CN205845994U - LED luminescence unit - Google Patents
LED luminescence unit Download PDFInfo
- Publication number
- CN205845994U CN205845994U CN201490000320.0U CN201490000320U CN205845994U CN 205845994 U CN205845994 U CN 205845994U CN 201490000320 U CN201490000320 U CN 201490000320U CN 205845994 U CN205845994 U CN 205845994U
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- CN
- China
- Prior art keywords
- led chip
- blue
- light
- containing cavity
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A kind of LED luminescence unit, including: the pedestal (1) with containing cavity (11) and the red LED chip (2) being arranged in described containing cavity (11), blue-light LED chip (3) and green LED chip (4), containing cavity (11) has a side opening (12), red LED chip (2), blue-light LED chip (3) and green LED chip (4) with default arrangement mode along the opening (12) of described containing cavity (11) to the most contour setting of same axis in the direction of bottom (13).Three kinds of LED chip are arranged along containing cavity (11) the most not contour interval, increase mixed light region, improve even light mixing degree.
Description
Technical field
The application relates to light emitting diode field, particularly relates to a kind of LED luminescence unit.
Background technology
Light emitting diode (Light Emitting Diode, LED) is widely used to mobile phone, flat board electricity as backlight
The field of backlights such as brain, notebook computer.(it is more than to preferably meet the more high color colour gamut of the terminal needs such as smart mobile phone
NTSC80%) requirement, the more commonly used technology is that blue-light LED chip is excitated red and green emitting phosphor, due to red fluorescence powder
Launching efficiency low, the light efficiency level of LED is low, and colour gamut is difficult to accomplish more than NTSC90%, and cost is the highest.In order to the most applicable
In smart mobile phone and panel computer to improve color fidelity, the side light emitting diode of present commonly used full color, this side is sent out
Optical diode includes pedestal, and pedestal is provided with containing cavity, is provided with red LED chip, green LED chip and indigo plant in containing cavity
Light LED chip, is filled with transparent glue (silica gel or silicones or epoxy resin etc.), red LED chip, green glow in containing cavity
LED chip and blue-light LED chip are point-blank arranged in in-line, and this side light emitting diode also includes being arranged at containing cavity
Bottom and extend to six pins pedestal outside, each two pin with the both positive and negative polarity of a LED chip corresponding connection, i.e. HONGGUANG
Two electrodes of LED chip, green LED chip and blue-light LED chip are each the most corresponding connects a pin, each electricity of each chip
The circuit of pole the most independently controls.When sending HONGGUANG, green glow, blue light respectively after three kinds of LED chip energisings, the light of these three color exists
Forming white light in transparent glue after mixing, this side light emitting diode there is problems in that
It is relatively big in the distance between each chip of red LED chip, green LED chip and blue-light LED chip of a word distribution,
HONGGUANG that three chips send, green glow, blue light overlap-add region is caused relatively to diminish, and then cause cavity light-emitting area to be sent out
The region that the light gone out has is the most blue, and some regions are the greenest, and have is the reddest；For the problem that this mixed light is uneven.
Summary of the invention
The application is intended to solve one of above-mentioned technical problem the most to a certain extent.
The application provides a kind of LED luminescence unit, including: there is the pedestal of containing cavity, be arranged in described containing cavity
Red LED chip, blue-light LED chip and green LED chip, described containing cavity has a side opening, it is characterised in that described
Red LED chip, blue-light LED chip and green LED chip with default arrangement mode along the opening of described containing cavity to described
The most contour setting of same axis in direction of bottom, and described containing cavity inwall designs for reflecting type.
Further, described containing cavity inwall is coated with reflectorized material.
Further, described pedestal uses reflectorized material to make.
Further, described red LED chip is placed in bottom described containing cavity, and described blue-light LED chip is arranged at described
Above red LED chip, described green LED chip is arranged at above described blue-light LED chip, described blue-light LED chip and
Green LED chip is fixed with described pedestal by printing opacity support.
Further, described red LED chip is placed in bottom described containing cavity, and described green LED chip is arranged at described
Above red LED chip, described blue-light LED chip is arranged at above described green LED chip, described green LED chip and
Blue-light LED chip is fixed with described pedestal by printing opacity support.
Further, described blue-light LED chip is placed in bottom described containing cavity, and described red LED chip is arranged at described
Above blue-light LED chip, described green LED chip is arranged at above described red LED chip, described red LED chip and
Green LED chip is fixed with described pedestal by printing opacity support.
Further, described blue-light LED chip is placed in bottom described containing cavity, and described green LED chip is arranged at described
Above blue-light LED chip, described red LED chip is arranged at above described green LED chip, described green LED chip and
Red LED chip is fixed with described pedestal by printing opacity support.
Further, described green LED chip is placed in bottom described containing cavity, and described red LED chip is arranged at described
Above green LED chip, described blue-light LED chip is arranged at above described red LED chip, described red LED chip and
Blue-light LED chip is fixed with described pedestal by printing opacity support.
Further, described green LED chip is placed in bottom described containing cavity, and described blue-light LED chip is arranged at described
Above green LED chip, described red LED chip is arranged at above described blue-light LED chip, described blue-light LED chip and
Red LED chip is fixed with described pedestal by printing opacity support.
Further, described printing opacity support is transparent rack or hollow out support.
Further, described pedestal has four pins, and one of them described pin is common pin, described in other three
Pin is individual pin, and the same type electrode of described red LED chip, blue-light LED chip and green LED chip is with described
Common pin is connected, and another type electrode each connects with corresponding described individual pin.
Further, described pedestal has five pins, and pin described in two of which is the common pin of electric connection, other
Three described pins are individual pin, the same type electricity of described red LED chip, blue-light LED chip and green LED chip
Pole is connected with common pin at least one described, and another type electrode each connects with corresponding described individual pin.
Further, described pedestal has six pins, and wherein three described pins are the common pin of electric connection, other
Three described pins are individual pin, the same type electricity of described red LED chip, blue-light LED chip and green LED chip
Pole is connected with common pin at least one described, and another type electrode each connects with corresponding described individual pin.
The application provides the benefit that:
By providing a kind of LED luminescence unit, including: have containing cavity pedestal, be arranged in described containing cavity red
Light LED chip, blue-light LED chip and green LED chip, described containing cavity has a side opening, it is characterised in that described red
Light LED chip, blue-light LED chip and green LED chip with default arrangement mode along the opening of described containing cavity to the described end
The most contour setting of same axis in the direction in portion, and described containing cavity inwall designs for reflecting type.So, three kinds of LED chip edges
Containing cavity the most not contour interval is arranged, and the mixed light region enhancing three kinds of LED chip becomes big, improves even light mixing degree, carries
Rise light-out effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED luminescence unit of the embodiment of the present application.
Fig. 2 is the generalized section of the LED luminescence unit of the embodiment of the present application.
Detailed description of the invention
Embodiments herein is described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, it is intended to be used for explaining the application, and it is not intended that restriction to the application.
In the description of the present application, it is to be understood that term " " center ", " longitudinally ", " laterally ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward ", " up time
Pin ", the orientation of the instruction such as " counterclockwise " or position relationship be based on orientation shown in the drawings or position relationship, be for only for ease of
Describe the application and simplification description rather than instruction or the device of hint indication or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that restriction to the application.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In the description of the present application, " multiple " are meant that two or more,
Unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or be integrally connected；It can be machine
Tool connects, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two units
Connection within part.For the ordinary skill in the art, can understand that above-mentioned term is in this Shen as the case may be
Concrete meaning in please.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
Can include that the first and second features directly contact, it is also possible to include that the first and second features are not directly contact but by it
Other characterisation contact between.And, fisrt feature second feature " on ", " top " and " above " include that first is special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " below " include that fisrt feature directly over second feature and oblique upper, or is merely representative of
Fisrt feature level height is less than second feature.
Combine accompanying drawing below by detailed description of the invention the application is described in further detail.
Refer to Fig. 1-2, present embodiments provide a kind of LED luminescence unit, its can together with other LED luminescence units group
Become LED illuminating module, be applied to the fields such as illumination, signal designation or display, and correspondence can be assembled into LEDbulb lamp, LED letter
The equipment such as signal lamp and LED display.
Above-mentioned LED luminescence unit specifically includes that the pedestal 1 with containing cavity 11, the red-light LED being arranged in containing cavity 11
Chip 2, blue-light LED chip 3 and green LED chip 4, containing cavity 11 has a side opening 12, red LED chip 2, blue light
LED chip 3 and green LED chip 4 with default arrangement mode along same to the direction of bottom 13 of the opening 12 of containing cavity 11
The most contour setting of axis, and containing cavity 11 inwall designs for reflecting type.
So, three kinds of LED chip are arranged along containing cavity the most not contour interval, enhance the mixed light district of three kinds of LED chip
Territory becomes big, improves even light mixing degree, improves light-out effect.
In order to promote the luminous reflectance effect of containing cavity inwall, above-mentioned reflecting type is designed as: containing cavity 11 inwall is coated with instead
Luminescent material, or, pedestal 1 itself uses reflectorized material to make.Reflectorized material can be selected for aluminum or aluminum alloy etc. and has reflection action
Metal material.
Above-mentioned default arrangement mode substantially has following six kinds:
One, i.e. the present embodiment content, red LED chip 2 is placed in bottom containing cavity 11, and blue-light LED chip 3 is arranged at red
Above light LED chip 2, green LED chip 4 is arranged at above blue-light LED chip 3, blue-light LED chip 3 and green LED chip
4 are fixed with pedestal 1 by printing opacity support 5.
Its two, as other embodiments, red LED chip is placed in bottom containing cavity, and green LED chip is arranged at HONGGUANG
Above LED chip, blue-light LED chip is arranged at above green LED chip, and green LED chip and blue-light LED chip are by thoroughly
Light support fixes with pedestal.
Its three, as other embodiments, blue-light LED chip is placed in bottom containing cavity, and red LED chip is arranged at blue light
Above LED chip, green LED chip is arranged at above red LED chip, and red LED chip and green LED chip are by thoroughly
Light support fixes with pedestal.
Its four, as other embodiments, blue-light LED chip is placed in bottom containing cavity, and green LED chip is arranged at blue light
Above LED chip, red LED chip is arranged at above green LED chip, and green LED chip and red LED chip are by thoroughly
Light support fixes with pedestal.
Its five, as other embodiments, green LED chip is placed in bottom containing cavity, and red LED chip is arranged at green glow
Above LED chip, blue-light LED chip is arranged at above red LED chip, and red LED chip and blue-light LED chip are by thoroughly
Light support fixes with pedestal.
Its six, as other embodiments, green LED chip is placed in bottom containing cavity, and blue-light LED chip is arranged at green glow
Above LED chip, red LED chip is arranged at above blue-light LED chip, and blue-light LED chip and red LED chip are by thoroughly
Light support fixes with pedestal.
When specifically applying, printing opacity support 5 can be transparent rack or hollow out support.Transparent rack uses transparent material, as
Crystalline ceramics or clear glass etc..
Pin on pedestal also has multiple with the connected mode of LED chip, but is not limited only to:
One, pedestal has four pins, and one of them pin is common pin, and other three pins are individual pin,
The same type electrode of red LED chip, blue-light LED chip and green LED chip is connected with common pin, another type electricity
Extremely each connect with corresponding individual pin.
Its two, pedestal has five pins, and two of which pin is the common pin of electric connection, and other three pins are only
Vertical pin, the same type electrode of red LED chip, blue-light LED chip and green LED chip and at least one common pin
Being connected, another type electrode each connects with corresponding individual pin.
Its three, pedestal has six pins, and wherein three pins are the common pin of electric connection, and other three pins are only
Vertical pin, the same type electrode of red LED chip, blue-light LED chip and green LED chip and at least one common pin
Being connected, another type electrode each connects with corresponding individual pin.
So, the red-light LED chip that is arranged in the above-described embodiments in containing cavity, blue-ray LED chip, green light LED
The same type electrode of chip connects and is connected with public electrode, and another type electrode is the most respectively with corresponding described individual pin the most even
Connect.One electrode copolar of the most each chip controls, and another electrode is the most individually separately controlled, and non-existing multi-chip light emitting two pole
The positive and negative electrode managing each chip is all individually to be separately controlled, and therefore connects up for during multi-chip light emitting diode Design PCB circuit
Simpler, it is possible to decrease its manufacturing cost.
In the description of this specification, reference term " embodiment ", " some embodiments ", " an enforcement
Example ", " some embodiments ", " example ", the description of " concrete example " or " some examples " etc. mean to combine this embodiment or example
The specific features, structure, material or the feature that describe are contained at least one embodiment or the example of the application.In this explanation
In book, the schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.And, the concrete spy of description
Levy, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
Above content is to combine the further description that the application is made by specific embodiment, it is impossible to assert this Shen
Being embodied as please is confined to these explanations.For the application person of an ordinary skill in the technical field, do not taking off
On the premise of the application conceives, it is also possible to make some simple deduction or replace.
Claims (10)
1. a LED luminescence unit, including: have the pedestal of containing cavity, the red LED chip being arranged in described containing cavity,
Blue-light LED chip and green LED chip, described containing cavity has a side opening, it is characterised in that described red LED chip,
Blue-light LED chip and green LED chip with default arrangement mode along same to the direction of bottom of the opening of described containing cavity
The most contour setting of axis, and described containing cavity inwall designs for reflecting type.
2. LED luminescence unit as claimed in claim 1, it is characterised in that described containing cavity inwall is coated with reflectorized material.
3. LED luminescence unit as claimed in claim 1, it is characterised in that described pedestal uses reflectorized material to make.
4. LED luminescence unit as claimed in claim 1, it is characterised in that described red LED chip is placed at the bottom of described containing cavity
Portion, described blue-light LED chip is arranged at above described red LED chip, and described green LED chip is arranged at described blue-ray LED
Above chip, described blue-light LED chip and green LED chip are fixed with described pedestal by printing opacity support.
5. LED luminescence unit as claimed in claim 1, it is characterised in that described red LED chip is placed at the bottom of described containing cavity
Portion, described green LED chip is arranged at above described red LED chip, and described blue-light LED chip is arranged at described green light LED
Above chip, described green LED chip and blue-light LED chip are fixed with described pedestal by printing opacity support.
6. LED luminescence unit as claimed in claim 1, it is characterised in that described blue-light LED chip is placed at the bottom of described containing cavity
Portion, described red LED chip is arranged at above described blue-light LED chip, and described green LED chip is arranged at described red-light LED
Above chip, described red LED chip and green LED chip are fixed with described pedestal by printing opacity support.
7. LED luminescence unit as claimed in claim 1, it is characterised in that described blue-light LED chip is placed at the bottom of described containing cavity
Portion, described green LED chip is arranged at above described blue-light LED chip, and described red LED chip is arranged at described green light LED
Above chip, described green LED chip and red LED chip are fixed with described pedestal by printing opacity support.
8. LED luminescence unit as claimed in claim 1, it is characterised in that described green LED chip is placed at the bottom of described containing cavity
Portion, described red LED chip is arranged at above described green LED chip, and described blue-light LED chip is arranged at described red-light LED
Above chip, described red LED chip and blue-light LED chip are fixed with described pedestal by printing opacity support.
9. LED luminescence unit as claimed in claim 1, it is characterised in that described green LED chip is placed at the bottom of described containing cavity
Portion, described blue-light LED chip is arranged at above described green LED chip, and described red LED chip is arranged at described blue-ray LED
Above chip, described blue-light LED chip and red LED chip are fixed with described pedestal by printing opacity support.
10. the LED luminescence unit as according to any one of claim 4-9, it is characterised in that described printing opacity support is transparent
Frame or hollow out support.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/091551 WO2016078015A1 (en) | 2014-11-19 | 2014-11-19 | Led light-emitting unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205845994U true CN205845994U (en) | 2016-12-28 |
Family
ID=56013057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000320.0U Expired - Fee Related CN205845994U (en) | 2014-11-19 | 2014-11-19 | LED luminescence unit |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205845994U (en) |
| WO (1) | WO2016078015A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107642690A (en) * | 2017-09-27 | 2018-01-30 | 深圳Tcl新技术有限公司 | LED seat, light-emitting device, presentation device, backlight module and liquid crystal display device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110808325A (en) * | 2019-12-16 | 2020-02-18 | 深圳市恒泰新材料科技有限公司 | Display device of all-in-one TOP design based on Mini full-color display |
| CN113964151B (en) * | 2021-10-29 | 2023-01-31 | 季华实验室 | Full-color micro display device and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| CN1755953A (en) * | 2004-09-28 | 2006-04-05 | 华上光电股份有限公司 | Full color LED formed by superposition of three primary colors |
| US8735913B2 (en) * | 2011-04-01 | 2014-05-27 | Visera Technologies Company Limited | Light emitting semiconductor structure |
| CN103185220B (en) * | 2011-12-28 | 2016-12-21 | 鸿富锦精密工业（深圳）有限公司 | Sony ericsson mobile comm ab color temperature adjusting method and the illuminator of use the method |
| CN203503652U (en) * | 2013-09-26 | 2014-03-26 | 荆州市大明灯业有限公司 | Multi-color-temperature LED lamp bead |
| CN203631549U (en) * | 2013-12-04 | 2014-06-04 | 深圳市久和光电有限公司 | Power-type COB integrated packaging structure with adjustable color temperature |
-
2014
- 2014-11-19 CN CN201490000320.0U patent/CN205845994U/en not_active Expired - Fee Related
- 2014-11-19 WO PCT/CN2014/091551 patent/WO2016078015A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107642690A (en) * | 2017-09-27 | 2018-01-30 | 深圳Tcl新技术有限公司 | LED seat, light-emitting device, presentation device, backlight module and liquid crystal display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016078015A1 (en) | 2016-05-26 |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20171119 |