CN202174778U - Copper foil base plate with composite structure - Google Patents
Copper foil base plate with composite structure Download PDFInfo
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- CN202174778U CN202174778U CN2011202754289U CN201120275428U CN202174778U CN 202174778 U CN202174778 U CN 202174778U CN 2011202754289 U CN2011202754289 U CN 2011202754289U CN 201120275428 U CN201120275428 U CN 201120275428U CN 202174778 U CN202174778 U CN 202174778U
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- composite structure
- copper foil
- clad laminate
- copper clad
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Abstract
The utility model discloses a copper foil base plate with a composite structure, which is formed by a copper foil layer, a polymer layer, an adhesion layer and a reinforcing layer, wherein the copper foil layer is provided with an upper surface and a lower surface which are opposite to each other, the polymer layer is formed on the upper surface of the copper foil layer, the adhesion layer is formed on the upper surface of the polymer layer, and the reinforcing layer is formed on the upper surface of the adhesion layer. The sum of the thickness of the polymer layer and the adhesion layer ranges from 8 micrometers to 50 micrometers. The copper foil base plate with the composite structure can adjust the thickness of the adhesion layer and the polymer layer according to requirements, meets the requirements for high dimension stability, high stiffness and easiness in process, and is particularly applied to products such as an antenna board of a mobile phone and the like.
Description
Technical field
The utility model relates to a kind of composite structure copper clad laminate, the composite structure copper clad laminate of especially a kind of high very property, high dimensional stability, easy processing.
Background technology
Flexible printed wiring board (Flexible Printed Circuit) must possess high thermal conductivity, high-cooling property, high-fire resistance, and the material behavior of low thermal coefficient of expansion with substrate.The polyimide resin heat endurance is high and have excellent thermal diffusivity, mechanical strength, reach then property, often applies to multiple electronic material.At present electronic system towards compact and cheaply direction develop, so the selecting for use towards will be more and more thinner of substrate because the very property of material is not enough, the yield of soft board production and dimensional stability problem will be big problems.
Polyimide composite film has been widely used in the electronic material; At present the mode of polyimide composite film on using does, to post pure glue, makes it to combine closely through pressing, curing in the middle of the polyimide layer that factory does not have a glue single face copper clad laminate product in the FPC downstream and the polyimide composite film product; Yet; This structure is in the problem of producing, meeting with in applications, is not have factor affecting such as the surperficial easy pollution of glue single face copper clad laminate and composite film and causes adhesion not good, and the plate bursting that technology (SMT) causes stiffening plate is followed on the surface of Yin Gaowen; On the other hand, then influence soft board technological operation and yield.
Therefore, the special construction copper clad laminate that still needs a kind of satisfied high property endured, high dimensional stability, easy processing.
The utility model content
In view of the shortcoming of above-mentioned prior art, the purpose of the utility model provides a kind of composite structure Copper Foil and preparation method thereof, makes it have high dimensional stability, high very property, be prone to machining characteristics.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of composite structure copper clad laminate; Be provided with copper foil layer, polymeric layer, adhesion layer and strengthening course, said copper foil layer has relative upper and lower surface, and said polymeric layer is formed at said copper foil layer upper surface; Said adhesion layer is formed at said polymeric layer upper surface; Said strengthening course is formed at said adhesion layer upper surface, and wherein, the thickness sum of said polymeric layer and said adhesion layer is 8～50 microns.
The thickness of said adhesion layer is 3～25 microns.
The thickness of said polymeric layer is 5～25 microns.
The thickness of said copper foil layer is 8～70 microns.
Said copper foil layer is a kind of in rolled copper foil layer and the electrodeposited copper foil layer.
The thickness of said strengthening course is 50～200 microns.
Said strengthening course is that thickness is the polyimide composite film that 50 microns pure polyimide film or thickness is 50～200 microns, and said polyimide composite film is made up of the adhesion agent layer that the pure polyimide film of several layers and some is used to cohere adjacent pure polyimide film.
Said adhesion layer material therefor is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin, the polyimide resin.
Said polymeric layer is a polyimide layer.
The beneficial effect of the utility model is: the composite structure copper clad laminate of the utility model is made up of copper foil layer, polymeric layer, adhesion layer and strengthening course successively; Make by short-cut method; Can adjust the thickness of adhesion layer and polymeric layer as required; Make the composite structure copper clad laminate of the utility model meet high dimensional stability, high very property, be prone to the requirement of processing, be specially adapted to the product of antenna for mobile phone plate etc.
Description of drawings
Fig. 1 is the composite structure copper clad laminate profile of the utility model.
The specific embodiment
Below through specific embodiment explanation the utility model, those of ordinary skills can be understood the advantage and the effect of the utility model easily by the content that this specification disclosed.The utility model also can be implemented by other different mode,, under the category that discloses from the utility model that is not contrary to, can carry out different modifications and change that is.
In this manual, the hear resistance of the relevant adhesion layer of glass transition temperature (Glass transition temperature claims Tg again).With the utility model; The glass transition temperature is a kind of in the transition temperature (Transition temperature); Especially the phase change temperature that refers to a kind of material particularly, is meant along with heating or cooling; The temperature of material is high or low when this critical-temperature, changes the glassy state of rubbery state or firm fragility (brittle) mutually into.
Embodiment: a kind of composite structure copper clad laminate, as shown in Figure 1, be provided with copper foil layer 1, polymeric layer 2, adhesion layer 3 and strengthening course 4; Said copper foil layer 1 has relative upper and lower surface; Said polymeric layer 2 is formed at said copper foil layer 1 upper surface, and said adhesion layer 3 is formed at said polymeric layer 2 upper surfaces, and said strengthening course 4 is formed at said adhesion layer 3 upper surfaces; Wherein, said polymeric layer 2 is 8～50 microns with the thickness sum of said adhesion layer 3.
In order to make the flexible printed wiring board that copper clad laminate manufactures reduce quality problems such as adhesion deficiency, plate bursting, the composite structure copper clad laminate of the utility model can be adjusted the composition and the thickness of the adhesion layer in the copper clad laminate as required.The material of the adhesion layer of copper clad laminate is generally and is selected from epoxy resin, acrylic resin, amido formate is that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be resin, polyimide resin or its mixture.It should be noted; The epoxy resin of the utility model indication and polyimides mixed type adhesion layer are not the TPI of existing special material; The thickness of this adhesion layer of the utility model is 3 to 25 microns; Therefore, the copper clad laminate of excellent performance can be provided under the condition of effectively controlling cost.
In this combined type copper clad laminate, the material of employed polymeric layer does not have special restriction, preferably uses not halogen-containing Thermocurable polyimide material, and preferred being to use has from stickiness and not halogen-containing Thermocurable polyimide material.The thickness of this polymeric layer is 5 to 25 microns.
In this composite structure copper clad laminate, the employed Copper Foil of copper foil layer is rolled copper foil (RA Copper Foil) or electrolytic copper foil (ED Copper Foil), and the thickness of copper foil layer is 8 to 70 microns.
In this combined type copper clad laminate, the thickness of strengthening course is 50 to 200 microns.Employed strengthening course is pure polyimide film or 50 to 200 microns polyimide composite films of 50 microns.Said polyimide composite film is made up of the adhesion agent layer that the pure polyimide film of several layers and some is used to cohere adjacent pure polyimide film.
This composite structure copper clad laminate can make through following method:
1., at arbitrary surface coated polymer of copper foil layer, and dry and form polymeric layer, make the single face copper clad laminate;
2., adhesion layer is formed on the polymeric layer surface of the single face copper clad laminate that 1. step make with coating or transfer printing; And make adhesion layer be in B-stage state (half polymerization semi-cured state; Chemical bond is few between adhesion layer molecule and the molecule at this moment, under HTHP, also can soften);
3., get strengthening course, strengthening course is covered on the adhesion layer, and gives pressing, make the composite structure copper clad laminate;
4., the 3. composite structure copper clad laminate of gained of baking procedure, make composite structure copper clad laminate finished product.
The bounce-back of the utility model composite structure copper clad laminate is tested as follows:
The utility model composite structure copper clad laminate as experimental group, is removed the copper foil layer etching of the utility model composite structure copper clad laminate, in order to test;
Simple supporting material is organized as comparison;
The test condition of bounce test: test pieces is cut into the test piece of 10mm * 30mm, and setting test R angle is 2.35mm, and every group of test piece measured 5 times, is embedded in table 1 behind the calculating mean value.
Table 1
Can be known that by the result shown in the table 1 the utility model composite structure copper clad laminate has high bounce, high more its property endured of bounce is good more.In addition, polyimide layer, strengthening course thicker in the experimental group data, its bounce is big more, and very property is good more.Under the same thickness condition, the experimental group data of the utility model obviously are superior to control group.
The chi peace of the utility model composite structure copper clad laminate is tested as follows:
The test condition of dimensional stability: as experimental group, general copper clad laminate is the comparison group with the utility model composite structure copper clad laminate.The face copper clad laminate is cut into the test piece of 25mm * 28mm, stamp 4 holes for four jiaos above that.Method B measures TD/MD after copper foil layer etching with copper clad laminate removes to size harmomegathus changing value; TD/MD was to size harmomegathus changing value after 30min were toasted with 150 degree in Method C measurement total eclipse back at quarter; Every group of test piece measured 3 times, is embedded in table 2 behind the calculating mean value.
Table 2
Can be known that by the result shown in the table 2 the utility model composite structure copper clad laminate has the excellent size stability, size harmomegathus value is all in-0.1% after its process etching, the baking.In addition, polyimide layer, strengthening course thicker in the experimental group data, its dimensional stability is good more.Under the same thickness condition, the experimental group data of the utility model obviously are superior to the comparison group.
Above-mentioned specification and embodiment are merely the principle and the effect thereof of exemplary illustration the utility model, and unrestricted the utility model.Any creation that falls in the utility model claim scope all belongs to the scope that the utility model is protected.
Claims (9)
1. composite structure copper clad laminate; It is characterized in that: be provided with copper foil layer, polymeric layer, adhesion layer and strengthening course, said copper foil layer has relative upper and lower surface, and said polymeric layer is formed at said copper foil layer upper surface; Said adhesion layer is formed at said polymeric layer upper surface; Said strengthening course is formed at said adhesion layer upper surface, and wherein, the thickness sum of said polymeric layer and said adhesion layer is 8～50 microns.
2. composite structure copper clad laminate according to claim 1 is characterized in that: the thickness of said adhesion layer is 3～25 microns.
3. composite structure copper clad laminate according to claim 1 is characterized in that: the thickness of said polymeric layer is 5～25 microns.
4. composite structure copper clad laminate according to claim 1 is characterized in that: the thickness of said copper foil layer is 8～70 microns.
5. composite structure copper clad laminate according to claim 4 is characterized in that: said copper foil layer is a kind of in rolled copper foil layer and the electrodeposited copper foil layer.
6. composite structure copper clad laminate according to claim 1 is characterized in that: the thickness of said strengthening course is 50～200 microns.
7. according to claim 1 or 6 described composite structure copper clad laminates, it is characterized in that: said strengthening course is that thickness is 50 microns pure polyimide film.
8. according to claim 1 or 6 described composite structure copper clad laminates; It is characterized in that: said strengthening course is that thickness is 50～200 microns polyimide composite film, and said polyimide composite film is made up of the adhesion agent layer that the pure polyimide film of several layers and some is used to cohere adjacent pure polyimide film.
9. composite structure copper clad laminate according to claim 1 is characterized in that: said polymeric layer is a polyimide layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202754289U CN202174778U (en) | 2011-08-01 | 2011-08-01 | Copper foil base plate with composite structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202754289U CN202174778U (en) | 2011-08-01 | 2011-08-01 | Copper foil base plate with composite structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202174778U true CN202174778U (en) | 2012-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202754289U Expired - Lifetime CN202174778U (en) | 2011-08-01 | 2011-08-01 | Copper foil base plate with composite structure |
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| Country | Link |
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| CN (1) | CN202174778U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547132A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
-
2011
- 2011-08-01 CN CN2011202754289U patent/CN202174778U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547132A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN103547132B (en) * | 2012-07-17 | 2017-03-22 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120328 |
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| CX01 | Expiry of patent term |