CN219536383U - High temperature resistant effectual PCB board - Google Patents
High temperature resistant effectual PCB board Download PDFInfo
- Publication number
- CN219536383U CN219536383U CN202223532035.9U CN202223532035U CN219536383U CN 219536383 U CN219536383 U CN 219536383U CN 202223532035 U CN202223532035 U CN 202223532035U CN 219536383 U CN219536383 U CN 219536383U
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- CN
- China
- Prior art keywords
- insulating metal
- plate
- high temperature
- metal strip
- glass fiber
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a PCB with good high temperature resistance effect, which belongs to the technical field of PCBs and comprises a substrate and an insulating metal strip, wherein a mixed bottom plate is arranged at the bottom of the substrate, the insulating metal strip is arranged in the mixed bottom plate, glass fiber cloth is arranged on the periphery of the insulating metal strip, a conductive copper plate is arranged at the top of the mixed bottom plate, an aluminum plate is arranged at the top of the conductive copper plate, and a resin protection layer is arranged at the top of the aluminum plate. According to the utility model, the mixed bottom plate made of the insulating metal strip and the glass fiber cloth is arranged on the substrate of the traditional PCB, so that the copper sheet can be directly formed on the insulating metal strip in a hot-press mode, and the direct contact with the glass fiber cloth is avoided, thereby avoiding the interference of uncured epoxy resin in the glass fiber cloth and improving the high temperature resistance of the circuit board.
Description
Technical Field
The utility model relates to a PCB, in particular to a PCB with good high temperature resistance effect, and belongs to the technical field of PCB processing.
Background
A PCB, a printed wiring board, is one of the important components of the electronics industry. Almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device, a military weapon system, has only electronic components such as an integrated circuit, and a printed board is used for electrically interconnecting the respective components.
Most of the base plates of the existing PCB are made of glass fibers, the glass fibers are fixed after being soaked in epoxy resin, part of the glass fibers enter the inside of the base plates, the epoxy resin is not cured and shaped, after the copper sheets are formed on the base plates in a hot pressing mode, the uncured epoxy resin influences the heat resistance of the copper sheets, and when current carrying is large, the connection between the damaged copper sheets and the base plates is influenced.
Disclosure of Invention
The utility model mainly aims to provide a PCB with good high temperature resistance effect.
The aim of the utility model can be achieved by adopting the following technical scheme:
the utility model provides a effectual PCB board of high temperature resistant, includes base plate and insulating metal strip, the base plate bottom is provided with mixed bottom plate, be provided with in the mixed bottom plate insulating metal strip, insulating metal strip periphery is provided with glass fiber cloth, mixed bottom plate top is provided with electrically conductive copper, electrically conductive copper top is provided with aluminum plate, the aluminum plate top is provided with the resin protective layer.
Preferably, the mixed bottom plate is fixed with the conductive copper plate in a hot pressing mode, and the insulating metal strips are made of insulating materials.
Preferably, the conductive copper plate is connected with the insulating metal strip in a hot pressing mode, and the aluminum plate is connected with the conductive copper plate in an extrusion mode.
Preferably, the glass fiber cloth is formed by extruding glass fibers soaked in epoxy resin, and the insulating metal strips and the glass fiber cloth are fixed and shaped.
Preferably, the resin protection layer is an impedance protection structure, and the resin protection layer is coated on the top of the copper wire.
The beneficial technical effects of the utility model are as follows:
according to the utility model, the mixed bottom plate made of the insulating metal strip and the glass fiber cloth is arranged on the substrate of the traditional PCB, so that the copper sheet can be directly formed on the insulating metal strip in a hot-press mode, and the direct contact with the glass fiber cloth is avoided, thereby avoiding the interference of uncured epoxy resin in the glass fiber cloth and improving the high temperature resistance of the circuit board.
Drawings
Fig. 1 is a schematic structural view of a preferred embodiment of a PCB board with good high temperature resistance according to the present utility model;
fig. 2 is a front cross-sectional view of a preferred embodiment of a PCB board with good high temperature resistance according to the present utility model;
fig. 3 is a front cross-sectional view of a hybrid chassis in a preferred embodiment of a PCB board with good high temperature resistance according to the present utility model.
The reference numerals are explained as follows:
1-a substrate; 2-a resin protective layer; 3-protecting an aluminum plate; 4-mixing a bottom plate; 5-a conductive copper plate; 6-insulating metal strips; 7-glass fiber cloth.
Detailed Description
In order to make the technical solution of the present utility model more clear and obvious to those skilled in the art, the present utility model will be described in further detail with reference to examples and drawings, but the embodiments of the present utility model are not limited thereto.
As shown in fig. 1-3, the PCB board with good high temperature resistance effect provided in this embodiment includes a substrate 1 and an insulating metal strip 6, a mixed bottom board 4 is provided at the bottom of the substrate 1, the insulating metal strip 6 is provided in the mixed bottom board 4, a glass fiber cloth 7 is provided at the periphery of the insulating metal strip 6, a conductive copper plate 5 is provided at the top of the mixed bottom board 4, an aluminum plate 3 is provided at the top of the conductive copper plate 5, and a resin protection layer 2 is provided at the top of the aluminum plate 3.
The mixed bottom plate 4 and the conductive copper plate 5 are fixed by hot pressing, the insulating metal strips 6 are made of insulating materials, the insulating metal strips 6 can prevent the current of the conductive copper plate 5 from leaking, and meanwhile, an excellent heat dissipation effect is achieved, and the size of an external heat dissipation assembly is reduced.
The conductive copper plate 5 is connected with the insulating metal strip 6 in a hot-pressing mode, the aluminum plate 3 is connected with the conductive copper plate 5 in an extrusion mode, the aluminum plate 3 is used for fixedly supporting the conductive copper plate 5, deformation is prevented, a radiating effect is achieved, and a supporting structure is provided for drilling.
The glass fiber cloth 7 is formed by extruding glass fibers soaked in epoxy resin, the insulating metal strips 6 and the glass fiber cloth 7 are fixed and shaped, and the glass fiber cloth 7 can bear high temperature of higher electronic components without deformation.
The resin protective layer 2 is of an impedance protective structure, and the resin protective layer 2 is coated on the top of the copper wire.
The working principle of the device is as follows: when the device is specifically processed, the glass fiber cloth 7 soaked with epoxy resin is buckled and connected with the insulating metal strip 6, solidification is carried out, after solidification forming, the conductive copper plate 5 is laminated to the top of the insulating metal strip 6 through hot pressing equipment, heat conduction between the copper sheet and the insulating metal strip 6 is achieved, then the aluminum plate 3 is hot-pressed to the top of the conductive copper plate 5, a circuit assembly of a circuit board is formed after etching, finally, the top of a copper trace is coated with the resin protective layer 2, the processing of a PCB board can be completed, when the device is specifically used, heat generated by the conductive copper plate 5 is transferred to the environment through the insulating metal strip 6, meanwhile, the high temperature resistant effect is also achieved, the glass fiber cloth 7 at the bottom can also play a good high temperature resistant effect, the stability of the substrate 1 is maintained, the defects that the substrate 1 is softened, bursts and the copper sheet is separated are avoided, compared with the traditional PCB board which is only made of glass fiber serving as the substrate 1, and the defect that the PCB board is not high temperature resistant due to uncured epoxy resin exists in the traditional glass fiber is solved.
The above is merely a further embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto, and any person skilled in the art will be able to apply equivalents and modifications according to the technical solution and the concept of the present utility model within the scope of the present utility model disclosed in the present utility model.
Claims (5)
1. The utility model provides a high temperature resistant effectual PCB board which characterized in that: including base plate (1) and insulating metal strip (6), base plate (1) bottom is provided with mixed bottom plate (4), be provided with in mixed bottom plate (4) insulating metal strip (6), insulating metal strip (6) periphery is provided with glass fiber cloth (7), mixed bottom plate (4) top is provided with electrically conductive copper (5), electrically conductive copper (5) top is provided with aluminum plate (3), aluminum plate (3) top is provided with resin protection layer (2).
2. The PCB board with good high temperature resistance effect according to claim 1, wherein: the mixed bottom plate (4) and the conductive copper plate (5) are fixed in a hot pressing mode, and the insulating metal strips (6) are made of insulating materials.
3. The PCB with good high temperature resistance effect according to claim 2, wherein: the conductive copper plate (5) is connected with the insulating metal strip (6) in a hot pressing mode, and the aluminum plate (3) is connected with the conductive copper plate (5) in an extrusion mode.
4. The PCB board with good high temperature resistance effect according to claim 3, wherein: the glass fiber cloth (7) is formed by extruding glass fibers soaked in epoxy resin, and the insulating metal strips (6) and the glass fiber cloth (7) are fixed and shaped.
5. The PCB with good high temperature resistance effect according to claim 4, wherein: the resin protection layer (2) is of an impedance protection structure, and the resin protection layer (2) is coated on the top of the copper wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223532035.9U CN219536383U (en) | 2022-12-29 | 2022-12-29 | High temperature resistant effectual PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223532035.9U CN219536383U (en) | 2022-12-29 | 2022-12-29 | High temperature resistant effectual PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219536383U true CN219536383U (en) | 2023-08-15 |
Family
ID=87584848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223532035.9U Active CN219536383U (en) | 2022-12-29 | 2022-12-29 | High temperature resistant effectual PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219536383U (en) |
-
2022
- 2022-12-29 CN CN202223532035.9U patent/CN219536383U/en active Active
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