CN219019119U - Insulated circuit board - Google Patents
Insulated circuit board Download PDFInfo
- Publication number
- CN219019119U CN219019119U CN202223135278.9U CN202223135278U CN219019119U CN 219019119 U CN219019119 U CN 219019119U CN 202223135278 U CN202223135278 U CN 202223135278U CN 219019119 U CN219019119 U CN 219019119U
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- circuit board
- insulating
- fan
- heat dissipation
- protective layer
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Abstract
The utility model discloses an insulating circuit board, which comprises a mounting bottom plate, an insulating circuit board assembly and a heat dissipation assembly, wherein the insulating circuit board assembly comprises a circuit board, an insulating rubber pad, insulating paint and a transparent protective layer, the insulating paint and the transparent protective layer are sequentially coated on the surface of the circuit board, the heat dissipation assembly comprises a fan mounting frame and at least one fan, the fan mounting frame is fixedly arranged on the end face of the mounting bottom plate, the fan is fixedly arranged on the fan mounting frame, the insulating rubber pad is arranged at the bottom end of the circuit board, the insulating paint is arranged on the surface of the circuit board, the insulating performance of the circuit board is improved, the transparent protective layer for protecting the insulating paint is arranged on the surface of the circuit board, the transparent protective layer can prevent the phenomenon that the insulating paint is worn or falls off due to long-time use of the circuit board, external air is blown to the circuit board after the fan is started, and heat emitted during the operation of the circuit board leaves the circuit board towards the gap direction, so that the heat dissipation efficiency of the circuit board can be greatly improved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to an insulating circuit board.
Background
Printed wiring boards, also known as printed circuit boards, which are used as carriers for electronic components, have been widely used in the field of electronic devices to realize connection between electronic components, and can be divided into single-sided boards, double-sided boards, four-sided boards, six-sided boards, and other multi-layer circuit boards according to the number of layers of the circuit boards;
along with the progress of technology, the use of the printed circuit board is more and more widespread, and higher requirements are also put on the performance of the printed circuit board, and at present, most of the conductive circuit substrates of electronic products are circuits manufactured on metal substrates after insulation and heat conduction treatment, and generally include a metal substrate, an insulating layer formed on the metal substrate, and a metal conductive circuit formed with the insulating layer, wherein the insulating layer is mainly made of organic materials such as resin at present, and although the insulating layer has good insulativity, the heat conductivity is poor, and the requirement of high-power electronic components on heat dissipation is difficult to meet.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides an insulating circuit board which can solve the problems of the background technology.
The technical scheme adopted for solving the technical problems is as follows: an insulating circuit board comprises a structural main body, wherein the structural main body comprises a mounting bottom plate, an insulating circuit board assembly and a heat dissipation assembly;
the insulation circuit board assembly comprises a circuit board, an insulation rubber mat, insulation paint and a transparent protective layer, wherein the insulation rubber mat is fixedly arranged on the end face of the installation base plate, the circuit board is arranged on the end face of the insulation rubber mat, and the insulation paint and the transparent protective layer are sequentially coated on the surface of the circuit board;
the heat dissipation assembly comprises a fan installation frame and at least one fan, wherein the fan installation frame is fixedly arranged on the end face of the installation bottom plate, and the fan is fixedly arranged on the fan installation frame.
Preferably: the insulating rubber pad is connected with the mounting bottom plate in an adhesive mode, and the circuit board is connected with the insulating rubber pad in an adhesive mode.
Preferably: the fan mounting frame is provided with a group of mounting grooves for mounting the fans, the fans are at least provided with a group, and the fans are respectively arranged in the corresponding mounting grooves.
Preferably: and a gap is reserved between the fan mounting frame and the circuit board.
Preferably: the transparent protective layer covers the surface of the insulating paint.
Compared with the prior art, the utility model has the beneficial effects that:
the bottom of circuit board is provided with insulating cushion to set up one deck insulating varnish on the surface of circuit board, thereby improve the insulating properties of circuit board, set up the transparent protective layer that one deck is used for protecting insulating varnish on the surface of circuit board simultaneously, the transparent protective layer can avoid the circuit board to lead to insulating varnish wearing and tearing or the phenomenon emergence that drops because of long-time use, blows the circuit board with external air after the fan starts, and the heat that the circuit board during operation was given off then leaves the circuit board towards the clearance direction, can increase substantially the radiating efficiency of circuit board.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is a schematic structural diagram of a heat dissipating assembly according to the present utility model.
Reference numerals in the drawings:
fan mounting bracket 1, transparent protective layer 2, mounting groove 3, insulating varnish 4, mounting plate 5, insulating cushion 6, circuit board 7, fan 8.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
An insulated circuit board according to the present utility model is described in detail below with reference to fig. 1-2:
an insulated circuit board comprises a structural body, wherein the structural body comprises a mounting bottom plate 5, an insulated circuit board assembly and a heat dissipation assembly;
the insulation circuit board assembly comprises a circuit board 7, an insulation rubber mat 6, insulation paint 4 and a transparent protection layer 2, wherein the insulation rubber mat 6 is fixedly arranged on the end face of the installation base plate 5, the circuit board 7 is arranged on the end face of the insulation rubber mat 6, and the insulation paint 4 and the transparent protection layer 2 are sequentially coated on the surface of the circuit board 7;
the heat dissipation assembly comprises a fan installation frame 1 and at least one fan 8, wherein the fan installation frame 1 is fixedly arranged on the end face of the installation base plate 5, and the fan 8 is fixedly arranged on the fan installation frame 1.
The insulating rubber cushion 6 is connected with the mounting bottom plate 5 in an adhesive mode, and the circuit board 7 is connected with the insulating rubber cushion 6 in an adhesive mode.
The fan mounting frame 1 is provided with a group of mounting grooves 3 for mounting the fans 8, the fans 8 are at least provided with a group, and the fans 8 are respectively arranged in the corresponding mounting grooves 3.
A gap is formed between the fan mounting frame 1 and the circuit board 7, external air is blown to the circuit board 7 after the fan 8 is started, and heat emitted by the circuit board 7 during operation leaves the circuit board 7 towards the gap direction, so that the heat dissipation efficiency of the circuit board 7 can be greatly improved.
The transparent protective layer 2 is covered on the surface of the insulating paint 4, and the transparent protective layer 2 can avoid the phenomenon that the insulating paint 4 is worn or falls off due to long-time use of the circuit board 7.
Working principle: the bottom of circuit board is provided with insulating cushion to set up one deck insulating varnish on the surface of circuit board, thereby improve the insulating properties of circuit board, set up the transparent protective layer that one deck is used for protecting insulating varnish on the surface of circuit board simultaneously, avoid the circuit board to lead to insulating varnish wearing and tearing or the phenomenon emergence that drops because of long-time use, blow the circuit board with external air after the fan starts, and the heat that the circuit board during operation was given off then leaves the circuit board towards the clearance direction, can improve the radiating efficiency of circuit board by a wide margin.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (5)
1. An insulated circuit board, characterized in that: the heat dissipation device comprises a structural main body, a heat dissipation device and a heat dissipation module, wherein the structural main body comprises a mounting bottom plate, an insulating circuit board assembly and a heat dissipation assembly;
the insulation circuit board assembly comprises a circuit board, an insulation rubber mat, insulation paint and a transparent protective layer, wherein the insulation rubber mat is fixedly arranged on the end face of the installation base plate, the circuit board is arranged on the end face of the insulation rubber mat, and the insulation paint and the transparent protective layer are sequentially coated on the surface of the circuit board;
the heat dissipation assembly comprises a fan installation frame and at least one fan, wherein the fan installation frame is fixedly arranged on the end face of the installation bottom plate, and the fan is fixedly arranged on the fan installation frame.
2. An insulated circuit board according to claim 1, wherein: the insulating rubber pad is connected with the mounting bottom plate in an adhesive mode, and the circuit board is connected with the insulating rubber pad in an adhesive mode.
3. An insulated circuit board according to claim 1, wherein: the fan mounting frame is provided with a group of mounting grooves for mounting the fans, the fans are at least provided with a group, and the fans are respectively arranged in the corresponding mounting grooves.
4. An insulated circuit board according to claim 1, wherein: and a gap is reserved between the fan mounting frame and the circuit board.
5. An insulated circuit board according to claim 1, wherein: the transparent protective layer covers the surface of the insulating paint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223135278.9U CN219019119U (en) | 2022-11-24 | 2022-11-24 | Insulated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223135278.9U CN219019119U (en) | 2022-11-24 | 2022-11-24 | Insulated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219019119U true CN219019119U (en) | 2023-05-12 |
Family
ID=86247674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223135278.9U Active CN219019119U (en) | 2022-11-24 | 2022-11-24 | Insulated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219019119U (en) |
-
2022
- 2022-11-24 CN CN202223135278.9U patent/CN219019119U/en active Active
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