CN201910417U - Thin metal substrate with high thermal conductivity - Google Patents
Thin metal substrate with high thermal conductivity Download PDFInfo
- Publication number
- CN201910417U CN201910417U CN2011200031444U CN201120003144U CN201910417U CN 201910417 U CN201910417 U CN 201910417U CN 2011200031444 U CN2011200031444 U CN 2011200031444U CN 201120003144 U CN201120003144 U CN 201120003144U CN 201910417 U CN201910417 U CN 201910417U
- Authority
- CN
- China
- Prior art keywords
- layer
- base plate
- heat
- metal base
- thermal conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model discloses a thin metal substrate with high thermal conductivity. The metal substrate comprises a copper foil layer, an adhesion layer and an insulating and heat-conducting polymer layer, wherein the insulating and heat-conducting polymer layer is fixedly clamped between the copper foil layer and the adhesion layer and comprises a solid material layer and a cooling powder layer; and the adhesion layer comprises a resin layer and a cooling powder layer. In the utility model, as both the adhesion layer and the insulating and heat-conducting polymer layer contain cooling powder, and the overall product is thinner, the thin metal substrate is endowed with high heat radiating efficiency; and the insulating and heat-conducting polymer layer can serve an insulating and voltage breakdown prevention function.
Description
Technical field
The utility model relates to the flexible base, board on heat radiation such as a kind of LED of the being used for product, especially a kind of slim high-thermal conductive metal base plate with high cooling efficiency.
Background technology
Along with the consciousness new line of global environmental protection, energy saving has become current trend.The LED industry is one of industry that attracts most attention in recent years.Development so far, that the LED product has had is energy-conservation, power saving, high efficiency, the reaction time is fast, life cycle is long and not mercurous, has advantages such as environmental benefit.Yet common LED high power products input power only is about 20% and can converts light to, and remaining 80% electric energy all is converted to heat energy.
Generally speaking, the heat energy that is produced when LED is luminous will make LED knot surface temperature too high, and then influence product life cycle, luminous efficiency and stability if can't derive.
When knot surface temperature when rising to 100 ℃ by 25 ℃, its luminous efficiency will fail and 20% to 75% not wait, and is wherein serious with sodium yellow decline 75% again.In addition, when the operating environment temperature of LED is high more, its life of product is also low more, and when operating temperature was raised to 74 ℃ by 63 ℃, the LED average life span will reduce 3/4.
The utility model content
In order to remedy above deficiency, the utility model provides a kind of slim high-thermal conductive metal base plate, and this slim high-thermal conductive metal base plate has the high advantage of radiating efficiency.
The utility model for the technical scheme that solves its technical problem and adopt is: a kind of slim high-thermal conductive metal base plate, comprise the insulating heat-conductive polymeric layer, be used for described slim high-thermal conductive metal base plate is adhered to adhesion coating and copper foil layer on the printed circuit board (PCB), described insulating heat-conductive polymeric layer geometrical clamp places between described copper foil layer and the described adhesion coating, described insulating heat-conductive polymeric layer comprises layers of solid material and heat radiation powder layer, described adhesion coating comprises resin bed and heat radiation powder layer, certainly the insulating heat-conductive polymeric layer also can comprise the mixture layer that promoter and catalyst etc. form except the material layer of solid and the powder layer of dispelling the heat, adhesion coating can also comprise rubber except resin bed and heat radiation powder layer, the mixture layer that curing agent and Nai Mi inserts etc. form, owing to contain the heat radiation powder in described insulating heat-conductive polymeric layer and the adhesion coating, the heat radiation powder improves radiating effect, so the utlity model has better radiating effect.
As further improvement of the utility model, the heat radiation powder average grain diameter of described heat radiation powder layer is 5～20 microns.
As further improvement of the utility model, the thickness of described copper foil layer is 12.5～35 microns, preferably 16～35 microns, uses this copper foil layer can form the circuit layer of high heat radiation on slim high-thermal conductive metal base plate.
As further improvement of the utility model, the thickness of described insulating heat-conductive polymeric layer is 5～12 microns.
As further improvement of the utility model, the thickness of described adhesion coating is 5～30um.
As further improvement of the utility model, also comprise the metal substrate that carries out the pressing hot curing with described adhesion coating outer surface, as metal material substrates such as aluminium base, copper bases.
As further improvement of the utility model, for the characteristic of keeping the slim high-thermal conductive metal base plate of the utility model to be applied to heat radiation product such as LED, and can effectively control cost, the utility model is 20～25 microns with the thickness of described adhesion coating, and the thickness of described insulating heat-conductive polymeric layer is 5～8 microns.
The utility model reaches control radiating effect and breakdown voltage resistant purpose by the thickness of control insulating heat-conductive polymeric layer and the thickness of adhesion coating.
The beneficial effects of the utility model are: the utility model comprises copper foil layer, insulating heat-conductive polymeric layer and adhesion coating successively, manufacture method is easy, can adjust the thickness of adhesion coating and insulating heat-conductive polymeric layer as required, make to the utlity model has high heat conduction efficiency high breakdown voltage resistant characteristic.
Description of drawings
Fig. 1 is a cross-sectional view of the present utility model;
Fig. 2 is the profile of the utility model applying metal substrate.
Embodiment
Embodiment: a kind of slim high-thermal conductive metal base plate, comprise copper foil layer 11, insulating heat-conductive polymeric layer 12 and adhesion coating 13, described insulating heat-conductive polymeric layer 12 comprises layers of solid material and heat radiation powder layer, adhesion coating 13 comprises resin bed and heat radiation powder layer, adhesion coating 13 is used for described slim high-thermal conductive metal base plate is adhered to various metal substrates or other base materials, certainly insulating heat-conductive polymeric layer 12 also can comprise promoter except the material layer of solid and the powder layer of dispelling the heat, the mixture layer that catalyst etc. form, adhesion coating 13 can also comprise rubber except resin bed and heat radiation powder layer, the mixture layer that curing agent and Nai Mi inserts etc. form, described insulating heat-conductive polymeric layer geometrical clamp places between described copper foil layer and the described adhesion coating, owing to all contain the heat radiation powder in described adhesion coating and the insulating heat-conductive polymeric layer, the heat radiation powder can improve radiating effect, so slim high-thermal conductive metal base plate of the present utility model has better radiating effect.
The heat radiation powder average grain diameter of described heat radiation powder layer is 5～20 microns.
The thickness of described copper foil layer is 12.5～35 microns, preferably 16～35 microns.
For the characteristic of keeping the flexible high thermal conductive substrate of the utility model being applied to the led circuit plate, and can effectively control cost, the thickness of adhesion coating described in the utility model is 20～25 microns, is 5～8 microns with the thickness of described insulating heat-conductive polymeric layer.
Also comprise the metal substrate 14 that carries out the pressing hot curing with described adhesion coating outer surface, as metal material substrates such as aluminium base, copper bases.
Slim high-thermal conductive metal base plate is carried out the heat conduction analysis test: carry out the heat conduction analysis test with thermal conductivity coefficient instrument (Hot Disk), cover the slim high-thermal conductive metal base plate sample of two full solidification after etching copper foil layers at the transducer upper and lower surface, and insert and put insulating heat-conductive polymeric layer and transducer with two steel plates respectively at these two slim high-thermal conductive metal base plate lateral surfaces, and by the heat conductivility of sensor measurement insulating heat-conductive polymeric layer and adhesion coating, the test that to do insulating heat-conductive polymeric layer of the present utility model and adhesion coating is as experimental group, the heat conductivility of testing general heat-conducting substrate with same method is embedded in the coefficient of heat conduction result who records in the table 1 as a comparative example:
Table 1
As seen from the above table, the utility model is with respect to general heat-conducting substrate, thereby can reach the effect of high-heat conductive efficency in design by the thickness that reduces integral product, heat conducting efficient can reach more than 0.06, in addition owing to increased one deck insulating heat-conductive polymeric layer, thereby reached high breakdown voltage resistant effect.
Claims (9)
1. slim high-thermal conductive metal base plate, it is characterized in that: comprise copper foil layer, insulating heat-conductive polymeric layer and adhesion coating, described insulating heat-conductive polymeric layer comprises layers of solid material and heat radiation powder layer, described adhesion coating comprises resin bed and heat radiation powder layer, and described insulating heat-conductive polymeric layer geometrical clamp places between described copper foil layer and the described adhesion coating.
2. slim high-thermal conductive metal base plate according to claim 1 is characterized in that: the heat radiation powder average grain diameter of described heat radiation powder layer is 5～20 microns.
3. slim high-thermal conductive metal base plate according to claim 1 is characterized in that: described copper foil layer thickness is 12.5～35 microns.
4. slim high-thermal conductive metal base plate according to claim 3 is characterized in that: described copper foil layer thickness is 16～35 microns.
5. slim high-thermal conductive metal base plate according to claim 1 is characterized in that: the thickness of described insulating heat-conductive polymeric layer is 5～12 microns.
6. slim high-thermal conductive metal base plate according to claim 5 is characterized in that: the thickness of described insulating heat-conductive polymeric layer is 5～8 microns.
7. slim high-thermal conductive metal base plate according to claim 1 is characterized in that: the thickness of described adhesion coating is 5～30 microns.
8. slim high-thermal conductive metal base plate according to claim 7 is characterized in that: the thickness of described adhesion coating is 20～25 microns.
9. slim high-thermal conductive metal base plate according to claim 1 is characterized in that: also comprise the metal substrate that carries out the pressing hot curing with described adhesion coating outer surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200031444U CN201910417U (en) | 2011-01-07 | 2011-01-07 | Thin metal substrate with high thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200031444U CN201910417U (en) | 2011-01-07 | 2011-01-07 | Thin metal substrate with high thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201910417U true CN201910417U (en) | 2011-07-27 |
Family
ID=44302617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200031444U Expired - Lifetime CN201910417U (en) | 2011-01-07 | 2011-01-07 | Thin metal substrate with high thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201910417U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103042762A (en) * | 2011-10-13 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | High thermal conductive metal substrate |
| CN103050616A (en) * | 2011-10-13 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | Compound heat-conducting copper foil substrate |
| CN103068151A (en) * | 2011-10-21 | 2013-04-24 | 松扬电子材料(昆山)有限公司 | Heat dissipation base material |
-
2011
- 2011-01-07 CN CN2011200031444U patent/CN201910417U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103042762A (en) * | 2011-10-13 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | High thermal conductive metal substrate |
| CN103050616A (en) * | 2011-10-13 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | Compound heat-conducting copper foil substrate |
| CN103042762B (en) * | 2011-10-13 | 2015-04-29 | 昆山雅森电子材料科技有限公司 | High thermal conductive metal substrate |
| CN103050616B (en) * | 2011-10-13 | 2015-10-28 | 昆山雅森电子材料科技有限公司 | Composition heat conducting copper foil base plate |
| CN103068151A (en) * | 2011-10-21 | 2013-04-24 | 松扬电子材料(昆山)有限公司 | Heat dissipation base material |
| CN103068151B (en) * | 2011-10-21 | 2015-09-09 | 松扬电子材料(昆山)有限公司 | Heat radiating material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102593338A (en) | Thin high-thermal-conductivity metal substrate and production method thereof | |
| CN102595766A (en) | Flexible copper-foil high thermal conductivity substrate and manufacturing method thereof | |
| CN201910417U (en) | Thin metal substrate with high thermal conductivity | |
| CN103042762B (en) | High thermal conductive metal substrate | |
| CN202285457U (en) | Heat dissipation substrate | |
| CN204634154U (en) | Two-sided heat-conducting substrate | |
| CN102469685A (en) | Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof | |
| CN202271584U (en) | Metal substrate with high thermal conductivity | |
| CN103068151B (en) | Heat radiating material | |
| CN203110435U (en) | Graphite copper foil composite membrane | |
| CN103781329A (en) | Graphite aluminum foil heat-conducting material | |
| CN201937950U (en) | Flexible copper foil high-heat-conductivity base plate | |
| CN210607231U (en) | Novel composite heat dissipation material | |
| TWM589118U (en) | Thermal conductive film structure | |
| CN207766651U (en) | A kind of low thermal resistance metal-based copper-clad plate | |
| TWI509194B (en) | Illumination apparatus | |
| CN202540847U (en) | Aluminium-carbon heat-conducting insulating composite foil | |
| CN202738258U (en) | Efficient heat dissipating flexible circuit board | |
| CN105351774B (en) | LED module and lamps and lanterns split structure | |
| TWM556055U (en) | Flexible back adhesive copper foil substrate | |
| CN209389927U (en) | A kind of Switching Power Supply radiator | |
| CN201898124U (en) | Heat-conducting double-sided rigid-flex substrate | |
| CN204810782U (en) | Radiator sheet | |
| CN203013789U (en) | Semiconductor chip heat dissipation substrate and semiconductor chip packaging structure | |
| CN202941078U (en) | Graphite aluminum foil composite diaphragm material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110727 |
|
| CX01 | Expiry of patent term |