WO2010108361A1 - Pcb including heat radiating structure with heat conducting and heat radiating ink - Google Patents

Pcb including heat radiating structure with heat conducting and heat radiating ink Download PDF

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Publication number
WO2010108361A1
WO2010108361A1 PCT/CN2009/074145 CN2009074145W WO2010108361A1 WO 2010108361 A1 WO2010108361 A1 WO 2010108361A1 CN 2009074145 W CN2009074145 W CN 2009074145W WO 2010108361 A1 WO2010108361 A1 WO 2010108361A1
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WO
WIPO (PCT)
Prior art keywords
heat
pcb
ink
insulating layer
dissipating
Prior art date
Application number
PCT/CN2009/074145
Other languages
French (fr)
Chinese (zh)
Inventor
沈李豪
Original Assignee
Shen Lihao
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Publication date
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Publication of WO2010108361A1 publication Critical patent/WO2010108361A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the utility model relates to the field of printed circuit boards for electronic circuits, in particular to a printed circuit board having a heat dissipation structure capable of conducting heat and dissipating ink.
  • PCB Printed Circuie Board
  • a conductive pattern which is formed on a dielectric material according to a predetermined design, made into a printed circuit, a printed component or a combination of the two is called a printed circuit.
  • the PCB board is multi-layered, highly intensive development, and the technical update of embedded resistors and capacitors makes the heat conduction and heat dissipation performance of the electronic circuit PCB board have higher and higher requirements, so the electronic circuit PCB
  • the problem of heat dissipation of the board has always been an urgent problem to be solved.
  • the heat dissipation function of the PCB board is realized by the carrier material of the PCB board or by an additional heat sink fin housing or a fan.
  • the conventional PCB board is shown in Figure 1.
  • the PCB board is connected to the heat-dissipating carrier board by an insulating layer.
  • the carrier board is connected to a heat-dissipating fin or other heat-dissipating device.
  • the carrier board is a heat-conducting metal, it itself Thermal conduction heat dissipation, but the heat dissipation speed is relatively slow, and other heat dissipation devices are needed to complete the heat dissipation during the electrical connection process; therefore, the heat dissipation structure of the conventional PCB board is not only complicated to install, high in cost, but also inconvenient to carry and repair, and The less than ideal cooling effect makes it very limited.
  • the utility model discloses a PCB board having a heat dissipation structure capable of heat conduction and heat dissipation ink, which has the characteristics of simple structure, convenient manufacture and good heat dissipation effect.
  • the utility model relates to a PCB board with a heat dissipation structure capable of heat conduction and heat dissipation ink, and the technical scheme thereof is as follows:
  • the present invention relates to a PCB board having a heat dissipating structure capable of thermally and thermally dissipating ink, comprising a PCB carrier board and at least one conductive layer: further comprising at least one surface insulating layer capable of thermally dissipating heat-dissipating ink and at least one heat-dissipating heat-dissipating ink An insulating layer; the upper and lower sides of the insulating layer are respectively bonded to the conductive layer and the PCB carrier, or the upper and lower sides of the insulating layer are respectively bonded to the PCB carrier and the conductive layer Together, the upper and lower sides of the insulating layer are respectively bonded to the corresponding conductive layer; one side of the surface insulating layer is bonded to the other
  • the PCB carrier material may be aluminum, copper, ceramic, plastic, glass or glass cloth.
  • the surface of the PCB carrier may be a flat surface or a curved surface.
  • the utility model has the advantages that: the utility model not only improves the problem of poor heat dissipation effect of the conventional PCB board, but also solves the problems of excessive weight, high cost and complicated installation of the carrier board or the heat sink device, It also provides a structure that is operability, direct heat dissipation, high efficiency, and suitable for rigid PCB boards and flexible PCB boards (FPCB).
  • Figure 1 is a conventional PCB junction (cross-sectional view);
  • Figure 2 is a schematic view (cross-sectional view) of the single panel structure of the present invention.
  • Figure 3 is a schematic view (cross-sectional view) of the double-sided or multi-layer board of the present invention.
  • FIG. 4 is a schematic view (cross-sectional view) of a heat dissipation mechanism of a preferred embodiment of the present invention.
  • a PCB board having a heat dissipation structure capable of thermally and thermally dissipating ink includes a PCB carrier board 01 and at least one conductive layer 03, and is characterized in that: at least one heat-dissipating heat-dissipating ink is further included.
  • the utility model relates to a PCB board having a heat dissipation structure capable of heat conduction and heat dissipation ink, wherein a single panel structure comprises a PCB carrier board 01 and a conductive layer 03, and further comprises a heat dissipation layer.
  • the present invention is a PCB board having a heat dissipation structure capable of thermally and thermally dissipating ink, and another double panel or multi-layer board structure including a PCB carrier board 01 and two or more conductive layers 03 And a surface insulating layer 02 of two or more layers of heat-dissipating heat-dissipating ink and two or more layers of insulating rubber layer 08 capable of heat-dissipating heat-dissipating ink; the upper and lower sides of the insulating layer 08 and the conductive layer 03 and the PCB carrier 01 respectively Correspondingly bonded together, or the upper and lower sides of the insulating adhesive layer 08 are respectively bonded to the PCB carrier 01 and the conductive layer 03, or the upper and lower sides of the insulating adhesive layer 08 are respectively bonded to the corresponding conductive layer 03.
  • One side of the surface insulating layer 02 is bonded to the other surface of the corresponding conductive layer 03.
  • the material of the PCB carrier 01 may be aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy copper clad sheet FR-4), and it may be a rigid or sturdy material.
  • the surface of the plate 01 can be a flat surface or a curved surface of any shape.
  • the surface insulating layer 02 and the heat-dissipating heat-dissipating ink of the insulating layer 08 are prepared by insulating and heat-dissipating heat-dissipating materials, or may be obtained by adding a heat-dissipating heat-dissipating material to a conventional PCB board ink.
  • the new type relies on the heat-dissipating heat-dissipating ink to conduct heat between the layers and dissipate heat from the surface of the board to the air to achieve heat balance.
  • the conductive layer 03 After the conductive layer 03 is energized, a part of the heat generated by the conductive layer 03 is absorbed by the surface insulating layer 02 (ie, heat-dissipating heat-dissipating ink) and directly radiated into the air, and another part of the heat passes through the insulating layer 08 (ie, heat conduction).
  • the heat-dissipating ink) is absorbed and transmitted to the PCB carrier board 01 below to diverge (see Figure 4).
  • the surface insulating layer 02 and the insulating adhesive layer 08 can be directly used for coating or spraying as a conventional PCB board ink, and can be conveniently applied to the PCB carrier board 01 of any surface;
  • the conductive layer 03 is used as a surface insulating layer (ie, a solder resist layer), and may also be laminated as an insulating layer of a single-sided or multi-layer PCB board, and more preferably in the conductive layer of the entire surface wireless path. It is coated and used as a heat sink.
  • the material of the PCB carrier 01 may be aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy resin copper clad sheet FR-4), and it may be a rigid or flexible material.
  • the surface can be a flat surface, a curved surface or an irregular surface 06 (Fig. 4); when it is a flexible material, it can be used not only for the installation of flat, differently shaped curved carriers but also for direct and different
  • the connection between the shape and type of PCB board can also conduct heat and heat at the same time; it should have high toughness and is not easy to break.
  • the present scheme describes a PCB board which has good heat conduction and heat dissipation performance, is easy to install, and has a simple structure, and can well solve the heat dissipation defects existing in the prior art.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A printed circuit board including a heat radiating structure with heat conducting and heat radiating ink, comprises a PCB carrier (01), at least one conducting layer (03), at least one surface insulating layer (02 ) including heat conducting and heat radiating ink, and insulating glue layer (08) including heat conducting and heat radiating ink. The upper and lower surface of the insulating glue layer (08) adheres to the conducting layer (03) and the PCB carrier (01) respectively, or adheres to the PCB carrier (01) and the conducting layer (03) respectively, or adheres to the corresponding conducting layers (03), and one surface of the surface insulating layer (02) adheres to the other surface if the conducting layer (03). The PCB may improve heat radiating effect, solve the problems that the carrier or heat radiating apparatus is too heavy, high-cost and complex to be installed, and is suitable for manufacturing rigid and flexible PCBs.

Description

包括具有可导热及散热油墨的散热结构  Including heat dissipation structure with heat conductive and heat dissipating ink
的 PCB板 技术领域  PCB board technology field
本实用新型涉及电子电路印制线路板领域， 尤其涉及一种具有可导热及 散热油墨的散热结构的印制线路板。  The utility model relates to the field of printed circuit boards for electronic circuits, in particular to a printed circuit board having a heat dissipation structure capable of conducting heat and dissipating ink.
背景技术 Background technique
PCB(Printed Circuie Board)是印制线路板的简称， 通常把在绝缘材上， 按预定设计， 制成印制线路、 印制元件或两者组合而成的导电图形称为印 制电路， 而在绝缘基材上提供元器件之间电气连接的导电图形， 称为印制 线路。 随着科技的不断发展， PCB板向多层， 高密集发展， 以及埋入电阻、 电容的技术更新， 使得对电子电路 PCB板的导热散热性能有了越来越高的要 求， 所以电子电路 PCB板的散热问题一直都是亟待解决的问题。 就目前的市 面上传统工艺制作出来的 PCB板产品，其导热散热功能依靠 PCB板的载板材 质或者是附加散热鳍片式壳体或风扇来实现。  PCB (Printed Circuie Board) is an abbreviation of printed circuit board. Generally, a conductive pattern which is formed on a dielectric material according to a predetermined design, made into a printed circuit, a printed component or a combination of the two is called a printed circuit. A conductive pattern that provides an electrical connection between components on an insulative substrate, referred to as a printed circuit. With the continuous development of technology, the PCB board is multi-layered, highly intensive development, and the technical update of embedded resistors and capacitors makes the heat conduction and heat dissipation performance of the electronic circuit PCB board have higher and higher requirements, so the electronic circuit PCB The problem of heat dissipation of the board has always been an urgent problem to be solved. In the current PCB manufacturing process made by the traditional process, the heat dissipation function of the PCB board is realized by the carrier material of the PCB board or by an additional heat sink fin housing or a fan.
传统的 PCB板如图 1所示， 该 PCB板由绝缘胶层连接可散热的载板， 再 由载板衔接可导热散热的散热鳍片或者其它散热装置， 虽然载板是导热金属, 本身起着导热散热作用， 但是散热速度相对较慢， 在电器连接过程中还需依 靠其它的散热装置来完成散热； 所以传统 PCB板的散热结构不但安装复杂、 成本高、 而且不便于携带和修复、 以及不太理想的散热效果使其受到很大的 局限。  The conventional PCB board is shown in Figure 1. The PCB board is connected to the heat-dissipating carrier board by an insulating layer. The carrier board is connected to a heat-dissipating fin or other heat-dissipating device. Although the carrier board is a heat-conducting metal, it itself Thermal conduction heat dissipation, but the heat dissipation speed is relatively slow, and other heat dissipation devices are needed to complete the heat dissipation during the electrical connection process; therefore, the heat dissipation structure of the conventional PCB board is not only complicated to install, high in cost, but also inconvenient to carry and repair, and The less than ideal cooling effect makes it very limited.
实用新型内容 Utility model content
针对传统 PCB板的散热效果不理想的问题， 本实用新型公开一种具有可 导热及散热油墨的散热结构的 PCB板， 其具有结构简单、 制作方便及散热效 果好的特点。  In view of the problem that the heat dissipation effect of the conventional PCB board is not ideal, the utility model discloses a PCB board having a heat dissipation structure capable of heat conduction and heat dissipation ink, which has the characteristics of simple structure, convenient manufacture and good heat dissipation effect.
为了实现上述目的， 本实用新型一种具有可导热及散热油墨的散热结构 的 PCB板， 其技术方案如下： 构造本实用新型一种具有可导热及散热油墨的散热结构的 PCB板， 包括 一 PCB载板及至少一导电层： 还包括至少一可导热散热油墨的表面绝缘层及 至少一可导热散热油墨的绝缘胶层； 所述绝缘胶层上下两面分别与所述导电 层及所述 PCB载体对应粘接在一起， 或者所述绝缘胶层上下两面分别与所述 PCB载体及所述导电层对应粘接在一起， 或者所述绝缘胶层上下两面分别皆 与对应的所述导电层粘接在一起； 所述表面绝缘层的一面与对应的所述导电 层的另一面粘接在一起。 In order to achieve the above object, the utility model relates to a PCB board with a heat dissipation structure capable of heat conduction and heat dissipation ink, and the technical scheme thereof is as follows: The present invention relates to a PCB board having a heat dissipating structure capable of thermally and thermally dissipating ink, comprising a PCB carrier board and at least one conductive layer: further comprising at least one surface insulating layer capable of thermally dissipating heat-dissipating ink and at least one heat-dissipating heat-dissipating ink An insulating layer; the upper and lower sides of the insulating layer are respectively bonded to the conductive layer and the PCB carrier, or the upper and lower sides of the insulating layer are respectively bonded to the PCB carrier and the conductive layer Together, the upper and lower sides of the insulating layer are respectively bonded to the corresponding conductive layer; one side of the surface insulating layer is bonded to the other side of the corresponding conductive layer.
所述 PCB载板材料可为铝、 铜、 陶瓷、 塑料、 玻璃或者是玻璃布基。 所述 PCB载板表面可为平面或曲面。  The PCB carrier material may be aluminum, copper, ceramic, plastic, glass or glass cloth. The surface of the PCB carrier may be a flat surface or a curved surface.
本实用新型与现有公知技术相比， 其优点在于： 其不仅改善了惯用 PCB 板散热效果不佳的问题， 同时亦解决了载板或散热装置重量过大、 成本高、 安装繁杂等问题， 并提供了一种可操作性强， 散热直接、 效率好、 同时适用 于刚性 PCB板和柔性 PCB板 （FPCB) 制作的结构型式。  Compared with the prior art, the utility model has the advantages that: the utility model not only improves the problem of poor heat dissipation effect of the conventional PCB board, but also solves the problems of excessive weight, high cost and complicated installation of the carrier board or the heat sink device, It also provides a structure that is operability, direct heat dissipation, high efficiency, and suitable for rigid PCB boards and flexible PCB boards (FPCB).
附图说明 DRAWINGS
图 1是传统 PCB板结 （剖面图）；  Figure 1 is a conventional PCB junction (cross-sectional view);
图 2是本实用新型单面板结构示意图 （剖面图）；  Figure 2 is a schematic view (cross-sectional view) of the single panel structure of the present invention;
图 3是本实用新型双面或多层板结构示意图 （剖面图）；  Figure 3 is a schematic view (cross-sectional view) of the double-sided or multi-layer board of the present invention;
图 4是本实用新型较佳实施例之散热机理示意图 （剖面图）。  4 is a schematic view (cross-sectional view) of a heat dissipation mechanism of a preferred embodiment of the present invention.
图中： 01、 PCB载板， 02、 表面绝缘层， 03、 导电层， 04、 传统的绝缘 胶层， 05、 传统油墨表面绝缘层， 07、 散热装置， 08、 绝缘胶层。  In the figure: 01, PCB carrier, 02, surface insulation, 03, conductive layer, 04, traditional insulating layer, 05, traditional ink surface insulation, 07, heat sink, 08, insulating layer.
具体实施方式 detailed description
如图 2、 图 3所示， 一种具有可导热及散热油墨的散热结构的 PCB板， 包括一 PCB载板 01及至少一导电层 03 ; 其特征在于： 还包括至少一可导热 散热油墨的表面绝缘层 02及至少一可导热散热油墨的绝缘胶层 08;所述绝缘 胶层 08上下两面分别与导电层 03及所述 PCB载体 01对应粘接在一起，或者 所述绝缘胶层 08上下两面分别与 PCB载体 01及导电层 03对应粘接在一起， 或者所述绝缘胶层 08上下两面分别皆与对应的导电层 03粘接在一起； 所述 表面绝缘层 02的一面与对应的所述导电层 03的另一面粘接在一起。 As shown in FIG. 2 and FIG. 3, a PCB board having a heat dissipation structure capable of thermally and thermally dissipating ink includes a PCB carrier board 01 and at least one conductive layer 03, and is characterized in that: at least one heat-dissipating heat-dissipating ink is further included. a surface insulating layer 02 and at least one insulating layer 08 capable of thermally dissipating heat-dissipating ink; the upper and lower sides of the insulating layer 08 are respectively bonded to the conductive layer 03 and the PCB carrier 01, or the insulating layer 08 is upper and lower The two sides are respectively bonded to the PCB carrier 01 and the conductive layer 03, or the upper and lower sides of the insulating layer 08 are respectively bonded to the corresponding conductive layer 03; One surface of the surface insulating layer 02 is bonded to the other surface of the corresponding conductive layer 03.
如图 2所示， 本实用新型一种具有可导热及散热油墨的散热结构的 PCB 板， 其中一种为单面板结构， 包括一 PCB载板 01及一导电层 03 ; 还包括一 可导热散热油墨的表面绝缘层 02及一可导热散热油墨的绝缘胶层 08;所述绝 缘胶层 08上下两面分别与所述导电层 03及所述 PCB载体 01对应粘接在一起， 所述表面绝缘层 02的一面与所述导电层 03的另一面粘接在一起。  As shown in FIG. 2, the utility model relates to a PCB board having a heat dissipation structure capable of heat conduction and heat dissipation ink, wherein a single panel structure comprises a PCB carrier board 01 and a conductive layer 03, and further comprises a heat dissipation layer. a surface insulating layer 02 of the ink and an insulating layer 08 capable of thermally dissipating the heat-dissipating ink; the upper and lower sides of the insulating layer 08 are respectively bonded to the conductive layer 03 and the PCB carrier 01, and the surface insulating layer One side of the 02 is bonded to the other side of the conductive layer 03.
如图 3所示， 本实用新型一种具有可导热及散热油墨的散热结构的 PCB 板，其中另一种双面板或多层板结构，包括一 PCB载板 01及两层以上的导电 层 03;还包括两层以上的可导热散热油墨的表面绝缘层 02及两层以上的可导 热散热油墨的绝缘胶层 08; 所述绝缘胶层 08上下两面分别与导电层 03及所 述 PCB载体 01对应粘接在一起， 或者所述绝缘胶层 08上下两面分别与 PCB 载体 01及导电层 03对应粘接在一起， 或者所述绝缘胶层 08上下两面分别皆 与对应的导电层 03粘接在一起； 所述表面绝缘层 02的一面与对应的所述导 电层 03的另一面粘接在一起。  As shown in FIG. 3, the present invention is a PCB board having a heat dissipation structure capable of thermally and thermally dissipating ink, and another double panel or multi-layer board structure including a PCB carrier board 01 and two or more conductive layers 03 And a surface insulating layer 02 of two or more layers of heat-dissipating heat-dissipating ink and two or more layers of insulating rubber layer 08 capable of heat-dissipating heat-dissipating ink; the upper and lower sides of the insulating layer 08 and the conductive layer 03 and the PCB carrier 01 respectively Correspondingly bonded together, or the upper and lower sides of the insulating adhesive layer 08 are respectively bonded to the PCB carrier 01 and the conductive layer 03, or the upper and lower sides of the insulating adhesive layer 08 are respectively bonded to the corresponding conductive layer 03. One side of the surface insulating layer 02 is bonded to the other surface of the corresponding conductive layer 03.
所述 PCB载板 01材料可为铝、铜、陶瓷、塑料、玻璃或者是玻璃布基（环 氧树脂覆铜箔板 FR-4) ,且其可以是刚性或揉性材质，所述 PCB载板 01表面 可为平面或任意形状的曲面。  The material of the PCB carrier 01 may be aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy copper clad sheet FR-4), and it may be a rigid or sturdy material. The surface of the plate 01 can be a flat surface or a curved surface of any shape.
所述表面绝缘层 02及所述绝缘胶层 08的可导热散热油墨为绝缘的及易 导热散热的材料配制而成， 亦可以是在传统 PCB制板油墨中添加导热散热材 料而得， 本实用新型依靠所述导热散热油墨将热量在各层间导热及将电路板 表面的热量散发到空气当中， 而達到熱平衡。  The surface insulating layer 02 and the heat-dissipating heat-dissipating ink of the insulating layer 08 are prepared by insulating and heat-dissipating heat-dissipating materials, or may be obtained by adding a heat-dissipating heat-dissipating material to a conventional PCB board ink. The new type relies on the heat-dissipating heat-dissipating ink to conduct heat between the layers and dissipate heat from the surface of the board to the air to achieve heat balance.
所述导电层 03通电后， 其产生的热量一部分由其所述表面绝缘层 02 (即 可导热散热油墨） 吸收并直接散发到空气当中， 另一部分的热量经所述绝缘 胶层 08 (即导热散热油墨） 吸收后传递给下面的所述 PCB载板 01发散出去 (如图 4)。  After the conductive layer 03 is energized, a part of the heat generated by the conductive layer 03 is absorbed by the surface insulating layer 02 (ie, heat-dissipating heat-dissipating ink) and directly radiated into the air, and another part of the heat passes through the insulating layer 08 (ie, heat conduction). The heat-dissipating ink) is absorbed and transmitted to the PCB carrier board 01 below to diverge (see Figure 4).
所述表面绝缘层 02和所述绝缘胶层 08其可如传统的 PCB制板油墨直接 用于涂布或喷涂，可方便地应用于任何表面的 PCB载板 01上；也可在有线路 的所述导电层 03上作为表面绝缘层 （即防焊层）， 也可通过层压作为单双面 或多层 PCB板的绝缘胶层，更可在整面无线路的所述导电层 03上涂布而作为 散热片使用。 The surface insulating layer 02 and the insulating adhesive layer 08 can be directly used for coating or spraying as a conventional PCB board ink, and can be conveniently applied to the PCB carrier board 01 of any surface; The conductive layer 03 is used as a surface insulating layer (ie, a solder resist layer), and may also be laminated as an insulating layer of a single-sided or multi-layer PCB board, and more preferably in the conductive layer of the entire surface wireless path. It is coated and used as a heat sink.
所述 PCB载板 01材料可为铝、铜、陶瓷、塑料、玻璃或者是玻璃布基（环 氧树脂覆铜箔板 FR-4 ) , 且其可以是刚性或柔性材质。 当其为刚性材质时， 表面可为平面、 曲面或不规则表面 06 (如图 4 ) ; 当其为柔性材质时， 不但可 用于平面、不同形状曲面载体的安装并可同时用于直接与不同形状及类型 PCB 板间的连接， 还同时可以导热和散热； 其应有较高韧性、 不易折断。  The material of the PCB carrier 01 may be aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy resin copper clad sheet FR-4), and it may be a rigid or flexible material. When it is a rigid material, the surface can be a flat surface, a curved surface or an irregular surface 06 (Fig. 4); when it is a flexible material, it can be used not only for the installation of flat, differently shaped curved carriers but also for direct and different The connection between the shape and type of PCB board can also conduct heat and heat at the same time; it should have high toughness and is not easy to break.
从以上所述可知， 本方案描述了一种导热散热性能好， 安装方便， 结构 简单的 PCB板， 其能很好的解决现有技术中存在的散热缺陷。  As can be seen from the above, the present scheme describes a PCB board which has good heat conduction and heat dissipation performance, is easy to install, and has a simple structure, and can well solve the heat dissipation defects existing in the prior art.
上述实施例仅是在本实用新型实施中一个较佳的优选方案， 而非限定性 穷举， 在不脱离其发明构思的前提下， 任何微小的变化或修饰均应视为在本 实用新型保护范围之内。  The above-described embodiments are merely preferred embodiments of the present invention, and are not intended to be exhaustive. Any minor changes or modifications should be considered as protection of the present invention without departing from the inventive concept. Within the scope.

Claims

权 利 要 求 书 Claim
1、 一种具有可导热及散热油墨的散热结构的 PCB板， 包括一 PCB载板 (01) 及至少一导电层 （03); 其特征在于： 还包括至少一可导热散热油墨的 表面绝缘层 （02) 及至少一可导热散热油墨的绝缘胶层 （08); 所述绝缘胶层 (08)上下两面分别与导电层（03)及所述 PCB载体（01)对应粘接在一起， 所述绝缘胶层 （08) 上下两面分别与 PCB载体 （01) 及导电层 （03) 对应粘 接在一起， 或者所述绝缘胶层 （08) 上下两面分别皆与对应的导电层 （03) 粘接在一起； 所述表面绝缘层 （02) 的一面与对应的所述导电层 （03) 的另 一面粘接在一起。 A PCB board having a heat dissipating structure capable of thermally and thermally dissipating ink, comprising a PCB carrier board (01) and at least one conductive layer (03); and characterized by: further comprising at least one surface insulating layer capable of thermally dissipating heat-dissipating ink (02) and at least one insulating layer (08) capable of thermally dissipating heat-dissipating ink; the upper and lower sides of the insulating layer (08) are respectively bonded to the conductive layer (03) and the PCB carrier (01), respectively The upper and lower sides of the insulating layer (08) are respectively bonded to the PCB carrier (01) and the conductive layer (03), or the upper and lower sides of the insulating layer (08) are respectively adhered to the corresponding conductive layer (03). Connected together; one side of the surface insulating layer (02) is bonded to the other side of the corresponding conductive layer (03).
2、如权利要求 1所述的一种具有可导热及散热油墨的散热结构的 PCB板， 其特征在于： 所述 PCB载板 （01) 材料可为铝、 铜、 陶瓷、 塑料、 玻璃或者 是玻璃布基。  2 . The PCB of claim 1 , wherein the PCB carrier ( 01 ) material is aluminum, copper, ceramic, plastic, glass or Glass cloth base.
3、如权利要求 1所述的一种具有可导热及散热油墨的散热结构的 PCB板， 其特征在于： 所述 PCB载板 （01) 表面可为平面或曲面。  3. A PCB according to claim 1, wherein the surface of the PCB carrier (01) is planar or curved.
PCT/CN2009/074145 2009-03-23 2009-09-23 Pcb including heat radiating structure with heat conducting and heat radiating ink WO2010108361A1 (en)

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