CN2927106Y - Diode carrier structure of liquid-crystal display device - Google Patents
Diode carrier structure of liquid-crystal display device Download PDFInfo
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- CN2927106Y CN2927106Y CN 200620120641 CN200620120641U CN2927106Y CN 2927106 Y CN2927106 Y CN 2927106Y CN 200620120641 CN200620120641 CN 200620120641 CN 200620120641 U CN200620120641 U CN 200620120641U CN 2927106 Y CN2927106 Y CN 2927106Y
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Abstract
The utility model relates to a diode carrier plate of an LCD displayer, which comprises a bottom layer, a heat conducting layer, an electric conducting layer and an LED. The heat conducting layer and the electric conducting layer can be a single-layer structure or a double-layer structure; a groove is arranged on the heat conducting layer and the electric conducting layer, in which the LED can be arranged. Therefore, not only the cooling problem of the LCD can be solved, but also the process of the LCD production can be simplified and the production cost can be reduced.
Description
Technical field:
The utility model relates to a kind of diode carrying board structure of LCD, refers to a kind ofly except that can effectively improving the heat dissipation problem of LCD especially, and can reach the processing procedure of simplifying LCD and the effect that reduces cost of manufacture simultaneously.
Background technology:
In the flat-panel screens industry, be with Thin Film Transistor-LCD (thin-filmtransistor liquid-crystal display at present, TFT LCD) be main, can be used for computing machine periphery application product, also can be used for middle-size and small-size products such as mobile phone or digital camera, more can be used for large products such as LCD TV.
And Thin Film Transistor-LCD is to belong to non-self luminous technology, so must be dependent on backlight, backlight mainly is with cold-cathode tube (Cold Cathode Fluorescent Lamp at present, CCFL) be main, because cold-cathode tube has mercurous, the following problem that must face environmental protection, and on brightness and color representation, all also be not enough to satisfy the demands of consumers fully, the very important direction of WeiLai Technology development just become so develop new backlight.For in response to the requirement of consumer for LCD TV high brightness and high color representation, except the excitation from colored filter improved, the design of thin-film transistor structure improves, the performance of backlight module also became the main project of requirement.
At present the structure of backlight module can be divided into three kinds of full run-down type+cold-cathode tube light source, side edge type+cold-cathode tube light source and side edge type+led light sources according to the size kenel classification of panel, wherein and the backlight module that full run-down type+cold-cathode tube light source is described in detail in detail be applied in LCD TV and 19 o'clock above LCD usually, and the backlight module of side edge type+cold-cathode tube light source is applied in 19 o'clock following LCD and mobile computers usually, and the backlight module of side edge type+LED source is applied in portable products such as small-medium size mobile phone and PDA usually in addition.
The backlight module of above-mentioned straight-down negative+cold-cathode tube light source, at back side of panel, because cold-cathode tube is directly put, this backlight module must consider that cold-cathode tube can be subjected to the problem of gravity sag with the design of lamp source for it; The cold-cathode tube overmatter has the problem of electromagnetic interference (EMI); And the problem of heat radiation must overcome, and at present exhausted most manufacturer has all overcome these problems, and this backlight module also uses at the LCD TV panel widely.
Because LCD TV is paid attention to color representation especially, hope can bring the audience the most real performance, so more and more higher in the requirement of color saturation.And LED source is owing to possess the colour gamut of broad and do not have the pollution problem of mercury, so also become the rising star of following light source.Sony cooperates with Lumileds, adopts back light source in LED successfully to develop and 46 o'clock two LCD TV at 40 o'clock, peddles in Japan in November, 2004.
The light-emitting diode (LED) backlight module LCD TV of Sony, the LCD TV of 40 o'clock types have been used 325 light-emitting diode (LED) modules, and the LCD TV of 46 o'clock types has been used 450 light-emitting diode (LED) modules.And the technical matters point of light emitting diode maximum is heat dissipation problem at present, when liquid crystal panel designs, in order to solve the LED heat radiating problem, must in module, add fan and assist heat radiation, if heat dissipation problem is not handled well, will have influence on the stability of whole Liquid Crystal Module, at present because add the fan institute energy that consume, also far above the required consumption electric power of cold-cathode tube more.Except the problem of power consumption, owing to must use considerable light-emitting diode (LED) module at large-sized LCD TV panel, to cost also is very large test, because most consumer, all be to wish to buy higher-quality enjoyment the manufacturer of exploitation back light source in LED with identical or lower price, to overcome above-mentioned several problem earlier, just might promote the city on a large scale and account for rate.
Outer electrode fluorescent tube (External Electrode Fluorescent Lamp, EEFL) be that with the traditional tube difference electrode design of outer electrode fluorescent tube is in the fluorescent tube outside, so backlight module can be designed to drive many tubes simultaneously with an inverted rectifier (Inverter), all must not drive by an inverted rectifier like every of traditional tube, therefore electrode can not have the situation of being polluted by metal sputtering and causing loss because of long-time the use, so fluorescent tube can have higher luminescence efficiency.And because electrode design does not externally more have the gas leakage situation, fluorescent tube can have the long life-span.But the problem that meets with is that the optimal drive waveform of outer electrode fluorescent tube is uncertain at present, and owing at present still untappedly go out suitable inverted rectifier, so still can't be promoted to high tube current at present, in addition since electrode outside, the consideration of design space also is an emphasis.
In the exploitation of backlight module light source, (Flat Fluorescent Lamp FLL) is the main project of many manufacturers and researchist exploitation to planar light source always.The employed cold-cathode tube light source of tradition is to belong to line source, in order to deal with the large scale liquid crystal panel in brightness and inhomogeneity requirement, the design of backlight module must be considered the quantity of fluorescent tube, and mechanism's problem that structure arranged etc. are complicated is in the hope of reaching the requirement of quality.But planar light source is with respect to conventional light source, and it has the higher brightness performance, and does not need light guide plate and prismatic lens, can reach the target that cost reduces, and since simple in structure, can robotization assemble, can simplify processing procedure.Use the backlight module material and shorten the assembling processing procedure owing to reduce, should reach the target of cost decline 30%, though planar light source be brightness and material cost all than sidelight source and directly-down light source come the tool competitive edge, so attract liquid crystal panel manufacturer to drop into relevant R﹠D work one after another.
In the competition of following backlight technology, back light source in LED has possessed the qualification of succeeding, but in order more to meet the market law of substitution, consumer's quality improvement that various new technology is brought of taking like a shot, but be difficult to accepting to eliminate old product in order to be higher than the several-fold price of script.So except doing the improvement in heat radiation and luminescence efficiency and stability, must be more competitive on price.Also can not be ignored in the application of this external planar light source, (Field Emission Display, FED) etc. technology also begins to come into one's own at planar light source for electricity slurry, Field Emission Display.
Though above-mentioned located by prior art, all can be applicable to Backlight For Liquid Crystal Display Panels, but cold-cathode tube contains mercury, can face environmental issue, and its brightness and color fail to satisfy user's demand, and the backlight cost of developing at present cost is also too high, also also fail to overcome fully problems such as heat radiation, luminescence efficiency and stability, therefore, required during not realistic making.
The utility model content:
Technical problem to be solved in the utility model is: at the above-mentioned deficiency of prior art, a kind of diode carrying board structure of LCD is provided, except that can effectively improving the heat dissipation problem of LCD, and can reach the processing procedure of simplifying LCD and the effect that reduces cost of manufacture simultaneously.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of diode carrying board structure of LCD, it forms by bottom, heat-conducting layer, conductive layer and light emitting diode are stacked, two sides of this light emitting diode electrically connect with a lead and conductive layer respectively, and be characterized in: described heat-conducting layer and conductive layer can be individual layer or bilayer; Described light emitting diode is arranged on the interior insulation division of described support plate.
Compared with prior art, the utility model has the advantages that: this carrying board structure can effectively improve the heat dissipation problem of LCD, and can simplify the processing procedure of LCD simultaneously and reduce the cost of making.
Description of drawings:
Fig. 1 is the profile status synoptic diagram of the utility model first embodiment.
Fig. 2 is the profile status synoptic diagram of the utility model second embodiment.
Fig. 3 is the profile status synoptic diagram of the utility model the 3rd embodiment.
Fig. 4 is the profile status synoptic diagram of the utility model the 4th embodiment.
Label declaration:
First conductive layer, 12 second heat-conducting layers 13
Notch part 131 second conductive layers 14
Lead 151 bottoms 20
Heat-conducting layer 21 conductive layers 22
Bottom 31 heat-conducting layers 32
Conductive layer 33 grooves 34
Light emitting diode 35 leads 351
Tin paste layer 36 support plates 40
Second heat-conducting layer, 43 conductive layers 44
Groove 45 light emitting diodes 46
Lead 461 tin paste layers 47
Embodiment:
Embodiment 1, see also shown in Figure 1, the utility model is a kind of diode carrying board structure of LCD, it is made of a bottom 10, one first heat-conducting layer 11, one first conductive layer 12, one second heat-conducting layer 13, one second conductive layer 14 and a light emitting diode 15 at least, can reach the processing procedure of simplifying LCD and the effect that reduces cost of manufacture.
The above-mentioned bottom of carrying 10 can be aluminium sheet, copper coin or the copper layer of thickness between between 0.1mm～5mm.
This first heat-conducting layer 11 is laminated on the one side of above-mentioned bottom 10, and this first heat-conducting layer 11 is insulating heat-conductive glue or insulating gel.
This first conductive layer 12 is laminated on the one side of above-mentioned first heat-conducting layer 11, and this first conductive layer 12 can be the copper layer of thickness between between 12um～180um.
This second heat-conducting layer 13 is laminated on the one side of above-mentioned first conductive layer 12, and the centre of this second heat-conducting layer 13 has a notch part 131, and wherein these notch part 131 copper coatings are with as heat conduction usefulness, and this second heat-conducting layer 13 is insulating heat-conductive glue or insulating gel.
This second conductive layer 14 is laminated on the one side of above-mentioned second heat-conducting layer 13, and this second conductive layer 14 is connected with first conductive layer 12 by the notch part 131 of above-mentioned second heat-conducting layer 13, and be respectively equipped with corresponding insulation division 141 in two sides of the corresponding notch part 131 of this second conductive layer 14, this insulation division 141 is a welding resistance printing ink, and this second conductive layer 14 can be the copper layer of thickness between between 12um～180um.
This light emitting diode 15 is laminated on two insulation divisions 141 of above-mentioned second conductive layer 14 by two sides of its bottom, and two sides of this light emitting diode 15 electrically connect with a lead 151 and second conductive layer 14 respectively.In this way, constitute the diode carrying board structure of a brand-new LCD by said structure.
When using, this light emitting diode 15 provides required electric power by the circuit layout of first conductive layer 12, make this light emitting diode 15 send required light source, and when light emitting diode 15 sends light source, make the light emitting diode 15 and second conductive layer 14 produce thermal source simultaneously, this moment, thermal source was directed at first conductive layer 12 by notch part 131, and cooperate second heat-conducting layer 13 to absorb, the thermal source of this first conductive layer 12 is then absorbed by first heat-conducting layer 11, and this thermal source is conducted to bottom 10 carry out the dissipation of thermal source, so, can effectively improve the heat dissipation problem of LCD.
Embodiment 2, see also shown in Figure 2ly, and it is made of a bottom 20, a heat-conducting layer 21, a conductive layer 22 and a light emitting diode 23 at least, can reach the processing procedure of simplifying LCD and the effect that reduces cost of manufacture.
The above-mentioned bottom of carrying 20 can be aluminium sheet, copper coin or the copper layer of thickness between between 0.1mm～5mm.
This heat-conducting layer 21 is laminated on the one side of above-mentioned bottom 20, and this heat-conducting layer 21 can be insulating heat-conductive glue or insulating gel.
This conductive layer 22 is laminated on the one side of above-mentioned heat-conducting layer 21, and the pre-position of this conductive layer 22 is provided with two corresponding insulation divisions 221, and this insulation division 221 is a welding resistance printing ink, and this conductive layer 22 can be the copper layer of thickness between between 12um～180um.
This light emitting diode 23 is laminated on two insulation divisions 221 of above-mentioned conductive layer 22 by two sides of its bottom, and two sides of this light emitting diode 23 electrically connect with a lead 231 and conductive layer 22 respectively.
When using, this light emitting diode 23 provides required electric power by conductive layer 22, make this light emitting diode 23 send required light source, and when light emitting diode 23 sends light source, make light emitting diode 23 and conductive layer 22 produce thermal source simultaneously, at this moment, the thermal source of conductive layer 22 is absorbed by heat-conducting layer 21, and this thermal source is conducted to bottom 20 carry out the dissipation of thermal source, so, can effectively improve the heat dissipation problem of LCD.
Embodiment 3, see also shown in Figure 3ly, and it includes a support plate 30 at least and a light emitting diode 35 constitutes, and can reach the effect of simplifying the LCD processing procedure and reducing cost of manufacture.
The above-mentioned support plate of carrying 30 by a bottom 31, be laminated in heat-conducting layer 32 on bottom 31 one side, and a conductive layer 33 that is laminated on heat-conducting layer 32 one sides constituted with the hot press pressing, this bottom 31 can be aluminium sheet, copper coin or the copper layer of thickness between between 0.1mm～5mm, this heat-conducting layer 32 is insulating heat-conductive glue or insulating gel, this conductive layer 33 can be the copper layer of thickness between between 12um～180um, and on this heat-conducting layer 32 and the conductive layer 33 with laser hole burning or electric paste etching mode be provided with one with bottom 31 one side corresponding groove 34.
This light emitting diode 35 is arranged in the groove 34 of above-mentioned support plate 30, and has a tin paste layer 36 between this light emitting diode 35 and the bottom 31, and electrically connects with a lead 351 and conductive layer 33 respectively in two sides of this light emitting diode 35.
When using, this light emitting diode 35 provides required electric power by conductive layer 33, make this light emitting diode 35 send required light source, and when light emitting diode 35 sends light source, make light emitting diode 35 and conductive layer 33 produce thermal source simultaneously, at this moment, the thermal source of light emitting diode 35 conducts to bottom 31 by tin paste layer 36, and the thermal source of conductive layer 33 is absorbed by heat-conducting layer 32, and equally this thermal source is conducted to bottom 31 and carry out the dissipation of thermal source, so, can effectively improve the heat dissipation problem of LCD.
Embodiment 4, see also shown in Figure 4ly, and it includes a support plate 40 at least and a light emitting diode 46 constitutes, and can reach the effect of simplifying the LCD processing procedure and reducing cost of manufacture.
The support plate of carrying 40 has a bottom 41, one is laminated in first heat-conducting layer 42 on bottom 41 one sides, one is laminated in second heat-conducting layer 43 on first heat-conducting layer, 42 one sides, reach a conductive layer 44 that is laminated on second heat-conducting layer, 43 one sides, this bottom 41 can be the aluminium sheet of thickness between between 0.1mm～5mm, copper coin or copper layer, this is first years old, two heat-conducting layers (42,43) be insulating heat-conductive glue or insulating gel, this conductive layer 44 can be the aluminium sheet of thickness between between 12um～180um, copper coin or copper (layer) paper tinsel, and this first, two heat-conducting layers (42,43) with conductive layer 44 on respectively with mould punching press (or boring) be provided with one with bottom 41 one side corresponding groove 45, and this bottom 41, first, two heat-conducting layers (42,43) be laminated with hot pressing with conductive layer 44.
This light emitting diode 46 is arranged in the groove 45 of above-mentioned support plate, and has a tin paste layer 47 between this light emitting diode 46 and the bottom 41, and electrically connects with a lead 461 and conductive layer 44 respectively in two sides of this light emitting diode 46.
When using, this light emitting diode 46 provides required electric power by the circuit layout of conductive layer 44, make this light emitting diode 46 send required light source, and when light emitting diode 46 sends light source, system makes light emitting diode 46 and conductive layer 44 produce thermal source simultaneously, at this moment, the thermal source of light emitting diode 46 conducts to bottom 41 by tin paste layer 47, and the thermal source of conductive layer 44 is absorbed by first and second heat-conducting layer (42,43), and equally this thermal source is conducted to bottom 31 and carry out the dissipation of thermal source, so, can effectively improve the heat dissipation problem of LCD.
In sum, the diode carrying board structure of the utility model LCD can effectively improve the various shortcoming of prior art, except that can effectively improving the heat dissipation problem of LCD, and can reach the processing procedure of simplifying LCD and the effect that reduces cost of manufacture simultaneously, and then generation can more progressive, more practical, more meet institute's palpus of user, really meet the important document of patented claim, proposed patented claim in accordance with the law.
Only the above only is preferred embodiment of the present utility model, when the scope that can not limit its enforcement with this; So, allly change and modify according to the application's claim and the simple equivalent done of creation description, all should still belong in the scope that this patent contains.
Claims (10)
1, a kind of diode carrying board structure of LCD, it forms by bottom, heat-conducting layer, conductive layer and light emitting diode are stacked, two sides of this light emitting diode electrically connect with a lead and conductive layer respectively, and it is characterized in that: described heat-conducting layer and conductive layer can be individual layer or bilayer.
2, the diode carrying board structure of LCD according to claim 1, it is characterized in that: described heat-conducting layer and conductive layer are bilayer, described heat-conducting layer comprises first heat-conducting layer and second heat-conducting layer, described conductive layer comprises first conductive layer and second conductive layer, and this first heat-conducting layer is laminated on the one side of described bottom; This first conductive layer is laminated on the one side of this first heat-conducting layer; This second heat-conducting layer is laminated on the one side of this first conductive layer, and the centre of this second heat-conducting layer has a notch part; This second conductive layer is laminated on the one side of this second heat-conducting layer, and this second conductive layer is connected with first conductive layer by this notch part, two sides of the corresponding notch part of this second conductive layer are provided with two insulation divisions, and two sides of described light emitting diode bottom are laminated on this insulation division.
3, the diode carrying board structure of LCD according to claim 1, it is characterized in that: described heat-conducting layer and conductive layer are individual layer, this heat-conducting layer is laminated on the base plate, conductive layer is laminated on the heat-conducting layer, the pre-position of conductive layer is provided with two insulation divisions, and two sides of described light emitting diode bottom are laminated on this insulation division.
4, the diode carrying board structure of LCD according to claim 1, it is characterized in that: described heat-conducting layer and conductive layer are individual layer, this heat-conducting layer is laminated on the base plate, conductive layer is laminated on the heat-conducting layer, be provided with groove between heat-conducting layer on the base plate and conductive layer, described light emitting diode is arranged on the interior tin paste layer of this groove.
5, the diode carrying board structure of LCD according to claim 1, it is characterized in that: described heat-conducting layer is for double-deck, conductive layer is an individual layer, this heat-conducting layer comprises first heat-conducting layer and second heat-conducting layer, and this first heat-conducting layer is laminated on the base plate, and second heat-conducting layer is laminated on first heat-conducting layer, and conductive layer is laminated on second heat-conducting layer, be provided with groove between heat-conducting layer on the base plate and conductive layer, described light emitting diode is located on the interior tin paste layer of this groove.
6, according to the diode carrying board structure of claim 2 or 3 or 4 or 5 described LCD, it is characterized in that: described bottom is aluminium sheet, copper coin or the copper layer of thickness between 0.1mm～5mm.
7, according to the diode carrying board structure of claim 2 or 3 or 4 or 5 described LCD, it is characterized in that: described heat-conducting layer is insulating heat-conductive glue or insulating gel.
8, according to the diode carrying board structure of claim 2 or 3 or 4 described LCD, it is characterized in that: described conductive layer is the copper layer of thickness between between 12um～180um.
9, the diode carrying board structure of LCD according to claim 5 is characterized in that: described conductive layer is aluminium sheet, copper coin or the copper layer/paper tinsel of thickness between between 12um～180um.
10, according to the diode carrying board structure of claim 2 or 3 described LCD, it is characterized in that: described insulation division is a welding resistance printing ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620120641 CN2927106Y (en) | 2006-06-23 | 2006-06-23 | Diode carrier structure of liquid-crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620120641 CN2927106Y (en) | 2006-06-23 | 2006-06-23 | Diode carrier structure of liquid-crystal display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2927106Y true CN2927106Y (en) | 2007-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620120641 Expired - Fee Related CN2927106Y (en) | 2006-06-23 | 2006-06-23 | Diode carrier structure of liquid-crystal display device |
Country Status (1)
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| CN (1) | CN2927106Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101441357B (en) * | 2007-11-23 | 2011-03-16 | 联茂电子股份有限公司 | Luminous module, molding mode |
-
2006
- 2006-06-23 CN CN 200620120641 patent/CN2927106Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101441357B (en) * | 2007-11-23 | 2011-03-16 | 联茂电子股份有限公司 | Luminous module, molding mode |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070725 Termination date: 20120623 |