CN204717395U - LED luminescence unit - Google Patents
LED luminescence unit Download PDFInfo
- Publication number
- CN204717395U CN204717395U CN201490000316.4U CN201490000316U CN204717395U CN 204717395 U CN204717395 U CN 204717395U CN 201490000316 U CN201490000316 U CN 201490000316U CN 204717395 U CN204717395 U CN 204717395U
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- Prior art keywords
- led chip
- accommodating cavity
- luminescence unit
- led
- pin
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Links
- 238000004020 luminiscence type Methods 0.000 title claims abstract description 23
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 238000009877 rendering Methods 0.000 claims abstract description 6
- 230000000694 effects Effects 0.000 claims abstract description 4
- 239000013078 crystal Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 abstract description 3
- 238000001228 spectrum Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- CVOFKRWYWCSDMA-UHFFFAOYSA-N 2-chloro-n-(2,6-diethylphenyl)-n-(methoxymethyl)acetamide;2,6-dinitro-n,n-dipropyl-4-(trifluoromethyl)aniline Chemical compound CCC1=CC=CC(CC)=C1N(COC)C(=O)CCl.CCCN(CCC)C1=C([N+]([O-])=O)C=C(C(F)(F)F)C=C1[N+]([O-])=O CVOFKRWYWCSDMA-UHFFFAOYSA-N 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
This application discloses a kind of LED luminescence unit, comprise: the pedestal with accommodating cavity, described accommodating cavity side has opening, to be arranged at bottom described accommodating cavity and have first wave length with adjust colour temperature/colour rendering index the first LED chip, be arranged in described accommodating cavity and be positioned at transparent substrates above described first LED chip, be fixed on described transparent substrates and there is the second LED chip of second wave length, and to cover above described second LED chip and to send the fluorescent adhesive layer of white light with described second LED chip effect.Like this, by regulating the electric current of the first LED chip, the light component of the first LED chip can be increased in the spectrum of the former white light jointly inspired in the second LED chip and fluorescent adhesive layer, change colour temperature with the light energy of the first LED chip and aobviously to refer to, meeting the demand of people.
Description
Technical field
The application relates to light emitting diode field, particularly relates to a kind of LED luminescence unit.
Background technology
Along with the development of semiconductor illumination technique, LED(Light Emitting Diode, light emitting diode) be widely used in the fields such as panel computer, notebook computer, liquid crystal display, large-size liquid crystal television and indoor and outdoor lighting as backlight.Illumination LED common application is in fields such as bulb lamp, fluorescent lamp, flat lamps, and existing market client is easier to be lower with cost in order to apply, and wishes with aobvious, the colour temperature of single white light LEDs luminescence unit refers to that (colour rendering index is called for short and shows finger) is adjustable.
Current white light LEDs luminescence unit forms by being provided with the pedestal of accommodating cavity, fluorescent adhesive layer, crystal bonding area and electrode district.Bottom accommodating cavity, be provided with crystal bonding area, crystal bonding area is connected to electrode district.Blue-light LED chip is positioned over crystal bonding area, in accommodating cavity, be filled with fluorescent adhesive layer, and fluorescent adhesive layer is fluorescent material and packaging plastic combination, and fluorescent material can be single powder such as yellow fluorescent powder, also can be composition powder such as red fluorescence powder and green emitting phosphor etc.
After the energising of blue-ray LED chip, blue light-emitting excites yellow fluorescent powder or red green fluorescence powder, in accommodating cavity, form white light after mixed light.Obviously, the white light LEDs luminescence unit of this structure can not adjust colour temperature and aobviously to refer to, cannot meet the demand at present to adjustable color temperature and adjustable aobvious finger.
Summary of the invention
The application is intended to one of solve the problems of the technologies described above at least to a certain extent.
The application provides a kind of LED luminescence unit, comprise: the pedestal with accommodating cavity, described accommodating cavity side has opening, to be arranged at bottom described accommodating cavity and have first wave length with adjust colour temperature/colour rendering index the first LED chip, be arranged in described accommodating cavity and be positioned at transparent substrates above described first LED chip, be fixed on described transparent substrates and there is the second LED chip of second wave length, and to cover above described second LED chip and to send the fluorescent adhesive layer of white light with described second LED chip effect.
Further, described second LED chip and described first LED chip shift to install to opening direction bottom described accommodating cavity.
Further, described second LED chip and described first LED chip arrive opening direction just to setting bottom described accommodating cavity.
Further, described transparent substrates is transparency carrier.
Further, described transparent substrates is hollow out support.
Further, be provided with bottom described accommodating cavity: for arranging the first crystal bonding area of the first LED chip, and be electrically connected with described first LED chip and there is the first region of the first pin; Described transparent substrates is provided with: for arranging the second crystal bonding area of the second LED chip, and to be electrically connected with described second LED chip and there is the second electrode district of the second pin, described first pin and described second pin penetrate described pedestal and extend certain length from the lateral surface of described pedestal.
Further, the contour setting of the part of extending the lateral surface of described pedestal of described first pin and described second pin.
Further, the non-contour setting of the part of extending the lateral surface of described pedestal of described first pin and described second pin.
Further, described first crystal bonding area and described second crystal bonding area have heat radiation lead foot, and described heat radiation lead foot penetrates described pedestal and extends certain length from the lateral surface of described pedestal.
Further, described fluorescent adhesive layer adopts and excites peak value at the yellow fluorescent powder of 530-590nm; The blue-light LED chip of described second LED chip to be wavelength be 430-470nm; Described first LED chip is red LED chip.
The beneficial effect of the application is:
By providing a kind of LED luminescence unit, comprise: the pedestal with accommodating cavity, described accommodating cavity side has opening, to be arranged at bottom described accommodating cavity and have first wave length with adjust colour temperature/colour rendering index the first LED chip, be arranged in described accommodating cavity and be positioned at transparent substrates above described first LED chip, be fixed on described transparent substrates and there is the second LED chip of second wave length, and to cover above described second LED chip and to send the fluorescent adhesive layer of white light with described second LED chip effect.Like this, by regulating the electric current of the first LED chip, the light component of the first LED chip can be increased in the spectrum of the former white light jointly inspired in the second LED chip and fluorescent adhesive layer, change colour temperature with the light energy of the first LED chip and aobviously to refer to, meeting the demand of people.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED luminescence unit of the embodiment of the present application.
Fig. 2 is the generalized section of the LED luminescence unit of the embodiment of the present application.
Detailed description of the invention
Be described below in detail the embodiment of the application, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the application, and the restriction to the application can not be interpreted as.
In the description of the application, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the application and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore the restriction to the application can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In the description of the application, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is less than second feature.
By reference to the accompanying drawings the application is described in further detail below by detailed description of the invention.
Please refer to Fig. 1-2, present embodiments provide a kind of LED luminescence unit, can be used for the fields such as illumination or signal designation.
Above-mentioned LED luminescence unit mainly comprises: the pedestal 1 with accommodating cavity 11, accommodating cavity 11 side has opening 111, to be arranged at bottom accommodating cavity 11 and have first wave length with adjust colour temperature/colour rendering index the first LED chip 2, be arranged in accommodating cavity 11 and be positioned at transparent substrates 4 above the first LED chip 2, be fixed on transparent substrates and there is the second LED chip 5 of second wave length, and to cover above the second LED chip 5 and to act on the second LED chip 5 fluorescent adhesive layer 3 sending white light.
Like this, by regulating the electric current of the first LED chip, the light component of the first LED chip can be increased in the spectrum of the former white light jointly inspired in the second LED chip and fluorescent adhesive layer, change colour temperature with the light energy of the first LED chip and aobviously to refer to, meeting the demand of people.
In the present embodiment, the second LED chip 5 and the first LED chip 2 shift to install to opening 111 direction bottom accommodating cavity 11.In other embodiments, the second LED chip can with the first LED chip bottom accommodating cavity to opening direction just to arranging.
And transparent substrates 4 can be transparency carrier or hollow out support, to ensure that the luminous energy sent from the first LED chip 2 normally comes out effectively.
When embody rule, be provided with bottom accommodating cavity 11: for arranging the first crystal bonding area of the first LED chip 2, and be electrically connected with the first LED chip 2 and there is the first region of the first pin 112; And transparent substrates 4 is provided with: for arranging the second crystal bonding area of the second LED chip 5, and to be electrically connected with the second LED chip 5 and there is the second electrode district of the second pin 41, the first pin 112 and the second pin 41 penetrate pedestal 1 and extend certain length from the lateral surface of pedestal 1.In the present embodiment, the contour setting of the part of extending the lateral surface of pedestal of the first pin 112 and the second pin 41, like this can adaptive existing substrate, certainly, due to bottom transparent substrates 4 and accommodating cavity 11 not at grade, therefore, the first pin 112 or the second pin 41 need bending, could meet above-mentionedly contourly to arrange requirement.In other embodiments, the part of extending the lateral surface of pedestal 1 of the first pin 112 and the second pin 41 also can non-contour setting.For ensureing heat dispersion, the first crystal bonding area and described second crystal bonding area have heat radiation lead foot 100, and heat radiation lead foot 100 penetrates pedestal 1 and extends certain length from the lateral surface of pedestal 1.
General, fluorescent adhesive layer 3 can adopt the yellow fluorescent powder exciting peak value at 530-590nm, also can adopt the mixed powder of red fluorescence powder and green emitting phosphor; Second LED chip 2 can be the blue-light LED chip that wavelength is 430-470nm, and the first LED chip 5 can be red LED chip.
In the description of this description, at least one embodiment that specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained in the application or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above content is the further description done the application in conjunction with concrete embodiment, can not assert that the concrete enforcement of the application is confined to these explanations.For the application person of an ordinary skill in the technical field, under the prerequisite not departing from the application's design, some simple deduction or replace can also be made.
Claims (10)
1. a LED luminescence unit, it is characterized in that, comprise: the pedestal with accommodating cavity, described accommodating cavity side has opening, to be arranged at bottom described accommodating cavity and have first wave length with adjust colour temperature/colour rendering index the first LED chip, be arranged in described accommodating cavity and be positioned at transparent substrates above described first LED chip, be fixed on described transparent substrates and there is the second LED chip of second wave length, and to cover above described second LED chip and to send the fluorescent adhesive layer of white light with described second LED chip effect.
2. LED luminescence unit as claimed in claim 1, it is characterized in that, described second LED chip and described first LED chip shift to install to opening direction bottom described accommodating cavity.
3. LED luminescence unit as claimed in claim 1, is characterized in that, described second LED chip and described first LED chip arrive opening direction just to setting bottom described accommodating cavity.
4. LED luminescence unit as claimed in claim 1, it is characterized in that, described transparent substrates is transparency carrier.
5. LED luminescence unit as claimed in claim 1, it is characterized in that, described transparent substrates is hollow out support.
6. LED luminescence unit as claimed in claim 1, is characterized in that, be provided with bottom described accommodating cavity: for arranging the first crystal bonding area of the first LED chip, and be electrically connected with described first LED chip and have the first region of the first pin; Described transparent substrates is provided with: for arranging the second crystal bonding area of the second LED chip, and to be electrically connected with described second LED chip and there is the second electrode district of the second pin, described first pin and described second pin penetrate described pedestal and extend certain length from the lateral surface of described pedestal.
7. LED luminescence unit as claimed in claim 6, is characterized in that, the contour setting of the part of extending the lateral surface of described pedestal of described first pin and described second pin.
8. LED luminescence unit as claimed in claim 6, is characterized in that, the non-contour setting of the part of extending the lateral surface of described pedestal of described first pin and described second pin.
9. LED luminescence unit as claimed in claim 6, it is characterized in that, described first crystal bonding area and described second crystal bonding area have heat radiation lead foot, and described heat radiation lead foot penetrates described pedestal and extends certain length from the lateral surface of described pedestal.
10. LED luminescence unit as claimed in any one of claims 1-9 wherein, is characterized in that, described fluorescent adhesive layer adopts and excites peak value at the yellow fluorescent powder of 530-590nm; The blue-light LED chip of described second LED chip to be wavelength be 430-470nm; Described first LED chip is red LED chip.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/091549 WO2016078013A1 (en) | 2014-11-19 | 2014-11-19 | Led light-emitting unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204717395U true CN204717395U (en) | 2015-10-21 |
Family
ID=54316396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000316.4U Expired - Fee Related CN204717395U (en) | 2014-11-19 | 2014-11-19 | LED luminescence unit |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN204717395U (en) |
| WO (1) | WO2016078013A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111828851A (en) * | 2020-08-13 | 2020-10-27 | 北京泊菲莱科技有限公司 | LED integrated lamp bead capable of simulating standard light source and spectrum adjustment and adaptation method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929710A (en) * | 2005-09-05 | 2007-03-14 | 林文钦 | White light-emitting device capable of regulating color temperature |
| KR100771811B1 (en) * | 2005-12-27 | 2007-10-30 | 삼성전기주식회사 | White light emitting device |
| CN101373763B (en) * | 2007-08-24 | 2010-11-10 | 富士迈半导体精密工业（上海）有限公司 | Led |
| EP2407706A1 (en) * | 2010-07-14 | 2012-01-18 | Civilight Shenzhen Semiconductor Lighting Co., Ltd | Warm white light LED lamp with high luminance and high color rendering index and led module |
| CN102157507B (en) * | 2011-01-25 | 2013-07-24 | 北京工业大学 | White LED integration module packaging structure with adjustable color temperature and color rendering indexes |
| US8735913B2 (en) * | 2011-04-01 | 2014-05-27 | Visera Technologies Company Limited | Light emitting semiconductor structure |
-
2014
- 2014-11-19 CN CN201490000316.4U patent/CN204717395U/en not_active Expired - Fee Related
- 2014-11-19 WO PCT/CN2014/091549 patent/WO2016078013A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016078013A1 (en) | 2016-05-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151021 Termination date: 20161119 |