CN102595766A - Flexible copper-foil high thermal conductivity substrate and manufacturing method thereof - Google Patents

Flexible copper-foil high thermal conductivity substrate and manufacturing method thereof Download PDF

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Publication number
CN102595766A
CN102595766A CN2011100022454A CN201110002245A CN102595766A CN 102595766 A CN102595766 A CN 102595766A CN 2011100022454 A CN2011100022454 A CN 2011100022454A CN 201110002245 A CN201110002245 A CN 201110002245A CN 102595766 A CN102595766 A CN 102595766A
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CN
China
Prior art keywords
copper foil
layer
thermal conductive
heat conduction
insulating polymer
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CN2011100022454A
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Chinese (zh)
Inventor
李莺
陈辉
张孟浩
李建辉
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昆山雅森电子材料科技有限公司
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Priority to CN2011100022454A priority Critical patent/CN102595766A/en
Publication of CN102595766A publication Critical patent/CN102595766A/en

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Abstract

The invention discloses a flexible copper-foil high thermal conductivity substrate. The substrate comprises a first copper foil layer, a second copper foil layer, a thermal conductive adhesive layer and an insulating polymer layer. The insulating polymer layer is fixedly arranged between the first copper foil layer and the thermal conductive adhesive layer. The second copper foil layer is arranged on an outside of the thermal conductive adhesive layer. The thermal conductive adhesive layer comprises a resin layer and a heat dissipation powder. A manufacturing method is characterized by: coating the insulating polymer on a rough surface of the first copper foil layer, drying and forming the insulating polymer layer; then, using one method of coating and transfer printing methods to forming the thermal conductive adhesive layer on the surface of the insulating polymer layer and making the thermal conductive adhesive layer be in a semi-polymerization semi-harden state; finally, overlaying the second copper foil layer, heating and curing. A technology is simple. Operation is easy. A production temperature is low. Cost can be saved. Popularization is strong. Product thickness is thin. Thermal conductivity property is high. High buckling sliding times can be accorded and a requirement that a bending fillet is less than 0.8 mm can be satisfied. The substrate is suitable for a product which has a demand for circuit board bending or a sliding demand. Dimensional stability is high, which is suitable for various kinds of the substrates.

Description

Flexible copper clad high thermal conductive substrate and preparation method thereof

Technical field

The present invention relates to flexible copper clad substrate on the heat radiation products such as a kind of LED of being used for, FPC and preparation method thereof, especially a kind of flexible copper clad high thermal conductive substrate and preparation method thereof with high cooling efficiency, high dimensional stability, high flexibility and high flexibility.

Background technology

Along with the consciousness new line of global environmental protection, energy saving has become current trend.The LED industry is one of industry that attracts most attention in recent years.Development so far, that the LED product has had is energy-conservation, power saving, high efficiency, the reaction time is fast, life cycle is long and not mercurous, has advantages such as environmental benefit.Yet common LED high power products input power only is about 20% and can converts light to, and remaining 80% electric energy all converts heat energy into.

Generally speaking, the heat energy that is produced when LED is luminous will make LED knot surface temperature too high, and then influence product life cycle, luminous efficiency and stability if can't derive.

Traditional heat sink material is owing to need to consider insulation characterisitic, and the thick needs of product glue accomplish that 60um can reach insulating requirements to 120um, so the gross thickness of product can be very big, and radiating effect is undesirable.If adopt TPI (TPI) to add the heat radiation model of the powder that dispels the heat; Though can product thickness be reduced the requirement that also can satisfy insulation characterisitic; But need high-temperature operation (operating temperature is greater than 350 ℃) during owing to processing thermoplastic polyimides (TPI); Therefore processing cost is very high, effectively mass production.

And at present the global electronic industry development to compact, high-fire resistance, multifunctionality, densification, high reliability and cheaply direction develop; Therefore selecting for use of substrate just becomes very significant effects factor, and traditional substrate can't satisfy the demand for development of present electronic industry.

Summary of the invention

In order to remedy above deficiency, the invention provides a kind of flexible copper clad high thermal conductive substrate, this flexible copper clad high thermal conductive substrate has thin thickness, and production cost is low, and radiating efficiency is high, good insulation preformance, dimensional stability is good, but the flexing degree is high, the advantage that bounce is little.

The present invention in order to solve traditional technical scheme that technical problem adopted is: a kind of flexible copper clad high thermal conductive substrate; Comprise first and second copper foil layer; The heat conduction adhesion coating that insulating polymer layer and being used for bonds together said insulating polymer layer and first and second copper foil layer; Said insulating polymer layer geometrical clamp places between said first copper foil layer and the said heat conduction adhesion coating, and said second copper foil layer is positioned at the heat conduction adhesion coating outside, and said heat conduction adhesion coating comprises resin bed and heat radiation powder; Said heat conduction adhesion coating can also comprise rubber, curing agent, rice inserts etc. how except resin bed and heat radiation powder; Owing to contain the heat radiation powder in the said heat conduction adhesion coating, the heat radiation powder improves radiating effect, so the present invention has better radiating effect.

As further improvement of the present invention, by weight percentage, said heat radiation powder accounts for 40~90% of said heat conduction adhesion coating solid content.

As further improvement of the present invention, said heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.

As further improvement of the present invention, the average grain diameter of said heat radiation powder is 5~20 microns.

As further improvement of the present invention, said first and second copper foil layer is a kind of in electrolytic copper foil and the rolled copper foil, uses this first and second copper foil layer can on flexible heat-conducting substrate, form the circuit layer of high heat radiation.

As further improvement of the present invention, said first, copper foil layer gross thickness is 12.5~70 microns.

As further improvement of the present invention, the thickness of said insulating polymer layer is 5~12 microns.

As further improvement of the present invention, the solid material of said insulating polymer layer is a polyimides, uses after this insulating polymer layer anti-electrical breakdown to flexible heat-conducting substrate, mechanical strength, flexibility, dimensional stability etc. all to be significantly improved.

As further improvement of the present invention, the resin bed of said heat conduction adhesion coating is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin.

As further improvement of the present invention, the thickness of said heat conduction adhesion coating is 5~30 microns.

As further improvement of the present invention; For the characteristic of keeping the flexible heat-conducting substrate of the present invention to be applied to heat radiation product such as LED; And can effectively control cost; Enhance productivity, the present invention is 20~25 microns with the thickness of said heat conduction adhesion coating, and the thickness of said insulating polymer layer is 5~8 microns.

The present invention reaches control radiating effect and breakdown voltage resistant purpose through the thickness of control insulating polymer layer and the thickness of heat conduction adhesion coating.

A kind of manufacture method of flexible copper clad high thermal conductive substrate comprises the steps:

Step 1:, and obtain a single face copper clad laminate after drying formation insulating polymer layer at the matsurface coating insulating polymer of first copper foil layer;

Step 2: with a kind of the heat conduction adhesion coating is formed on the insulating polymer laminar surface in coating and the transfer printing; And make the heat conduction adhesion coating be in the semi-harden state of half polymerization (B-Stage state; Chemical bond is few between heat conduction adhesion coating molecule and the molecule at this moment, under HTHP, also can soften);

Step 3: baseplate-laminating is cured at the matsurface of second copper foil layer and by certain heating condition.

The invention has the beneficial effects as follows: the present invention comprises first and second copper foil layer, insulating polymer layer and heat conduction adhesion coating successively, and than the production temperature of traditional production process desired very high (greater than 350 ℃), the operating temperature that the present invention needs when producing is less than 180 ℃; Production method is easy; Production cost is low, and applicable scope is wide, owing to adopted the insulating polymer layer to improve the insulation property of product greatly; Therefore can reach high heat radiation and high breakdown voltage resistant characteristic are arranged under the condition of thin size; And the present invention adopts the flexible copper clad material as base material, and product flexible good also can be through adjustment heat conduction adhesion layer and insulating polymer layer thickness; Make copper clad laminate of the present invention meet high flexing slip number of times and bending fillet, be specially adapted to the product that circuit board has bending or slip demand less than the requirement of 0.8mm; The present invention has high dimensional stability, is applicable to various product demand.

Description of drawings

Fig. 1 is a cross-sectional view of the present invention.

Embodiment

Embodiment: a kind of flexible copper clad high thermal conductive substrate; Comprise first copper foil layer 11, insulating polymer layer 12, heat conduction adhesion coating 13 and second copper foil layer 14; Said insulating polymer layer 12 geometrical clamp place between said first copper foil layer 11 and the said heat conduction adhesion coating 13; Said second copper foil layer 14 is positioned at heat conduction adhesion coating 13 outsides, and said heat conduction adhesion coating 13 comprises resin bed and heat radiation powder, and heat conduction adhesion coating 13 can also comprise rubber, curing agent, rice inserts etc. how except resin bed and heat radiation powder; Said insulating polymer layer geometrical clamp places between said first copper foil layer and the said heat conduction adhesion coating; Owing to contain the heat radiation powder in the said heat conduction adhesion coating, the heat radiation powder can improve radiating effect, so flexible copper clad heat-conducting substrate of the present invention has better radiating effect.

Said heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.

By weight percentage, the heat radiation powder accounts for 40~90% of said heat conduction adhesion coating solid content in the said heat conduction adhesion coating.

The average grain diameter of said heat radiation powder is 5~20 microns.

The solid material of said insulating polymer layer 12 is a polyimides, preferably uses not halogen-containing Thermocurable polyimide material, and preferred being to use has from stickiness and not halogen-containing Thermocurable polyimide material.

The resin bed of said heat conduction adhesion coating is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin.

Said first and second copper foil layer is a kind of in rolled copper foil (RA Copper Foil) and the electrolytic copper foil (ED copper), and the gross thickness of said first and second copper foil layer is 12.5~70 microns.

The thickness of said insulating polymer layer is 5~12 microns.The thickness of said heat conduction adhesion coating is 5~30 microns.

For the characteristic of keeping flexible copper clad high thermal conductive substrate of the present invention being applied to the led circuit plate, and can effectively control cost, the thickness of the adhesion coating of heat conduction described in the present invention is 20~25 microns, is 5~8 microns with the thickness of said insulating heat-conductive polymeric layer.

A kind of manufacture method of flexible copper clad high thermal conductive substrate comprises the steps:

Step 1:, and obtain a single face copper clad laminate after drying formation insulating polymer layer 12 at the matsurface coating insulating polymer of first copper foil layer 11;

Step 2: with a kind of heat conduction adhesion coating 13 is formed on insulating polymer layer 12 surface in coating and the transfer printing; And make heat conduction adhesion coating 13 be in the semi-harden state of half polymerization (B-stage state; Chemical bond is few between heat conduction adhesion coating molecule and the molecule at this moment, under HTHP, also can soften);

Step 3: on heat conduction adhesion coating 13, post second copper foil layer again, the substrate after fitting is cured by certain heating condition.

The flexible copper clad high thermal conductive substrate is carried out the heat conduction analysis test: carry out the heat conduction analysis test with thermal conductivity coefficient appearance (Hot Disk); Cover the flexible copper clad high thermal conductive substrate sample of two first and second copper foil layers of full solidification after etching at the transducer upper and lower faces; And insert and put insulating polymer layer and transducer with two steel plates respectively at these two flexible copper clad high thermal conductive substrate sample lateral surfaces; And by the heat conductivility of sensor measurement insulating polymer layer and heat conduction adhesion coating; The test that to be done insulating polymer layer of the present invention and heat conduction adhesion coating is as experimental group; The heat conductivility of testing general heat-conducting substrate with same method is embedded in the coefficient of heat conduction result who records in the table 1 as comparative example:

Table 1

Can know by last table; The present invention is with respect to general heat-conducting substrate, thereby in design, can reach the effect of high-heat conductive efficency through the thickness that reduces integral product, and heat conducting efficient can reach more than 0.06; Can be through the type of adjustment heat radiation powder; Reach the effect of super-high heat-conductive,, thereby reached high breakdown voltage resistant effect in addition owing to increased one deck insulating polymer layer.

The flexible copper clad high thermal conductive substrate is carried out slide unit test and bounce test:

On first copper foil layer of the present invention, stick the adhesion layer of 20 micron thick and the insulating polymer layer of 5 micron thick, in order to testing:

The test condition that slide unit slides and tests: the test piece that the present invention is cut into 1Omm * 30mm; Setting slide unit test fillet is 0.65mm; Sliding frequency is that 60 times/minute and sliding stroke are 35mm, and slip flexing number of times and the resistance change rate of testing general heat-conducting substrate with same method are as comparative example, and the standard of test passes is flexing 100,000 times; In the resistance change rate 10%, test result is recorded in table 3:

The test condition of bounce test: the test piece that the present invention is cut into 1Omm * 30mm; And the second copper foil layer etching of the present invention removed; And setting test fillet is 2.35mm; Every group of test piece measured 5 times, and the bounce of testing general heat-conducting substrate with same method is embedded in table 3 as comparative example behind the calculating mean value:

Experimental group 1 Experimental group 2 Comparison group 1 Comparison group 2 Copper thickness (μ m) 12 12 12 12 Insulating polymer layer thickness (μ m) 5 8 20 25 Heat conduction adhesion layer thickness (μ m) 8 12 - - Thickness after the single face etching (um) 48 55 55 60 Bounce (g) 4.3 6.5 8.5 10.5 Slip flexing number of times 100000 130000 Defective Defective Resistance change rate 7.4% 4.92% Defective Defective

Table 3

Can know that by the result shown in the table 3 the present invention has extremely low bounce, and can satisfy the slip testing time requirement when low flexing fillet is 0.65mm, and resistance change rate is also less than 10%.In addition, experimental group 2 is the preferred embodiments of the invention, and first copper foil layer of experimental group 2 adopts the high flexing Copper Foil of high temperature, and its slip flexing number of times is more up to 130000 times, resistance change rate only 4.92%.

In the present invention, the adhesion layer thickness of discovery epoxide resin type is less to the influence of bounce; The thickness of insulating polymer layer is good with 5~8 microns, is more preferably 5 microns.

The flexible copper clad high thermal conductive substrate is carried out the dimensional stability test:

The test condition of dimensional stability: as experimental group, general two-sided copper clad laminate is organized as comparison with the present invention.Two-sided copper clad laminate is cut into the test piece of 25mm * 28mm, stamp 4 holes for four jiaos above that.Method B measures TD/MD after first and second copper foil layer etching with two-sided copper clad laminate removes to size harmomegathus changing value; Method C measures total eclipse and carves the back with 150 degree baking 30min rear film system film direction/Width (MD/TD) size harmomegathus changing values; Every group of test piece measured 3 times, is embedded in table 4 behind the calculating mean value:

Table 4

Can be known that by the result shown in the table 4 the present invention has dimensional stability preferably, and size is all for contracting on process etching and baking rear film system film direction/Width (MD/TD) both direction, shrinkage value all is stabilized in 0.1%.And general copper clad laminate is inconsistent with the harmomegathus generation on baking rear film system film direction/Width (MD/TD) both direction in the process etching, and film system film direction (MD) contracts, and Width (TD) rises, and is unfavorable for downstream contraposition operability.

Claims (9)

1. flexible copper clad high thermal conductive substrate; It is characterized in that: comprise first copper foil layer, insulating polymer layer, heat conduction adhesion coating and second copper foil layer; Said heat conduction adhesion coating comprises resin bed and heat radiation powder; Said insulating polymer layer geometrical clamp places between said first copper foil layer and the said heat conduction adhesion coating, and said second copper foil layer is positioned at the heat conduction adhesion coating outside.
2. flexible copper clad high thermal conductive substrate according to claim 1 is characterized in that: by weight percentage, the heat radiation powder in the said heat conduction heat conduction adhesion coating accounts for 40~90% of said heat conduction adhesion coating solid content.
3. flexible copper clad high thermal conductive substrate according to claim 1 and 2 is characterized in that: the average grain diameter of said heat radiation powder is 5~20 microns.
4. flexible copper clad high thermal conductive substrate according to claim 3 is characterized in that: said heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.
5. flexible copper clad high thermal conductive substrate according to claim 1 is characterized in that: said first and second copper foil layer is a kind of in electrolytic copper foil and the rolled copper foil.
6. flexible copper clad high thermal conductive substrate according to claim 1 is characterized in that: said first, copper foil layer gross thickness is 12.5~70 microns, and the thickness of insulating polymer layer is 5~12 microns, and the thickness of heat conduction adhesion coating is 5~30 microns.
7. flexible copper clad high thermal conductive substrate according to claim 1 is characterized in that: the solid material of said insulating polymer layer is a polyimides.
8. flexible copper clad high thermal conductive substrate according to claim 1 is characterized in that: the resin bed of said heat conduction adhesion coating is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin.
9. the manufacture method of a flexible copper clad high thermal conductive substrate as claimed in claim 1 is characterized in that: comprise the steps:
Step 1:, and obtain a single face copper clad laminate after drying formation insulating polymer layer at the matsurface coating insulating polymer of first copper foil layer;
Step 2:, and make the heat conduction adhesion coating be in the semi-harden state of half polymerization with a kind of the heat conduction adhesion coating is formed on the insulating heat-conductive polymeric layer surface in coating and the transfer printing;
Step 3: baseplate-laminating is cured at the matsurface of second copper foil layer and by certain heating condition.
CN2011100022454A 2011-01-07 2011-01-07 Flexible copper-foil high thermal conductivity substrate and manufacturing method thereof CN102595766A (en)

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CN2011100022454A CN102595766A (en) 2011-01-07 2011-01-07 Flexible copper-foil high thermal conductivity substrate and manufacturing method thereof
TW100216246U TWM425495U (en) 2011-01-07 2011-08-31 Flexible high thermal conductive copper substrate

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103144377A (en) * 2013-03-15 2013-06-12 松扬电子材料(昆山)有限公司 Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof
CN103342976A (en) * 2013-06-26 2013-10-09 苏州天脉导热科技有限公司 Short-term high-temperature resistant acrylic-based composition and method for preparing heat conducting fin by using same
CN103702511A (en) * 2013-12-31 2014-04-02 广东生益科技股份有限公司 High thermal conductivity metal substrate and manufacturing method thereof
CN105269884A (en) * 2014-07-22 2016-01-27 昆山雅森电子材料科技有限公司 Combined type high-frequency double-sided copper foil basal plate and manufacture method thereof
CN105992457A (en) * 2015-02-11 2016-10-05 昆山雅森电子材料科技有限公司 Heat conducting copper-foil metal substrate
CN106211543A (en) * 2015-04-30 2016-12-07 昆山雅森电子材料科技有限公司 Two-sided heat-conducting substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080047742A1 (en) * 2006-08-23 2008-02-28 Mitsubishi Electric Corporation Printed circuit board and method of manufacturing the same
CN201590948U (en) * 2009-12-30 2010-09-22 昆山雅森电子材料科技有限公司 Double-surfaced copper clad laminate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080047742A1 (en) * 2006-08-23 2008-02-28 Mitsubishi Electric Corporation Printed circuit board and method of manufacturing the same
CN201590948U (en) * 2009-12-30 2010-09-22 昆山雅森电子材料科技有限公司 Double-surfaced copper clad laminate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103144377A (en) * 2013-03-15 2013-06-12 松扬电子材料(昆山)有限公司 Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof
CN103342976A (en) * 2013-06-26 2013-10-09 苏州天脉导热科技有限公司 Short-term high-temperature resistant acrylic-based composition and method for preparing heat conducting fin by using same
CN103702511A (en) * 2013-12-31 2014-04-02 广东生益科技股份有限公司 High thermal conductivity metal substrate and manufacturing method thereof
CN105269884A (en) * 2014-07-22 2016-01-27 昆山雅森电子材料科技有限公司 Combined type high-frequency double-sided copper foil basal plate and manufacture method thereof
CN105992457A (en) * 2015-02-11 2016-10-05 昆山雅森电子材料科技有限公司 Heat conducting copper-foil metal substrate
CN106211543A (en) * 2015-04-30 2016-12-07 昆山雅森电子材料科技有限公司 Two-sided heat-conducting substrate

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Application publication date: 20120718