CN204717394U - Led module - Google Patents
Led module Download PDFInfo
- Publication number
- CN204717394U CN204717394U CN201490000314.5U CN201490000314U CN204717394U CN 204717394 U CN204717394 U CN 204717394U CN 201490000314 U CN201490000314 U CN 201490000314U CN 204717394 U CN204717394 U CN 204717394U
- Authority
- CN
- China
- Prior art keywords
- led chip
- led module
- substrate
- adhesive layer
- fluorescent adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000010410 layer Substances 0.000 claims abstract description 33
- 239000012790 adhesive layer Substances 0.000 claims abstract description 28
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract description 6
- 230000031700 light absorption Effects 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
This application discloses a kind of LED module, comprise: substrate, the LED chip be arranged on described substrate, and the first fluorescent adhesive layer covered above described LED chip, described LED module also comprises: cover and on described substrate, to be positioned at described LED chip one side and to fit with the thermally conductive insulating layer of dispelling the heat, the second fluorescent adhesive layer be arranged in described thermally conductive insulating layer with described LED chip, and cover the reflecting layer being positioned at described substrate side in described second fluorescent adhesive layer.Like this, heat that LED chip produces is distributed by thermally conductive insulating layer, reduces its heat radiation thermal resistance, improves radiating efficiency, avoids the problem occurring larger light decay and look drift, improves the quality of LED module; In addition, due to the effect in the second fluorescent adhesive layer and reflecting layer, LED chip can be inspired fluorescence to the light absorption of orientation substrate, cause Integral luminous effect to promote further.
Description
Technical field
The application relates to light emitting diode field, particularly relates to a kind of LED module.
Background technology
Light emitting diode (Light Emitting Diode, LED) is widely used in field of backlights, has subversiveness advantage, become the main backlight of LCD TV in color reducibility, life-span and response speed etc.At present, LED module profile is rectangle.LED module is adopting surface mounted LED, connector is mounted on circuit board (Printed Circuit Board, PCB) plate forms, pcb board has FR-4, CEM-3 and aluminium base etc. are dissimilar, the profile of LED also has different packing forms, existing LED module comprises pcb board, be arranged at the adopting surface mounted LED that pcb board is connected electrically, concrete, adopting surface mounted LED realizes being electrically connected with PCB plate by the mode of tin cream backflow attachment LED, in order to meet the requirement of backlight screen brightness, adopting surface mounted LED generally adopts great power LED, at least there is following problem in existing this LED module: owing to being directly be welded on pcb board by adopting surface mounted LED, when doing, the heat that adopting surface mounted LED produces need be delivered to pcb board by LED support, then reach on the radiator of pcb board setting, cause radiating effect poor, heat radiation thermal resistance is large, easy generation light decay and look drift problem, thus affect the quality of LCD TV image.
Summary of the invention
The application is intended to one of solve the problems of the technologies described above at least to a certain extent.
The application provides a kind of LED module, comprise: substrate, the LED chip be arranged on described substrate, and the first fluorescent adhesive layer covered above described LED chip, described LED module also comprises: cover and on described substrate, to be positioned at described LED chip one side and to fit with the thermally conductive insulating layer of dispelling the heat, the second fluorescent adhesive layer be arranged in described thermally conductive insulating layer with described LED chip, and cover the reflecting layer being positioned at described substrate side in described second fluorescent adhesive layer.
Further, described reflecting layer is the reflector be sticked with described second fluorescent adhesive layer or the reflectorized material be coated on described second fluorescent adhesive layer.
Further, the outside of described first fluorescent adhesive layer is also provided with substratum transparent.
Further, described thermally conductive insulating layer adopts Graphene, aluminium oxide heat conductive rubber or boron nitride heat conductive rubber material.
Further, described substrate is provided with the plated through-hole be communicated with described LED chip, described LED chip is electrically connected with described plated through-hole by pin.
Further, described thermally conductive insulating layer has the through hole passed for described pin.
Further, the described LED chip opposite side that is positioned at of described substrate is provided with radiator.
Further, described thermally conductive insulating layer is provided with the extension connected with described radiator.
Further, described substrate offers the thermal hole passed for described extension.
Further, described substrate is ceramic substrate or copper-clad base plate.
Further, described LED chip is blue-light LED chip.
The beneficial effect of the application is:
By providing a kind of LED module, comprise: substrate, the LED chip be arranged on described substrate, and the first fluorescent adhesive layer covered above described LED chip, described LED module also comprises: cover and on described substrate, to be positioned at described LED chip one side and to fit with the thermally conductive insulating layer of dispelling the heat, the second fluorescent adhesive layer be arranged in described thermally conductive insulating layer with described LED chip, and cover the reflecting layer being positioned at described substrate side in described second fluorescent adhesive layer.Like this, heat that LED chip produces is distributed by thermally conductive insulating layer, reduces its heat radiation thermal resistance, improves radiating efficiency, avoids the problem occurring larger light decay and look drift, improves the quality of LED module; In addition, due to the effect in the second fluorescent adhesive layer and reflecting layer, LED chip can be inspired fluorescence to the light absorption of orientation substrate, cause Integral luminous effect to promote further.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED module of the embodiment of the present application.
Detailed description of the invention
Be described below in detail the embodiment of the application, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the application, and the restriction to the application can not be interpreted as.
In the description of the application, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the application and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore the restriction to the application can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In the description of the application, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is less than second feature.
By reference to the accompanying drawings the application is described in further detail below by detailed description of the invention.
Please refer to Fig. 1, present embodiments provide a kind of LED module, can be applicable to LED display or lighting field, concrete accessible site relevant device, as LED display, LED signal lamp or LEDbulb lamp etc.
Above-mentioned LED module mainly comprises: substrate 1, the LED chip 2 be arranged on substrate 1, and the first fluorescent adhesive layer 3 covered above LED chip 2, LED module also comprises: cover and on substrate 1, to be positioned at LED chip 2 one side and to fit the thermally conductive insulating layer 4 of dispelling the heat, the second fluorescent adhesive layer 5 be arranged in thermally conductive insulating layer 4 with LED chip 2, and cover the reflecting layer 6 being positioned at substrate 1 side in the second fluorescent adhesive layer 5.
Like this, heat that LED chip produces is distributed by thermally conductive insulating layer, reduces its heat radiation thermal resistance, improves radiating efficiency, avoids the problem occurring larger light decay and look drift, improves the quality of LED module; In addition, due to the effect in the second fluorescent adhesive layer and reflecting layer, LED chip can be inspired fluorescence to the light absorption of orientation substrate, cause Integral luminous effect to promote further.
As another kind of embodiment, for improving light-out effect, the outside of the first fluorescent adhesive layer 3 is also provided with substratum transparent.First fluorescent adhesive layer and substratum transparent all can adopt silica gel as colloid bed material.
When embody rule, reflecting layer 6 is the reflector be sticked with the second fluorescent adhesive layer 5 or the reflectorized material be coated on the second fluorescent adhesive layer 5, and reflector can be aluminium sheet or other metallic plates, and certain vibrational power flow need be adopted like this to ensure relative insulating properties.Thermally conductive insulating layer 4 can adopt the materials such as Graphene, aluminium oxide heat conductive rubber or boron nitride heat conductive rubber.
For ensureing the heat radiation of LED module, as a kind of preferred embodiment, substrate 1 is provided with the plated through-hole 11 be communicated with LED chip 2, LED chip 2 is electrically connected with plated through-hole 11 by pin 21.And thermally conductive insulating layer 4 has the through hole 41 passed for pin 21.
For ensureing the heat radiation of LED module, as another kind of preferred embodiment, LED chip 2 opposite side that is positioned at of substrate 1 is provided with radiator 7.Thermally conductive insulating layer 4 is provided with the extension connected with radiator.Correspondingly, substrate 1 offers the thermal hole passed for extension.
Generally, substrate 1 can be ceramic substrate or copper-clad base plate etc.And LED chip 2 can be blue-light LED chip or red LED chip etc.
In the description of this description, at least one embodiment that specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained in the application or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above content is the further description done the application in conjunction with concrete embodiment, can not assert that the concrete enforcement of the application is confined to these explanations.For the application person of an ordinary skill in the technical field, under the prerequisite not departing from the application's design, some simple deduction or replace can also be made.
Claims (10)
1. a LED module, comprise: substrate, the LED chip be arranged on described substrate, and the first fluorescent adhesive layer covered above described LED chip, it is characterized in that, described LED module also comprises: cover and on described substrate, to be positioned at described LED chip one side and to fit with the thermally conductive insulating layer of dispelling the heat, the second fluorescent adhesive layer be arranged in described thermally conductive insulating layer with described LED chip, and cover the reflecting layer being positioned at described substrate side in described second fluorescent adhesive layer.
2. LED module as claimed in claim 1, it is characterized in that, described reflecting layer is the reflector be sticked with described second fluorescent adhesive layer or the reflectorized material be coated on described second fluorescent adhesive layer.
3. LED module as claimed in claim 1, it is characterized in that, the outside of described first fluorescent adhesive layer is also provided with substratum transparent.
4. LED module as claimed in claim 1, is characterized in that, described thermally conductive insulating layer adopts Graphene, aluminium oxide heat conductive rubber or boron nitride heat conductive rubber material.
5. LED module as claimed in claim 1, it is characterized in that, described substrate is provided with the plated through-hole be communicated with described LED chip, described LED chip is electrically connected with described plated through-hole by pin.
6. LED module as claimed in claim 5, is characterized in that, described thermally conductive insulating layer has the through hole passed for described pin.
7. LED module as claimed in claim 1, it is characterized in that, the described LED chip opposite side that is positioned at of described substrate is provided with radiator.
8. LED module as claimed in claim 7, it is characterized in that, described thermally conductive insulating layer is provided with the extension connected with described radiator.
9. LED module as claimed in claim 8, is characterized in that, described substrate offers the thermal hole passed for described extension.
10. LED module as claimed in any one of claims 1-9 wherein, it is characterized in that, described substrate is ceramic substrate or copper-clad base plate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/091723 WO2016078049A1 (en) | 2014-11-20 | 2014-11-20 | Led module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204717394U true CN204717394U (en) | 2015-10-21 |
Family
ID=54316395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000314.5U Expired - Fee Related CN204717394U (en) | 2014-11-20 | 2014-11-20 | Led module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN204717394U (en) |
| WO (1) | WO2016078049A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105375669A (en) * | 2015-12-07 | 2016-03-02 | 天津博威动力设备有限公司 | Generator housing material facilitating heat dissipation |
| CN107808923A (en) * | 2017-10-31 | 2018-03-16 | 上海应用技术大学 | A kind of preparation method of fluorescence membrane structure for LED |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201302063Y (en) * | 2008-12-05 | 2009-09-02 | 上海芯光科技有限公司 | Seamless splicing type semiconductor planar light source module |
| CN101614333A (en) * | 2009-03-23 | 2009-12-30 | 广州南科集成电子有限公司 | High-efficiency radiating LED illumination light source and manufacture method |
| US8541802B2 (en) * | 2012-01-31 | 2013-09-24 | Bridgelux, Inc. | Phosphor placement in white light emitting diode assemblies |
| JP2014007204A (en) * | 2012-06-21 | 2014-01-16 | Panasonic Corp | Led module |
-
2014
- 2014-11-20 CN CN201490000314.5U patent/CN204717394U/en not_active Expired - Fee Related
- 2014-11-20 WO PCT/CN2014/091723 patent/WO2016078049A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105375669A (en) * | 2015-12-07 | 2016-03-02 | 天津博威动力设备有限公司 | Generator housing material facilitating heat dissipation |
| CN107808923A (en) * | 2017-10-31 | 2018-03-16 | 上海应用技术大学 | A kind of preparation method of fluorescence membrane structure for LED |
| CN107808923B (en) * | 2017-10-31 | 2019-07-26 | 上海应用技术大学 | A kind of preparation method of the fluorescence membrane structure for LED |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016078049A1 (en) | 2016-05-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151021 Termination date: 20161120 |