CN201119120Y - Improved printed circuit board for LED - Google Patents

Improved printed circuit board for LED Download PDF

Info

Publication number
CN201119120Y
CN201119120Y CNU2007200154804U CN200720015480U CN201119120Y CN 201119120 Y CN201119120 Y CN 201119120Y CN U2007200154804 U CNU2007200154804 U CN U2007200154804U CN 200720015480 U CN200720015480 U CN 200720015480U CN 201119120 Y CN201119120 Y CN 201119120Y
Authority
CN
China
Prior art keywords
layer
emitting diode
light emitting
circuit board
printed circuit
Prior art date
Application number
CNU2007200154804U
Other languages
Chinese (zh)
Inventor
陈永丰
沈志豪
Original Assignee
陈永丰;沈志豪
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 陈永丰;沈志豪 filed Critical 陈永丰;沈志豪
Priority to CNU2007200154804U priority Critical patent/CN201119120Y/en
Application granted granted Critical
Publication of CN201119120Y publication Critical patent/CN201119120Y/en

Links

Abstract

The utility model relates to a modified printing circuit board structure of a light emitting diode, which comprises a base plate layer, a heat conductive insulation layer, a conducting layer, a solder proof screen layer and a light emitting diode are superimposed on the upper surface of the base plate layer in sequence, another heat conductive insulation layer and another conducting layer are superimposed on the lower surface of the base plate in sequence. The light emitting diode is electrically connected with the conducting layer, because the heat conductive insulation layers are superimposed on the both upper surface and the lower surface of the base plate, the speed of the heat of the light emitting diode and the conducting layer transmitted on the base palate for dissipation is promoted, the temperature of the printing circuit board is reduced, to ensure that a light emitting diode with higher power or higher brightness can be installed on the printing circuit board.

Description

发光二极管的印刷电路板改良结构技术领域一种发光二极管的印刷电路板改良结构,特别指一种双面皆可使用的印刷电路板,可将发光二极管与其电子电路设置在同一印刷电路板上,并配合良好的散热机制,以节省空间,扩大应用领域,并有效降低成本的印刷电路板结构。 The improved structure of the light emitting diode printed circuit board BACKGROUND A light emitting diode printed circuit board structure, particularly a double-sided printed circuit board refers to the use of either of the light emitting diode can be provided with its electronic circuitry on the same printed circuit board, and with good heat dissipation mechanism, to save space, the expansion of application fields, and reduce the cost of the printed circuit board structure. 背景技术在传统的照明设备中,多半是以灯泡作为光源,以取得足够的亮度提供使用,特别是需要高亮度的装置,例如路灯、车灯等,其必须提高灯泡功率,以换取更高的亮度,如此,虽能提供更高的亮度,但也必须消耗更多能源,产生更多热量,且灯泡寿命减少,而必须经常维修或更换。 BACKGROUND In a conventional lighting equipment, is mostly used as a light source lamp, in order to obtain sufficient brightness to provide use, in particular, high luminance devices required, e.g. lights, headlights, etc., it is necessary to increase the lamp power, in exchange for higher brightness, so, although able to provide higher brightness, but also must consume more energy and produce more heat and reduce lamp life, but must be frequently repaired or replaced. 为此,有人考虑釆取其它的照明光源,以高亮度、耐用为其诉求。 For this reason, consideration was taken preclude other illumination source, high brightness, demands for durability. 在种种改良方案中,发光二极管(LED)可谓是解决前述缺失的最佳方案,因为发光二极管本身就有坚固、耐用的优点,且在长期改良后,目前的高亮度发光二极管已具有足够的亮度,可作为一般照明的功用,甚至包括任何需要光源的产品,例如液晶显示器等。 In various modified embodiment, a light emitting diode (LED) can be described as the best solution to the deletion, the light emitting diode itself as strong, durable advantage, and after long-term improvement, the current high-brightness light-emitting diodes have a sufficient luminance , as a general illumination function, even any product requiring a light source, such as liquid crystal display or the like. 在所有的显示器产品中,液晶显示器由于体积小、重量轻、低耗能、 低幅射等优点,目前已大幅应用在各类电视、计算机,以及各类电子产品的显示器单元中。 All the products in the display, the liquid crystal display due to the small size, light weight, low energy, low radiation, etc., has been substantially used in all types television, a computer, and a variety of electronic display units. 而在液晶显示器的主要组件中,除了液晶模块外,其背光组件可谓是产品中最重要的组件。 In the main components of a liquid crystal display, in addition to the liquid crystal module, a backlight assembly which can be described as the most important components of the product. 由于液晶模块本身不具发光功能,故液晶显示器想要得到饱和的色彩,只有依靠背光组件来达成。 Since the liquid crystal module itself does not have a light emitting function, it is desired to obtain a liquid crystal display color saturation, achieved only rely on the backlight assembly. 传统的背光组件,主要是以白光冷阴极灯管(CCFL)为主,将CCFL设置在液晶模块背后,使液晶模块上的画面得以显现。 A conventional backlight assembly mainly white cold cathode fluorescent lamp (CCFL) mainly, the CCFL is provided behind the liquid crystal module, so that the screen appears on the LCD module can. 然而,由于先天上的限制,冷阴极灯管的亮度不均,尤其对于大尺寸液晶显示器更为明显;且冷阴极灯管寿命较短,且不易更换,造成液晶显示器的使用寿命大幅缩短; 而冷阴极灯管在色彩饱和度略显不足,尤其对于红光的表现更差,无法满足高规格的色彩需求,例如仪器量测等需要表现特定色彩的环境下;再者,使用上较为耗电,又会产生紫外线,不仅违反环保,且长期使用严重伤害人类的眼睛。 However, due to the inherent limitations, the CCFL brightness unevenness, especially for large-size liquid crystal display is more obvious; cold cathode fluorescent lamp, and short-lived and easy to replace, resulting in significantly shorten the life of the liquid crystal display; and slightly less than the cold cathode fluorescent lamp color saturation, especially for red even worse, can not meet the demand for high-color, for example, measuring instruments and the like need to demonstrate a particular color environment; Moreover, the use of more power , will produce ultraviolet light, not only in violation of environmental protection, and long-term use of serious injury to a human eye. 因此,目前业界普遍实行的技术,乃为利用发光二极管作为背光来源。 Thus, the industry generally practiced technique, it is for the use of LEDs as a backlight source. 发光二极管相较于白光冷阴极灯管,其具有重量轻巧、坚固,且寿命较长, 开机反应较快等优点,实为液晶显示器最佳的选择对象。 Compared to the light emitting diode white cold cathode fluorescent lamp, having a light weight, strong, and longer life, rapid startup, etc. The reaction, in fact, the best choice of the liquid crystal display objects. 在以往,发光二极管的亮度不够,无法有效应用在显示器中,但近几年来,发光二极管的技术大幅精进,在亮度、色彩上均有一定的水平,故完全取代白光冷阴极灯管乃是普遍的趋势。 In the past, the brightness of the light emitting diode is not sufficient to effectively monitor the applications, but in recent years, light emitting diode technology significantly sophisticated, there is a certain level of brightness, the color, it is fully substituted white cold cathode fluorescent lamp but generally the trend of. 然而,由于发光二极管的亮度增加,相对使其消耗功率以及产生热量大幅提升,使传统发光二极管的印刷电路板设计不敷使用,而需要革新的产品,方能满足更大尺寸的液晶显示器需求。 However, due to the increased brightness of light emitting diodes, so that the relative power consumption and heat generation significantly improve the conventional light-emitting diode printed circuit board design shortage of space, and requires innovative products, a liquid crystal display in order to meet the needs of a larger size. 传统发光二极管的印刷电路板,主要是针对低功率的发光二极管设计, 其散热需求不大,故不具有效的散热结构。 Conventional light-emitting diode printed circuit board, a light emitting diode is mainly designed for low power, less heat dissipation requirements, it is not an effective heat dissipation structure. 因此,常规印刷电路板在设计发光二极管与其线路时,是将发光二极管放在主要印刷电路板上,而其电路及其它电子零件,则放置到其它电路板上,避免发光二极管的热度损坏电子零件。 Thus, conventional printed circuit board in the design of the light emitting diode line therewith, is a light emitting diode on the main printed circuit board and its circuits and other electronic components, are placed into the other circuit board, the light emitting diode to avoid heat damage to electronic components . 如此,传统印刷电路的体积庞大,却无法提供等效的光源,使常规照明装置的亮度略显不足。 Thus, the conventional printed circuit bulky, can not provide equivalent source, the luminance of conventional lighting apparatus slightly less. 而后,如台湾专利第M299865号"液晶显示器的二极管载板结构改良" 专利案,以及第M311116号"发光二极管载板的印刷电路板结构改良"专利案,均提到增设绝缘层、导热层来分散发光二极管的热量,以在印刷电路板上设置高功率发光二极管的结构。 Then, "the printed circuit board structure of a light emitting diode carrier plate" patent case as Taiwan Patent No. M299865 "diode carrier board structure of a liquid crystal display" Patent case, and No. M311116, both mentioned additional insulating layer, the thermally conductive layer dispersing heat emitting diode, disposed at a high power light emitting diode printed circuit board structure. 然而,该两项现有专利的散热效果有限,故发光二极管与电子电路仍然放在不同的印刷电路板上,造成空间的浪费,并不适用于大尺寸的液晶显示器。 However, the limited heat dissipation effect of the two prior patents, it is still a light emitting diode and an electronic circuit on a different printed circuit board, resulting in a waste of space, does not apply to large-sized liquid crystal display. 有鉴于此,本实用新型设计人即构思解决的方法,以特殊散热机制去除高功率发光二极管发热故障等问题,并进一步可以缩小体积,形成印刷电路板双面均可使用的目的,经由长期研发与实验后,终能成功研发完成本件发光二极管的印刷电路板改良结构。 Accordingly, the present invention i.e. designers conceived the solution, special cooling mechanisms to remove the heat of high-power light-emitting diode fault and the like, and further can reduce the volume, the purpose of forming a double-sided printed circuit board can be used via the long-term development after the experiment, finally able to successfully developed a printed circuit board structure of the present light emitting diode element. 实用实用新型内容本实用新型的主要目的即在提供一种发光二极管的印刷电路板改良结构,该印刷电路板双面皆可使用,以将发光二极管与电子电路设计在同一印刷电路板上,缩小体积,增加单位面积的发光二极管亮度,特别适用在各种路灯、车灯,或是大尺寸的液晶显示器上。 Utility SUMMARY primary object of the present invention that provides a light emitting diode printed circuit board structure, the double-sided printed circuit board can be used, the light emitting diode to the electronic circuit on the same printed circuit board design, reduced volume, brightness per unit area of ​​the light emitting diode increases, especially for various lights on the liquid crystal display, lights, or large size. 本实用新型的另一目的即在提供一种发光二极管的印刷电路板改良结构,其具有良好的散热结构,可将发光二极管的热量有效分散,以避免破坏产品,增加发光二极管的使用寿命。 Another object of the present invention to provide a light emitting diode that is a printed circuit board structure, which has good heat dissipation structure, the light emitting diode can be effectively disperse the heat, in order to avoid damaging the product, increase the life of the light emitting diode. 本实用新型的再一目的即在提供一种发光二极管的印刷电路板改良结构,其结省材料、简化制程,可降低生产成本,使发光二极管的应用更容易普及。 The present invention still further object to provide a light emitting diode that is a printed circuit board structure, which junction saving materials, simplify the manufacturing process, the production cost can be reduced, so that the application of the light emitting diode is more easy to spread. 为实现上述目的,本实用新型所釆用的技术方案为: 一种发光二极管的印刷电路板改良结构,其包括有一基板层,该基板层上表面依次迭置有一导热绝缘层、 一导电层、 一防焊油墨层,最后于该防焊油墨层的上表面设置有一发光二极管,并使该发光二极管与导电层形成电性连接,而该基板层下表面依次迭置有另一导热绝缘层,以及另一导电层。 To achieve the above object, the present invention is that preclude the use of technical solutions: a light emitting diode printed circuit board structure, comprising a substrate layer, on the substrate surface of the layer are sequentially stacked set with a heat-conducting insulating layer, a conductive layer, a solder mask layer, and finally on the surface of the solder mask layer is provided with a light emitting diode, and the light emitting diode electrically connected to the conductive layer is formed, and the lower surface of the substrate layer are sequentially stacked set there is another thermal insulation layer, and another conductive layer. 由该基板层的上、下表面均迭置有一导热绝缘层,以加速将发光二极管以及导电层的热量传导到基板层上消散,以降低该印刷电路板的温度,使该印刷电路板可装置更高功率或高亮度的发光二极管。 Made on the substrate layer, the lower surface of each laminate is a thermal insulation layer, in order to accelerate light-emitting diode and the heat conductive layer is conductive to the substrate layer is dissipated to lower the temperature of the printed circuit board so that the printed circuit board may means higher power or light emitting diode of high luminance. 而该另一导热绝缘层下表面亦可设置另一基板层,以增加散热效果。 The other surface may be disposed at other substrate layer thermally insulating layer, in order to increase the cooling effect. 发光二极管的印刷电路板改良结构包括有: 一基板层; 一导热绝缘层,迭置于该基板层的上表面; 一导电层,迭置在该导热绝缘层的上表面;一防焊油墨层,设置于该导电层的上表面;以及一与导电层形成电性连接的发光二极管,设置于该防焊油墨层的上表面。 A light emitting diode printed circuit board structure comprising: a substrate layer; a thermally insulating layer disposed on a surface of the laminated substrate layer; on the surface of a conductive layer overlying the thermally insulating layer; and a solder mask layer , disposed on the conductive layer on the surface; and the upper surface of a conductive layer electrically connected to the light emitting diode is provided in the solder mask layer. 该基板层下表面设置有另一导热绝缘层与导电层。 The lower surface of the substrate layer is provided with a further thermally insulating layer and the conductive layer. 该基板层下表面设置有另一导热绝缘层与基板层。 The lower surface of the substrate layer is provided with a further thermally insulating layer and the substrate layer. 该基板层与防焊油墨层之间的导热绝缘层与导电层,可设置一组以上。 Thermal insulation layer and the conductive layer between the substrate layer and the solder mask layer may be provided more than one set. 该基板层为铝板或铝片,该基板层为O. lmm-4mm。 The substrate layer is an aluminum sheet or an aluminum plate, the substrate layer is O. lmm-4mm. 该导热绝缘层为具有导热效果的绝缘薄膜,该导热绝缘层为12jLim-125nm。 The thermally conductive insulating layer is an insulating film having a thermal effect, the thermally conductive insulating layer 12jLim-125nm. 该导电层为铜板或铜片,该导电层为12]am-175pm。 The conductive layer is copper or a copper plate, the conductive layer is 12] am-175pm. 本实用新型所具有的优点:1. 本实用新型发光二极管的印刷电路板改良结构,该印刷电路板双面皆可使用,以将发光二极管与电子电路设计在同一印刷电路板上,缩小体积,增加单位面积的发光二极管亮度,特别适用在各种路灯、车灯,或是大尺寸的液晶显示器上。 The present invention has advantages: 1. the present invention a light emitting diode printed circuit board structure, the double-sided printed circuit board can be used, the light emitting diode to the electronic circuit in the same printed circuit board design, smaller size, increasing the luminance of the light emitting diode unit area, especially for various lights on the liquid crystal display, lights, or large size. 2. 本实用新型改良结构,其具有良好的散热结构,可将发光二极管的热量有效分散,以避免破坏产品,增加发光二极管的使用寿命。 2. The improved structure of the present invention, which has a good heat dissipating structure, the light emitting diode can be effectively disperse the heat, in order to avoid damaging the product, increase the life of the light emitting diode. 3. 本实用新型的改良结构,其结省材料、简化制程,可降低生产成本, 使发光二极管的应用更容易普及。 3. The improved structure of the present invention, which junction saving materials, simplify the manufacturing process, the production cost can be reduced, so that the application of the light emitting diode is more easy to spread. 附图说明请参阅以下有关本实用实用新型较佳实施例的详细说明及其附图,将可进一步了解本实用实用新型的技术内容及其目的功效:图i为本实用新型的第一实施例示意图;图2为本实用新型的第二实施例示意图; 图3为本实用新型的第三实施例示意图;以及图4为本实用新型的第四实施例示意图。 BRIEF DESCRIPTION See below for the present invention and the invention described in detail preferred embodiments of the drawings, will be further understood in the art of new content and the efficacy of the present invention utility object: a first invention of the present embodiment of FIG i schematic; Fig. 2 a schematic view of a second embodiment of the novel utility of the present; to a third embodiment of the present practical embodiment of schematic Figure 3; and a fourth embodiment of the invention FIG. 4 is a schematic diagram. 主要组件符号说明:1.第一基板层,8.第二基板层,2.第一导热绝缘层,2a.第二导热绝缘层,6.第三导热绝缘层,3.第一导电层,3a.第二导电层,7.第三导电层,4.防焊墨层,5.发光二极管。 Description of Symbols major components:...... A first substrate layer, second substrate layer 8, the first thermal insulation layer 2, 2a of the second thermal insulation layer, the third thermal insulation layer 6, a first conductive layer 3, . 3A. The second conductive layer 7 third conductive layer 4. solder ink, 5 a light emitting diode. 具体实施方式请参阅图l所示,本实用新型是提供一种发光二极管的印刷电路板改良结构,其主要包括有第一基板层l,该第一基板层l上表面迭置有第一导热绝缘层2,该第一导热绝缘层2上表面迭置有第一导电层3,在该第一导电层3的上表面设置有一防焊油墨层4,最后于该防焊油墨层4的上表面设置有一发光二极管5,并使该发光二极管5与第一导电层3形成电性连接。 DETAILED DESCRIPTION Referring to FIG. L embodiment, the present invention is to provide a light emitting diode printed circuit board structure, which mainly comprises a first substrate layer l, a first surface of the laminate is thermally conductive layer on the first substrate l the insulating layer 2, the first heat conductive insulating layer with a surface of laminate is last on the first conductive layer 3, the upper surface of the first conductive layer is provided with a solder mask layer 3, 4 to the solder mask layer 4 2 surface is provided with a light-emitting diode 5, and the LED 5 and the first conductive layer 3 is electrically connected. 而本实用新型更在该第一基板层1下表面迭置有第三导热绝缘层6,以及该第三导热绝缘层6下表面迭置有第三导电层7。 And more the present invention at a first surface of the substrate, the thermally conductive layer overlying the third insulating layer 6, 6 and the lower surface of the third heat insulating layer overlying the third conductive layer 7. 藉此,该第一基板层l的上、下表面均迭置有第一导热绝缘层2和第三导电层7,以加速将发光二极管5以及第一导电层3的热量传导到第一基板层1上消散,以降低该印刷电路板的温度,使该印刷电路板可装置更高功率或高亮度的发光二极管5。 Thereby, the first substrate layer l and lower opposing surfaces are stacked with a first thermal insulation layer 2 and the third conductive layer 7, the light emitting diode to accelerate the first conductive layer 5 and the heat conducted to the first substrate 3 dissipating layer 1 to reduce the temperature of the printed circuit board, the printed circuit board may cause higher power devices or high-brightness light-emitting diode 5. 前述第一基板层l为铝板或铝片,或其它具有散热效果的材料,以便将热量快速传导消散;而该第一基板层l的理想厚度约在O. lmm-4腿之间,以取得最佳的散热效果。 L the first substrate layer is aluminum or an aluminum sheet, or other material having a heat radiating effect, in order to dissipate heat quickly conduction; over the layer thickness of the first substrate is between about l O. lmm-4 legs, to obtain the best cooling effect. 该第一导热绝缘层2和第三导热绝缘层6为具有导热效果的绝缘薄膜,或其它具有导热效果的薄膜材料,可快速将热量传导到第一基板层l上,减少热量对该印刷电路板的影响;而该第一导热绝缘层2 和第三导热绝缘层6的理想厚度约在12ym-125pm之间,以得到最佳的导热效果。 2 and the third heat insulating layer 6 of the first insulating film is a thermally insulating layer having a thermal effect, or other thin film material having thermal effect, heat can be quickly conducted to the first substrate layer L, the printed circuit to reduce heat Effects plate; and over the thickness of the first insulating layer 2 and the third thermally conductive thermal insulation layer 6 is between about 12ym-125pm, to obtain the best thermal effects. 另外,该第一导电层3和第三导电层7为铜板或铜片,或其它导电效果良好的材料,其上布设有电路,以便与其它电子零件连接,取得控制该发光二极管5的功能;同样地,该第一导电层3和第三导电层7的理想厚度为12jam-175jam之间,以得到最佳的使用功能。 Further, the first conductive layer 3 and the third conductive layer 7 as a copper plate or copper, or other conductive good effect material laid on a circuit, for connection to other electronic components, acquiring function of controlling the light emitting diode 5; Similarly, the third conductive layer 3 and the first conductive layer over a thickness of between 7 12jam-175jam, to get the best use of the function. 藉此,前述完成的印刷电路板,其除了具有良好的散热效果,以装配高功率、高亮度的发光二极管5外,由于其具有第一导电层3和第三导电层7 的两层导电层,第一导电层3和第三导电层7可单独配置电路,以装置该发光二极管5与其相关的电子零件,故可在该印刷电路板上、下端设置电子零件,以节省空间。 Accordingly, the complete printed circuit board, which in addition to having a good cooling effect, the outer mounting a high power, high brightness light-emitting diode 5, since it has the third conductive layer 3 and the first conductive layer of two conductive layers 7 , a first conductive layer 3 and the third conductive layer 7 may be individually configured circuit to the light emitting diode device associated with the electronic parts 5, it can be in the printed circuit board, the lower end of the electronic component is provided, to save space. 请参阅图2所示,该实施例同样提供有第一基板层l、第一导热绝缘层2、 第一导电层3、防焊油墨层4与发光二极管5,以及在基板层下表面迭置有另第二导热绝缘层6。 Please refer to FIG. 2, this embodiment is also provided with a first substrate layer L, the first thermal insulation layer 2, a first conductive layer 3, the solder mask layer 4 and the light emitting diode 5, and the lower surface of the substrate layer in superposed there is another second thermal conductive insulating layer 6. 所不同者,该实施例在第二导热绝缘层6的下表面迭置有第二基板层8,如此,该发光二极管5与第一导电层3所产生的热量,除了原来的第一导热绝缘层2与第一基板层1作用外,尚可藉由第二导热绝缘层6 与第二基板层8进行排热,以达到更佳的散热效果。 What makes it different, in this embodiment the second surface of the laminate is thermally insulating layer 6 of 8, so, the heat of the light emitting diode 5 and the first conductive layer 3 generated by the second substrate layer, in addition to the original first thermal insulation an outer layer 2 and the role of the first substrate layer 1, still by the second thermal conductive insulating layer 6 and the second substrate layer 8 for heat removal in order to achieve better heat dissipation effect. 另外,请参阅图3、图4所示,前述两项实施例,其第一基板层l与防焊油墨层4之间的第一导热绝缘层2和第二导热绝缘层导热绝缘层2a、第一导电层3和第二导电层导电层3a,均可同时设置一组或一组以上,藉由反复的第一导热绝缘层2和第二导热绝缘层导热绝缘层2a、第一导电层3和第二导电层导电层3a,可设置更为复杂的印刷电路板,并且保证温度不会提升, 藉以配合日益先进的印刷电路板设计,且不占用空间。 Also, see FIG. 3 and FIG. 4, the two embodiments, the first thermal insulation layer between the first substrate layer 4 which l and the solder mask layer 2 and the second thermally insulating layer thermally insulating layer 2a, a first conductive layer 3 and the second conductive layers 3a, can be simultaneously set or a set of more than one group, by repeating a first thermal insulation layer 2 and the second thermally insulating layer thermally insulating layer, a first conductive layer 2a 3 and the second conductive layers 3a, may be provided more complex printed circuit boards, and to ensure that the temperature does not increase, thereby increasingly sophisticated with the printed circuit board design, it does not take up space. 上列详细说明针对本实用新型的一可行实施例的具体说明,惟该实施例并非用以限制本实用新型的专利范围,凡未脱离本实用新型技艺精神所为的等效实施或变更,均应包含于本实用新型的专利范围中。 The above detailed description of the present invention for a detailed description of possible embodiments, but the embodiments are not intended to limit the patent scope of the present invention, the art who have not departing from the spirit of the present invention is equivalent embodiments or changes are It should be included in the present patent disclosure range.

Claims (7)

1.一种发光二极管的印刷电路板改良结构,其特征在于包括有: 一基板层; 一导热绝缘层,迭置于该基板层的上表面; 一导电层,迭置在该导热绝缘层的上表面; 一防焊油墨层,设置于该导电层的上表面;以及一与导电层形成电性连接的发光二极管,设置于该防焊油墨层的上表面。 1. A light emitting diode printed circuit board structure, comprising: a substrate layer; a thermally insulating layer disposed on a surface of the laminated substrate layer; a conductive layer, the laminate is thermally insulating layer an upper surface; a solder mask layer disposed on the conductive layer on the surface; and the upper surface of a conductive layer electrically connected to the light emitting diode is provided in the solder mask layer.
2. 如权利要求l所述发光二极管的印刷电路板改良结构,其特征在于: 该基板层下表面设置有另一导热绝缘层与导电层。 2. The printed circuit board structure of the light emitting diode of claim l, characterized in that: the thermally conductive surface is provided with a further insulating layer and the lower conductive layer of the substrate layer.
3. 如权利要求l所述发光二极管的印刷电路板改良结构,其特征在于:该基板层下表面设置有另一导热绝缘层与基板层。 as claimed in claim l 3. The printed circuit board structure of the light emitting diode, comprising: a thermally conductive surface is provided with a further insulating layer and the substrate layer below the substrate layer.
4. 如权利要求1所述发光二极管的印刷电路板改良结构,其特征在于: 该基板层与防焊油墨层之间的导热绝缘层与导电层,可设置一组以上。 The light emitting diode printed circuit board structure as claimed in claim 4, wherein: thermal insulation layer and the conductive layer between the substrate layer and the solder mask layer may be provided more than one set.
5. 如权利要求1所述发光二极管的印刷电路板改良结构,其特征在于: 该基板层为铝板或铝片,该基板层为0.1111111-4111111。 5. The light emitting diode printed circuit board structure as claimed in claim, wherein: the substrate layer is an aluminum sheet or an aluminum plate, the substrate layer is 0.1111111-4111111.
6. 如权利要求1所述发光二极管的印刷电路板改良结构,其特征在于: 该导热绝缘层为具有导热效果的绝缘薄膜,该导热绝缘层为12jam-125Mm。 6. The light emitting diode printed circuit board structure as claimed in claim, characterized in that: the thermally conductive insulating layer is an insulating film having a thermal effect, the thermally conductive insulating layer 12jam-125Mm.
7. 如权利要求l所述发光二极管的印刷电路板改良结构,其特征在于: 该导电层为铜板或铜片,该导电层为12ym-175|am。 The printed circuit board structure of the light emitting diode of claim l, characterized in that: the conductive layer is copper or a copper plate, the conductive layer is 12ym-175 | am.
CNU2007200154804U 2007-10-24 2007-10-24 Improved printed circuit board for LED CN201119120Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200154804U CN201119120Y (en) 2007-10-24 2007-10-24 Improved printed circuit board for LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200154804U CN201119120Y (en) 2007-10-24 2007-10-24 Improved printed circuit board for LED

Publications (1)

Publication Number Publication Date
CN201119120Y true CN201119120Y (en) 2008-09-17

Family

ID=39993726

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007200154804U CN201119120Y (en) 2007-10-24 2007-10-24 Improved printed circuit board for LED

Country Status (1)

Country Link
CN (1) CN201119120Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010108361A1 (en) * 2009-03-23 2010-09-30 Shen Lihao Pcb including heat radiating structure with heat conducting and heat radiating ink
CN102548229A (en) * 2010-12-29 2012-07-04 陆富强 Embedded type circuit distribution method and structure
CN102655711A (en) * 2012-05-17 2012-09-05 宁波市佰仕电器有限公司 Novel circuit board
WO2013071553A1 (en) * 2011-11-18 2013-05-23 深圳市华星光电技术有限公司 Flat-panel display device and stereo display device
WO2013071548A1 (en) * 2011-11-18 2013-05-23 深圳市华星光电技术有限公司 Backlight system
US8708512B2 (en) 2011-11-18 2014-04-29 Shenzhen China Star Optoelectronics Technology Co., Ltd. Backlight system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010108361A1 (en) * 2009-03-23 2010-09-30 Shen Lihao Pcb including heat radiating structure with heat conducting and heat radiating ink
CN102548229A (en) * 2010-12-29 2012-07-04 陆富强 Embedded type circuit distribution method and structure
WO2013071553A1 (en) * 2011-11-18 2013-05-23 深圳市华星光电技术有限公司 Flat-panel display device and stereo display device
WO2013071548A1 (en) * 2011-11-18 2013-05-23 深圳市华星光电技术有限公司 Backlight system
US8708512B2 (en) 2011-11-18 2014-04-29 Shenzhen China Star Optoelectronics Technology Co., Ltd. Backlight system
CN102655711A (en) * 2012-05-17 2012-09-05 宁波市佰仕电器有限公司 Novel circuit board

Similar Documents

Publication Publication Date Title
DE102005063433B4 (en) Backlight unit and liquid crystal display device
TWI333576B (en) Bottom lighting module
US20080143916A1 (en) Light source module, light source apparatus and liquid crystal display
KR101255833B1 (en) Liquid crystal display device
KR101546741B1 (en) Light emitting module and display apparatus having the same
KR101189135B1 (en) Liquid Crystal Display device module
JP2006011239A (en) Liquid crystal display device
CN101421857B (en) Display unit, light emitting device, and solid-state light emitting element substrate
KR101305884B1 (en) Light emitting diode package, manufacturing method thereof and Back light unit having the same
US8016452B2 (en) Advertising displays
US7505109B2 (en) Heat dissipation structure of backlight module
JP2007335371A (en) Surface lighting device
EP2607949A1 (en) Display module and display apparatus having the same
CN1844984A (en) LED module assembly and backlight system using the same
US7677899B2 (en) LED light source module and LED backlight module using the same
JP2007242617A (en) Backlight unit
US20110019126A1 (en) Apparatus for radiating heat of light emitting diode and liquid crystal display using the same
US8687142B2 (en) Backlight unit comprising a bottom cover including an embossing portion that overlaps with a portion of an LED package and liquid crystal display using the same
KR100664349B1 (en) Led board for illumination and illumination unit including the board
US8199306B2 (en) Printed circuit board, backlight unit having the printed circuit board, and liquid crystal display device having the printed circuit board
KR101151599B1 (en) Heat radiation tape and manufacturing method thereof
US8648993B2 (en) Combined serial/parallel light configuration and single layer PCB containing the same
TW200804926A (en) Liquid crystal display and backlight module thereof
US8305516B2 (en) Liquid crystal display device
JP5097127B2 (en) Light emitting device, display device, and solid light emitting element substrate

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
C17 Cessation of patent right