CN219999674U - Double-sided metal-based circuit board - Google Patents
Double-sided metal-based circuit board Download PDFInfo
- Publication number
- CN219999674U CN219999674U CN202321323358.9U CN202321323358U CN219999674U CN 219999674 U CN219999674 U CN 219999674U CN 202321323358 U CN202321323358 U CN 202321323358U CN 219999674 U CN219999674 U CN 219999674U
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- CN
- China
- Prior art keywords
- copper
- circuit board
- fixedly connected
- sided metal
- double
- Prior art date
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Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 32
- 239000002184 metal Substances 0.000 title claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 105
- 229910052802 copper Inorganic materials 0.000 claims abstract description 88
- 239000010949 copper Substances 0.000 claims abstract description 88
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 239000011889 copper foil Substances 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 13
- 230000001681 protective effect Effects 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 abstract description 2
- 238000005728 strengthening Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 18
- 230000008021 deposition Effects 0.000 description 9
- 238000005553 drilling Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a double-sided metal-based circuit board, which relates to the field of metal-based circuit boards and comprises a copper substrate and a via hole, wherein a limit groove is formed in the inner wall of the copper substrate, a high-conductivity adhesive insulating layer is fixedly connected to the outer surface of the copper substrate, insulating resin adhesive is fixedly connected to the inner wall of the high-conductivity adhesive insulating layer, and a copper component is fixedly arranged on the inner wall of the insulating resin adhesive. This two-sided metal base circuit board for the heat dissipation area of this circuit board has obtained the increase through the heat dissipation protruding piece of setting, thereby has increased the radiating efficiency of this circuit board self to a certain extent, simultaneously through the cooperation of heat conduction pole, make the radiating efficiency of this circuit board obtain further strengthening, and the setting of protection support can effectively ensure that this circuit board can not receive the interference when the installation heat conduction pole, simultaneously through the fixed plate of setting, make this circuit board be convenient for the staff location install in the casing.
Description
Technical Field
The utility model relates to the field of metal-based circuit boards, in particular to a double-sided metal-based circuit board.
Background
The circuit boards are generally called PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc., and the existing circuit boards are classified into three major categories of single-sided boards, double-sided boards, and multi-layer circuit boards according to the number of layers, while the metal substrate is one of the important component parts of the circuit boards, and the existing circuit boards are mostly made of copper substrates or aluminum substrates.
However, the existing double-sided metal-based circuit board still has some defects, such as lower heat dissipation efficiency of the existing double-sided metal-based circuit board, so that the temperature of the outer surface of the circuit board can gradually rise when the circuit board continuously runs for a long time, thus the circuit board and the subsequent running of the electrical components welded on the outer surface of the circuit board are easy to interfere, the existing double-sided metal-based circuit board has poor anti-degumming function, and the insulation adhesive filled in the circuit board is easy to slide out from the through hole in the subsequent heating process, so that the subsequent running of the circuit board is irreversibly interfered, and even the circuit board is easy to be scrapped directly.
Therefore, there is an urgent need to improve the disadvantage, and the present utility model is to solve the existing structural shortcomings and provide a double-sided metal-based circuit board.
Disclosure of Invention
The present utility model is directed to a double-sided metal-based circuit board, which solves the problems set forth in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a two-sided metal base circuit board, includes copper base plate and via hole, the spacing groove has been seted up to copper base plate's inner wall, and copper base plate's surface fixedly connected with high conductive adhesive insulating layer to high conductive adhesive insulating layer's inner wall fixedly connected with insulating resin glues, and insulating resin glues's inner wall fixed mounting has copper subassembly moreover, and copper base plate's avris fixedly connected with heat dissipation protruding piece simultaneously, the via hole is seted up in copper base plate's inside, and copper base plate's avris fixedly connected with heat dissipation subassembly.
Furthermore, the inner dimension of the limit groove is completely matched with the outer dimension of the insulating resin adhesive, and the insulating resin adhesive is bonded and connected with the copper substrate through the limit groove.
Further, the copper subassembly includes copper foil, hole wall copper deposition circuit copper, top layer circuit road surface and bottom layer circuit road surface, and the avris laminating of copper foil is connected with hole wall copper deposition circuit copper to the top fixed mounting of copper foil has top layer circuit road surface, and the bottom fixedly connected with bottom layer circuit road surface of copper foil moreover.
Furthermore, the side of the hole wall copper-deposited electro-copper is fixedly connected with the end part of the copper foil, the inner surface of the copper foil is fixedly connected with the outer surface of the high-conductivity adhesive insulating layer, and the hole wall copper-deposited electro-copper forms a fixed structure through the copper foil and the high-conductivity adhesive insulating layer.
Further, the outer surface of the hole wall copper-depositing electrolytic copper is fixedly connected with the inner surface of the insulating resin adhesive, and the hole wall copper-depositing electrolytic copper is manufactured by a copper-depositing processing technology.
Further, the number of the heat dissipation protruding blocks is ten, every two of the ten heat dissipation protruding blocks are in a group, and the five groups of heat dissipation protruding blocks are equidistantly arranged on the side of the copper substrate.
Further, the heat dissipation assembly comprises a fixing plate, a protection support and a heat conducting rod, the end part of the fixing plate is fixedly connected with the protection support, the inner wall of the protection support is fixedly connected with the end part of the heat conducting rod, and the outer surface of the protection support is fixedly connected with the side of the copper substrate.
Further, the number of the fixing plates is two, the two fixing plates are symmetrically arranged by taking the perpendicular bisectors of the protective brackets as symmetry axes, the outer surfaces of the fixing plates are fixedly connected with the side sides of the copper base plate, the fixing plates form a fixing structure with the copper base plate through the protective brackets, and threads are formed in the fixing plates.
The utility model provides a double-sided metal-based circuit board, which has the following beneficial effects:
1. according to the utility model, the radiating area of the circuit board is increased through the radiating protruding blocks, so that the self radiating efficiency of the circuit board is increased to a certain extent, meanwhile, the radiating efficiency of the circuit board is further enhanced through the cooperation of the heat conducting rods, the heat conducting rods can not be disturbed when the circuit board is installed through the arrangement of the protective support, and meanwhile, the circuit board is convenient for workers to position and install in the shell through the fixed plate.
2. According to the utility model, the connecting area between the insulating resin glue and the copper substrate is increased through the limiting groove, and meanwhile, the limiting groove can effectively ensure that the insulating resin glue does not slide when the circuit board is subjected to heat treatment, so that the condition that the circuit board is irreversibly disturbed in subsequent operation due to the fact that the insulating glue filled into the circuit board slides out of the through hole in the subsequent heating process is avoided.
Drawings
FIG. 1 is a schematic diagram of a double-sided metal-based circuit board in front view;
FIG. 2 is a schematic diagram of a front cross-sectional structure of a double-sided metal-based circuit board according to the present utility model;
fig. 3 is a schematic perspective view of an insulating resin adhesive for a double-sided metal-based circuit board according to the present utility model;
fig. 4 is a schematic perspective view of a fixing plate-protective bracket of a double-sided metal-based circuit board according to the present utility model.
In the figure: 1. a copper substrate; 2. a limit groove; 3. a high-conductivity adhesive insulating layer; 4. insulating resin glue; 5. a copper component; 51. copper foil; 52. copper deposition and electrolytic copper deposition on the hole wall; 53. a top layer of road surface; 54. a bottom line surface; 6. a heat dissipation protrusion block; 7. a via hole; 8. a heat dissipation assembly; 81. a fixing plate; 82. a protective bracket; 83. a heat conducting rod.
Description of the embodiments
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.
As shown in fig. 1-4, a double-sided metal-based circuit board comprises a copper substrate 1 and a via hole 7, wherein a limit groove 2 is formed in the inner wall of the copper substrate 1, the outer surface of the copper substrate 1 is fixedly connected with a high-conductivity adhesive insulating layer 3, the inner wall of the high-conductivity adhesive insulating layer 3 is fixedly connected with an insulating resin adhesive 4, the inner wall of the insulating resin adhesive 4 is fixedly provided with a copper component 5, the copper component 5 comprises a copper foil 51, a hole wall copper-depositing electrolytic copper 52, a top layer circuit surface 53 and a bottom layer circuit surface 54, the side of the copper foil 51 is attached and connected with the hole wall copper-depositing electrolytic copper 52, the outer surface of the hole wall copper-depositing electrolytic copper 52 is fixedly connected with the inner surface of the insulating resin adhesive 4, the hole wall copper-depositing electrolytic copper 52 is made by a copper-depositing processing technology, the side of the hole wall copper-depositing electrolytic copper 52 is fixedly connected with the end part of the copper foil 51, the inner surface of the copper foil 51 is fixedly connected with the outer surface of the high-conductivity adhesive insulating layer 3, the hole wall copper deposition electro-copper 52 and the high-conductivity adhesive insulating layer 3 form a fixed structure, the hole wall copper deposition electro-copper 52 and the high-conductivity adhesive insulating layer 3 which are arranged into the fixed structure ensure that the hole wall copper deposition electro-copper 52 is not separated when in use, the top of the copper foil 51 is fixedly provided with a top layer line surface 53, the bottom of the copper foil 51 is fixedly connected with a bottom layer line surface 54, the hole wall copper deposition electro-copper 52 is arranged to ensure that the circuit board has better conductive effect when in-hole jumper, meanwhile, the side of the copper substrate 1 is fixedly connected with heat dissipation protruding blocks 6, the number of the heat dissipation protruding blocks 6 is ten, each two of the ten heat dissipation protruding blocks 6 is a group, five groups of heat dissipation protruding blocks 6 are equidistantly arranged on the side of the copper substrate 1, the through holes 7 are formed in the copper substrate 1, the side of the copper substrate 1 is fixedly connected with a heat dissipation assembly 8, the heat dissipation assembly 8 comprises fixing plates 81, protective brackets 82 and heat conducting rods 83, the end portions of the fixing plates 81 are fixedly connected with the protective brackets 82, the number of the fixing plates 81 is two, the two fixing plates 81 are symmetrically arranged by taking the perpendicular bisectors of the protective brackets 82 as symmetry axes, the outer surfaces of the fixing plates 81 are fixedly connected with the side sides of the copper base plate 1, the fixing plates 81 form a fixing structure through the protective brackets 82 and the copper base plate 1, threads are formed in the fixing plates 81, the fixing plates 81 and the copper base plate 1 are arranged into the fixing structure, the fixing plates 81 cannot fall off when being installed in an auxiliary mode, the inner walls of the protective brackets 82 are fixedly connected with the end portions of the heat conducting rods 83, the outer surfaces of the protective brackets 82 are fixedly connected with the side sides of the copper base plate 1, and the heat conducting rods 83 cannot be interfered when the circuit board is installed through the protective brackets 82.
As shown in fig. 2 and 3, the inner wall of the copper substrate 1 is provided with a limit groove 2, the inner dimension of the limit groove 2 is completely matched with the outer dimension of the insulating resin adhesive 4, the insulating resin adhesive 4 is bonded and connected with the copper substrate 1 through the limit groove 2, the insulating resin adhesive 4 cannot move and fall off when being interfered by high temperature through the limit groove 2, the outer surface of the copper substrate 1 is fixedly connected with a high-conductivity adhesive insulating layer 3, the inner wall of the high-conductivity adhesive insulating layer 3 is fixedly connected with the insulating resin adhesive 4, the inner wall of the insulating resin adhesive 4 is fixedly provided with a copper component 5, and a through hole 7 is formed in the copper substrate 1.
In summary, according to the structure shown in fig. 1 to 4, firstly, a worker performs the soldering work of the electrical components on the outer surfaces of the top layer circuit surface 53 and the bottom layer circuit surface 54, and simultaneously, through the arrangement of the limiting grooves 2, the insulating resin adhesive 4 does not fall out of the circuit board during the heat treatment processing of the circuit board, then the worker grabs the circuit board and installs the circuit board into the housing through the cooperation of the fixing plate 81, then the worker passes through the fixing plate 81 and rotates into the housing to complete the installation work of the circuit board, and as the circuit board and the electrical components on the outer surfaces thereof operate, the outer surface temperature of the circuit board gradually rises, then the heat is conducted to the copper substrate 1 through the copper foil 51 and the top layer circuit surface 53, so that the heat dissipation purpose is achieved, and then through the cooperation of the heat dissipation protrusion block 6 and the heat conducting rod 83, the heat dissipation efficiency of the copper substrate 1 is greatly enhanced, and the temperature of the outer surface of the circuit board is not rapidly raised during the long-time operation is ensured;
the processing technology of the double-sided metal-based circuit board comprises the following steps: cutting a metal substrate, drilling (note: a drilling refers to alignment holes), processing a boss pattern, etching a boss (note: the boss depth depends on the thickness of a board core and the thickness of a copper foil of a panel), browning, pressing (note: pressing is well adhered together with the front and back panels), drilling two holes (note: drilling Seban Kong Lvpian) simultaneously, surface treatment (note: resin on a hole opening of the surface of the metal substrate is required to be ground cleanly and flatly consistent), hole filling (note: no bad phenomena such as bubbles, pinholes and cracks in the hole needs to be detected after the glue filling is completed), grinding (note: the resin on the hole opening of the surface of the metal substrate is required to be ground cleanly and flatly consistent), inspection (note: no bad phenomena such as delamination, foaming, pinholes and hole opening cracks) three holes, removing glue, copper deposition, and board electrification (note: copper thickness of one copper hole is required to be 8-10 microns and copper on the surface of the hole and the resin needs to be ensured), and post-processing.
The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (8)
1. The utility model provides a two-sided metal base circuit board, includes copper base plate (1) and via hole (7), its characterized in that, spacing groove (2) have been seted up to the inner wall of copper base plate (1), and the surface fixedly connected with high conductive adhesive insulating layer (3) of copper base plate (1), and the inner wall fixedly connected with insulating resin glue (4) of high conductive adhesive insulating layer (3), the inner wall fixed mounting of insulating resin glue (4) has copper subassembly (5) moreover, the avris fixedly connected with heat dissipation protruding piece (6) of copper base plate (1) simultaneously, the inside at copper base plate (1) is seted up to via hole (7), and avris fixedly connected with heat dissipation subassembly (8) of copper base plate (1).
2. The double-sided metal-based circuit board according to claim 1, wherein the inner dimension of the limit groove (2) is completely matched with the outer dimension of the insulating resin glue (4), and the insulating resin glue (4) is bonded and connected with the copper substrate (1) through the limit groove (2).
3. The double-sided metal-based circuit board according to claim 1, wherein the copper component (5) comprises a copper foil (51), a hole wall copper-deposited electro-copper (52), a top layer circuit surface (53) and a bottom layer circuit surface (54), the hole wall copper-deposited electro-copper (52) is attached to the side of the copper foil (51), the top layer circuit surface (53) is fixedly mounted on the top of the copper foil (51), and the bottom layer circuit surface (54) is fixedly connected to the bottom of the copper foil (51).
4. A double-sided metal-based circuit board according to claim 3, wherein the side of the hole wall copper-deposited electro-copper (52) is fixedly connected with the end of the copper foil (51), the inner surface of the copper foil (51) is fixedly connected with the outer surface of the high-conductivity-rubber insulating layer (3), and the hole wall copper-deposited electro-copper (52) and the high-conductivity-rubber insulating layer (3) form a fixed structure through the copper foil (51).
5. A double-sided metal-based wiring board according to claim 3, wherein the outer surface of the hole wall copper-deposited electrolytic copper (52) is fixedly connected with the inner surface of the insulating resin glue (4), and the hole wall copper-deposited electrolytic copper (52) is produced by a copper-deposition processing process.
6. The double-sided metal-based circuit board according to claim 1, wherein the number of the heat dissipation bumps (6) is ten, ten heat dissipation bumps (6) are each two in one group, and five groups of heat dissipation bumps (6) are equidistantly arranged on the side of the copper substrate (1).
7. The double-sided metal-based circuit board according to claim 1, wherein the heat dissipation assembly (8) comprises a fixing plate (81), a protection support (82) and a heat conducting rod (83), the end part of the fixing plate (81) is fixedly connected with the protection support (82), the inner wall of the protection support (82) is fixedly connected with the end part of the heat conducting rod (83), and the outer surface of the protection support (82) is fixedly connected with the side of the copper substrate (1).
8. The double-sided metal-based circuit board according to claim 7, wherein the number of the fixing plates (81) is two, the two fixing plates (81) are symmetrically arranged with the center line of the protective bracket (82) as a symmetry axis, the outer surface of the fixing plate (81) is fixedly connected with the side of the copper substrate (1), the fixing plate (81) and the copper substrate (1) form a fixing structure through the protective bracket (82), and the inside of the fixing plate (81) is provided with threads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321323358.9U CN219999674U (en) | 2023-05-29 | 2023-05-29 | Double-sided metal-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321323358.9U CN219999674U (en) | 2023-05-29 | 2023-05-29 | Double-sided metal-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219999674U true CN219999674U (en) | 2023-11-10 |
Family
ID=88610032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321323358.9U Active CN219999674U (en) | 2023-05-29 | 2023-05-29 | Double-sided metal-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219999674U (en) |
-
2023
- 2023-05-29 CN CN202321323358.9U patent/CN219999674U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |