WO2010108361A1 - Pcb including heat radiating structure with heat conducting and heat radiating ink - Google Patents

Pcb including heat radiating structure with heat conducting and heat radiating ink Download PDF

Info

Publication number
WO2010108361A1
WO2010108361A1 PCT/CN2009/074145 CN2009074145W WO2010108361A1 WO 2010108361 A1 WO2010108361 A1 WO 2010108361A1 CN 2009074145 W CN2009074145 W CN 2009074145W WO 2010108361 A1 WO2010108361 A1 WO 2010108361A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
pcb
insulating layer
ink
surface
Prior art date
Application number
PCT/CN2009/074145
Other languages
French (fr)
Chinese (zh)
Inventor
沈李豪
Original Assignee
Shen Lihao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN200920136181.5 priority Critical
Priority to CN2009201361815U priority patent/CN201426214Y/en
Application filed by Shen Lihao filed Critical Shen Lihao
Publication of WO2010108361A1 publication Critical patent/WO2010108361A1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

A printed circuit board including a heat radiating structure with heat conducting and heat radiating ink, comprises a PCB carrier (01), at least one conducting layer (03), at least one surface insulating layer (02 ) including heat conducting and heat radiating ink, and insulating glue layer (08) including heat conducting and heat radiating ink. The upper and lower surface of the insulating glue layer (08) adheres to the conducting layer (03) and the PCB carrier (01) respectively, or adheres to the PCB carrier (01) and the conducting layer (03) respectively, or adheres to the corresponding conducting layers (03), and one surface of the surface insulating layer (02) adheres to the other surface if the conducting layer (03). The PCB may improve heat radiating effect, solve the problems that the carrier or heat radiating apparatus is too heavy, high-cost and complex to be installed, and is suitable for manufacturing rigid and flexible PCBs.

Description

 Including heat dissipation structure with heat conductive and heat dissipating ink

 PCB board technology field

 The utility model relates to the field of printed circuit boards for electronic circuits, in particular to a printed circuit board having a heat dissipation structure capable of conducting heat and dissipating ink.

Background technique

 PCB (Printed Circuie Board) is an abbreviation of printed circuit board. Generally, a conductive pattern which is formed on a dielectric material according to a predetermined design, made into a printed circuit, a printed component or a combination of the two is called a printed circuit. A conductive pattern that provides an electrical connection between components on an insulative substrate, referred to as a printed circuit. With the continuous development of technology, the PCB board is multi-layered, highly intensive development, and the technical update of embedded resistors and capacitors makes the heat conduction and heat dissipation performance of the electronic circuit PCB board have higher and higher requirements, so the electronic circuit PCB The problem of heat dissipation of the board has always been an urgent problem to be solved. In the current PCB manufacturing process made by the traditional process, the heat dissipation function of the PCB board is realized by the carrier material of the PCB board or by an additional heat sink fin housing or a fan.

 The conventional PCB board is shown in Figure 1. The PCB board is connected to the heat-dissipating carrier board by an insulating layer. The carrier board is connected to a heat-dissipating fin or other heat-dissipating device. Although the carrier board is a heat-conducting metal, it itself Thermal conduction heat dissipation, but the heat dissipation speed is relatively slow, and other heat dissipation devices are needed to complete the heat dissipation during the electrical connection process; therefore, the heat dissipation structure of the conventional PCB board is not only complicated to install, high in cost, but also inconvenient to carry and repair, and The less than ideal cooling effect makes it very limited.

Utility model content

 In view of the problem that the heat dissipation effect of the conventional PCB board is not ideal, the utility model discloses a PCB board having a heat dissipation structure capable of heat conduction and heat dissipation ink, which has the characteristics of simple structure, convenient manufacture and good heat dissipation effect.

In order to achieve the above object, the utility model relates to a PCB board with a heat dissipation structure capable of heat conduction and heat dissipation ink, and the technical scheme thereof is as follows: The present invention relates to a PCB board having a heat dissipating structure capable of thermally and thermally dissipating ink, comprising a PCB carrier board and at least one conductive layer: further comprising at least one surface insulating layer capable of thermally dissipating heat-dissipating ink and at least one heat-dissipating heat-dissipating ink An insulating layer; the upper and lower sides of the insulating layer are respectively bonded to the conductive layer and the PCB carrier, or the upper and lower sides of the insulating layer are respectively bonded to the PCB carrier and the conductive layer Together, the upper and lower sides of the insulating layer are respectively bonded to the corresponding conductive layer; one side of the surface insulating layer is bonded to the other side of the corresponding conductive layer.

 The PCB carrier material may be aluminum, copper, ceramic, plastic, glass or glass cloth. The surface of the PCB carrier may be a flat surface or a curved surface.

 Compared with the prior art, the utility model has the advantages that: the utility model not only improves the problem of poor heat dissipation effect of the conventional PCB board, but also solves the problems of excessive weight, high cost and complicated installation of the carrier board or the heat sink device, It also provides a structure that is operability, direct heat dissipation, high efficiency, and suitable for rigid PCB boards and flexible PCB boards (FPCB).

DRAWINGS

 Figure 1 is a conventional PCB junction (cross-sectional view);

 Figure 2 is a schematic view (cross-sectional view) of the single panel structure of the present invention;

 Figure 3 is a schematic view (cross-sectional view) of the double-sided or multi-layer board of the present invention;

 4 is a schematic view (cross-sectional view) of a heat dissipation mechanism of a preferred embodiment of the present invention.

 In the figure: 01, PCB carrier, 02, surface insulation, 03, conductive layer, 04, traditional insulating layer, 05, traditional ink surface insulation, 07, heat sink, 08, insulating layer.

detailed description

As shown in FIG. 2 and FIG. 3, a PCB board having a heat dissipation structure capable of thermally and thermally dissipating ink includes a PCB carrier board 01 and at least one conductive layer 03, and is characterized in that: at least one heat-dissipating heat-dissipating ink is further included. a surface insulating layer 02 and at least one insulating layer 08 capable of thermally dissipating heat-dissipating ink; the upper and lower sides of the insulating layer 08 are respectively bonded to the conductive layer 03 and the PCB carrier 01, or the insulating layer 08 is upper and lower The two sides are respectively bonded to the PCB carrier 01 and the conductive layer 03, or the upper and lower sides of the insulating layer 08 are respectively bonded to the corresponding conductive layer 03; One surface of the surface insulating layer 02 is bonded to the other surface of the corresponding conductive layer 03.

 As shown in FIG. 2, the utility model relates to a PCB board having a heat dissipation structure capable of heat conduction and heat dissipation ink, wherein a single panel structure comprises a PCB carrier board 01 and a conductive layer 03, and further comprises a heat dissipation layer. a surface insulating layer 02 of the ink and an insulating layer 08 capable of thermally dissipating the heat-dissipating ink; the upper and lower sides of the insulating layer 08 are respectively bonded to the conductive layer 03 and the PCB carrier 01, and the surface insulating layer One side of the 02 is bonded to the other side of the conductive layer 03.

 As shown in FIG. 3, the present invention is a PCB board having a heat dissipation structure capable of thermally and thermally dissipating ink, and another double panel or multi-layer board structure including a PCB carrier board 01 and two or more conductive layers 03 And a surface insulating layer 02 of two or more layers of heat-dissipating heat-dissipating ink and two or more layers of insulating rubber layer 08 capable of heat-dissipating heat-dissipating ink; the upper and lower sides of the insulating layer 08 and the conductive layer 03 and the PCB carrier 01 respectively Correspondingly bonded together, or the upper and lower sides of the insulating adhesive layer 08 are respectively bonded to the PCB carrier 01 and the conductive layer 03, or the upper and lower sides of the insulating adhesive layer 08 are respectively bonded to the corresponding conductive layer 03. One side of the surface insulating layer 02 is bonded to the other surface of the corresponding conductive layer 03.

 The material of the PCB carrier 01 may be aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy copper clad sheet FR-4), and it may be a rigid or sturdy material. The surface of the plate 01 can be a flat surface or a curved surface of any shape.

 The surface insulating layer 02 and the heat-dissipating heat-dissipating ink of the insulating layer 08 are prepared by insulating and heat-dissipating heat-dissipating materials, or may be obtained by adding a heat-dissipating heat-dissipating material to a conventional PCB board ink. The new type relies on the heat-dissipating heat-dissipating ink to conduct heat between the layers and dissipate heat from the surface of the board to the air to achieve heat balance.

 After the conductive layer 03 is energized, a part of the heat generated by the conductive layer 03 is absorbed by the surface insulating layer 02 (ie, heat-dissipating heat-dissipating ink) and directly radiated into the air, and another part of the heat passes through the insulating layer 08 (ie, heat conduction). The heat-dissipating ink) is absorbed and transmitted to the PCB carrier board 01 below to diverge (see Figure 4).

The surface insulating layer 02 and the insulating adhesive layer 08 can be directly used for coating or spraying as a conventional PCB board ink, and can be conveniently applied to the PCB carrier board 01 of any surface; The conductive layer 03 is used as a surface insulating layer (ie, a solder resist layer), and may also be laminated as an insulating layer of a single-sided or multi-layer PCB board, and more preferably in the conductive layer of the entire surface wireless path. It is coated and used as a heat sink.

 The material of the PCB carrier 01 may be aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy resin copper clad sheet FR-4), and it may be a rigid or flexible material. When it is a rigid material, the surface can be a flat surface, a curved surface or an irregular surface 06 (Fig. 4); when it is a flexible material, it can be used not only for the installation of flat, differently shaped curved carriers but also for direct and different The connection between the shape and type of PCB board can also conduct heat and heat at the same time; it should have high toughness and is not easy to break.

 As can be seen from the above, the present scheme describes a PCB board which has good heat conduction and heat dissipation performance, is easy to install, and has a simple structure, and can well solve the heat dissipation defects existing in the prior art.

 The above-described embodiments are merely preferred embodiments of the present invention, and are not intended to be exhaustive. Any minor changes or modifications should be considered as protection of the present invention without departing from the inventive concept. Within the scope.

Claims

Claim
A PCB board having a heat dissipating structure capable of thermally and thermally dissipating ink, comprising a PCB carrier board (01) and at least one conductive layer (03); and characterized by: further comprising at least one surface insulating layer capable of thermally dissipating heat-dissipating ink (02) and at least one insulating layer (08) capable of thermally dissipating heat-dissipating ink; the upper and lower sides of the insulating layer (08) are respectively bonded to the conductive layer (03) and the PCB carrier (01), respectively The upper and lower sides of the insulating layer (08) are respectively bonded to the PCB carrier (01) and the conductive layer (03), or the upper and lower sides of the insulating layer (08) are respectively adhered to the corresponding conductive layer (03). Connected together; one side of the surface insulating layer (02) is bonded to the other side of the corresponding conductive layer (03).
 2 . The PCB of claim 1 , wherein the PCB carrier ( 01 ) material is aluminum, copper, ceramic, plastic, glass or Glass cloth base.
 3. A PCB according to claim 1, wherein the surface of the PCB carrier (01) is planar or curved.
PCT/CN2009/074145 2009-03-23 2009-09-23 Pcb including heat radiating structure with heat conducting and heat radiating ink WO2010108361A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200920136181.5 2009-03-23
CN2009201361815U CN201426214Y (en) 2009-03-23 2009-03-23 PCB with radiating structure having heat-conducting and heat-radiating printing ink

Publications (1)

Publication Number Publication Date
WO2010108361A1 true WO2010108361A1 (en) 2010-09-30

Family

ID=42025672

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2009/074145 WO2010108361A1 (en) 2009-03-23 2009-09-23 Pcb including heat radiating structure with heat conducting and heat radiating ink

Country Status (2)

Country Link
CN (1) CN201426214Y (en)
WO (1) WO2010108361A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10133636B2 (en) 2013-03-12 2018-11-20 Formulus Black Corporation Data storage and retrieval mediation system and methods for using same
US9304703B1 (en) 2015-04-15 2016-04-05 Symbolic Io Corporation Method and apparatus for dense hyper IO digital retention
US10061514B2 (en) 2015-04-15 2018-08-28 Formulus Black Corporation Method and apparatus for dense hyper IO digital retention
CN104968140B (en) * 2015-06-10 2018-08-10 江西鑫力华数码科技有限公司 Flexible folding wiring board
USD742887S1 (en) 2015-07-22 2015-11-10 Symbolic Io Corporation Tray
CN105822911A (en) * 2016-05-10 2016-08-03 深圳市瑞梓光电科技有限公司 Lamp
WO2019126072A1 (en) 2017-12-18 2019-06-27 Formulus Black Corporation Random access memory (ram)-based computer systems, devices, and methods

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900602A (en) * 1987-12-18 1990-02-13 Nippon Cmk Corp. Printed wiring board
US5326623A (en) * 1992-01-28 1994-07-05 Kabushiki Kaisha Toshiba Circuit board
JP2006140377A (en) * 2004-11-15 2006-06-01 Matsushita Electric Ind Co Ltd Sheet-form circuit board
WO2007109474A2 (en) * 2006-03-17 2007-09-27 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
CN200973203Y (en) * 2006-11-09 2007-11-07 佳总兴业股份有限公司 Printed circuit board structure of LED
CN201119120Y (en) * 2007-10-24 2008-09-17 陈永丰;沈志豪 Improved printed circuit board for LED

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900602A (en) * 1987-12-18 1990-02-13 Nippon Cmk Corp. Printed wiring board
US5326623A (en) * 1992-01-28 1994-07-05 Kabushiki Kaisha Toshiba Circuit board
JP2006140377A (en) * 2004-11-15 2006-06-01 Matsushita Electric Ind Co Ltd Sheet-form circuit board
WO2007109474A2 (en) * 2006-03-17 2007-09-27 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
CN200973203Y (en) * 2006-11-09 2007-11-07 佳总兴业股份有限公司 Printed circuit board structure of LED
CN201119120Y (en) * 2007-10-24 2008-09-17 陈永丰;沈志豪 Improved printed circuit board for LED

Also Published As

Publication number Publication date
CN201426214Y (en) 2010-03-17

Similar Documents

Publication Publication Date Title
CN1191742C (en) Heat transfer substrate and method for mfg. same
DE102007057533B4 (en) Heat sink, method for manufacturing a heat sink and printed circuit board with heat sink
KR100912051B1 (en) Printed board and printed board manuafctruing method
CN101379894B (en) Printed circuit board with additional functional elements, method of production and use
KR20080102300A (en) Led with integral thermal via
JP3312723B2 (en) Heat conductive sheet, method of manufacturing the same, heat conductive substrate using the same, and method of manufacturing the same
US20070010086A1 (en) Circuit board with a through hole wire and manufacturing method thereof
JP5947400B2 (en) Method for manufacturing metal printed circuit board
KR101014418B1 (en) Board for an electronic parts and lighting unit included the board
US7057896B2 (en) Power module and production method thereof
CN203748098U (en) Flexible circuit board structure improving heat dissipation performance of flashlight of camera
EP2658356A1 (en) Manufacturing method for printed circuit board with insulated micro radiator
WO1997006658A1 (en) Controller with a housing made of at least two parts
CN203057688U (en) Pcb
US7038310B1 (en) Power module with improved heat dissipation
JP5167516B1 (en) Component-embedded substrate, manufacturing method thereof, and component-embedded substrate mounting body
US7295441B1 (en) Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe
EP1850647A1 (en) Multilayer printed wiring board
CN101556941B (en) Heat radiation structure of surface mounting high-power element
WO2004068923A1 (en) Metal core multilayer printed wiring board
WO2009020169A1 (en) Method for producing wiring board and wiring board
JP2010109036A (en) Printed circuit board and circuit device
CN101592322A (en) LED packaging method for high-power LED lighting fixtures
JP4421081B2 (en) Power module and manufacturing method thereof
JP2014165486A (en) Power device module and manufacturing method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09842095

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase in:

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09842095

Country of ref document: EP

Kind code of ref document: A1