diagram provided in this embodiment, including：Chessboard trellis is isolated
Between 1, support transparent membrane 2；
1 is placed in 2 top of support transparent membrane wherein between the isolation of chessboard trellis, and the two can fit closely.
1 be length and width dimensions is n × n between the isolation of chessboard trellis, is highly h, and inside is between a × a isolation, between being each isolated
Length and width dimensions be b × b, be highly h, isolation between inner hollow, high color temperature block region and low color will be divided between isolation
Warm block region, and two groups of regions are arranged alternately, support 2 length and width dimensions of transparent membrane are m × m, and m >=n, thickness is g mm, support
1 is bonded and can freely take out between transparent membrane 2 can be isolated with chessboard trellis completely.
As shown in Fig. 2, the process flow chart provided in this embodiment for making LED structure fluorescent film, includes the following steps：
（1）The transparent colloids such as the same epoxy resin of fluorescent powder original powder, silica gel are mixed, is hydrolyzed, is condensed chemical reaction, through old
Gradually it polymerize between change micelle, forms fluorescent powder colloid.
（2）The fluorescent powder colloid prepared is poured into above-mentioned chessboard trellis structure mold, between being each isolated in
Fluorescent powder colloid certain thickness fluorescent film is obtained using dry-pressing mode.
（3）It is finally dried, cures and be removed from the molds together with support transparent membrane, make structured fluorescent
Film.
As shown in figure 3, two kinds of fluorescent powder alternating structure fluorescent film schematic diagrames of preparation provided in this embodiment, two kinds are matched
The fluorescence of the various concentration or different component that make is solidifying to be poured into respectively in chessboard trellis structure mold, by low concentration phosphor gel
Body is poured into high color temperature block region, and phosphor concentration is a mol/L；High concentration fluorescent powder colloid is poured into low color temperature module
Area, phosphor concentration are b mol/L (a<B), ensure the highly consistent of the fluorescent powder colloid for being poured into two groups of block regions, pass through
It after dry-pressing, is finally dried, cures, fluorescent film will be attached on support transparent membrane, by support transparent membrane together with fluorescence
Film takes out together, obtains two kinds of fluorescent powder alternating structure fluorescent films.
As shown in figure 4, two kinds of fluorescent powder alternating structures fluorescent film 3 provided in this embodiment, two kinds of fluorescent powders are alternately tied
Structure fluorescent film 3 is attached to 2 on support transparent membrane, and the fluorescence that two groups of various concentrations or different component are presented is arranged alternately, point
For high concentration region 31 and low concentration region 32, a × a array blue-light LED chip is divided into two groups, two groups of blue-light LED chip alternatings
Arrangement excites high concentration region fluorescent film and low concentration region fluorescent film respectively, generates warm white warm area and cool white warm area, when respectively
The current ratio for regulating and controlling Liang Ge different-colours area, realizes photochromic regulation and control.
As shown in figure 5, provided in this embodiment prepare thickness structure fluorescent film schematic diagram, fluorescent powder colloid is poured respectively
It fills in chessboard trellis structure mold, prepared fluorescent powder colloid is poured into high color temperature block region, glimmering phosphor gel body fluid
Face height is c mm, by prepared fluorescent powder colloid is poured into low color temperature block region, fluorescent powder colloid liquid level height in advance
Degree is d mm, and the fluorescent powder colloid height in low color temperature block region is higher than fluorescent powder colloid height (c in high color temperature block region<D),
After dry-pressing, be finally dried, cure, fluorescent film will be attached to support transparent membrane on, will support transparent membrane together with
Fluorescent film takes out together, obtains thickness structure fluorescent film.
As shown in fig. 6, thickness structure fluorescent film 4 provided in this embodiment, fluorescent film thickness structure fluorescent film 4 attaches
On support transparent membrane 2, the fluorescence that two groups of different-thickness are presented is arranged alternately, and is divided into high caliper zones 41 and low thickness area 42,
A × a array blue-light LED chip is divided into two groups, two groups of blue-light LED chips are alternately arranged, and excite high caliper zones fluorescence respectively
Film and low thickness area fluorescent film generate warm white warm area and cool white warm area, when the electric current for regulating and controlling Liang Ge different-colours area respectively
Ratio realizes photochromic regulation and control.
Claims (6)
1. a kind of manufacturing method of LED structure fluorescent film, it is characterised in that：Include the following steps：
（1）The transparent colloids such as the same epoxy resin of fluorescent powder original powder, silica gel are mixed, is hydrolyzed, is condensed chemical reaction, through old
Gradually it polymerize between change micelle, forms fluorescent powder colloid；
（2）The fluorescent powder colloid prepared is poured into chessboard trellis structure mold, by the phosphor gel between each isolation
Body obtains certain thickness fluorescent film using dry-pressing mode；
（3）It is finally dried, cures and be removed from the molds together with support transparent membrane, make structured fluorescent film.
2. a kind of manufacturing method of LED structure fluorescent film according to claim 1, it is characterised in that：Step（1）Middle institute
The form for the structured fluorescent film stated includes a, two kinds of fluorescent powder alternating structure fluorescent films, b, thickness structure fluorescent film.
3. a kind of manufacturing method of LED structure fluorescent film according to claim 2, it is characterised in that：Step（1）Middle institute
Fluorescent powder original powder is YAG yellow fluorescent powders, the ratio mixing of fluorescence original powder and transparent colloid 1%-10%.
4. a kind of manufacturing method of LED structure fluorescent film according to claim 1, it is characterised in that：In step（2）In
The chessboard trellis structure mold includes：Between the isolation of chessboard trellis（1）With support transparent membrane（2）；Wherein chessboard trellis is isolated
Between（1）It is placed in support transparent membrane（2）Top, the two can fit closely；Be length and width dimensions it is n × n between the isolation of chessboard trellis, height
Degree is h, and inside is between a × a isolation, and the length and width dimensions between each isolation are b × b, are highly h, between isolation in inside
Sky is divided into high color temperature block region and low color temperature block region between isolation, and two groups of regions are arranged alternately, and supports transparent membrane length and width
Size is m × m, and m >=n, thickness is g mm, between support transparent membrane is isolated with chessboard trellis（1）It is bonded and can freely take out.
5. a kind of manufacturing method of LED structure fluorescent film according to claim 2, it is characterised in that：Described two kinds
Fluorescent powder alternating structure fluorescent film uses following steps：The fluorescence of two kinds of prepared various concentrations or different component is coagulated and is divided
It is not poured into chessboard trellis structure mold, low concentration fluorescent powder colloid is poured into high color temperature block region, phosphor concentration
For a mol/L；High concentration fluorescent powder colloid is poured into low color temperature block region, phosphor concentration is b mol/L, a<B is poured
Enter the highly consistent of the fluorescent powder colloid of two groups of block regions.
6. a kind of manufacturing method of LED structure fluorescent film according to claim 2, it is characterised in that：The thickness
Structured fluorescent film uses following steps：Fluorescent powder colloid is poured respectively in chessboard trellis structure mold, it will be prepared glimmering
Light arogel body is poured into high color temperature block region, and glimmering phosphor gel body liquid level is c mm, will prepared fluorescence in advance
Arogel body is poured into low color temperature block region, and fluorescent powder colloid liquid level is d mm, the phosphor gel in low color temperature block region
Body height is higher than fluorescent powder colloid height in high color temperature block region, c>d.
Priority Applications (1)
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| CN201810614837.3A CN108807647A (en) | 2018-06-14 | 2018-06-14 | A kind of manufacturing method of LED structure fluorescent film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810614837.3A CN108807647A (en) | 2018-06-14 | 2018-06-14 | A kind of manufacturing method of LED structure fluorescent film |
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| CN108807647A true CN108807647A (en) | 2018-11-13 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111403573A (en) * | 2020-03-27 | 2020-07-10 | 创维液晶器件(深圳)有限公司 | L ED packaging structure and L ED packaging method |
| US11879607B2 (en) | 2022-04-28 | 2024-01-23 | Nichia Corporation | Light-emitting device and manufacturing method thereof |
| CN118507607A (en) * | 2024-07-16 | 2024-08-16 | 江西省兆驰光电有限公司 | Fluorescent adhesive film and preparation method and application thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008191321A (en) * | 2007-02-02 | 2008-08-21 | Stanley Electric Co Ltd | Surface light source device using color conversion filter |
| CN103489991A (en) * | 2013-09-27 | 2014-01-01 | 五邑大学 | Partitioned COB LED fluorescent film with high color rendering |
| CN104752588A (en) * | 2013-12-31 | 2015-07-01 | 晶能光电（江西）有限公司 | Fluorescent glue coating method for flip chip |
| CN105336836A (en) * | 2015-10-29 | 2016-02-17 | 横店集团得邦照明股份有限公司 | Light color-variable LED structure |
| CN106030836A (en) * | 2014-03-10 | 2016-10-12 | 欧司朗光电半导体有限公司 | Wavelength conversion element, light-emitting semiconductor component comprising a wavelength conversion element, method for producing a wavelength conversion element and method for producing a light-emitting semiconductor component comprising a wavelength conversion element |
| CN106033789A (en) * | 2015-03-18 | 2016-10-19 | 比亚迪股份有限公司 | Phosphor powder substrate and manufacturing method thereof, and composite luminescence LED and manufacturing method thereof |
| CN107546313A (en) * | 2017-02-28 | 2018-01-05 | 江苏罗化新材料有限公司 | LED light source and preparation method thereof |
-
2018
- 2018-06-14 CN CN201810614837.3A patent/CN108807647A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008191321A (en) * | 2007-02-02 | 2008-08-21 | Stanley Electric Co Ltd | Surface light source device using color conversion filter |
| CN103489991A (en) * | 2013-09-27 | 2014-01-01 | 五邑大学 | Partitioned COB LED fluorescent film with high color rendering |
| CN104752588A (en) * | 2013-12-31 | 2015-07-01 | 晶能光电（江西）有限公司 | Fluorescent glue coating method for flip chip |
| CN106030836A (en) * | 2014-03-10 | 2016-10-12 | 欧司朗光电半导体有限公司 | Wavelength conversion element, light-emitting semiconductor component comprising a wavelength conversion element, method for producing a wavelength conversion element and method for producing a light-emitting semiconductor component comprising a wavelength conversion element |
| CN106033789A (en) * | 2015-03-18 | 2016-10-19 | 比亚迪股份有限公司 | Phosphor powder substrate and manufacturing method thereof, and composite luminescence LED and manufacturing method thereof |
| CN105336836A (en) * | 2015-10-29 | 2016-02-17 | 横店集团得邦照明股份有限公司 | Light color-variable LED structure |
| CN107546313A (en) * | 2017-02-28 | 2018-01-05 | 江苏罗化新材料有限公司 | LED light source and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111403573A (en) * | 2020-03-27 | 2020-07-10 | 创维液晶器件(深圳)有限公司 | L ED packaging structure and L ED packaging method |
| CN111403573B (en) * | 2020-03-27 | 2021-06-11 | 创维液晶器件(深圳)有限公司 | LED packaging structure and LED packaging method |
| US11879607B2 (en) | 2022-04-28 | 2024-01-23 | Nichia Corporation | Light-emitting device and manufacturing method thereof |
| US12111029B2 (en) | 2022-04-28 | 2024-10-08 | Nichia Corporation | Light-emitting device |
| CN118507607A (en) * | 2024-07-16 | 2024-08-16 | 江西省兆驰光电有限公司 | Fluorescent adhesive film and preparation method and application thereof |
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Application publication date: 20181113 |