CN201119120Y - Improved printed circuit board for LED - Google Patents
Improved printed circuit board for LED Download PDFInfo
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- CN201119120Y CN201119120Y CNU2007200154804U CN200720015480U CN201119120Y CN 201119120 Y CN201119120 Y CN 201119120Y CN U2007200154804 U CNU2007200154804 U CN U2007200154804U CN 200720015480 U CN200720015480 U CN 200720015480U CN 201119120 Y CN201119120 Y CN 201119120Y
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Abstract
The utility model relates to a modified printing circuit board structure of a light emitting diode, which comprises a base plate layer, a heat conductive insulation layer, a conducting layer, a solder proof screen layer and a light emitting diode are superimposed on the upper surface of the base plate layer in sequence, another heat conductive insulation layer and another conducting layer are superimposed on the lower surface of the base plate in sequence. The light emitting diode is electrically connected with the conducting layer, because the heat conductive insulation layers are superimposed on the both upper surface and the lower surface of the base plate, the speed of the heat of the light emitting diode and the conducting layer transmitted on the base palate for dissipation is promoted, the temperature of the printing circuit board is reduced, to ensure that a light emitting diode with higher power or higher brightness can be installed on the printing circuit board.
Description
Technical field
A kind of printed circuit board (PCB) structure-improved of light-emitting diode, refer in particular to a kind of two-sided all spendable printed circuit board (PCB), light-emitting diode and its electronic circuit can be arranged on the same printed circuit board (PCB), and the cooling mechanism of no-float, to save the space, enlarge application, and the printed circuit board arrangement that effectively reduces cost.
Background technology
In traditional lighting apparatus, be mostly with bulb as light source, provide use to obtain enough brightness, the device that particularly needs high brightness, for example street lamp, car light etc., it must improve bulb power, to exchange higher brightness for, so, though higher brightness can be provided, also must consume more multipotency source, produce more heats, and bulb life reduces, and often maintenance or replacing.
For this reason, the someone considers to take other lighting source, with high brightness, durable be its demand.In all evolutionary approach, light-emitting diode (LED) is the preferred plan that solves aforementioned disappearance, because light-emitting diode itself just has firm, durable advantage, and after long-term improvement, present high brightness LED has had enough brightness, can be used as the function of general lighting, even comprise any product that needs light source, for example LCD etc.
In all display products, advantages such as LCD is little, in light weight owing to volume, low power consuming, low radiation significantly are applied in all kinds of TVs, computer at present, and in the display unit of each electronic product.And in the primary clustering of LCD, except Liquid Crystal Module, its backlight assembly is a most important assembly in the product.Because Liquid Crystal Module itself is not had a lighting function, so LCD wants to obtain saturated color, only reliable backlight assembly is reached.
Traditional backlight assembly mainly is based on white light cold cathode fluorescent lamp (CCFL), and CCFL is arranged on Liquid Crystal Module behind, and the picture on the Liquid Crystal Module is manifested.Yet, since restriction in the sky earlier, the brightness disproportionation of cold cathode fluorescent lamp, especially more obvious for the large scale liquid crystal display; And the cold cathode lamp tube lifetime is shorter, and is difficult for changing, and causes significantly shorten the useful life of LCD; And cold cathode fluorescent lamp is slightly inadequate at color saturation, and is especially poorer for the performance of ruddiness, can't satisfy the color demand of high standard, and for example instrument measurement etc. needs under the environment of performance specific color; Moreover comparatively power consumption in the use can produce ultraviolet ray again, not only violates environmental protection, and uses the grievous injury mankind's eyes for a long time.
Therefore, the technology that present industry is generally carried out is for utilizing light-emitting diode as source backlight.Advantages such as light-emitting diode is compared to the white light cold cathode fluorescent lamp, and it is light and handy, firm that it has weight, and the life-span is longer, and the start reaction is very fast, real is the alternative of LCD the best.In the past, the brightness of light-emitting diode is not enough, can't effectively be applied in the display, but in recent years, the technology of light-emitting diode significantly progresses greatly, and certain level is all arranged on brightness, color, is general trend so replace the white light cold cathode fluorescent lamp fully.
Yet, because the brightness of light-emitting diode increases, make its consumed power relatively and produce heat significantly to promote, make the PCB design of traditional light-emitting diode not apply use, and need the product of innovation, can satisfy larger sized LCD demand.
The printed circuit board (PCB) of tradition light-emitting diode mainly is at lower powered led designs, and its radiating requirements is little, so the effective radiator structure of tool not.Therefore, conventional printed circuit board (PCB) be that light-emitting diode is placed on the main printed circuit board (PCB), and its circuit and other electronic component then is placed on other circuit board when design light-emitting diode and its circuit, avoids the temperature of light-emitting diode to damage electronic component.So, traditional printing circuit bulky but can't provide the light source of equivalence, makes the brightness of conventional lighting device slightly inadequate.
Then, as M299865 number " the diode carrying board structure improvement of LCD " patent case of Taiwan patent, and M311116 number " the printed circuit board arrangement improvement of light-emitting diode support plate " patent case, all mention and set up the heat that insulating barrier, heat-conducting layer disperse light-emitting diode, so that the structure of High Power LED to be set on printed circuit board (PCB).Yet the radiating effect of these two existing patents is limited, so light-emitting diode still is placed on the different printed circuit board (PCB)s with electronic circuit, causes the waste in space, and is not suitable for large-sized LCD.
In view of this, the utility model designer promptly conceives the method for solution, remove problems such as High Power LED heating accident with special cooling mechanism, and further can reduced volume, form the two-sided all spendable purpose of printed circuit board (PCB), after long-term research and development and experiment, can successfully research and develop the printed circuit board (PCB) structure-improved of finishing this part light-emitting diode eventually.
Practical utility model content
Main purpose of the present utility model is promptly providing a kind of printed circuit board (PCB) structure-improved of light-emitting diode, this printed circuit board (PCB) is two-sided all can be used, with with light-emitting diode and design of electronic circuits on same printed circuit board (PCB), reduced volume, increase the light-emitting diode luminance of unit are, particularly suitable is at various street lamps, car light, or on large-sized LCD.
Another purpose of the present utility model is promptly providing a kind of printed circuit board (PCB) structure-improved of light-emitting diode, and it has good radiator structure, the heat of light-emitting diode effectively can be disperseed, and to avoid destroying product, increases the useful life of light-emitting diode.
A purpose more of the present utility model is promptly providing a kind of printed circuit board (PCB) structure-improved of light-emitting diode, and its knot material saving, simplification processing procedure can reduce production costs, and makes easier the popularizing of application of light-emitting diode.
For achieving the above object, the technical scheme that the utility model adopted is: a kind of printed circuit board (PCB) structure-improved of light-emitting diode, it includes a substrate layer, this substrate layer upper surface repeatedly is equipped with a heat conductive insulating layer, a conductive layer, an anti-solder ink layer successively, upper surface in this anti-solder ink layer is provided with a light-emitting diode at last, and make this light-emitting diode and conductive layer form electric connection, and this substrate layer lower surface repeatedly is equipped with another heat conductive insulating layer successively, and another conductive layer.Upper and lower surface by this substrate layer all repeatedly is equipped with a heat conductive insulating layer, be transmitted on the substrate layer and dissipate to quicken heat with light-emitting diode and conductive layer, to reduce the temperature of this printed circuit board (PCB), make this printed circuit board (PCB) can install the light-emitting diode of high power more or high brightness.And this another heat conductive insulating layer lower surface also can be provided with another substrate layer, to increase radiating effect.
The printed circuit board (PCB) structure-improved of light-emitting diode includes: a substrate layer; One heat conductive insulating layer repeatedly places the upper surface of this substrate layer; One conductive layer is repeatedly put the upper surface at this heat conductive insulating layer; One anti-solder ink layer is arranged at the upper surface of this conductive layer; And one and the light-emitting diode that form to electrically connect of conductive layer, be arranged at the upper surface of this anti-solder ink layer.
This substrate layer lower surface is provided with another heat conductive insulating layer and conductive layer.This substrate layer lower surface is provided with another heat conductive insulating layer and substrate layer.Heat conductive insulating layer and conductive layer between this substrate layer and the anti-solder ink layer can be provided with more than one group.
This substrate layer is aluminium sheet or aluminium flake, and this substrate layer is 0.1mm-4mm.This heat conductive insulating layer is the insulation film with heat-conducting effect, and this heat conductive insulating layer is 12 μ m-125 μ m.This conductive layer is copper coin or copper sheet, and this conductive layer is 12 μ m-175 μ m.
The advantage that the utility model had:
1. the printed circuit board (PCB) structure-improved of the utility model light-emitting diode, this printed circuit board (PCB) is two-sided all can be used, with with light-emitting diode and design of electronic circuits on same printed circuit board (PCB), reduced volume, increase the light-emitting diode luminance of unit are, particularly suitable is at various street lamps, car light, or on large-sized LCD.
2. the utility model structure-improved, it has good radiator structure, the heat of light-emitting diode effectively can be disperseed, and to avoid destroying product, increases the useful life of light-emitting diode.
3. structure-improved of the present utility model, its knot material saving, simplification processing procedure can reduce production costs, and make easier the popularizing of application of light-emitting diode.
Description of drawings
See also the detailed description and the accompanying drawing thereof of following relevant this practical utility model preferred embodiment, can further understand the technology contents and the purpose effect thereof of this practical utility model:
Fig. 1 is the first embodiment schematic diagram of the present utility model;
Fig. 2 is the second embodiment schematic diagram of the present utility model;
Fig. 3 is the 3rd an embodiment schematic diagram of the present utility model; And
Fig. 4 is the 4th an embodiment schematic diagram of the present utility model.
Primary clustering symbol description: 1. first substrate layer, 8. second substrate layer, the 2. first heat conductive insulating layer, the 2a. second heat conductive insulating layer, 6. the 3rd heat conductive insulating layer, 3. first conductive layer, 3a. second conductive layer, 7. the 3rd conductive layer, 4. anti-welding China ink layer, 5. light-emitting diode.
Embodiment
See also shown in Figure 1, the utility model provides a kind of printed circuit board (PCB) structure-improved of light-emitting diode, it mainly includes first substrate layer 1, this first substrate layer, 1 upper surface repeatedly is equipped with the first heat conductive insulating layer 2, these first heat conductive insulating layer, 2 upper surfaces repeatedly are equipped with first conductive layer 3, upper surface at this first conductive layer 3 is provided with an anti-solder ink layer 4, upper surface in this anti-solder ink layer 4 is provided with a light-emitting diode 5 at last, and makes this light-emitting diode 5 and first conductive layer 3 form electric connection.And the utility model more repeatedly is equipped with the 3rd heat conductive insulating layer 6 at this first substrate layer, 1 lower surface, and the 3rd heat conductive insulating layer 6 lower surface repeatedly are equipped with the 3rd conductive layer 7.By this, the upper and lower surface of this first substrate layer 1 all repeatedly is equipped with the first heat conductive insulating layer 2 and the 3rd conductive layer 7, to quicken that the heat of the light-emitting diode 5 and first conductive layer 3 is transmitted to dissipation on first substrate layer 1, to reduce the temperature of this printed circuit board (PCB), make this printed circuit board (PCB) can install the light-emitting diode 5 of high power more or high brightness.
Aforementioned first substrate layer 1 is aluminium sheet or aluminium flake, or other has the material of radiating effect, so that heat is conducted dissipation fast; And the ideal thickness of this first substrate layer 1 is between 0.1mm-4mm, to obtain best radiating effect.This first heat conductive insulating layer 2 and the insulation film of the 3rd heat conductive insulating layer 6 for having heat-conducting effect, or other has the thin-film material of heat-conducting effect, can conduct heat to fast on first substrate layer 1, reduces the influence of heat to this printed circuit board (PCB); And the ideal thickness of this first heat conductive insulating layer 2 and the 3rd heat conductive insulating layer 6 is between 12 μ m-125 μ m, to obtain best heat-conducting effect.In addition, this first conductive layer 3 and the 3rd conductive layer 7 are copper coin or copper sheet, or the good material of other conductive effect, are laid with circuit on it, so that be connected with other electronic component, obtain the function of this light-emitting diode 5 of control; Similarly, the ideal thickness of this first conductive layer 3 and the 3rd conductive layer 7 is between the 12 μ m-175 μ m, to obtain best function of use.
By this, the aforementioned printed circuit board (PCB) of finishing, it is except having better heat radiating effect, outside the light-emitting diode 5 with assembling high power, high brightness, because it has the two conductive layers of first conductive layer 3 and the 3rd conductive layer 7, first conductive layer 3 and the 3rd conductive layer 7 be configuration circuit separately, to install this light-emitting diode 5 relative electronic components, so can electronic component be set at this printed circuit board (PCB) upper and lower end, to save the space.
See also shown in Figure 2ly, this embodiment provides first substrate layer 1, the first heat conductive insulating layer 2, first conductive layer 3, anti-solder ink layer 4 and light-emitting diode 5 equally, and repeatedly is equipped with the second heat conductive insulating layer 6 in addition at the substrate layer lower surface.Different persons, this embodiment repeatedly is equipped with second substrate layer 8 at the lower surface of the second heat conductive insulating layer 6, so, the heat that this light-emitting diode 5 and first conductive layer 3 are produced, except first original heat conductive insulating layer 2 and 1 effect of first substrate layer, still can carry out heat extraction by the second heat conductive insulating layer 6 and second substrate layer 8, to reach better radiating effect.
In addition, see also Fig. 3, shown in Figure 4, aforementioned two embodiment, the first heat conductive insulating layer 2 between its first substrate layer 1 and the anti-solder ink layer 4 and the second heat conductive insulating layer heat conductive insulating layer 2a, first conductive layer 3 and the second conductive layer conductive layer 3a, all can a group or more be set simultaneously, by the first heat conductive insulating layer 2 and the second heat conductive insulating layer heat conductive insulating layer 2a repeatedly, first conductive layer 3 and the second conductive layer conductive layer 3a, more complicated printed circuit board (PCB) can be set, and guarantee that temperature can not promote, use the advanced day by day PCB design of cooperation, and do not take up room.
Above-listed detailed description specifies at a possible embodiments of the present utility model, only this embodiment is not in order to limit claim of the present utility model, allly do not break away from the equivalence that the utility model skill spirit does and implement or change, all should be contained in the claim of the present utility model.
Claims (7)
1. the printed circuit board (PCB) structure-improved of a light-emitting diode is characterized in that including:
One substrate layer;
One heat conductive insulating layer repeatedly places the upper surface of this substrate layer;
One conductive layer is repeatedly put the upper surface at this heat conductive insulating layer;
One anti-solder ink layer is arranged at the upper surface of this conductive layer; And
One light-emitting diode that form to electrically connect with conductive layer is arranged at the upper surface of this anti-solder ink layer.
2. the printed circuit board (PCB) structure-improved of light-emitting diode according to claim 1, it is characterized in that: this substrate layer lower surface is provided with another heat conductive insulating layer and conductive layer.
3. the printed circuit board (PCB) structure-improved of light-emitting diode according to claim 1, it is characterized in that: this substrate layer lower surface is provided with another heat conductive insulating layer and substrate layer.
4. the printed circuit board (PCB) structure-improved of light-emitting diode according to claim 1, it is characterized in that: heat conductive insulating layer and conductive layer between this substrate layer and the anti-solder ink layer can be provided with more than one group.
5. the printed circuit board (PCB) structure-improved of light-emitting diode according to claim 1, it is characterized in that: this substrate layer is aluminium sheet or aluminium flake, this substrate layer is 0.1mm-4mm.
6. the printed circuit board (PCB) structure-improved of light-emitting diode according to claim 1, it is characterized in that: this heat conductive insulating layer is the insulation film with heat-conducting effect, this heat conductive insulating layer is 12 μ m-125 μ m.
7. the printed circuit board (PCB) structure-improved of light-emitting diode according to claim 1, it is characterized in that: this conductive layer is copper coin or copper sheet, this conductive layer is 12 μ m-175 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200154804U CN201119120Y (en) | 2007-10-24 | 2007-10-24 | Improved printed circuit board for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200154804U CN201119120Y (en) | 2007-10-24 | 2007-10-24 | Improved printed circuit board for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201119120Y true CN201119120Y (en) | 2008-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200154804U Expired - Fee Related CN201119120Y (en) | 2007-10-24 | 2007-10-24 | Improved printed circuit board for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201119120Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010108361A1 (en) * | 2009-03-23 | 2010-09-30 | Shen Lihao | Pcb including heat radiating structure with heat conducting and heat radiating ink |
| CN102548229A (en) * | 2010-12-29 | 2012-07-04 | 陆富强 | Embedded type circuit distribution method and structure |
| CN102655711A (en) * | 2012-05-17 | 2012-09-05 | 宁波市佰仕电器有限公司 | Novel circuit board |
| WO2013071548A1 (en) * | 2011-11-18 | 2013-05-23 | 深圳市华星光电技术有限公司 | Backlight system |
| WO2013071553A1 (en) * | 2011-11-18 | 2013-05-23 | 深圳市华星光电技术有限公司 | Flat-panel display device and stereo display device |
| US8708512B2 (en) | 2011-11-18 | 2014-04-29 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight system |
| CN111315108A (en) * | 2018-12-12 | 2020-06-19 | 珠海方正科技高密电子有限公司 | Circuit board and electrical equipment |
-
2007
- 2007-10-24 CN CNU2007200154804U patent/CN201119120Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010108361A1 (en) * | 2009-03-23 | 2010-09-30 | Shen Lihao | Pcb including heat radiating structure with heat conducting and heat radiating ink |
| CN102548229A (en) * | 2010-12-29 | 2012-07-04 | 陆富强 | Embedded type circuit distribution method and structure |
| WO2013071548A1 (en) * | 2011-11-18 | 2013-05-23 | 深圳市华星光电技术有限公司 | Backlight system |
| WO2013071553A1 (en) * | 2011-11-18 | 2013-05-23 | 深圳市华星光电技术有限公司 | Flat-panel display device and stereo display device |
| US8708512B2 (en) | 2011-11-18 | 2014-04-29 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight system |
| CN102655711A (en) * | 2012-05-17 | 2012-09-05 | 宁波市佰仕电器有限公司 | Novel circuit board |
| CN111315108A (en) * | 2018-12-12 | 2020-06-19 | 珠海方正科技高密电子有限公司 | Circuit board and electrical equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080917 Termination date: 20111024 |