CN219478192U

CN219478192U - PCB circuit board structure

Info

Publication number: CN219478192U
Application number: CN202223436306.0U
Authority: CN
Inventors: 张未繁; 王泉栋; 江忠胜; 娄阳
Original assignee: Zhuhai Hongsen Electronic Technology Co ltd
Current assignee: Zhuhai Hongsen Electronic Technology Co ltd
Priority date: 2022-12-22
Filing date: 2022-12-22
Publication date: 2023-08-04
Anticipated expiration: 2032-12-22

Abstract

The utility model discloses a PCB (printed circuit board) structure, which comprises a circuit board body, wherein a circuit is arranged above the circuit board body, the left side and the right side of the circuit are respectively provided with a via hole, and copper rings are arranged in the via holes; the heat conducting pad is arranged on the front side and the rear side of the circuit, a heat conducting plate is arranged above the heat conducting pad, and the heat conducting plates are transversely and orderly arranged on the upper surface of the heat conducting pad. The PCB circuit board structure is characterized in that the material of the arranged substrate is set to be the epoxy glass fiber cloth copper-clad plate material, and the epoxy glass fiber cloth copper-clad plate is lower than other material copper-clad plate constant mediums, so that the corresponding high-speed signal transmission effect is better, crosstalk is not easy to occur between wires when the frequency of the transmitted signal is higher, the transmission quality of electronic signals is greatly improved, and the epoxy glass fiber cloth copper-clad plate has the characteristics of excellent electrical performance, good mechanical performance, good dimensional stability, good impact resistance and the like.

Description

PCB circuit board structure

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a PCB (printed circuit board) structure.

Background

The PCB, called a printed circuit board, is an important electronic component, is a support for electronic components, and is a carrier for electrical interconnection of electronic components. Since it is made using electronic printing, it is called a "printed" circuit board, and PCB is one of the important components of the electronic industry. Almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device, a military weapon system, has only electronic components such as an integrated circuit, and a printed board is used for electrically interconnecting the respective components. However, for electronic devices, the existing PCB circuit board generates a certain amount of heat during operation, so that the internal temperature of the device rises rapidly, if the heat is not timely emitted, the reliability of the electronic device is reduced, and the circuit board is used as a high heating element, and can hardly be expected to conduct heat by the resin of the circuit board itself, so that it is very important to perform good heat dissipation treatment on the circuit board, and then crosstalk is easily generated between wires when the frequency of signal transmission is high, so that the signal transmission quality is affected.

Disclosure of Invention

The utility model aims to provide a PCB circuit board structure, which can conduct certain heat to a circuit board body while ensuring signal transmission of the circuit board body by utilizing a copper ring under the mutual matching of a through hole and the copper ring, so as to achieve the aim of heat dissipation, and a heat conducting pad has good viscosity, flexibility, good compression performance and excellent heat conductivity, so that the heat conducting pad can achieve the best heat conduction and heat dissipation aims to the circuit board body in use under the matching of the heat conducting plate.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a PCB circuit board structure comprising: the circuit board comprises a circuit board body, wherein a circuit is arranged above the circuit board body, the left side and the right side of the circuit are respectively provided with a via hole, and copper rings are arranged in the via holes;

the heat conducting pad is arranged on the front side and the rear side of the circuit, a heat conducting plate is arranged above the heat conducting pad, and the heat conducting plates are transversely and orderly arranged on the upper surface of the heat conducting pad.

Preferably, the through holes are symmetrically distributed about a vertical central line axis of the circuit, a plurality of through holes are formed in the through holes, and the circuit is in a 'rice' -shaped structure.

Preferably, the depth of the via hole is equal to the thickness of the circuit board body, the via hole is tightly attached to the copper ring, and the copper ring is in an I-shaped structure.

Preferably, the circuit board body is connected with the heat conducting pad in an adhesive mode, the heat conducting pad is connected with the heat conducting plate in an adhesive mode, and the two heat conducting pads are arranged.

Preferably, the circuit board body is further provided with:

the circuit board comprises a circuit board body, wherein the circuit board body is provided with a substrate, inner core plates are arranged on the upper side and the lower side of the substrate, a prepreg is arranged on one side, far away from the substrate, of the inner core plates, and a copper foil is arranged on one side, far away from the inner core plates, of the prepreg.

Preferably, the inner core plate, the prepreg and the copper foil are symmetrically distributed relative to the substrate, the substrate is in adhesive connection with the inner core plate, the prepreg is respectively in adhesive connection with the inner core plate and the copper foil, and meanwhile, the substrate is made of an epoxy glass fiber cloth copper-clad plate.

Compared with the prior art, the utility model has the following beneficial effects:

the PCB circuit board structure is characterized in that the material of the arranged substrate is set to be the epoxy glass fiber cloth copper-clad plate material, and the epoxy glass fiber cloth copper-clad plate is lower than other material copper-clad plate constant mediums, so that the corresponding high-speed signal transmission effect is better, crosstalk is not easy to occur between wires when the frequency of the transmitted signal is higher, the transmission quality of electronic signals is greatly improved, and the epoxy glass fiber cloth copper-clad plate has the characteristics of excellent electrical performance, good mechanical performance, good dimensional stability, good impact resistance and the like.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of an explosion structure of a circuit board body according to the present utility model;

FIG. 3 is a schematic diagram of the junction between the via and the copper ring according to the present utility model.

In the figure: 1. a circuit board body; 101. a substrate; 102. an inner core plate; 103. a prepreg; 104. copper foil; 2. a line; 3. a via hole; 4. a copper ring; 5. a thermal pad; 6. a heat conducting plate.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, it will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In order to solve the problem that the existing PCB circuit board generates a certain amount of heat for the electronic device during operation, so that the internal temperature of the device rises rapidly, if the heat is not timely emitted, the reliability of the electronic device decreases, and the circuit board is used as a high heating element, and the heat conduction by the resin of the circuit board is hardly expected, so that it is very important to perform good heat dissipation treatment on the circuit board, and referring to fig. 1 and 2, the following technical scheme is provided in this embodiment;

a PCB circuit board structure comprising: the circuit board comprises a circuit board body 1, wherein a circuit 2 is arranged above the circuit board body 1, the left side and the right side of the circuit 2 are respectively provided with a via hole 3, and copper rings 4 are arranged in the via holes 3;

and the heat conducting pads 5 are arranged on the front side and the rear side of the circuit 2, the heat conducting plates 6 are arranged above the heat conducting pads 5, and the heat conducting plates 6 are transversely and orderly arranged on the upper surface of the heat conducting pads 5.

The via hole 3 is symmetric distribution about the vertical center line axis of the circuit 2, and the via hole 3 is provided with a plurality of, and the structure of circuit 2 sets up to "rice" font structure, and the degree of depth of via hole 3 equals the thickness of circuit board body 1, and the via hole 3 closely laminates with copper circle 4, and the structure of copper circle 4 sets up to "worker" style of calligraphy structure, and circuit board body 1 is connected with heat conduction pad 5 bonding, and heat conduction pad 5 is connected with heat conduction plate 6 bonding, and heat conduction pad 5 is provided with two.

Specifically, during the use, firstly the circuit board body 1 can utilize a plurality of via holes 3 to effectively dissipate heat, simultaneously can accelerate radiating rate and radiating area under the mutually supporting of heat conduction pad 5, increase the performance of circuit board body 1, secondly transversely orderly zigzag heat-conducting plate 6 can be resistant to effectively dredge the heat that heat conduction pad 5 collected, is convenient for dispel the heat.

In order to solve the problem that the crosstalk is easy to occur between wires when the frequency of the transmission signal is high in the conventional PCB, and the signal transmission quality is affected, referring to FIG. 3, the following technical scheme is provided:

a substrate 101 disposed in the circuit board body 1, an inner core board 102 disposed on both upper and lower sides of the substrate 101, a prepreg 103 disposed on a side of the inner core board 102 away from the substrate 101, a copper foil 104 disposed on a side of the prepreg 103 away from the inner core board 102, the inner core plate 102, the prepreg 103 and the copper foil 104 are symmetrically distributed with respect to the substrate 101, the substrate 101 is in adhesive connection with the inner core plate 102, the prepreg 103 is respectively in adhesive connection with the inner core plate 102 and the copper foil 104, and meanwhile, the substrate 101 is made of an epoxy glass fiber cloth copper-clad plate.

Specifically, when the circuit board body 1 is manufactured, firstly, a substrate 101 with good heat dissipation and stability is required to be selected, secondly, a film is utilized to develop and image an electronic circuit on the film, the substrate 101 is clamped between the two films, two inner core boards 102 with wiring are obtained, then two copper foils 104 are respectively adhered to two sides of the two inner core boards 102 through prepregs 103, at this time, the inner core boards 102 and the copper foils 104 are perfectly adhered together through the prepregs 103, and then, the next lamination and perfecting process is carried out on the whole circuit board body 1, so that the circuit board body 1 with good performance and stable signal transmission is obtained.

In summary, this PCB circuit board structure, through the mutual cooperation of via hole 3 and copper circle 4, can carry out certain heat to circuit board body 1 when utilizing copper circle 4 to ensure circuit board body 1 signal transmission, thereby reach radiating purpose, secondly, heat conduction pad 5 has good viscidity, flexibility, good compressibility and have good thermal conductivity, make it in use can reach best heat conduction and heat dissipation purpose to circuit board body 1 under the cooperation of heat conduction board 6, the material through the base plate 101 after setting is established to epoxy glass fiber cloth copper-clad plate material, because of epoxy glass fiber cloth copper-clad plate is lower than other material copper-clad plate constant medium, therefore corresponding transmission high-speed signal effect is better, so can be at transmission signal frequency time line and line difficult emergence crosstalk, electronic signal transmission quality has been greatly improved, secondly, epoxy glass fiber cloth copper-clad plate has the electrical property is good, good mechanical property, dimensional stability, characteristics such as shock resistance are good.

It should be noted that in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action, and does not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A PCB circuit board structure, comprising: the circuit board comprises a circuit board body (1), wherein a circuit (2) is arranged above the circuit board body (1), the left side and the right side of the circuit (2) are respectively provided with a via hole (3), and copper rings (4) are arranged in the via holes (3);

the heat conducting pads (5) are arranged on the front side and the rear side of the circuit (2), heat conducting plates (6) are arranged above the heat conducting pads (5), and the heat conducting plates (6) are transversely and orderly arranged on the upper surfaces of the heat conducting pads (5).

2. The PCB circuit board structure of claim 1, wherein the via holes (3) are symmetrically distributed about a vertical center line axis of the circuit (2), the via holes (3) are provided in a plurality, and the circuit (2) is configured in a "m" shape.

3. The PCB circuit board structure of claim 1, wherein the depth of the via hole (3) is equal to the thickness of the circuit board body (1), the via hole (3) is tightly attached to the copper ring (4), and the copper ring (4) is configured as an "i" structure.

4. A PCB circuit board structure according to claim 1, characterized in that the circuit board body (1) is adhesively connected with the thermal pads (5), and that the thermal pads (5) are adhesively connected with the thermal board (6), and that the thermal pads (5) are provided with two.

5. A PCB circuit board structure according to claim 1, characterized in that the circuit board body (1) is further provided with:

the circuit board comprises a substrate (101) which is arranged in the circuit board body (1), wherein inner core plates (102) are arranged on the upper side and the lower side of the substrate (101), a prepreg (103) is arranged on one side, far away from the substrate (101), of the inner core plates (102), and a copper foil (104) is arranged on one side, far away from the inner core plates (102), of the prepreg (103).

6. The PCB circuit board structure of claim 5, wherein the inner core board (102), the prepreg (103) and the copper foil (104) are symmetrically distributed with respect to the substrate (101), the substrate (101) is bonded to the inner core board (102), the prepreg (103) is bonded to the inner core board (102) and the copper foil (104), and the substrate (101) is made of an epoxy glass fiber cloth copper-clad plate.