CN107808923A - A kind of preparation method of fluorescence membrane structure for LED - Google Patents
A kind of preparation method of fluorescence membrane structure for LED Download PDFInfo
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- CN107808923A CN107808923A CN201711050036.0A CN201711050036A CN107808923A CN 107808923 A CN107808923 A CN 107808923A CN 201711050036 A CN201711050036 A CN 201711050036A CN 107808923 A CN107808923 A CN 107808923A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Abstract
The present invention relates to a kind of preparation method of the fluorescence membrane structure for LED, it is to be well mixed one or more kinds of fluorescent material with adhesive, deaeration and vacuumizing solidifies on the carrier that rear multilayer repeats to be spin-coated on substrate, then a layer graphene or boron nitride are coated in the superiors of fluorescence membrane or middle any layer or the bottom, spin coating finishes solidify afterwards, the fluorescence membrane of one-time formed enhancing LED heat-sinking capabilities can be finally obtained, is encapsulated on one or more blue chip and can obtain white light LEDs.The present invention can solve in gluing process to reabsorb the problems such as photochromic uniformity difference in poor effect, fluorescent material backscattering blue light, LED heat-sinking capabilities, fluorescent material deposited phenomenon and packaging technology between different fluorescent material, simultaneously, potting process is also shortened, reduces production cost.
Description
Technical field
The present invention relates to a kind of preparation method of the fluorescence membrane structure for LED, it is possible to increase LED heat-sinking capabilities, category
In solid state lighting field.
Background technology
White light LEDs are as a kind of novel solid light source, the advantages that by its small volume, long lifespan, energy-conserving and environment-protective, specular removal
Attract wide attention, it is considered to be third generation lighting engineering, be widely used in large screen display, Landscape Lighting, street lighting,
The fields such as room lighting, traffic lights.
The method for packing of industrialization white light LEDs is blue chip and yellow fluorescent powder or green and red fluorescence powder at present
The combination of mixing, concrete technology weigh a certain proportion of glimmering for chip is fixed on support according to LED optical color parameter
Light powder and silica gel or epoxide-resin glue be sufficiently mixed uniformly after, be placed in vacuum degasing machine vacuumized with deaeration handle,
Then fluorescent glue mixture is placed in a packing element drop coating in chip surface, being finally placed in baking box makes it thoroughly solidify, and finally will
One or more LED combination together, connects circuit, that is, forms required LED.
But following problem be present in above LED encapsulation process：
1st, during dispensing, the concentration of fluorescent material is difficult to be consistent from beginning to end, and fluorescent material is blended in silica gel and kept
Have certain granularity, during dispensing, point packing element is placed vertically, though silica gel has certain viscosity, fluorescent material it is inevitable with
The passage of dispensing time slowly precipitates, and has just started that the concentration of fluorescent material during dispensing is larger, and in the backward, the concentration of fluorescent material can be got over
It is low, therefore cause the LED light colourity of different batches even same batch encapsulation not quite identical, last factory need to LED according to
Different optical color parameters are reclassified；
2nd, the dispensing uniformity on one single chip is also inconsistent, puts the fluorescent glue in packing element by gravity drop coating in chip list
Face, the fluorescent glue approximation water droplet of drop coating it is spherical, the shape of projection, i.e. thick middle are also necessarily presented after the solidification of natural levelling,
Surrounding is thin, therefore the LED light colourity finally encapsulated is also inconsistent, and middle partially yellow, surrounding is partially blue；
3rd, fluorescent material is heated light decay problem, and chip circumference is wrapped in because fluorescent material is blended in silica gel, and chip is when long
Between work after, substantial amounts of heat can be produced, and fluorescent glue is wrapped in chip, makes heat be difficult to scatter and disappear, temperature rise makes fluorescent material
Luminous efficiency reduce, while chip also can make service life reduction because temperature is too high, finally result in LED luminous efficiency and reduce,
Life-span is reduced.
Raised with LED power, the area of chip also can constantly increase, and three problems of the above also can increasingly dash forward
Go out, therefore in order to solve problem above, Chinese patent literature CN101847682A discloses a kind of " made using heavy powder craft
White light LED fluorescent powder film layer and preparation method thereof ", the fluorescent powder film layer thickness of preparation is uniform, and the LED light source brightness produced is equal
Even, high conversion efficiency, good reliability, but its preparation technology is more complicated, including carrier surface cleaning, distiller liquor are prepared, electrolysis
Liquid is prepared, settling suspension liquid is prepared, heavy powder, is come down in torrents, is dried, being calcined, checking, step of preparation process is more, and technique is more complicated.
The content of the invention
A kind of fluorescence membrane structure for LED of mesh offer of the present invention and preparation method thereof, the preparation method simple possible,
Can solve in gluing process to reabsorb between different fluorescent material effect, fluorescent material backscattering blue light, LED heat-sinking capabilities compared with
In difference, fluorescent material deposited phenomenon and packaging technology the problems such as photochromic uniformity difference, meanwhile, fluorescence membrane the superiors or
Either middle a certain layer coats the boron nitride or graphene of one layer of one-dimentional structure to person's bottom, improves dissipating for LED upper surfaces
Heat energy power, reduce fluorescent material by heat ageing and light decay, improve LED service life, also, the preparation method shortens envelope
Technical process is filled, reduces production cost.
The technical scheme is that：
A kind of preparation method of fluorescence membrane structure for LED, its raw material are mainly fluorescent material and adhesive, the system
Preparation Method is：One or more kinds of fluorescent material and adhesive are pressed 0.1~1:1 mass ratio is well mixed to obtain mixture, will
Said mixture deaeration and after vacuumizing, with spin coating method, multilayer repeats to be spin-coated on the carrier on substrate, every layer of spin coating
Afterwards, fluorescence membrane is placed in curing oven together with substrate, 70~90 DEG C of 10~15min of baking, then 120~160 DEG C of bakings 10~
15min, micro- solid state is formed, after spin coating, be placed in baking oven and thoroughly solidify, 70~90 DEG C of 20~40min of baking, then 120
~160 DEG C of 20~40min of baking, finally obtain fluorescence membrane of the thickness in 0.1 ± 0.02mm~1mm ± 0.02mm.
Preferably, the stone of at least one layer of one-dimentional structure is coated in the superiors of fluorescence membrane or middle any layer or the bottom
Black alkene or boron nitride, the wherein graphene of one-dimentional structure either boron nitride coated in fluorescence membrane upper and lower surface or in
Between a certain layer, the thickness of graphene or boron nitride coating is 6~15 μm, carries out micro- solidification afterwards.Coating method can use
The various ways such as spin coating, spraying, printing.
The fluorescence membrane that the present invention is prepared is one-time formed.
In a preferred embodiment, above-mentioned preparation method can include step in detail below：
(1) mixed proportion of suitable fluorescent material and adhesive is selected as needed, weighs fluorescent material and adhesive respectively,
It is placed in being sufficiently mixed uniformly with glass bar in glue cup, forms fluorescent material binder combination；The mixing of fluorescent material and adhesive
Ratio selection needs to consider that parameter during encapsulation LED in terms of the specific encapsulation such as specific colour temperature, colour rendering index, light efficiency will
Ask, it is necessary to according to specific parameter regulation, carry out selecting a certain suitable proportioning or change proportioning；
(2) thing mixed above is placed in vacuum degasing machine selects suitable program to take off it according to the quality of mixture
Bubble, vacuumize process 5~10 minutes；The selection of the suitable program has with fluorescent glue mixture with the gross weight with glue cup
Close, also inclined heated plate is relevant in addition.The deaeration machine of every kind of model has corresponding program, while also has a guarantor in deaeration machine
Maintain an equal level the element for needing to adjust manually of weighing apparatus (because rotate at a high speed), it is only necessary to adjusts the quality of this element and fluorescent glue and matches somebody with somebody
Glue cup quality is about the same；The glue matched somebody with somebody in addition is more, and inclined heated plate just sets more, and the glue matched somebody with somebody is few, corresponding deaeration
Time is shorter；
(3) carrier material is pasted on substrate, substrate is placed on the pallet of sol evenning machine, sets the rotation in each stage
Time, rotary speed, acceleration program, mixture are placed in feeding cylinder, startup program, and fluorescent glue mixture is just spin-coated on base
On plate；
(4) after first layer spin coating, fluorescence membrane is placed in the micro- solidification of baking box together with carrier material and substrate, first 80
Toasted 20 minutes at DEG C, then be transferred to 150 DEG C and toast 10 minutes, that is, form the fluorescence membrane of micro- solidification；
(5) multiple spin coating is distinguished on first layer, each of which layer film contains a kind of fluorescent material or a variety of fluorescence
Powder, it can be specifically adjusted according to the thickness of required film, optical color parameter etc.；After each layer of spin coating, it is both needed in baking box
Micro- solidification, solidification temperature be 80 DEG C 20 minutes, then 150 DEG C 10 minutes；
(6) after whole spin coatings, thoroughly solidified, the fluorescence membrane of multilayer is placed in into 80 DEG C of baking box solidifies 20 points
Clock, then be transferred to 150 DEG C and solidify 20~40 minutes.
It is preferred that described adhesive is a kind of or several in silica gel, epoxy resin, silicone material, acrylic resin
Kind, it is well mixed according to appropriate ratio.
It is preferred that described fluorescent material is YAG bases, aluminate-base, the one or more of nitride base fluorescent powder, and root
The factually suitable proportioning of optical color parameter selection needed for the LED of border.
It is preferred that either boron nitride is solid-state or the liquid being dispersed in suitable solvent to the graphene of described one-dimentional structure
Any states such as state, may be selected the either type such as spraying, spin coating, printing be coated in fluorescence membrane the bottom or the superiors or
A certain layer among person.
It is preferred that described substrate is glass, silica glass, one kind of plastics, thickness is between 0.1~1cm, surface
Flat smooth, it is resistant to deform under 150 DEG C of high temperature above and high temperature.
It is preferred that described carrier is PET, PVC, PVE, carbonic ester, polyethylene, polyacrylic one kind, thickness 0.1~
Between 2mm, and surfacing is smooth, is resistant to 150 DEG C of high temperature above, and will not decompose, deform.
Sol evenning machine used in described preparation method includes vacuum tray, vavuum pump, feeding cylinder, spin coating chamber, chain of command
Plate etc..
Resulting fluorescence membrane completely can be taken off from carrier, can be bonded in the first layer spin coating last layer of carrier
Agent or the mixture of fluorescent material and adhesive, thoroughly solidification, spin coating afterwards can the spin coatings on the basis of first layer, you can complete
The whole fluorescence membrane for taking monoblock off.
Beneficial effects of the present invention are as follows：
The preparation method of the fluorescence membrane structure for LED of the present invention is simple, and the thickness of film, shape, size etc. are just
In control, film is controlled to adjust according to specific required optical color parameter etc., problem present in dispensing method is solved, subtracts
Packaging technology flow is lacked, there is certain application value.
Brief description of the drawings
Fig. 1 is the photoluminescence spectra figure of fluorescence membrane made from the embodiment of the present invention 1；
Fig. 2 is the EL spectrograms that fluorescence membrane made from the embodiment of the present invention 1 is tested.
Embodiment
The inventors discovered that the mode for fluorescent material and silica gel being made film is taken to be beneficial to solve LED encapsulation process
Gluing process present in three subject matters, while preferably in fluorescence membrane increase one-dimentional structure boron nitride or stone
Black alkene layer will be helpful to strengthen the heat-sinking capability of fluorescence membrane, be to solve three subject matters in existing LED encapsulation process
Effective ways.
Chinese patent literature CN 104830341A be " a kind of rare earth ion doped yttrium fluoride green upconverting fluorescent material
Preparation method " and a kind of Chinese patent literature CN 104830344A " Er3+, Yb3+It is co-doped with YOF red upconverting fluorescent materials
Preparation method ", although having used spin coating method, object used in its spin coating method is up-conversion fluorescence material
Material, and the applicable object of the preparation method of the present invention is white light LEDs fluorescence membrane, belongs to different from above-mentioned two patent documents
Luminescent material, application field also differs.Specifically, up-conversion luminescent material is anti-Stokes luminescence (Anti-
Stokes), and the present invention fluorescence membrane luminescent material be that Stokes lights, and in above-mentioned patent document upper conversion hair
Luminescent material cannot be used for LED, can not realize white light LEDs, therefore above-mentioned patent document is to belong to different from the present invention
Field.
Because the material of the invention being directed to from above-mentioned patent document preparation method is different, therefore specific preparation method step,
Used raw material, specific technological parameter etc. differ.Also, from the point of view of relatively, the present invention prepares fluorescence membrane
Technique it is relatively simple, the fluorescence membrane being prepared not only possesses the good optical property of LED light transition material, has simultaneously
Standby heat-sinking capability, enhances the heat-sinking capability on LED light source surface, reduces light decay and the aging of fluorescent material, improve fluorescent material
Luminous efficiency and service life, finally improve LED service life.
The present invention is further illustrated with reference to embodiments.Implementation below is only used for explaining the present invention, but is not used in
Limit protection scope of the present invention.
Embodiment 1.
A, B silica gel, YAG (Y are weighed respectively3Al5O12：Ce) fluorescent material 5g, 5g, 1.5g, i.e., proportioning is A：B：YAG=1:1:
0.3, it is sufficiently mixed uniformly, after mixing fluorescent glue is carried out into deaeration vacuumize process, is placed in feeding cylinder, is spin-coated on and is placed in glass
In PET film on glass substrate, the acceleration of wherein sol evenning machine first stage is：340rpm/s, second stage constant velocity stage's speed
For：420rpm/s, phase III are stop phase, and velocity and acceleration is 0rpm/s, spin-coating time 160s.Drying afterwards
80 DEG C of solidification 20min in case, then 150 DEG C of solidification 10min.On the basis of first layer, according to said ratio and method spin coating again
One layer.Third layer is boron nitride layer, and before coating first by boron nitride ultrasonic vibration 30 minutes, boron nitride is dispersed in isopropanol
In, concentration 2mg/ml, each 5g of A, B silica gel, the isopropanol dispersion liquid of boron nitride are weighed respectively) 2.5ml, it is sufficiently mixed uniformly
Afterwards, be placed in vacuum degasing machine vacuumized with deaeration handle, be placed in feeding cylinder and be spin-coated on above-mentioned fluorescence membrane afterwards, most
After be placed in baking box, 80 DEG C solidify 20 minutes, and 150 DEG C solidify 30 minutes, and it is thin for the fluorescence of boron nitride layer that the superiors are finally made
Film.
Embodiment 2.
A, B silica gel, YAG (Y are weighed respectively3Al5O12：Ce) fluorescent material 5g, 5g, 1.5g, i.e., proportioning is A：B：YAG=1:1:
0.3, it is sufficiently mixed uniformly, after mixing fluorescent glue is carried out into deaeration vacuumize process, is placed in feeding cylinder, is spin-coated on and is placed in glass
In PET film on glass substrate, the acceleration of wherein sol evenning machine first stage is：340rpm/s, second stage constant velocity stage's speed
For：420rpm/s, phase III are stop phase, and velocity and acceleration is 0rpm/s, spin-coating time 160s.Drying afterwards
80 DEG C of solidification 20min in case, then 150 DEG C of solidification 10min.The second layer is boron nitride layer, before the use first by boron nitride ultrasound
Concussion 30 minutes, boron nitride is dispersed in isopropanol, concentration 2mg/ml, weighs each 5g of A, B silica gel, the isopropyl of boron nitride respectively
Alcohol dispersion liquid 2.5ml, be sufficiently mixed uniformly after, be placed in vacuum degasing machine vacuumized with deaeration handle, be placed in charging afterwards
It is spin-coated in cylinder on above-mentioned fluorescence membrane, is placed in baking box, 80 DEG C solidifies 20 minutes, and 150 DEG C solidify 10 minutes, and third layer is according to the
The ratio and method spin coating phosphor powder layer of one layer of spin coating, baking box is finally placed in, 80 DEG C solidify 20 minutes, and 150 DEG C solidify 30 minutes,
It can be prepared by the fluorescence membrane that middle one layer is boron nitride layer.
PL (PhotoluminescenceSpectroscopy, luminescence generated by light) spectrum of fluorescence membrane made from embodiment 1
Figure such as Fig. 1.It can be seen that by Fig. 1 spectrogram：
1st, the emission peak of fluorescence membrane is consistent with phosphor emission peak wavelength in 550nm or so, illustrates to coat boron nitride
Afterwards, the luminous situation of fluorescence membrane is not influenceed, maintains the characteristics of luminescence of fluorescent material；
2nd, Fig. 1 emission spectrum is very wide, can match to form white light with blue chip, at the same broad band can meet it is a variety of
The chip of different wave length.
Fluorescence membrane made from embodiment 1 is encapsulated into blue light LED light source, obtains white light LEDs, the colour temperature of white light LEDs
It is (0.3818,0.4181) for 4227K, light efficiency 98.6lm/W, colour rendering index 69.5, chromaticity coordinates.
EL (electroluminescent) spectrogram such as Fig. 2 that fluorescence membrane made from embodiment 1 is tested.Have two in Fig. 2 EL spectrograms
Individual peak, wherein 460nm or so are that blue light, 550nm or so is gold-tinted, and it is white that blue chip excites yellow fluorescence film to send
Light, the peak of blue light is high as the peak of gold-tinted, illustrates that fluorescence membrane can be good at absorption blue light and be converted into white light, in addition blue light
Can be good at passing through fluorescence membrane, fluorescence membrane will not block blue light, so as to which the fluorescence membrane prepared can meet to encapsulate white light
LED demand, and optical color parameter is also relatively good.
White light LEDs are carried out to light aging for a long time, after lighting one week, contrast the fluorescence membrane of uncoated boron nitride layer with
The surface temperature of the fluorescence membrane of surface coating BN layers, the surface temperature for finding not add BN fluorescence membrane sample is 97~110
Between DEG C, and between the fluorescence membrane surface temperature coated with BN layers is 85~95 DEG C, the results showed that, painting is covered with after BN layers,
Can significantly reduce the surface temperature of fluorescence membrane, the heat-sinking capability on enhancing fluorescence membrane surface, reduce fluorescence membrane by
Heat ageing degree, improve fluorescence membrane service life.
Under the teaching of the present invention and above-described embodiment, those skilled in the art are easy to it is envisioned that cited by the present invention
Or each raw material enumerated or its equivalent alterations, each processing method or its equivalent alterations can realize the present invention, and each original
The parameter bound value of material and processing method, interval value can realize the present invention, embodiment numerous to list herein.
Claims (10)
1. the preparation method of a kind of fluorescence membrane structure for LED, it is characterised in that its raw material is mainly fluorescent material and bonding
Agent, the preparation method are：One or more kinds of fluorescent material and adhesive are pressed 0.1~1:1 mass ratio is well mixed to be obtained
Mixture, after said mixture deaeration and vacuumizing, with spin coating method, multilayer repeats to be spin-coated on the carrier on substrate,
After every layer of spin coating, fluorescence membrane is placed in curing oven together with substrate, 70~90 DEG C are toasted 10~15min minutes, then 120~
160 DEG C of baking 10~15min minutes, micro- solid state is formed, after all layer spin coatings, baking oven is placed in and thoroughly solidifies, 70
~90 DEG C of 20~40min of baking, then 120~160 DEG C of 20~40min of baking, finally obtain thickness in 0.1 ± 0.02mm~1mm
± 0.02mm fluorescence membrane.
2. it is used for the preparation method of LED fluorescence membrane structure as claimed in claim 1, it is characterised in that：In fluorescence membrane
The superiors or middle any layer or the bottom coat the graphene or boron nitride of at least one layer of one-dimentional structure, wherein one-dimensional knot
The graphene of structure either upper and lower surface or middle a certain layer, graphene or boron nitride of the boron nitride coated in fluorescence membrane
The thickness of coating is 6~15 μm, carries out micro- solidification afterwards.
3. it is used for the preparation method of LED fluorescence membrane structure as claimed in claim 1, it is characterised in that specific to prepare
Method comprises the following steps：
(1) mixed proportion of suitable fluorescent material and adhesive is selected as needed, is weighed fluorescent material and adhesive respectively, is placed in
With being sufficiently mixed uniformly with glass bar in glue cup, fluorescent material binder combination is formed；
(2) thing mixed above is placed in vacuum degasing machine and selects suitable program to its deaeration according to the quality of mixture, takes out
Application of vacuum 5~10 minutes；
(3) carrier material is pasted on substrate, substrate is placed on the pallet of sol evenning machine, when setting the rotation in each stage
Between, rotary speed, acceleration program, mixture is placed in feeding cylinder, startup program, fluorescent glue mixture is just spin-coated on substrate
On；
(4) after first layer spin coating, fluorescence membrane is placed in the micro- solidification of baking box together with carrier material and substrate, first at 80 DEG C
Baking 20 minutes, then be transferred to 150 DEG C and toast 10 minutes, that is, form the fluorescence membrane of micro- solidification；
(5) multiple spin coating is distinguished on first layer, each of which layer film contains a kind of fluorescent material or a variety of fluorescent material, has
Body can be adjusted according to the thickness of required film, optical color parameter etc.；After each layer of spin coating, it is both needed to micro- solid in baking box
Change, solidification temperature be 80 DEG C 20 minutes, then 150 DEG C 10 minutes；
(6) after whole spin coatings, thoroughly being solidified, the fluorescence membrane of multilayer is placed in into 80 DEG C of baking box solidifies 20 minutes, then
150 DEG C are transferred to solidify 20~40 minutes.
4. it is used for the preparation method of LED fluorescence membrane structure as claimed in claim 3, it is characterised in that the step (6)
Also include before：
The boron nitride or graphene of one-dimentional structure are covered with the bottom of film, the superiors or middle any one layer of painting.
5. it is used for the preparation method of LED fluorescence membrane structure as claimed in claim 1, it is characterised in that described bonding
One or several kinds of the agent in silica gel, epoxy resin, silicone material, acrylic resin.
6. it is used for the preparation method of LED fluorescence membrane structure as claimed in claim 1, it is characterised in that described fluorescence
Powder is selected from YAG bases, aluminate-base, the one or more of nitride base fluorescent powder, and optical color parameter selects according to needed for actual LED
Select suitable proportioning.
7. it is used for the preparation method of LED fluorescence membrane structure as claimed in claim 1, it is characterised in that described graphite
Either boron nitride is solid-state or the liquid being dispersed in suitable solvent to alkene.
8. it is used for the preparation method of LED fluorescence membrane structure as claimed in claim 1, it is characterised in that described substrate
Selected from glass, silica glass, plastics one kind, for thickness between 0.1~1cm, surfacing is smooth, be resistant to more than 150 DEG C
It will not be deformed under high temperature and high temperature.
9. it is used for the preparation method of LED fluorescence membrane structure as claimed in claim 1, it is characterised in that described carrier
Selected from PET, PVC, PVE, carbonic ester, polyethylene, polyacrylic one kind, thickness is between 0.1~2mm, and surfacing is smooth,
150 DEG C of high temperature above are resistant to, and will not decompose, deform.
10. a kind of fluorescence membrane structure for LED, it is characterised in that the fluorescence membrane structure is used in claim 1-9
Any described preparation method is prepared.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538975A (en) * | 2018-05-15 | 2018-09-14 | 上海应用技术大学 | A kind of preparation method of LED fluorescence membranes |
| CN113583275A (en) * | 2021-08-27 | 2021-11-02 | 辽宁大学 | High-heat-dissipation carbon quantum dot fluorescent composite film and preparation method thereof |
| CN113823727A (en) * | 2021-09-22 | 2021-12-21 | 烟台布莱特光电材料有限公司 | Fluorescent powder film with high moisture-proof characteristic and application thereof |
| CN115505331A (en) * | 2022-08-29 | 2022-12-23 | 重庆翰博显示科技研发中心有限公司 | Preparation method and device of fluorescent film with high luminescence contrast |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110756A (en) * | 2009-12-23 | 2011-06-29 | 海洋王照明科技股份有限公司 | White light LED (light-emitting diode) and packaging method thereof |
| CN102437255A (en) * | 2011-11-25 | 2012-05-02 | 上海祥羚光电科技发展有限公司 | Fluorescent chip for white light LED (light-emitting diode) prepared by spinning coating process |
| CN103280516A (en) * | 2013-05-15 | 2013-09-04 | 陕西煤业化工技术研究院有限责任公司 | Light-emitting diode packaging material and packaging forming method |
| JP2014130871A (en) * | 2012-12-28 | 2014-07-10 | Konica Minolta Inc | Light emitting device |
| CN203979961U (en) * | 2014-07-16 | 2014-12-03 | 惠州市隆和光电有限公司 | The great power LED of the high light efficiency low light attenuation of a kind of high heat radiation |
| CN204717394U (en) * | 2014-11-20 | 2015-10-21 | 史利利 | Led module |
| CN106653980A (en) * | 2017-01-17 | 2017-05-10 | 大连德豪光电科技有限公司 | Method for preparing white-light LED package device with high color rendering index |
-
2017
- 2017-10-31 CN CN201711050036.0A patent/CN107808923B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110756A (en) * | 2009-12-23 | 2011-06-29 | 海洋王照明科技股份有限公司 | White light LED (light-emitting diode) and packaging method thereof |
| CN102437255A (en) * | 2011-11-25 | 2012-05-02 | 上海祥羚光电科技发展有限公司 | Fluorescent chip for white light LED (light-emitting diode) prepared by spinning coating process |
| JP2014130871A (en) * | 2012-12-28 | 2014-07-10 | Konica Minolta Inc | Light emitting device |
| CN103280516A (en) * | 2013-05-15 | 2013-09-04 | 陕西煤业化工技术研究院有限责任公司 | Light-emitting diode packaging material and packaging forming method |
| CN203979961U (en) * | 2014-07-16 | 2014-12-03 | 惠州市隆和光电有限公司 | The great power LED of the high light efficiency low light attenuation of a kind of high heat radiation |
| CN204717394U (en) * | 2014-11-20 | 2015-10-21 | 史利利 | Led module |
| CN106653980A (en) * | 2017-01-17 | 2017-05-10 | 大连德豪光电科技有限公司 | Method for preparing white-light LED package device with high color rendering index |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538975A (en) * | 2018-05-15 | 2018-09-14 | 上海应用技术大学 | A kind of preparation method of LED fluorescence membranes |
| CN113583275A (en) * | 2021-08-27 | 2021-11-02 | 辽宁大学 | High-heat-dissipation carbon quantum dot fluorescent composite film and preparation method thereof |
| CN113823727A (en) * | 2021-09-22 | 2021-12-21 | 烟台布莱特光电材料有限公司 | Fluorescent powder film with high moisture-proof characteristic and application thereof |
| CN115505331A (en) * | 2022-08-29 | 2022-12-23 | 重庆翰博显示科技研发中心有限公司 | Preparation method and device of fluorescent film with high luminescence contrast |
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