CN219981322U - Multilayer printed circuit board - Google Patents

Multilayer printed circuit board Download PDF

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Publication number
CN219981322U
CN219981322U CN202320465849.0U CN202320465849U CN219981322U CN 219981322 U CN219981322 U CN 219981322U CN 202320465849 U CN202320465849 U CN 202320465849U CN 219981322 U CN219981322 U CN 219981322U
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CN
China
Prior art keywords
multilayer printed
circuit board
screw
printed circuit
wiring board
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Active
Application number
CN202320465849.0U
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Chinese (zh)
Inventor
陈恺
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Suzhou Huiliyuan Technology Co ltd
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Suzhou Huiliyuan Technology Co ltd
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Priority to CN202320465849.0U priority Critical patent/CN219981322U/en
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Publication of CN219981322U publication Critical patent/CN219981322U/en
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Abstract

The utility model discloses a multilayer printed circuit board, relates to the technical field of multilayer printed circuit boards, and aims to solve the problems that the existing circuit boards are generally combined and fixed in a screw mounting mode, the circuit board is easy to be damaged due to the fact that gravity is applied during mounting, screw holes in the circuit board are easy to abrade along with the increase of the times of dismounting and mounting, and the mounting stability of the follow-up circuit board is affected. A bottom plate is arranged below the multilayer printed circuit board body, and first screw holes are formed in four corners of the outer wall of the multilayer printed circuit board body; further comprises: the plastic expansion pipe is arranged in the first screw hole, the lower end of the plastic expansion pipe extends to the outside of the first screw hole, and a plurality of first tooth blocks are integrally arranged on two sides of the plastic expansion pipe; the second screw hole is arranged below the first screw hole, the second screw hole is aligned with the first screw hole in position, and a plurality of second tooth blocks are arranged on the inner wall of the second screw hole.

Description

Multilayer printed circuit board
Technical Field
The utility model relates to the technical field of multilayer printed circuit boards, in particular to a multilayer printed circuit board.
Background
The printed circuit board is an important electronic component, is a support body of the electronic component, is a carrier for electrically connecting the electronic component, and is called a printed circuit board because it is manufactured by adopting an electronic printing technology; the maintenance of the printed circuit board is an emerging repair industry, and the automation degree of industrial equipment is higher and higher, so that the number of the printed circuit boards in each industry is also higher and higher; the method for manufacturing the multi-layer circuit board generally comprises the steps of firstly manufacturing an inner layer pattern, then manufacturing a single-sided or double-sided substrate by a printing etching method, incorporating the single-sided or double-sided substrate into a designated interlayer, and then heating, pressurizing and bonding the single-sided or double-sided substrate.
However, the existing circuit board is generally assembled and fixed in a screw mounting mode, the mounting structure is easy to apply gravity to damage the circuit board during mounting, screw holes at the circuit board are easy to abrade along with the increase of the times of dismounting and mounting, and the mounting stability of the subsequent circuit board is affected; therefore, the existing demand is not satisfied, and for this reason we propose a multilayer printed wiring board.
Disclosure of Invention
The utility model aims to provide a multilayer printed circuit board, which is used for solving the problems that the existing circuit board proposed in the background art is generally assembled and fixed in a screw mounting mode, the mounting structure is easy to damage a circuit board due to the fact that gravity is applied during mounting, screw holes at the circuit board are easy to abrade along with the increase of the times of dismounting and mounting, and the mounting stability of the subsequent circuit board is affected.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a multilayer printed wiring board comprising: the multi-layer printed circuit board comprises a multi-layer printed circuit board body, wherein a bottom plate is arranged below the multi-layer printed circuit board body, and first screw holes are formed in four corners of the outer wall of the multi-layer printed circuit board body;
further comprises:
the plastic expansion pipe is arranged in the first screw hole, the lower end of the plastic expansion pipe extends to the outside of the first screw hole, and a plurality of first tooth blocks are integrally arranged on two sides of the plastic expansion pipe;
the second screw hole is arranged below the first screw hole, the second screw hole is aligned with the first screw hole in position, a plurality of second tooth blocks are arranged on the inner wall of the second screw hole, and the second tooth blocks are clamped with the first tooth blocks.
Preferably, a hollow expansion cavity is arranged inside the plastic expansion pipe.
Preferably, a limiting block is integrally arranged at the upper end of the plastic expansion pipe, and a through hole is formed in the middle of the limiting block.
Preferably, a screw is installed above the through hole, the lower end of the screw extends into the hollow expansion cavity, and a nut is integrally arranged at the upper end of the screw.
Preferably, the outer wall of stopper lower surface bonds there is the adhesive tape, it has the tear film to bond on the outer wall of adhesive tape, and the stopper bonds with the multilayer printed wiring board body through the adhesive tape.
Preferably, a chip layer is mounted on the outer wall of the upper surface of the multilayer printed circuit board body, and heat conduction silicone grease is bonded above the chip layer.
Preferably, an insert radiator is arranged above the heat-conducting silicone grease.
Preferably, a heat-conducting silica gel pad is adhered between the multilayer printed circuit board body and the bottom plate.
Preferably, a heat-conducting aluminum plate is arranged below the heat-conducting silica gel pad, and a heat-dissipating grid is arranged below the heat-conducting aluminum plate.
Preferably, the four corners of the outer wall of the bottom plate are respectively provided with a third screw hole.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the plastic expansion pipe, the first tooth block, the hollow expansion cavity, the second tooth block and the screw rod are arranged to achieve the effect of combined installation, specifically, before installation, the plastic expansion pipe is inserted into the first screw hole in advance, the limiting block is adhered and fixed on the circuit board, the second screw hole at the bottom plate is aligned with the plastic expansion pipe, the extension end at the lower end of the plastic expansion pipe is inserted into the second screw hole, then the screw rod is inserted into the hollow expansion cavity from the through hole, the hollow expansion cavity is extruded by the screw rod in the inserting process, the two sides of the hollow expansion cavity are expanded, the expanded first tooth block is clamped with the second tooth block, the lower end of the plastic expansion pipe is fixed in the second screw hole, the effect of combined installation is achieved, the multilayer printed circuit board can be quickly installed and detached through the structure, the circuit board is not damaged due to the fact that gravity is applied in the installing process, the plastic expansion pipe is not easy to wear, and the service life of the printed circuit board is prolonged.
2. The heat conduction silicone grease is used for playing the effect of upwards conducting heat at the chip layer, the inserting sheet radiator is used for outwards radiating the heat conducted at the heat conduction silicone grease, the radiating effect is improved, the heat conduction silicone pad is used for downwards conducting the heat of the whole circuit board, the heat conduction aluminum plate has good heat conductivity, the heat conducted to the lower side can be continuously transferred, the heat is radiated from the radiating grid, and the radiating effect is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of a partial structure of a plastic expansion pipe according to the present utility model;
FIG. 3 is a schematic view of a partial structure of a stopper according to the present utility model;
FIG. 4 is a schematic view of the partial structure of the multilayer printed wiring board body of the present utility model;
in the figure: 1. a multilayer printed wiring board body; 2. a bottom plate; 3. a first screw hole; 4. a plastic expansion tube; 5. a first tooth block; 6. a hollow expansion chamber; 7. a second screw hole; 8. a second tooth block; 9. a limiting block; 10. a screw; 11. a screw cap; 12. a through hole; 13. tearing the film; 14. sticking a tape; 15. an insert radiator; 16. heat conductive silicone grease; 17. a chip layer; 18. a thermally conductive silicone pad; 19. a heat conducting aluminum plate; 20. a heat-dissipating grille; 21. and a third screw hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-4, an embodiment of the present utility model is provided: a multilayer printed wiring board comprising: the multi-layer printed circuit board comprises a multi-layer printed circuit board body 1, wherein a bottom plate 2 is arranged below the multi-layer printed circuit board body 1, and first screw holes 3 are formed in four corners of the outer wall of the multi-layer printed circuit board body 1;
further comprises:
the plastic expansion pipe 4 is arranged in the first screw hole 3, the lower end of the plastic expansion pipe 4 extends to the outside of the first screw hole 3, and a plurality of first tooth blocks 5 are integrally arranged on two sides of the plastic expansion pipe 4;
the second screw hole 7 is arranged below the first screw hole 3, the second screw hole 7 is aligned with the first screw hole 3, a plurality of second tooth blocks 8 are arranged on the inner wall of the second screw hole 7, and the second tooth blocks 8 are clamped with the first tooth blocks 5;
a hollow expansion cavity 6 is arranged in the plastic expansion pipe 4;
through setting up plastics expansion pipe 4, first tooth piece 5, cavity inflation chamber 6, second tooth piece 8, screw rod 10 plays the effect of composite installation, specifically, before the installation, insert plastics expansion pipe 4 in advance to first screw 3 in, and fix stopper 9 bonding on the circuit board, second screw 7 and plastics expansion pipe 4 department alignment of bottom plate 2 department, make the extension end of plastics expansion pipe 4 lower extreme insert in second screw 7, then insert the cavity inflation chamber 6 with screw rod 10 by through-hole 12 department, in-process, cavity inflation chamber 6 is extruded by screw rod 10, make it expand to both sides, first tooth piece 5 after the inflation can carry out the block with second tooth piece 8, make plastics expansion pipe 4 lower extreme by fixed in second screw 7, reach the effect of composite installation, through above-mentioned structure, can realize quick installation and dismantle the multilayer printed circuit board, and the installation in-process is difficult for taking place to exert the condition that the gravity leads to the circuit board, and adopt the expansion pipe 4 also difficult wearing and tearing of screw hole, service life of the printed circuit board is obtained to the improvement.
Referring to fig. 2 and 3, a limiting block 9 is integrally provided at the upper end of the plastic expansion tube 4, a through hole 12 is provided at the middle position of the limiting block 9, the limiting block 9 has a limiting effect, the upper end of the limiting block is limited above the first screw hole 3, and the through hole 12 is convenient for the screw 10 to pass through.
Referring to fig. 2 and 3, a screw rod 10 is installed above the through hole 12, the lower end of the screw rod 10 extends into the hollow expansion cavity 6, a nut 11 is integrally arranged at the upper end of the screw rod 10, the screw rod 10 is used for combining with the plastic expansion pipe 4, the screw rod 10 does not directly act on the screw hole, the screw hole is ensured not to be worn, and the nut 11 is convenient for a user to install and detach the screw rod 10.
Referring to fig. 2 and 3, an adhesive tape 14 is adhered to the outer wall of the lower surface of the limiting block 9, a tearing film 13 is adhered to the outer wall of the adhesive tape 14, the limiting block 9 is adhered to the multilayer printed circuit board body 1 through the adhesive tape 14, the adhesive tape 14 is used for being adhered to a circuit board, specifically, the adhesive tape 14 is an insulating tape, the insulativity is improved, and the tearing film 13 has the effect of protecting the inner adhesive tape 14 when not in use.
Referring to fig. 1 and 4, a chip layer 17 is mounted on an outer wall of an upper surface of a multi-layer printed circuit board body 1, and a heat-conducting silicone grease 16 is adhered above the chip layer 17, wherein the heat-conducting silicone grease 16 is used for conducting heat at the chip layer 17 upwards.
Referring to fig. 4, an insert radiator 15 is installed above the heat-conducting silicone grease 16, and the insert radiator 15 is configured to radiate heat conducted at the heat-conducting silicone grease 16 outwards, so as to improve the heat radiation effect.
Referring to fig. 4, a heat-conducting silica gel pad 18 is adhered between the multi-layer printed circuit board body 1 and the bottom plate 2, and the heat-conducting silica gel pad 18 is used for conducting heat of the whole circuit board downwards.
Referring to fig. 4, a heat-conducting aluminum plate 19 is disposed below the heat-conducting silica gel pad 18, a heat-dissipating grid 20 is mounted below the heat-conducting aluminum plate 19, and the heat-conducting aluminum plate 19 has good heat transfer property, and can continuously transfer heat conducted to the lower side, and disperse from the heat-dissipating grid 20, so that the heat-dissipating effect is improved.
Referring to fig. 1, the four corners of the outer wall of the bottom plate 2 are respectively provided with a third screw hole 21, and the third screw holes 21 have the effect of being assembled with other components.
Working principle: when in use, the plastic expansion pipe 4, the first tooth block 5, the hollow expansion cavity 6, the second tooth block 8 and the screw 10 are arranged to achieve the combined installation effect, specifically, before installation, the plastic expansion pipe 4 is inserted into the first screw hole 3 in advance, the limiting block 9 is adhered and fixed on the circuit board, the second screw hole 7 at the bottom plate 2 is aligned with the plastic expansion pipe 4, the extension end of the lower end of the plastic expansion pipe 4 is inserted into the second screw hole 7, then the screw 10 is inserted into the hollow expansion cavity 6 from the through hole 12, in the insertion process, the hollow expansion cavity 6 is extruded by the screw 10 to expand towards two sides, the expanded first tooth block 5 is clamped with the second tooth block 8, the lower end of the plastic expansion pipe 4 is fixed in the second screw hole 7, reach the effect of composite installation, through above-mentioned structure, can realize quick installation and dismantlement multilayer printed wiring board, and the difficult emergence of installation is applyed the circumstances that the gravity leads to the circuit board to damage and is taken place, and adopt plastics expansion pipe 4 also difficult wearing and tearing screw more, make printed wiring board's life obtain improving, heat conduction silicone grease 16 is used for playing the effect with the upward conduction of heat of chip layer 17 department, insert radiator 15 is used for outwards dispersing the heat of heat conduction silicone grease 16 department heat, improve the radiating effect, heat conduction silicone rubber mat 18 is used for the heat downwardly conduction with whole circuit board, heat conduction aluminum plate 19 possesses good heat transfer nature, can continue the heat transfer to the below, and disperse from heat dissipation grille 20 department, improve the radiating effect.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (10)

1. The multilayer printed circuit board comprises a multilayer printed circuit board body (1), wherein a bottom plate (2) is arranged below the multilayer printed circuit board body (1), and first screw holes (3) are formed in four corners of the outer wall of the multilayer printed circuit board body (1);
the method is characterized in that: further comprises:
the plastic expansion pipe (4) is arranged in the first screw hole (3), the lower end of the plastic expansion pipe (4) extends to the outside of the first screw hole (3), and a plurality of first tooth blocks (5) are integrally arranged on two sides of the plastic expansion pipe (4);
the second screw (7) is arranged below the first screw (3), the second screw (7) is aligned with the first screw (3), a plurality of second tooth blocks (8) are arranged on the inner wall of the second screw (7), and the second tooth blocks (8) are clamped with the first tooth blocks (5).
2. A multilayer printed wiring board according to claim 1, wherein: a hollow expansion cavity (6) is arranged in the plastic expansion pipe (4).
3. A multilayer printed wiring board according to claim 2, wherein: the upper end of the plastic expansion pipe (4) is integrally provided with a limiting block (9), and a through hole (12) is formed in the middle of the limiting block (9).
4. A multilayer printed wiring board according to claim 3, wherein: the screw rod (10) is installed to the top of through-hole (12), and in the lower extreme of screw rod (10) extends to cavity inflation chamber (6), the upper end of screw rod (10) is provided with nut (11) an organic whole.
5. A multilayer printed wiring board according to claim 3, wherein: the outer wall of stopper (9) lower surface bonds has adhesive tape (14), the outer wall of adhesive tape (14) is last to be adhered with tear film (13), and stopper (9) are through adhesive tape (14) and multilayer printed wiring board body (1) bonding.
6. A multilayer printed wiring board according to claim 1, wherein: the outer wall of the upper surface of the multilayer printed circuit board body (1) is provided with a chip layer (17), and heat conduction silicone grease (16) is adhered above the chip layer (17).
7. The multilayer printed wiring board according to claim 6, wherein: an inserting sheet radiator (15) is arranged above the heat conduction silicone grease (16).
8. A multilayer printed wiring board according to claim 1, wherein: a heat-conducting silica gel pad (18) is adhered between the multilayer printed circuit board body (1) and the bottom plate (2).
9. A multilayer printed wiring board according to claim 8, wherein: the heat conduction silica gel pad is characterized in that a heat conduction aluminum plate (19) is arranged below the heat conduction silica gel pad (18), and a heat dissipation grid (20) is arranged below the heat conduction aluminum plate (19).
10. A multilayer printed wiring board according to claim 1, wherein: third screw holes (21) are formed in four corners of the outer wall of the bottom plate (2).
CN202320465849.0U 2023-03-13 2023-03-13 Multilayer printed circuit board Active CN219981322U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320465849.0U CN219981322U (en) 2023-03-13 2023-03-13 Multilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320465849.0U CN219981322U (en) 2023-03-13 2023-03-13 Multilayer printed circuit board

Publications (1)

Publication Number Publication Date
CN219981322U true CN219981322U (en) 2023-11-07

Family

ID=88587121

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320465849.0U Active CN219981322U (en) 2023-03-13 2023-03-13 Multilayer printed circuit board

Country Status (1)

Country Link
CN (1) CN219981322U (en)

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