CN110446335A - A kind of compound layer circuit board and preparation method thereof - Google Patents

A kind of compound layer circuit board and preparation method thereof Download PDF

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Publication number
CN110446335A
CN110446335A CN201910659434.5A CN201910659434A CN110446335A CN 110446335 A CN110446335 A CN 110446335A CN 201910659434 A CN201910659434 A CN 201910659434A CN 110446335 A CN110446335 A CN 110446335A
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China
Prior art keywords
insulating layer
aluminum substrate
copper foil
hydrocarbon resin
circuit board
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Application number
CN201910659434.5A
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Chinese (zh)
Inventor
沈振春
向峰
王刚
朱德明
施吉连
蒋文
蒋志俊
刘超
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Individual
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Individual
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Priority to CN201910659434.5A priority Critical patent/CN110446335A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a kind of compound layer circuit boards and preparation method thereof, the compound layer circuit board includes aluminum substrate, the insulating layer on aluminum substrate, the copper foil on insulating layer and is located at aluminum substrate, insulating layer and two stiffening plates of copper foil two sides, insulating layer includes the glass cloth for being impregnated with hydrocarbon resin glue, has been evenly distributed ceramic powder in hydrocarbon resin glue.1) preparation method is the following steps are included: provide an aluminum substrate；2) glass cloth is put into hydrocarbon resin glue and carries out dipping to form insulating layer；3) insulating layer in step 2 is dried；4) insulating layer dried through step 3) is placed on aluminum substrate, then copper foil is placed on the insulating layer, make triplicity at one by hot-pressing technique；5) two stiffening plates are passed through into two outsides that thermally conductive glue is bonded in aluminum substrate, insulating layer and copper foil respectively.Compound layer circuit board provided by the invention has good peel strength and thermal diffusivity by with good thermal conductivity, toughness and adhesive force.

Description

A kind of compound layer circuit board and preparation method thereof
Technical field
The present invention relates to composite layer circuit board technology fields, more particularly to a kind of compound layer circuit board and its preparation side Method.
Background technique
With the high speed development of electronic information technology, the especially high frequency and high speed of signal transmission, signal is transmitted Quality requirement it is higher and higher, it is desirable that signaling rate as quickly as possible, signal transmission loss it is small as far as possible, with signal transmit it is related Compound layer circuit board is required there is higher high frequency characteristics, lower dielectric constant and dielectric loss, this is because the news of substrate The square root of the dielectric constant of number transmission speed and baseplate material is inversely proportional, thus the dielectric constant of baseplate material usually it is smaller more It is good；On the other hand, the loss that signal transmitting is represented since dielectric loss is smaller is fewer, therefore the lesser material of dielectric loss can mention The transmission quality of confession is also better.
The substrate of general circuit plate be metal foil combined with hydrocarbon resin layer with pressing mode, with improve dielectric constant and Dielectric loss value, and promote flame retardancy and hygroscopicity, however the substrate peel strength that is formed of metal foil and hydrocarbon resin layer and Intensity is inadequate, and then influences the function and reliability of its electronic product.
Summary of the invention
In order to overcome the deficiencies of the prior art, the invention discloses a kind of compound layer circuit boards and preparation method thereof.
To achieve the above object, the invention is realized by the following technical scheme:
The embodiment of the invention discloses a kind of compound layer circuit boards, including aluminum substrate, the insulating layer on the aluminum substrate, set In the copper foil on the insulating layer and the aluminum substrate, insulating layer and two stiffening plates of copper foil two sides are located at, described in two The aluminum substrate, insulating layer and copper foil are held among the two by stiffening plate, and the insulating layer includes being impregnated with hydrocarbon resin glue Glass cloth, be evenly distributed ceramic powder in the hydrocarbon resin glue.
One of as a preferred solution of the present invention, the hydrocarbon resin glue includes the substance of following parts by weight: hydrocarbon resin 250-265 parts, 20-25 parts of curing agent, 120-150 parts of ceramic powder, 0.2-1.5 parts of coupling agent and 20-25 parts of solvent.
One of as a preferred solution of the present invention, the hydrocarbon resin in Petropols C5 and Petropols C9 extremely Few one kind；And/or the ceramic powder includes the aluminium oxide that partial size is 10-50 μm；And/or the coupling agent is using silane coupled Agent；And/or the curing agent uses dicyandiamide.
One of as a preferred solution of the present invention, multiple heat release holes have been evenly distributed on the outside of the stiffening plate.
One of as a preferred solution of the present invention, the aluminum substrate is provided with multiple heat dissipations far from the side of the insulating layer Hole.
One of as a preferred solution of the present invention, the aluminum substrate is provided with several on the one side of the insulating layer Tiny pit.
One of as a preferred solution of the present invention, between the stiffening plate and the aluminum substrate, insulating layer and copper foil respectively It is bonded using heat-conducting glue layer.
The embodiment of the invention also discloses a kind of preparation methods of compound layer circuit board, comprising the following steps:
Step 1): providing an aluminum substrate, and if carrying out blasting treatment on aluminum substrate to be formed on the one side of aluminum substrate Do tiny pit；
Step 2: glass cloth is put into hydrocarbon resin glue and carries out dipping to form insulating layer, in the hydrocarbon resin glue Ceramic powder is distributed with evenly；
Step 3): the insulating layer drying in step 2 is obtained to the insulating layer of semi-cured state；
Step 4): the insulating layer dried through step 3) is placed on aluminum substrate, then copper foil is placed on the insulating layer, through overheating Pressure technology makes triplicity at one；
Step 5): two stiffening plates are passed through into two outsides that thermally conductive glue is bonded in aluminum substrate, insulating layer and copper foil respectively.
One of as a preferred solution of the present invention, the hydrocarbon resin glue includes the substance of following parts by weight: hydrocarbon resin 250-265 parts, 20-25 parts of curing agent, 120-150 parts of ceramic powder, 0.2-1.5 parts of coupling agent and 20-25 parts of solvent；And/or institute It states hydrocarbon resin and is selected from least one of Petropols C5 and Petropols C9；And/or the ceramic powder includes that partial size is 10-50 μm of aluminium oxide；And/or the coupling agent uses silane coupling agent；And/or the curing agent uses dicyandiamide;With/ Or, being evenly distributed multiple heat release holes on the outside of the stiffening plate；And/or the aluminum substrate far from the insulating layer one Side is provided with multiple heat release holes；And/or the aluminum substrate be provided on the one side of the insulating layer it is several tiny recessed Hole；And/or heat-conducting glue layer bonding is respectively adopted between the stiffening plate and the aluminum substrate, insulating layer and copper foil.
One of as a preferred solution of the present invention, insulating layer is toasted into 200- at a temperature of 120-140 ° in the step 3) 400s；And/or the insulating layer dried through step 3) is placed on aluminum substrate in the step 4), then copper foil is placed on absolutely In edge layer, 2-3h is heated at a temperature of three is placed in 180-190 °, while pressing 2-3h under the pressure of 4-6Mpa, to make Triplicity is obtained at one.
Compared with prior art, the present invention has at least the following advantages:
1) circuit board provided by the invention is improved the intensity of compound layer circuit board by ceramic powder, and has good Thermal conductivity, and can guarantee that compound layer circuit board has certain toughness and adhesive force by hydrocarbon resin；
2) aluminum substrate, insulating layer and copper foil are clamped in wherein it is possible to mention by circuit board provided by the invention by two pieces of stiffening plates The peel strength of high recombination region circuit board, the resistance of enhancing aluminum substrate, insulating layer and copper foil separation.
3) make compound layer circuit board that there is excellent dielectric properties and low dielectric damage using hydrocarbon resin in the present invention Consumption；
4) present invention in stiffening plate and aluminum substrate on respectively heat release hole can increase the thermal diffusivity of compound layer circuit board.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described.
Fig. 1 is a kind of structural schematic diagram of compound layer circuit board disclosed in the embodiment of the present invention.
Specific embodiment
Below with reference to examples and drawings, the present invention is described in further detail, to enable those skilled in the art's reference Specification word can be implemented accordingly.
Embodiment 1:
Shown in Figure 1, the embodiment of the present invention 1 discloses a kind of compound layer circuit board, including aluminum substrate 1, is set on aluminum substrate 1 Insulating layer 2, the copper foil 3 on insulating layer 2 and two reinforcements for being located at 3 two sides of aluminum substrate 1, insulating layer 2 and copper foil Aluminum substrate 1, insulating layer 2 and copper foil 3 are held among the two by plate 4, two stiffening plates 4, and insulating layer 2 includes being impregnated with hydrocarbon resin The glass cloth of glue has been evenly distributed ceramic powder in hydrocarbon resin glue.
Wherein, hydrocarbon resin glue includes the substance of following parts by weight: 250 parts of hydrocarbon resin, 20 parts of curing agent, ceramic powder 120 parts, 0.2 part of coupling agent and 20 parts of solvent.
Hydrocarbon resin is selected from Petropols C5, and ceramic powder includes the aluminium oxide that partial size is 10 μm.
Coupling agent uses silane coupling agent, such as A151 (vinyltriethoxysilane), A171 (vinyl trimethoxy Silane), A172 (vinyl three (beta-methoxy ethyoxyl) silane)；Curing agent uses dicyandiamide.
The outside of stiffening plate 4 has been evenly distributed multiple heat release holes 41, can be incited somebody to action by the heat release hole 41 in 4 outside of stiffening plate The heat that aluminum substrate 1, insulating layer 2 and copper foil 3 transmit distributes.
Aluminum substrate 1 is provided with multiple heat release holes 11 far from the side of insulating layer 2, can by the heat release hole 11 on aluminum substrate 1 The heat spreader transmitted on insulating layer 2 to be gone out.
Aluminum substrate 1 is provided with several tiny pits on the one side of insulating layer 2.It is arranged on the surface of aluminum substrate 1 Pit can increase the binding force of insulating layer 2 Yu aluminium base, that is, increase insulating layer 2 in the adhesive force on aluminium base surface.
The bonding of heat-conducting glue layer 5 is respectively adopted between stiffening plate 4 and aluminum substrate 1, insulating layer 2 and copper foil 3.Using heat-conducting glue layer 5 one side can make stiffening plate 4 be combined with aluminum substrate 1, insulating layer 2 and copper foil 3, increase aluminum substrate 1, insulating layer 2 and copper foil 3 Between binding force, and then improve the peel strength between aluminum substrate 1, insulating layer 2 and copper foil 3, on the other hand can be by aluminium Heat derives in substrate 1, insulating layer 2 and copper foil 3.
The embodiment of the invention also discloses the preparation methods of above-mentioned compound layer circuit board, comprising the following steps:
Step 1): providing above-mentioned aluminum substrate 1, and blasting treatment has been carried out on the aluminum substrate 1 to the shape on the one side of aluminum substrate 1 At several tiny pits；
Step 2: glass cloth is put into hydrocarbon resin glue and carries out dipping to form insulating layer 2, in hydrocarbon resin glue equably Ceramic powder is distributed with；Wherein, the preparation process of hydrocarbon resin glue is by the substance of following parts by weight: 250 parts of hydrocarbon resin, solidification 20 parts of agent, 120 parts of ceramic powder, 0.2 part of coupling agent and 20 parts of solvent are stirred mixing, so that hydrocarbon resin glue be made；
Step 3): the insulating layer 2 in step 2 is toasted into 200s at a temperature of 120 °, to obtain the insulation of semi-cured state Layer；
Step 4): the insulating layer 2 dried through step 3) being placed on aluminum substrate 1, then copper foil 3 is placed on insulating layer 2, will Three heats 2h at a temperature of being placed in 180 °, while pressing 2h under the pressure of 4Mpa, so that triplicity is at one；
Step 5): two stiffening plates 4 are bonded in two outsides of aluminum substrate 1, insulating layer 2 and copper foil 3 by thermally conductive glue respectively.
Embodiment 2:
Shown in Figure 1, the embodiment of the present invention 2 discloses a kind of compound layer circuit board, including aluminum substrate 1, is set on aluminum substrate 1 Insulating layer 2, the copper foil 3 on insulating layer 2 and two reinforcements for being located at 3 two sides of aluminum substrate 1, insulating layer 2 and copper foil Aluminum substrate 1, insulating layer 2 and copper foil 3 are held among the two by plate 4, two stiffening plates 4, and insulating layer 2 includes being impregnated with hydrocarbon resin The glass cloth of glue has been evenly distributed ceramic powder in hydrocarbon resin glue.
Wherein, hydrocarbon resin glue includes the substance of following parts by weight: 255 parts of hydrocarbon resin, 22 parts of curing agent, ceramic powder 130 parts, 0.6 part of coupling agent and 22 parts of solvent.
Hydrocarbon resin is selected from Petropols C5, and ceramic powder includes the aluminium oxide that partial size is 20 μm.
Coupling agent uses silane coupling agent, such as A151 (vinyltriethoxysilane), A171 (vinyl trimethoxy Silane), A172 (vinyl three (beta-methoxy ethyoxyl) silane)；Curing agent uses dicyandiamide.
The outside of stiffening plate 4 has been evenly distributed multiple heat release holes, can be by aluminium base by the heat release hole in 4 outside of stiffening plate The heat that plate 1, insulating layer 2 and copper foil 3 transmit distributes.
Aluminum substrate 1 is provided with multiple heat release holes far from the side of insulating layer 2, can be incited somebody to action by the heat release hole on aluminum substrate 1 The heat spreader transmitted on insulating layer 2 is gone out.
Aluminum substrate 1 is provided with several tiny pits on the one side of insulating layer 2.It is arranged on the surface of aluminum substrate 1 Pit can increase the binding force of insulating layer 2 Yu aluminium base, that is, increase insulating layer 2 in the adhesive force on aluminium base surface.
The bonding of heat-conducting glue layer 5 is respectively adopted between stiffening plate 4 and aluminum substrate 1, insulating layer 2 and copper foil 3.Using heat-conducting glue layer 5 one side can make stiffening plate 4 be combined with aluminum substrate 1, insulating layer 2 and copper foil 3, increase aluminum substrate 1, insulating layer 2 and copper foil 3 Between binding force, and then improve the peel strength between aluminum substrate 1, insulating layer 2 and copper foil 3, on the other hand can be by aluminium Heat derives in substrate 1, insulating layer 2 and copper foil 3.
The embodiment of the invention also discloses the preparation methods of above-mentioned compound layer circuit board, comprising the following steps:
Step 1): providing above-mentioned aluminum substrate 1, and blasting treatment has been carried out on the aluminum substrate 1 to the shape on the one side of aluminum substrate 1 At several tiny pits；
Step 2: glass cloth is put into hydrocarbon resin glue and carries out dipping to form insulating layer 2, in hydrocarbon resin glue equably Ceramic powder is distributed with；Wherein, the preparation process of hydrocarbon resin glue is by the substance of following parts by weight: 255 parts of hydrocarbon resin, solidification 22 parts of agent, 130 parts of ceramic powder, 0.6 part of coupling agent and 22 parts of solvent are stirred mixing, so that hydrocarbon resin glue be made；
Step 3): the insulating layer 2 in step 2 is toasted into 250s at a temperature of 125 °, to obtain the insulation of semi-cured state Layer；
Step 4): the insulating layer 2 dried through step 3) being placed on aluminum substrate 1, then copper foil 3 is placed on insulating layer 2, will Three heats 2.5h at a temperature of being placed in 185 °, while pressing 2h under the pressure of 4.5Mpa, so that triplicity is in one Place；
Step 5): two stiffening plates 4 are bonded in two outsides of aluminum substrate 1, insulating layer 2 and copper foil 3 by thermally conductive glue respectively.
Embodiment 3:
Shown in Figure 1, the embodiment of the present invention 3 discloses a kind of compound layer circuit board, including aluminum substrate 1, is set on aluminum substrate 1 Insulating layer 2, the copper foil 3 on insulating layer 2 and two reinforcements for being located at 3 two sides of aluminum substrate 1, insulating layer 2 and copper foil Aluminum substrate 1, insulating layer 2 and copper foil 3 are held among the two by plate 4, two stiffening plates 4, and insulating layer 2 includes being impregnated with hydrocarbon resin The glass cloth of glue has been evenly distributed ceramic powder in hydrocarbon resin glue.
Wherein, hydrocarbon resin glue includes the substance of following parts by weight: 260 parts of hydrocarbon resin, 24 parts of curing agent, ceramic powder 140 parts, 0.9 part of coupling agent and 23 parts of solvent.
Hydrocarbon resin is selected from Petropols C9, and ceramic powder includes the aluminium oxide that partial size is 40 μm.
Coupling agent uses silane coupling agent, such as A151 (vinyltriethoxysilane), A171 (vinyl trimethoxy Silane), A172 (vinyl three (beta-methoxy ethyoxyl) silane)；Curing agent uses dicyandiamide.
The outside of stiffening plate 4 has been evenly distributed multiple heat release holes, can be by aluminium base by the heat release hole in 4 outside of stiffening plate The heat that plate 1, insulating layer 2 and copper foil 3 transmit distributes.
Aluminum substrate 1 is provided with multiple heat release holes far from the side of insulating layer 2, can be incited somebody to action by the heat release hole on aluminum substrate 1 The heat spreader transmitted on insulating layer 2 is gone out.
Aluminum substrate 1 is provided with several tiny pits on the one side of insulating layer 2.It is arranged on the surface of aluminum substrate 1 Pit can increase the binding force of insulating layer 2 Yu aluminium base, that is, increase insulating layer 2 in the adhesive force on aluminium base surface.
The bonding of heat-conducting glue layer 5 is respectively adopted between stiffening plate 4 and aluminum substrate 1, insulating layer 2 and copper foil 3.Using heat-conducting glue layer 5 one side can make stiffening plate 4 be combined with aluminum substrate 1, insulating layer 2 and copper foil 3, increase aluminum substrate 1, insulating layer 2 and copper foil 3 Between binding force, and then improve the peel strength between aluminum substrate 1, insulating layer 2 and copper foil 3, on the other hand can be by aluminium Heat derives in substrate 1, insulating layer 2 and copper foil 3.
The embodiment of the invention also discloses the preparation methods of above-mentioned compound layer circuit board, comprising the following steps:
Step 1): providing above-mentioned aluminum substrate 1, and blasting treatment has been carried out on the aluminum substrate 1 to the shape on the one side of aluminum substrate 1 At several tiny pits；
Step 2: glass cloth is put into hydrocarbon resin glue and carries out dipping to form insulating layer 2, in hydrocarbon resin glue equably Ceramic powder is distributed with；Wherein, the preparation method of hydrocarbon resin glue is by the substance of following parts by weight: 260 parts of hydrocarbon resin, solidification 24 parts of agent, 140 parts of ceramic powder, 0.9 part of coupling agent and 23 parts of solvent are stirred mixing, so that hydrocarbon resin glue be made；
Step 3): the insulating layer 2 in step 2 is toasted into 300s at a temperature of 130 °, to obtain the insulation of semi-cured state Layer；
Step 4): the insulating layer 2 dried through step 3) being placed on aluminum substrate 1, then copper foil 3 is placed on insulating layer 2, will Three heats 2.5h at a temperature of being placed in 185 °, while pressing 2.5h under the pressure of 5Mpa, so that triplicity is in one Place；
Step 5): two stiffening plates 4 are bonded in two outsides of aluminum substrate 1, insulating layer 2 and copper foil 3 by thermally conductive glue respectively.
Embodiment 4:
Shown in Figure 1, the embodiment of the present invention 4 discloses a kind of compound layer circuit board, including aluminum substrate 1, is set on aluminum substrate 1 Insulating layer 2, the copper foil 3 on insulating layer 2 and two reinforcements for being located at 3 two sides of aluminum substrate 1, insulating layer 2 and copper foil Aluminum substrate 1, insulating layer 2 and copper foil 3 are held among the two by plate 4, two stiffening plates 4, and insulating layer 2 includes being impregnated with hydrocarbon resin The glass cloth of glue has been evenly distributed ceramic powder in hydrocarbon resin glue.
Wherein, hydrocarbon resin glue includes the substance of following parts by weight: 265 parts of hydrocarbon resin, 25 parts of curing agent, ceramic powder 150 parts, 1.5 parts of coupling agent and 25 parts of solvent.
Hydrocarbon resin includes Petropols C5 and Petropols C9, and ceramic powder includes the aluminium oxide that partial size is 50 μm.
Coupling agent uses silane coupling agent, such as A151 (vinyltriethoxysilane), A171 (vinyl trimethoxy Silane), A172 (vinyl three (beta-methoxy ethyoxyl) silane)；Curing agent uses dicyandiamide.
The outside of stiffening plate 4 has been evenly distributed multiple heat release holes, can be by aluminium base by the heat release hole in 4 outside of stiffening plate The heat that plate 1, insulating layer 2 and copper foil 3 transmit distributes.
Aluminum substrate 1 is provided with multiple heat release holes far from the side of insulating layer 2, can be incited somebody to action by the heat release hole on aluminum substrate 1 The heat spreader transmitted on insulating layer 2 is gone out.
Aluminum substrate 1 is provided with several tiny pits on the one side of insulating layer 2.It is arranged on the surface of aluminum substrate 1 Pit can increase the binding force of insulating layer 2 Yu aluminium base, that is, increase insulating layer 2 in the adhesive force on aluminium base surface.
The bonding of heat-conducting glue layer 5 is respectively adopted between stiffening plate 4 and aluminum substrate 1, insulating layer 2 and copper foil 3.Using heat-conducting glue layer 5 one side can make stiffening plate 4 be combined with aluminum substrate 1, insulating layer 2 and copper foil 3, increase aluminum substrate 1, insulating layer 2 and copper foil 3 Between binding force, and then improve the peel strength between aluminum substrate 1, insulating layer 2 and copper foil 3, on the other hand can be by aluminium Heat derives in substrate 1, insulating layer 2 and copper foil 3.
The embodiment of the invention also discloses the preparation methods of above-mentioned compound layer circuit board, comprising the following steps:
Step 1): providing above-mentioned aluminum substrate 1, and blasting treatment is carried out on the aluminum substrate 1 to be formed on the one side of aluminum substrate 1 Several tiny pits；
Step 2: glass cloth is put into hydrocarbon resin glue and carries out dipping to form insulating layer 2, in hydrocarbon resin glue equably Ceramic powder is distributed with；Wherein, the preparation method of hydrocarbon resin glue is by the substance of following parts by weight: 265 parts of hydrocarbon resin, solidification 25 parts of agent, 150 parts of ceramic powder, 1.5 parts of coupling agent and 25 parts of solvent are sufficiently stirred, to obtain hydrocarbon resin glue；
Step 3): the insulating layer 2 in step 2 is toasted into 400s at a temperature of 140 °, to obtain the insulation of semi-cured state Layer；
Step 4): the insulating layer 2 dried through step 3) being placed on aluminum substrate 1, then copper foil 3 is placed on insulating layer 2, will Three heats 3h at a temperature of being placed in 190 °, while pressing 3h under the pressure of 6Mpa, so that triplicity is at one；
Step 5): two stiffening plates 4 are bonded in two outsides of aluminum substrate 1, insulating layer 2 and copper foil 3 by thermally conductive glue respectively.
Compound layer circuit board provided by 1-4 of the embodiment of the present invention through detection indices it is qualified, testing result referring to Table 1.
By above technical scheme, the compound layer circuit board that 1-4 of the embodiment of the present invention is provided is made compound by ceramic powder The intensity of layer circuit board is improved, and has good thermal conductivity, and can guarantee compound layer circuit board by hydrocarbon resin With certain toughness and adhesive force；Circuit board provided by the invention passes through two pieces of stiffening plates for aluminum substrate, insulating layer and copper foil It is clamped in wherein it is possible to improve the peel strength of compound layer circuit board, the resistance of enhancing aluminum substrate, insulating layer and copper foil separation； Make compound layer circuit board that there is excellent dielectric properties and low dielectric loss using hydrocarbon resin in the present invention, conforms to It asks；Heat release hole can increase the thermal diffusivity of compound layer circuit board respectively in stiffening plate and aluminum substrate in the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, herein Defined General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Cause This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein and new The consistent widest scope of clever feature.

Claims (10)

1. a kind of compound layer circuit board, it is characterised in that: including aluminum substrate, the insulating layer on the aluminum substrate, be set to institute It states the copper foil on insulating layer and is located at the aluminum substrate, insulating layer and two stiffening plates of copper foil two sides, two reinforcements The aluminum substrate, insulating layer and copper foil are held among the two by plate, and the insulating layer includes the glass for being impregnated with hydrocarbon resin glue Glass cloth has been evenly distributed ceramic powder in the hydrocarbon resin glue.
2. a kind of compound layer circuit board according to claim 1, it is characterised in that: the hydrocarbon resin glue includes following heavy Measure part substance: 250-265 parts of hydrocarbon resin, 20-25 parts of curing agent, 120-150 parts of ceramic powder, 0.2-1.5 parts of coupling agent and 20-25 parts of solvent.
3. a kind of compound layer circuit board according to claim 2, it is characterised in that: the hydrocarbon resin is selected from Petropols At least one of C5 and Petropols C9；And/or the ceramic powder includes the aluminium oxide that partial size is 10-50 μm；And/or institute Coupling agent is stated using silane coupling agent；And/or the curing agent uses dicyandiamide.
4. a kind of compound layer circuit board according to claim 1, it is characterised in that: the outside of the stiffening plate is equably divided It is furnished with multiple heat release holes.
5. a kind of compound layer circuit board according to claim 1, it is characterised in that: the aluminum substrate is far from the insulating layer Side be provided with multiple heat release holes.
6. a kind of compound layer circuit board according to claim 1, it is characterised in that: the aluminum substrate is close to the insulating layer One side on be provided with several tiny pits.
7. a kind of compound layer circuit board according to claim 1, it is characterised in that: the stiffening plate and the aluminum substrate, Heat-conducting glue layer bonding is respectively adopted between insulating layer and copper foil.
8. a kind of preparation method of compound layer circuit board, it is characterised in that: the following steps are included:
Step 1): providing an aluminum substrate, and if carrying out blasting treatment on aluminum substrate to be formed on the one side of aluminum substrate Do tiny pit；
Step 2: glass cloth is put into hydrocarbon resin glue and carries out dipping to form insulating layer, in the hydrocarbon resin glue Ceramic powder is distributed with evenly；
Step 3): the insulating layer drying in step 2 is obtained to the insulating layer of semi-cured state；
Step 4): the insulating layer dried through step 3) is placed on aluminum substrate, then copper foil is placed on the insulating layer, through overheating Pressure technology makes triplicity at one；
Step 5): two stiffening plates are passed through into two outsides that thermally conductive glue is bonded in aluminum substrate, insulating layer and copper foil respectively.
9. a kind of preparation method of compound layer circuit board according to claim 8, it is characterised in that: the hydrocarbon resin glue Substance including following parts by weight: 250-265 parts of hydrocarbon resin, 20-25 parts of curing agent, 120-150 parts of ceramic powder, coupling agent 0.2-1.5 parts and solvent 20-25 parts；And/or the hydrocarbon resin in Petropols C5 and Petropols C9 at least one Kind；And/or the ceramic powder includes the aluminium oxide that partial size is 10-50 μm；And/or the coupling agent uses silane coupling agent； And/or the curing agent uses dicyandiamide；And/or multiple heat release holes are evenly distributed on the outside of the stiffening plate；With/ Or, the aluminum substrate is provided with multiple heat release holes far from the side of the insulating layer；And/or the aluminum substrate is close to described exhausted Several tiny pits are provided on the one side of edge layer；And/or the stiffening plate and the aluminum substrate, insulating layer and copper foil Between be respectively adopted heat-conducting glue layer bonding.
10. a kind of preparation method of compound layer circuit board according to claim 8, it is characterised in that: in the step 3) Insulating layer is toasted into 200-400s at a temperature of 120-140 °；And/or the insulating layer that will be dried through step 3) in the step 4) It is placed on aluminum substrate, then copper foil is placed on the insulating layer, 2-3h is heated at a temperature of three is placed in 180-190 °, simultaneously 2-3h is pressed under the pressure of 4-6Mpa, so that triplicity is at one.
CN201910659434.5A 2019-07-22 2019-07-22 A kind of compound layer circuit board and preparation method thereof Withdrawn CN110446335A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111586967A (en) * 2020-06-07 2020-08-25 方炜 Copper-clad circuit board and preparation method thereof
CN116985409A (en) * 2023-07-19 2023-11-03 东莞市项华电子科技有限公司 Production line for composite backing plate of circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111586967A (en) * 2020-06-07 2020-08-25 方炜 Copper-clad circuit board and preparation method thereof
CN116985409A (en) * 2023-07-19 2023-11-03 东莞市项华电子科技有限公司 Production line for composite backing plate of circuit board
CN116985409B (en) * 2023-07-19 2024-02-13 东莞市项华电子科技有限公司 Production line for composite backing plate of circuit board

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Application publication date: 20191112