CN217883958U - Multilayer printed wiring board with thermal-insulated function - Google Patents
Multilayer printed wiring board with thermal-insulated function Download PDFInfo
- Publication number
- CN217883958U CN217883958U CN202221891251.XU CN202221891251U CN217883958U CN 217883958 U CN217883958 U CN 217883958U CN 202221891251 U CN202221891251 U CN 202221891251U CN 217883958 U CN217883958 U CN 217883958U
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- China
- Prior art keywords
- circuit board
- board body
- multilayer printed
- printed wiring
- wiring board
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 14
- 239000004033 plastic Substances 0.000 claims description 14
- 238000009434 installation Methods 0.000 claims description 9
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004321 preservation Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 230000008595 infiltration Effects 0.000 description 4
- 238000001764 infiltration Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
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Abstract
The utility model discloses a multilayer printed wiring board with thermal-insulated function, including the circuit board body to and the welding is provided with one row of first resistance at circuit board body top surface, and the welding is provided with the second resistance in the rear side surface top of circuit board body, still includes: one row be connected through one row of connecting wire harness between first resistance and the second resistance, two louvres have been seted up to the left surface of circuit board body. This multilayer printed wiring board with thermal-insulated function installs the insulating layer, anticreep protection shield and heat dissipation backplate utilize to be provided with insulating layer and heat dissipation backplate in printed circuit layer outside, not only can be fine the convenience carry out thermal-insulated heat preservation to the bottom on printed circuit layer, can also be fine the convenience dispels the heat to the top on printed circuit layer ventilative, excrete the inside steam of circuit board body to the external world through the louvre of its surface side offering at last, can be fine make things convenient for the later stage to carry out thermal-insulated heat preservation to multilayer printed wiring board.
Description
Technical Field
The utility model relates to a multilayer printed wiring board technical field specifically is a multilayer printed wiring board with heat insulation function.
Background
Printed wiring boards, also known as printed circuit boards, which are used as carriers of electronic components, have been widely used in the field of electronic devices, and can be divided into single-sided boards, double-sided boards, four-layered boards, six-layered boards, and other multilayer wiring boards, where a multilayer printed wiring board is a circuit board formed by stacking two or more conductive layers on top of each other, but there are some disadvantages when using a multilayer printed wiring board;
(1) When the existing multilayer printed circuit board is used, the traditional method for radiating the multilayer printed circuit board usually adopts a metal plate to be added on the printed circuit board to realize heat radiation, but when the heat absorbed by the metal plate is too high, a wiring harness connected to the outer side of the metal plate can be melted, the phenomenon of short circuit of the multilayer printed circuit board is easily caused, the multilayer printed circuit board is not well insulated, and the use of the multilayer printed circuit board is influenced due to the fact that the internal temperature of the multilayer printed circuit board is too high in the later period;
(2) When the existing multilayer printed circuit board is used, the existing multilayer printed circuit board is basically fixedly installed by screws, but the screw installation easily causes the phenomenon of cracking and damage to the surface of the multilayer printed circuit board body, the installation can be influenced, and the use of the multilayer printed circuit board at the later stage is inconvenient;
therefore, the multilayer printed circuit board with the heat insulation function can well solve the problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multilayer printed wiring board with thermal-insulated function, with current multilayer printed wiring board when using in the present market that solves above-mentioned background art and put forward, traditional multilayer printed wiring board takes radiating method to increase the metal sheet usually on printed wiring board and realizes the heat dissipation, but when the absorbed heat of metal sheet was too high, can cause the pencil of connecting outside it to melt, it takes place to cause the phenomenon that multilayer printed wiring board takes place the short circuit easily, do not have fine thermal-insulated function to carry out thermal-insulated processing to multilayer printed wiring board, lead to later stage multilayer printed wiring board inside high temperature and influence the use of multilayer printed wiring board and because current multilayer printed wiring board all adopts the screw to carry out fixed mounting basically, but the screw installation leads to the fact the phenomenon that the fracture damaged to multilayer printed wiring board body surface easily, can influence the installation, the problem of the use of inconvenient later stage multilayer printed wiring board.
In order to achieve the above object, the utility model provides a following technical scheme: a multilayer printed circuit board with a heat insulation function comprises a circuit board body, a row of first resistors welded on the upper surface of the circuit board body, and a second resistor welded on the upper surface of the rear side of the circuit board body;
further comprising: one row be connected through one row of connecting wire harness between first resistance and the second resistance, and one row the structure of connecting wire harness is equal, two louvres have been seted up to the left surface of circuit board body, and two the size of louvre is equal, and two louvres are the horizontal central line symmetry setting about the circuit board body.
Preferably, the bottom below fixed mounting of circuit board body has the fixed plate, and the length of fixed plate is less than the length of circuit board body to the bottom both ends of fixed plate all are provided with the lug, two the outside of lug all is connected with the recess, and the standing groove has all been seted up to the bottom both ends inboard of stating the fixed plate, and the inboard of two standing grooves all is provided with the plastic spring, and the outside of two plastic springs all is connected with the stopper, two the inboard of lug all is provided with the stopper, and the lug passes through the plastic spring and constitutes elastic motion with the fixed plate.
Through adopting above technical scheme, utilize the lug to constitute elastic motion through plastic spring and fixed plate, convenience that can be fine pops out two lugs to the recess of external installed part in, convenient quick installation that can be fine.
Preferably, sealing rubber pads are arranged on the outer sides of the two lugs, the outer sides of the two sealing rubber pads are attached to an external installation body, and the two sealing rubber pads are identical in structure.
Through adopting above technical scheme, can be fine carry out sealing process through two sealing rubber pads to the bottom of circuit board body, avoid the later stage to take place the inside of dust or impurity infiltration circuit board body and influence the use of circuit board body when the circuit board body uses.
Preferably, the inside fluting of circuit board body is provided with the printed circuit layer, and the upper and lower both ends on printed circuit layer laminate respectively and are provided with heat dissipation backplate and insulating layer to the size of insulating layer and heat dissipation backplate is equal.
Through adopting above technical scheme, not only can be fine the convenience carry out thermal-insulated heat preservation to the bottom on printed circuit layer, can also carry out the heat dissipation to the heat source that printed circuit layer top work produced and handle, the better use that makes things convenient for later stage circuit board body.
Preferably, a PTFE substrate layer is attached to the upper side of the heat dissipation back plate, an anti-leakage protection plate is arranged below the bottom of the heat insulation layer, and the outer side of the bottom of the anti-leakage protection plate is connected to the bottom of the fixing plate.
Through adopting above technical scheme, can be fine carry out anticreep protection through anticreep protection shield to the bottom of circuit board body, the phenomenon that the later stage maintenance workman appears the electric shock when maintaining the circuit board body, the better use that makes things convenient for the circuit board body.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) The multilayer printed circuit board with the heat insulation function is provided with the heat insulation layer, the anticreep protective plate and the heat dissipation back plate, and the heat insulation layer and the heat dissipation back plate are arranged on the outer side of the printed circuit board layer, so that the bottom of the printed circuit layer can be well and conveniently insulated and insulated, the upper part of the printed circuit layer can be well and conveniently radiated and ventilated, finally, hot gas in the circuit board body is discharged to the outside through heat dissipation holes formed in the surface of the circuit board body, and the multilayer printed circuit board can be well and conveniently insulated and insulated in the later period;
(2) This multilayer printed wiring board with thermal-insulated function is provided with the lug, plasticity spring and sealing rubber pad, the utilization all is provided with the lug at the bottom both ends of fixed plate, then utilize the lug to constitute elastic motion through plasticity spring and fixed plate, can be fine when installing the circuit board body, pop out two lugs to external recess through the plasticity spring, can conveniently install the circuit board body fast, avoid causing the fracture of multilayer printed wiring board to damage, influence the problem of installation, be provided with sealing rubber pad in the outside of two lugs at last, the convenience that can be fine is sealed the bottom of circuit board body, avoid the later stage when using the circuit board body, the inside of external dust infiltration circuit board body, better convenience later stage circuit board body's use.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the main cross-sectional structure of the circuit board body and the fixing plate of the present invention;
FIG. 3 is a schematic view of the main sectional structure of the circuit board body of the present invention;
fig. 4 is an enlarged schematic structural view of a in fig. 2 according to the present invention.
In the figure: 1. a circuit board body; 2. a first resistor; 3. a second resistor; 4. connecting a wire harness; 5. a fixing plate; 6. a bump; 7. a printed circuit layer; 8. a thermal insulation layer; 9. an anti-creeping protection plate; 10. a heat dissipation back plate; 11. a PTFE substrate layer; 12. a limiting block; 13. a placement groove; 14. a plastic spring; 15. sealing the rubber pad; 16. and (4) radiating holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a multilayer printed circuit board with a heat insulation function comprises a circuit board body 1, a first resistor 2, a second resistor 3, a connecting wire harness 4, a fixing plate 5, a bump 6, a printed circuit layer 7, a heat insulation layer 8, an anti-leakage protection plate 9, a heat dissipation backboard 10, a PTFE substrate layer 11, a limiting block 12, a placing groove 13, a plastic spring 14, a sealing rubber pad 15 and a heat dissipation hole 16;
the circuit board comprises a circuit board body 1, wherein a row of first resistors 2 are welded on the upper surface of the circuit board body 1, and a second resistor 3 is welded on the upper surface of the rear side of the circuit board body 1;
further comprising: one row of first resistors 2 are connected with one row of second resistors 3 through one row of connecting harnesses 4, the structure of the one row of connecting harnesses 4 is identical, two heat dissipation holes 16 are formed in the left side surface of the circuit board body 1, the size of the two heat dissipation holes 16 is identical, and the two heat dissipation holes 16 are symmetrically arranged about the transverse center line of the circuit board body 1.
Fixed plate 5 is installed to the bottom below fixed mounting of circuit board body 1, and the length of fixed plate 5 is less than the length of circuit board body 1, and the bottom both ends of fixed plate 5 all are provided with lug 6, the outside of two lug 6 all is connected with the recess, standing groove 13 has all been seted up to the bottom both ends inboard of fixed plate 5, and the inboard of two standing groove 13 all is provided with plastic spring 14, and the outside of two plastic spring 14 all is connected with stopper 12, the inboard of two lug 6 all is provided with stopper 12, and lug 6 passes through plastic spring 14 and fixed plate 5 constitution elastic motion, as shown in figure 2, 4, when installing circuit board body 1, place circuit board body 1 in the position of installing, then extrude two lug 6, two plastic spring 14 of recycling carry out elastic motion to two lug 6, can be fine pop out two lug 6 to the recess of external seting up, can be fine conveniently install circuit board body 1's position fast.
The outside of two lugs 6 all is provided with sealing rubber pad 15, and the outside of two sealing rubber pads 15 all laminates and is connected to external installation body to two sealing rubber pad 15's structure is equal, then utilizes to be provided with sealing rubber pad 15 in the outside of two lugs 6, and the convenience that can be fine is sealed the bottom of circuit board body 1 and is handled, avoids the later stage outside dust and impurity infiltration circuit board body 1's when circuit board body 1 uses inside.
Inside fluting of circuit board body 1 is provided with printed circuit layer 7, and the laminating of the upper and lower both ends of printed circuit layer 7 is provided with heat dissipation backplate 10 and insulating layer 8 respectively, and insulating layer 8 equals with heat dissipation backplate 10's size, as shown in figure 1, 2, 3, when circuit board body 1 uses, utilize the upper and lower both ends at printed circuit layer 7 to be provided with insulating layer 8 and heat dissipation backplate 10 respectively, not only can be fine the convenience carry out thermal-insulated heat preservation to the temperature of printed circuit layer 7 bottom, can also be fine the convenience dispels the heat to the heat source of printed circuit layer 7 top, excrete the inside heat source of circuit board body 1 through two louvres 16 on its surface afterwards, the use of convenient later stage circuit board body 1 that can be fine.
The laminating of the top of heat dissipation backplate 10 is provided with PTFE base plate layer 11, and the bottom below of insulating layer 8 is provided with anticreep protection shield 9, and the bottom outside of anticreep protection shield 9 is connected to the bottom of line fixed plate 5, then is provided with anticreep protection shield 9 in the bottom inboard of circuit board body 1, and the convenience later stage that can be fine carries out protection against electric shock to the workman when maintaining circuit board body 1, the better use of making things convenient for later stage circuit board body 1.
The working principle is as follows: when using this multilayer printed wiring board with thermal-insulated function, at first, when circuit board body 1 uses, the utilization is provided with insulating layer 8 and heat dissipation backplate 10 respectively at the upper and lower both ends of printed circuit layer 7, the convenience that can be fine dispels the heat to the heat source of printed circuit layer 7 top, excrete the heat source of circuit board body 1 inside through two louvres 16 on its surface afterwards, then be provided with anticreep protection shield 9 in the bottom inboard of circuit board body 1, convenient later stage that can be fine carries out protection against electric shock to the workman when maintaining circuit board body 1.
To place circuit board body 1 in the position of installing, then extrude two lugs 6, recycle two plastic spring 14 and carry out elastic motion to two lugs 6, can be fine pop out two lugs 6 to the recess that the external world was seted up in, then utilize to be provided with sealing rubber pad 15 in the outside of two lugs 6, the convenience that can be fine is sealed the bottom of circuit board body 1 and is handled, avoids the inside of external dust and impurity infiltration circuit board body 1 when circuit board body 1 uses in later stage.
Those not described in detail in this specification are well within the skill of the art.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. A multilayer printed circuit board with a heat insulation function comprises a circuit board body (1), a row of first resistors (2) welded on the upper surface of the circuit board body (1), and a second resistor (3) welded on the upper side of the rear side surface of the circuit board body (1);
it is characterized by also comprising:
the first resistors (2) and the second resistors (3) are connected through a row of connecting harnesses (4), and the connecting harnesses (4) are identical in structure;
two heat dissipation holes (16) are formed in the left side surface of the circuit board body (1), the sizes of the two heat dissipation holes (16) are equal, and the two heat dissipation holes (16) are symmetrically arranged about the transverse center line of the circuit board body (1).
2. The multilayer printed wiring board having a heat insulating function according to claim 1, wherein: the circuit board is characterized in that a fixing plate (5) is fixedly mounted below the bottom of the circuit board body (1), the length of the fixing plate (5) is smaller than that of the circuit board body (1), protruding blocks (6) are arranged at two ends of the bottom of the fixing plate (5), and grooves are formed in the outer sides of the protruding blocks (6).
3. The multilayer printed wiring board having a heat insulating function according to claim 2, wherein: the bottom both ends inboard of fixed plate (5) has all been seted up standing groove (13), and the inboard of two standing grooves (13) all is provided with plastic spring (14) to the outside of two plastic spring (14) all is connected with stopper (12), two the inboard of lug (6) all is provided with stopper (12), and lug (6) constitute elastic motion through plastic spring (14) and fixed plate (5).
4. A multilayer printed wiring board having a heat insulating function according to claim 3, wherein: the outer sides of the two convex blocks (6) are provided with sealing rubber pads (15), the outer sides of the two sealing rubber pads (15) are attached to an external installation body, and the two sealing rubber pads (15) are identical in structure.
5. The multilayer printed wiring board having a heat insulating function according to claim 1, wherein: the printed circuit board is characterized in that a printed circuit layer (7) is arranged in the circuit board body (1) in a groove mode, the upper end and the lower end of the printed circuit layer (7) are respectively provided with a heat dissipation back plate (10) and a heat insulation layer (8) in a laminating mode, and the heat insulation layer (8) and the heat dissipation back plate (10) are equal in size.
6. The multilayer printed wiring board having a heat insulating function according to claim 5, wherein: the heat dissipation backboard (10) is provided with a PTFE substrate layer (11) in an attaching mode, an anti-leakage protection plate (9) is arranged below the bottom of the heat insulation layer (8), and the outer side of the bottom of the anti-leakage protection plate (9) is connected to the bottom of the fixing plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221891251.XU CN217883958U (en) | 2022-07-21 | 2022-07-21 | Multilayer printed wiring board with thermal-insulated function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221891251.XU CN217883958U (en) | 2022-07-21 | 2022-07-21 | Multilayer printed wiring board with thermal-insulated function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217883958U true CN217883958U (en) | 2022-11-22 |
Family
ID=84053555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221891251.XU Active CN217883958U (en) | 2022-07-21 | 2022-07-21 | Multilayer printed wiring board with thermal-insulated function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217883958U (en) |
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2022
- 2022-07-21 CN CN202221891251.XU patent/CN217883958U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240102 Address after: 516000 Factory Building, No. 90 Baigang Road North, Xiaojinkou Street, Huicheng District, Huizhou City, Guangdong Province Patentee after: Huizhou Kaifeng Electronic Technology Co.,Ltd. Address before: 516000 Baigang village, Xiaojinkou Town, Huicheng District, Huizhou City, Guangdong Province Patentee before: Huizhou Shengfeng circuit board manufacturing Co.,Ltd. |
|
| TR01 | Transfer of patent right |