CN109473535A - A kind of stack fluorescent film and preparation method thereof - Google Patents
A kind of stack fluorescent film and preparation method thereof Download PDFInfo
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- CN109473535A CN109473535A CN201811350197.6A CN201811350197A CN109473535A CN 109473535 A CN109473535 A CN 109473535A CN 201811350197 A CN201811350197 A CN 201811350197A CN 109473535 A CN109473535 A CN 109473535A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 85
- 239000000741 silica gel Substances 0.000 claims abstract description 46
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000010410 layer Substances 0.000 claims abstract description 28
- 238000000295 emission spectrum Methods 0.000 claims abstract description 24
- 239000000203 mixture Substances 0.000 claims abstract description 24
- 239000002356 single layer Substances 0.000 claims abstract description 19
- 239000012528 membrane Substances 0.000 claims abstract description 17
- 238000007639 printing Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 67
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 17
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 11
- 229910052909 inorganic silicate Inorganic materials 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- -1 polytetrafluoroethylene Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- 230000005284 excitation Effects 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 238000001228 spectrum Methods 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 238000003854 Surface Print Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 229960001866 silicon dioxide Drugs 0.000 description 35
- 239000003292 glue Substances 0.000 description 3
- 230000009102 absorption Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009103 reabsorption Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
Abstract
The invention discloses a kind of stack fluorescent films and preparation method thereof, and by i layers of certain thickness single layer one-color fluorescence film, rule is stacked in sequence, 3≤i≤6；Specific preparation step is: (1) matching according to preset quality, weigh one-color fluorescence powder and silica gel materials；(2) raw material is stirred into resulting mixture；(3) mixture deaeration in vacuum oven is put into handle；(4) substrate is selected, in the highest fluorescence membrane selection of its surface printing first layer Emission Spectrum Peals；(5) fluorescence membrane in step (4) is placed in high temperature oven, carries out precuring；(6) the step of fluorescence membrane high in (5) surface printing second layer Emission Spectrum Peals second, repetition (4)-(6), until all finishing printing；(7) be placed in baking oven and carry out curing process and prepare stack fluorescent film, the present invention has alleviate one-color fluorescence powder between cross absorption influence, the advantages of efficiency and fluorescence membrane spectrum for improving energy utilization easily adjust.
Description
Technical field
The present invention relates to a kind of stack fluorescent films and preparation method thereof, belong to field of semiconductor illumination.
Background technique
White light LEDs obtain in fields such as illumination, displays widely answer in recent years as a kind of New Solid lighting source
With.Currently, the main stream approach for realizing white light LEDs is LED chip excitated fluorescent powder, i.e., it will be straight after fluorescent powder and silica gel mixing deaeration
It connects and is coated in LED chip surface, but this method the disadvantages of there are heat accumulation effects, back scattering loss, fluorescence membrane is logical
It crosses fluorescent powder and silica gel preforming to place far from LED chip, can effectively alleviate the above problem.
Raising with people to light quality requirements, Quan Guangpu, high-quality white light LEDs be increasingly becoming focus, realize
Full spectrum white-light LED needs at least two fluorescent powders and combination of the above, but due to there are reabsorption efficiency between a variety of fluorescent powders,
It is easy to cause energy loss, and fluorescent powder type excessively causes the spectrum of white light LEDs to design to become more complicated and difficult.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of stack fluorescent film and preparation method thereof, this kind of method is logical
Cross by the different one-color fluorescence powder of Emission Spectrum Peals and silica gel is compound prepare fluorescence membrane after, according to one-color fluorescence powder emit
The direction that spectrum peak reduces stacks upwards, alleviates the influence of cross absorption between one-color fluorescence powder, improves the efficiency of energy utilization,
The adjustment of the adjustment or thickness that are matched simultaneously by one-color fluorescence powder in each layer and silica gel quality, to obtain any spectrum shape
The stack fluorescent film of shape, any optical color parameter.
A kind of stack fluorescent film provided by the invention, it is characterised in that: stack fluorescent film is by i layers of certain thickness list
Rule stacks layer one-color fluorescence film in sequence, 3≤i≤6；The single layer one-color fluorescence film is by one-color fluorescence powder
It is prepared under different quality proportion with silica gel；
The one-color fluorescence powder be under the excitation of LED chip can Emission Spectrum Peals be respectively 440 ~ 480nm blue powder,
The green powder of 490 ~ 510nm, the green powder of 520 ~ 540nm, the bloom of 550 ~ 585nm, the orange powder of 590 ~ 610nm, 620 ~ 670nm it is red
Powder；
The blue powder group of the 440 ~ 480nm becomes (Ba, Sr, Ca, Y, Li)10(PO4)6Cl2: Eu, Mn, Ce or (Ba, Sr,
Ca,Na,Li)10(PO4)6O2: Eu or (Ba, Sr, Ca, Yb, Y)10(PO4)6Cl2: Eu, Mn or (Ba, Sr, Ca, Y, Na)10
(PO4)6F2:Eu；
The sequence rule stacks upwards according to the direction that one-color fluorescence powder Emission Spectrum Peals reduce.
The Emission Spectrum Peals of the LED chip are 385 ~ 420nm.
The single layer one-color fluorescence film is prepared by silk-screen printing, and thickness range is 0.05 ~ 1.0mm.
The blue powder that the one-color fluorescence powder and silica gel quality proportion are 440 ~ 480nm: molding silica gel=0.4:1 ~ 2:1,
The green powder of 490 ~ 510nm: the green powder of molding silica gel=0.25:1 ~ 0.95:1,520 ~ 540nm: molding silica gel=0.1:1 ~ 1:1,550
The bloom of ~ 585nm: the orange powder of molding silica gel=0.05:1 ~ 1:1,590 ~ 610nm: molding silica gel=0.1:1 ~ 1:1,620 ~ 670nm
Rouge and powder: molding silica gel=0.1:1 ~ 0.8:1.
The green powder group of the 490 ~ 510nm becomes (Ca, Sr, Ba) Si2N2O2: the green powder group of Eu, 520 ~ 540nm become
(Ca,Sr,Ba)2SiO4: Eu or (Ca, Sr, Ba)2Si2O5: Eu or (Ba, Ca, Y, Na)10(SiO4)2(PO4)4O2: Eu,
The bloom group of 550 ~ 585nm becomes (Ca, Sr, Ba)4Si2O8: the orange powder group of Eu, 590 ~ 610nm become (Ca, Sr, Ba) SiO5:
Eu or (Ba, Ca, Sr, Na)10(SiO4)2(PO4)4O2: Eu, Mn, 620 ~ 670nm rouge and powder group become (Ca, Sr, Ba)
AlSiN3:Eu。
The present invention provides a kind of preparation method of stack fluorescent film, including following implemented step:
(1) according to preset quality proportioning, i kind one-color fluorescence powder and silica gel are weighed as raw material, 3≤i≤6；
(2) i kind one-color fluorescence powder and silica gel are stirred in beaker using blender, forms mixture, time 5-30min, speed
Spend 300-1000rpm/min；
(3) after stirring, mixture is put into progress deaeration processing, vacuum degree -0.1MPa, time 10- in vacuum oven
40min；
(4) it selects polytetrafluoroethylene film or silicon wafer as substrate, selects one-color fluorescence powder Emission Spectrum Peals most on its surface
High mixture printing first layer single layer one-color fluorescence film to be solidified, halftone mesh number is 80-300 mesh；
(5) single fluorescent film to be solidified in step (4) is placed in high temperature oven, carries out precuring processing, it is solid to form half
Change fluorescence membrane, 80-100 DEG C of temperature, time 30-60min；
(6) the semi-solid preparation fluorescence membrane in step (5) is taken out, selection one-color fluorescence powder Emission Spectrum Peals second are high on its surface
Mixture the step of making printing second layer single layer one-color fluorescence film to be solidified, repeating (4)-(6), until i kind monochrome is glimmering
Light powder all finishes printing, and forms i layers of stack fluorescent film to be solidified；
(7) i layers of stack fluorescent film to be solidified are placed in baking oven and carry out curing process, 150-160 DEG C of temperature, time 1-
2h prepares stack fluorescent film.
The utility model has the advantages that
(1) alleviate one-color fluorescence powder between cross absorption influence, improve the efficiency of energy utilization；
(2) adjustment of the adjustment or thickness matched by one-color fluorescence powder in each layer and silica gel quality, to obtain any light
The stack fluorescent film of spectral shape, any optical color parameter.
Detailed description of the invention
Fig. 1 is the stack fluorescent membrane structure schematic cross-section of the embodiment of the present invention 1；
1-blue powder, 2-green powder, 3-rouge and powder, 4-silica gel
Fig. 2 is the stack fluorescent film emission spectrum of the embodiment of the present invention 1；
Fig. 3 is the stack fluorescent film emission spectrum of the embodiment of the present invention 2.
Specific embodiment
The present invention is described in further details in conjunction with case study on implementation, but the scope of the present invention is not limited to the content.
Embodiment 1
(1) it is respectively blue powder according to preset quality proportioning: silica gel=0.7:1, green powder: silica gel=0.3:1, rouge and powder: silica gel=
0.25:1 weighs 3 kinds of one-color fluorescence powder and silica gel as raw material, is blue powder and composition that Emission Spectrum Peals are 450nm respectively
For (Ba, Sr, Ca, Na, Li)10(PO4)6O2: Eu is the green powder of 530nm and group becomes (Ca, Sr, Ba)2Si2O5: Eu and 630nm
Rouge and powder and group become (Ca, Sr, Ba) AlSiN3:Eu；
(2) rouge and powder of 630nm and silica gel are stirred in beaker using blender, forms mixture, time 20min, speed
600rpm/min；
(3) after stirring, mixture is put into progress deaeration processing, vacuum degree -0.1MPa, time in vacuum oven
20min；
(4) it selects polytetrafluoroethylene film as substrate, selects Emission Spectrum Peals for the rouge and powder and silicon of 630nm on its surface
The mixture printing first layer of glue single layer one-color fluorescence film to be solidified, halftone mesh number is 120 mesh；
(5) single fluorescent film to be solidified in step (4) is placed in high temperature oven, carries out precuring processing, it is solid to form half
Change fluorescence membrane, 80 DEG C of temperature, time 30min；
(6) the semi-solid preparation fluorescence membrane in step (5) is taken out as base, selects Emission Spectrum Peals for 530nm on its surface
Green powder and silica-gel mixture printing second layer single layer one-color fluorescence film to be solidified, the step of repeating (4)-(6), until 3
Kind one-color fluorescence powder all finishes printing, and forms 3 layers of stack fluorescent film to be solidified；
(7) 3 layers of stack fluorescent film to be solidified are placed in baking oven and carry out curing process, 150 DEG C of temperature, time 1.5h, system
Standby stack fluorescent film, the thickness of three kinds of single layer one-color fluorescence films out are respectively blue-fluorescence film 0.1mm, and green fluorescence is thin
Film 0.15mm, red fluorescence film 0.15mm.
Embodiment 2
(1) it is respectively blue powder according to preset quality proportioning: silica gel=0.7:1, green powder: silica gel=0.45:1, rouge and powder: silica gel=
0.45:1 weighs 3 kinds of one-color fluorescence powder and silica gel as raw material, is blue powder and composition that Emission Spectrum Peals are 450nm respectively
For for the green powder (Ca, Sr, Ba) of 530nm2Si2O5: Eu and group become and 630nm rouge and powder and group become (Ca, Sr, Ba)
AlSiN3:Eu；
(2) rouge and powder of 630nm and silica gel are stirred in beaker using blender, forms mixture, time 20min, speed
600rpm/min；
(3) after stirring, mixture is put into progress deaeration processing, vacuum degree -0.1MPa, time in vacuum oven
20min；
(4) it selects polytetrafluoroethylene film as substrate, selects Emission Spectrum Peals for the rouge and powder and silicon of 630nm on its surface
The mixture printing first layer of glue single layer one-color fluorescence film to be solidified, halftone mesh number is 120 mesh；
(5) single fluorescent film to be solidified in step (4) is placed in high temperature oven, carries out precuring processing, it is solid to form half
Change fluorescence membrane, 80 DEG C of temperature, time 30min；
(6) the semi-solid preparation fluorescence membrane in step (5) is taken out as base, selects Emission Spectrum Peals for 530nm on its surface
Green powder and silica-gel mixture printing second layer single layer one-color fluorescence film to be solidified, the step of repeating (4)-(6), until 3
Kind one-color fluorescence powder all finishes printing, and forms 3 layers of stack fluorescent film to be solidified；
(7) 3 layers of stack fluorescent film to be solidified are placed in baking oven and carry out curing process, 150 DEG C of temperature, time 1.5h, system
Standby stack fluorescent film, the thickness of three kinds of single layer one-color fluorescence films out are respectively blue-fluorescence film 0.1mm, and green fluorescence is thin
Film 0.15mm, red fluorescence film 0.15mm.
Embodiment 3
(1) it is respectively blue powder according to preset quality proportioning: silica gel=0.5:1, green powder: silica gel=0.3:1, bloom: silica gel=0.2:
1, rouge and powder: silica gel=0.25:1 weighs 4 kinds of one-color fluorescence powder and silica gel as raw material, be respectively Emission Spectrum Peals be 450nm
Blue powder and group become (Ba, Sr, Ca, Y, Na)10(PO4)6F2: Eu is the green powder of 530nm and group becomes (Ca, Sr, Ba)2SiO4: Eu is the bloom of 550nm and group becomes (Ca, Sr, Ba)4Si2O8: the rouge and powder of Eu and 630nm and group become (Ca, Sr,
Ba)AlSiN3:Eu；
(2) rouge and powder of 630nm and silica gel are stirred in beaker using blender, forms mixture, time 30min, speed
500rpm/min；
(3) after stirring, mixture is put into progress deaeration processing, vacuum degree -0.1MPa, time in vacuum oven
40min；
(4) it selects polytetrafluoroethylene film as substrate, selects Emission Spectrum Peals for the rouge and powder and silicon of 630nm on its surface
The mixture printing first layer of glue single layer one-color fluorescence film to be solidified, halftone mesh number is 800 mesh；
(5) single fluorescent film to be solidified in step (4) is placed in high temperature oven, carries out precuring processing, it is solid to form half
Change fluorescence membrane, 100 DEG C of temperature, time 30min；
(6) the semi-solid preparation fluorescence membrane in step (5) is taken out as base, selects Emission Spectrum Peals for 530nm on its surface
Green powder and silica-gel mixture printing second layer single layer one-color fluorescence film to be solidified, the step of repeating (4)-(6), until 4
Kind one-color fluorescence powder all finishes printing, and forms 3 layers of stack fluorescent film to be solidified；
(7) 3 layers of stack fluorescent film to be solidified are placed in baking oven and carry out curing process, 150 DEG C of temperature, time 1.5h, system
Standby stack fluorescent film, the thickness of four kinds of single layer one-color fluorescence films out are respectively blue-fluorescence film 0.3mm, and green fluorescence is thin
Film 0.45mm, yellow fluorescence film 0.34mm, red fluorescence film 0.45mm.
Claims (6)
1. a kind of stack fluorescent film, it is characterised in that: the stack fluorescent film is glimmering by i layers of certain thickness single layer monochrome
Rule stacks optical thin film in sequence, 3≤i≤6；The single layer one-color fluorescence film is existed by one-color fluorescence powder and silica gel
It is prepared under different quality proportion；
The one-color fluorescence powder be under the excitation of LED chip can Emission Spectrum Peals be respectively 440 ~ 480nm blue powder,
The green powder of 490 ~ 510nm, the green powder of 520 ~ 540nm, the bloom of 550 ~ 585nm, the orange powder of 590 ~ 610nm, 620 ~ 670nm it is red
Powder；
The blue powder group of the 440 ~ 480nm becomes (Ba, Sr, Ca, Y, Li)10(PO4)6Cl2: Eu, Mn, Ce or (Ba, Sr,
Ca,Na,Li)10(PO4)6O2: Eu or (Ba, Sr, Ca, Yb, Y)10(PO4)6Cl2: Eu, Mn or (Ba, Sr, Ca, Y, Na)10
(PO4)6F2:Eu；
The sequence rule stacks upwards according to the direction that one-color fluorescence powder Emission Spectrum Peals reduce.
2. a kind of stack fluorescent film as described in claim 1, it is characterised in that: the emission spectrum peak of the LED chip
Value is 385 ~ 420nm.
3. a kind of stack fluorescent film as described in claim 1, it is characterised in that: the single layer one-color fluorescence film passes through
Silk-screen printing is prepared, and thickness range is 0.05 ~ 1.0mm.
4. a kind of stack fluorescent film as described in claim 1, it is characterised in that: the one-color fluorescence powder and silica gel quality
Proportion is the blue powder of 440 ~ 480nm: the green powder of molding silica gel=0.4:1 ~ 2:1,490 ~ 510nm: molding silica gel=0.25:1 ~
The green powder of 0.95:1,520 ~ 540nm: the bloom of molding silica gel=0.1:1 ~ 1:1,550 ~ 585nm: molding silica gel=0.05:1 ~ 1:
1, the orange powder of 590 ~ 610nm: the rouge and powder of molding silica gel=0.1:1 ~ 1:1,620 ~ 670nm: molding silica gel=0.1:1 ~ 0.8:1.
5. a kind of stack fluorescent film as described in claim 1, it is characterised in that: the green powder of the 490 ~ 510nm forms
For (Ca, Sr, Ba) Si2N2O2: the green powder group of Eu, 520 ~ 540nm become (Ca, Sr, Ba)2SiO4: Eu or (Ca, Sr, Ba)2Si2O5: Eu or (Ba, Ca, Y, Na)10(SiO4)2(PO4)4O2: the bloom group of Eu, 550 ~ 585nm become (Ca, Sr, Ba)4Si2O8: the orange powder group of Eu, 590 ~ 610nm become (Ca, Sr, Ba) SiO5: Eu or (Ba, Ca, Sr, Na)10(SiO4)2(PO4)4O2: Eu, Mn, 620 ~ 670nm rouge and powder group become (Ca, Sr, Ba) AlSiN3:Eu。
6. a kind of stack fluorescent film as described in claim 1, preparation method includes following implemented step:
(1) according to preset quality proportioning, i kind one-color fluorescence powder and silica gel are weighed as raw material, 3≤i≤6；
(2) i kind one-color fluorescence powder and silica gel are stirred in beaker using blender, forms mixture, time 5-30min, speed
Spend 300-1000rpm/min；
(3) after stirring, mixture is put into progress deaeration processing, vacuum degree -0.1MPa, time 10- in vacuum oven
40min；
(4) it selects polytetrafluoroethylene film or silicon wafer as substrate, selects one-color fluorescence powder Emission Spectrum Peals most on its surface
High mixture printing first layer single layer one-color fluorescence film to be solidified, halftone mesh number is 80-300 mesh；
(5) single fluorescent film to be solidified in step (4) is placed in high temperature oven, carries out precuring processing, it is solid to form half
Change fluorescence membrane, 80-100 DEG C of temperature, time 30-60min；
(6) the semi-solid preparation fluorescence membrane in step (5) is taken out, selection one-color fluorescence powder Emission Spectrum Peals second are high on its surface
Mixture the step of making printing second layer single layer one-color fluorescence film to be solidified, repeating (4)-(6), until i kind monochrome is glimmering
Light powder all finishes printing, and forms i layers of stack fluorescent film to be solidified；
(7) i layers of stack fluorescent film to be solidified are placed in baking oven and carry out curing process, 150-160 DEG C of temperature, time 1-
2h prepares stack fluorescent film.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110642642A (en) * | 2019-09-25 | 2020-01-03 | 中国计量大学 | Composite fluorescent film, preparation method thereof and application of laser display |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102428582A (en) * | 2009-05-15 | 2012-04-25 | 株式会社小糸制作所 | Light emitting module, method of producing light-emitting module, and lighting fixture unit |
| CN103337584A (en) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | White light LED and packaging method thereof |
| CN108538975A (en) * | 2018-05-15 | 2018-09-14 | 上海应用技术大学 | A kind of preparation method of LED fluorescence membranes |
-
2018
- 2018-11-14 CN CN201811350197.6A patent/CN109473535A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102428582A (en) * | 2009-05-15 | 2012-04-25 | 株式会社小糸制作所 | Light emitting module, method of producing light-emitting module, and lighting fixture unit |
| CN103337584A (en) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | White light LED and packaging method thereof |
| CN108538975A (en) * | 2018-05-15 | 2018-09-14 | 上海应用技术大学 | A kind of preparation method of LED fluorescence membranes |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110642642A (en) * | 2019-09-25 | 2020-01-03 | 中国计量大学 | Composite fluorescent film, preparation method thereof and application of laser display |
| CN110642642B (en) * | 2019-09-25 | 2021-07-06 | 中国计量大学 | Composite fluorescent film, preparation method thereof and application of laser display |
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