CN209914170U - High temperature resistant circuit board - Google Patents
High temperature resistant circuit board Download PDFInfo
- Publication number
- CN209914170U CN209914170U CN201920204799.4U CN201920204799U CN209914170U CN 209914170 U CN209914170 U CN 209914170U CN 201920204799 U CN201920204799 U CN 201920204799U CN 209914170 U CN209914170 U CN 209914170U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- circuit substrate
- high temperature
- plate
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000000919 ceramic Substances 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 3
- 238000004073 vulcanization Methods 0.000 claims 3
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high temperature resistance circuit board, including circuit substrate, the surface covering at circuit substrate top has component welding position panel, the equal fixedly connected with position sleeve in four corners of circuit substrate bottom surface, the four corners of circuit substrate top surface is all seted up flutedly, the locating hole has been seted up to recess inner chamber's bottom, the bottom of locating hole is from last to running through circuit substrate and position sleeve down in proper order, circuit substrate's four corners is all overlapped and is equipped with elastic protection cover, circuit substrate includes ceramic bottom plate, the surface covering at ceramic bottom plate top has the heat dissipation fin board. The utility model discloses a set up circuit substrate, improved the radiating efficiency of circuit board, the high temperature resistance of circuit board is better like this, has solved the circuit board when using, and is lower because of the radiating efficiency of circuit board, causes the circuit board to heat up sooner to lead to the problem that high temperature damage appears in the circuit board, improved the high temperature resistance of circuit board greatly.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a high temperature resistance circuit board.
Background
The circuit board has the name: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, printed circuit boards, and the like; the circuit board makes the circuit miniaturized, direct-viewing, plays important effect to fixed circuit's batch production and optimization electrical apparatus overall arrangement, and the circuit board can be called printed wiring board or printed circuit board.
The circuit board has obtained the wide use in modern industrial production and people's daily life, and current circuit board is when using, and the radiating efficiency of circuit board is lower, makes the phenomenon that the intensification is very fast appear at the in-process of work in the circuit board like this easily, causes the circuit board temperature higher to lead to the problem that the circuit board appears high temperature damage, greatly reduced the high temperature resistance of circuit board, bring great economic loss for the user.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high temperature resistance circuit board possesses the advantage that the radiating efficiency is high, has solved the problem that high temperature damaged appears in the circuit board.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high temperature resistance circuit board, includes circuit substrate, the surface covering at circuit substrate top has component welding position panel, the equal fixedly connected with position sleeve in four corners of circuit substrate bottom surface, the four corners of circuit substrate top surface is all seted up flutedly, the locating hole has been seted up to recess inner chamber's bottom, the bottom of locating hole is from last to running through circuit substrate and position sleeve down in proper order, circuit substrate's four corners is all overlapped and is equipped with the elasticity protective sheath.
Preferably, the circuit substrate comprises a ceramic base plate, the surface of the top of the ceramic base plate is covered with a radiating fin plate, the surface of the top of the radiating fin plate is covered with an aluminum honeycomb plate, and the surface of the top of the aluminum honeycomb plate is covered with a PCB substrate.
Preferably, the surface at the top of the ceramic base plate is fixedly connected with the surface at the bottom of the radiating fin plate through hot vulcanized silica gel, the surface at the top of the radiating fin plate is fixedly connected with the surface at the bottom of the aluminum honeycomb plate through hot vulcanized silica gel, and the surface at the top of the aluminum honeycomb plate is fixedly connected with the surface at the bottom of the PCB base plate through hot vulcanized silica gel.
Preferably, the surface of the top of the locating sleeve is fixedly connected with the surface of the bottom of the ceramic bottom plate.
Preferably, the surface of component welding position panel bottom and the surface at PCB base plate top pass through hot vulcanized silica gel fixed connection, the surface at component welding position panel top covers there is the PE protection film.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up circuit substrate, improved the radiating efficiency of circuit board, the high temperature resistance of circuit board is better like this, has solved the circuit board when using, and is lower because of the radiating efficiency of circuit board, causes the circuit board to heat up sooner to lead to the problem that high temperature damage appears in the circuit board, improved the high temperature resistance of circuit board greatly, be worth promoting.
2. The utility model discloses an elastic protection sleeve can protect circuit substrate's four corners, through the cooperation of recess, locating hole and position sleeve, can fix a position the installation to the circuit board.
Drawings
FIG. 1 is a top view of the present invention;
FIG. 2 is a front view of the present invention;
fig. 3 is a cross-sectional view of the circuit board structure of the present invention.
In the figure: 1 circuit substrate, 11 PCB base plates, 12 aluminum honeycomb plates, 13 radiating fin plates, 14 ceramic bottom plates, 2 element welding positioning panels, 3 positioning holes, 4 elastic protection sleeves, 5 grooves and 6 positioning sleeves.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a high temperature resistant circuit board includes a circuit substrate 1, the circuit substrate 1 includes a ceramic base plate 14, a heat dissipation fin plate 13 covers a surface of a top of the ceramic base plate 14, an aluminum honeycomb plate 12 covers a surface of a top of the heat dissipation fin plate 13, a PCB substrate 11 covers a surface of a top of the aluminum honeycomb plate 12, the surface of the top of the ceramic base plate 14 and the surface of a bottom of the heat dissipation fin plate 13 are fixedly connected through a heat vulcanized silica gel, the surface of the top of the heat dissipation fin plate 13 and the surface of the bottom of the aluminum honeycomb plate 12 are fixedly connected through a heat vulcanized silica gel, the circuit substrate 1 is arranged to improve a heat dissipation efficiency of the circuit board, so that the circuit board has a better high temperature resistance, and solves a problem that the heat dissipation efficiency of the circuit board is lower when the circuit board is used, cause the circuit board to heat up faster, thereby cause the problem that the circuit board is damaged by high temperature, the high temperature resistance of the circuit board is greatly improved, and the circuit board is worthy of popularization, the surface of the top of the circuit substrate 1 is covered with the element welding positioning panel 2, the surface of the bottom of the element welding positioning panel 2 is fixedly connected with the surface of the top of the PCB substrate 11 through the hot vulcanized silica gel, the surface of the top of the element welding positioning panel 2 is covered with the PE protective film, four corners of the bottom surface of the circuit substrate 1 are fixedly connected with the positioning sleeves 6, the surface of the top of the positioning sleeves 6 is fixedly connected with the surface of the bottom of the ceramic bottom plate 14, four corners of the top surface of the circuit substrate 1 are respectively provided with the grooves 5, the bottoms of the inner cavities of the grooves 5 are provided with the positioning holes 3, the bottoms of the positioning holes 3 sequentially penetrate through the circuit substrate, the four corners of the circuit substrate 1 are all sleeved with elastic protection sleeves 4, and the four corners of the circuit substrate 1 can be protected through the elastic protection sleeves 4.
During the use, through setting up circuit substrate 1, improved the radiating efficiency of circuit board, the high temperature resistance of circuit board is better like this, has solved the circuit board when using, because of the radiating efficiency of circuit board is lower, causes the circuit board to heat up sooner to lead to the problem that high temperature damage appears in the circuit board, improved the high temperature resistance of circuit board greatly, through the cooperation of heat dissipation fin board 13 and aluminium honeycomb panel 12, increased the heat radiating area of circuit board, improved the radiating efficiency of circuit board.
All kinds of parts used in this application document are standard parts, can purchase from the market, and the specific connected mode of each part all adopts conventional means such as mature bolt, rivet and welding among the prior art.
In summary, the following steps: this high temperature resistant circuit board through setting up circuit substrate 1, has solved the problem that the circuit board appears high temperature damage.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A high temperature resistant circuit board, includes circuit substrate (1), its characterized in that: the surface at circuit substrate (1) top covers there is component welding position panel (2), the equal fixedly connected with position sleeve (6) in four corners on circuit substrate (1) bottom surface, circuit substrate (1) top surface's four corners is all seted up flutedly (5), locating hole (3) have been seted up to the bottom of recess (5) inner chamber, the bottom of locating hole (3) is from last to running through circuit substrate (1) and position sleeve (6) down in proper order, the four corners of circuit substrate (1) is all overlapped and is equipped with elastic protection cover (4).
2. The high-temperature resistant circuit board of claim 1, wherein: the circuit substrate (1) comprises a ceramic bottom plate (14), a radiating fin plate (13) covers the surface of the top of the ceramic bottom plate (14), an aluminum honeycomb plate (12) covers the surface of the top of the radiating fin plate (13), and a PCB substrate (11) covers the surface of the top of the aluminum honeycomb plate (12).
3. The high-temperature resistant circuit board of claim 2, wherein: the surface at ceramic bottom plate (14) top and the surface of heat dissipation fin board (13) bottom pass through hot vulcanization silica gel fixed connection, the surface at heat dissipation fin board (13) top and the surface of aluminium honeycomb panel (12) bottom pass through hot vulcanization silica gel fixed connection, the surface at aluminium honeycomb panel (12) top and the surface of PCB base plate (11) bottom pass through hot vulcanization silica gel fixed connection.
4. The high-temperature resistant circuit board of claim 2, wherein: the surface of the top of the locating sleeve (6) is fixedly connected with the surface of the bottom of the ceramic bottom plate (14).
5. The high-temperature resistant circuit board of claim 2, wherein: the surface of component welding position panel (2) bottom and the surface at PCB base plate (11) top pass through hot vulcanized silicone rubber fixed connection, the surface at component welding position panel (2) top covers there is the PE protection film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920204799.4U CN209914170U (en) | 2019-02-18 | 2019-02-18 | High temperature resistant circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920204799.4U CN209914170U (en) | 2019-02-18 | 2019-02-18 | High temperature resistant circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209914170U true CN209914170U (en) | 2020-01-07 |
Family
ID=69030519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920204799.4U Expired - Fee Related CN209914170U (en) | 2019-02-18 | 2019-02-18 | High temperature resistant circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209914170U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
-
2019
- 2019-02-18 CN CN201920204799.4U patent/CN209914170U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200107 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |