CN102469685A - Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof - Google Patents
Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof Download PDFInfo
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- CN102469685A CN102469685A CN2010105512775A CN201010551277A CN102469685A CN 102469685 A CN102469685 A CN 102469685A CN 2010105512775 A CN2010105512775 A CN 2010105512775A CN 201010551277 A CN201010551277 A CN 201010551277A CN 102469685 A CN102469685 A CN 102469685A
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Abstract
The invention discloses a heat-conducting double-faced soft and hard combined base plate, which comprises copper foil layers, aluminum plates, insulated heat-conducting polymer layers, and bonding layers. The insulated heat-conducting polymer layers are fixedly pasted at the two sides of the bonding layers. The copper foil layers are fixedly pasted on two outer side surfaces of the insulated heat-conducting polymer layers. The aluminum plates are fixedly arranged in the inner parts of the bonding layers. The surface areas of the aluminum plates are smaller than that of the bonding layers. The insulated heat-conducting polymer layers comprise a solid material and a heat radiating powder body. The bonding layers comprise a resin layer and a heat radiating powder body. A manufacturing method for the heat-conducting double-faced soft and hard combined base plate comprises the steps of: coating the insulated heat-conducting polymers on the rough surfaces of the copper foil layers, and drying; next, forming the bonding layers onto the surfaces of the insulated heat-conducting polymer layers by using one of coating and transfer printing methods, and enabling the bonding layers to be in semi-polymerizing and semi-hardening states; then, pasting the bonding layers with single-faced copper foil base plates at the two sides of the aluminum plates, directly pasting the parts without the aluminum plates between the two bonding layers; finally, heating and curing. The heat-conducting double-faced soft and hard combined base plate disclosed by the invention is high in heat radiating efficiency, insulated and resistant to voltage breakdown, and is capable of solving the troubles of line designs of different planes.
Description
Technical field
The present invention relates to heat-conducting substrate on heat radiation such as a kind of LED of the being used for product and preparation method thereof, relate in particular to a kind of two-sided soft or hard of heat conduction and combine substrate and preparation method thereof with high cooling efficiency.
Background technology
Along with the consciousness new line of global environmental protection, energy saving has become current trend.The LED industry is one of industry that attracts most attention in recent years.Development so far, that the LED product has had is energy-conservation, power saving, high efficiency, the reaction time is fast, life cycle is long and not mercurous, has advantages such as environmental benefit.Yet common LED high power products input power is about 20% and can converts light to, and remaining 80% electric energy all converts heat energy into.
Generally speaking, the heat energy that is produced when LED is luminous will make LED knot surface temperature too high, and then influence product life cycle, luminous efficiency, stability if can't derive.
Secondly, when designed lines, owing to need the heat radiating metal material, like aluminium sheet, material is harder, does not have the function of deflection, has limited the category of circuit design, can't design the product of Different Plane.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides the two-sided soft or hard of a kind of heat conduction and combine substrate and preparation method thereof, the two-sided soft or hard of this heat conduction combines substrate radiating efficiency height, ability deflection, has widened the category of circuit design, can effectively design the product of Different Plane.
The present invention for the technical scheme that solves its technical problem and adopt is: the two-sided soft or hard of a kind of heat conduction combines substrate; Comprise copper foil layer, aluminium sheet, insulating heat-conductive polymeric layer and adhesion coating; Said insulating heat-conductive polymeric layer fixedly adheres on the adhesion coating both sides, and copper foil layer fixedly adheres on insulating heat-conductive polymeric layer two lateral surfaces, and aluminium sheet is fixedly set in the inside of adhesion coating; Said surface of aluminum plate area is less than the adhesion coating surface area; Said insulating heat-conductive polymeric layer comprises solid material and the powder that dispels the heat, and adhesion coating comprises resin bed and heat radiation powder, and the insulating heat-conductive polymeric layer also can comprise promoter and catalyst etc. except the material of solid and the powder that dispels the heat certainly; Adhesion coating can also comprise rubber, curing agent, rice inserts etc. how except resin bed and heat radiation powder; Owing to contain the heat radiation powder in said polymeric layer and the adhering agent layer, the heat radiation powder improves radiating effect, so the present invention has better radiating effect.
Further technical scheme of the present invention is:
For the characteristic of keeping the flexible high thermal conductive substrate of the present invention to be applied to heat radiation product such as LED; And can effectively control cost; The present invention is 5～30 microns with the THICKNESS CONTROL of said adhesion coating, and preferred 20～25 microns is 5～8 microns with the THICKNESS CONTROL of said insulating heat-conductive polymeric layer.
The resin bed material therefor of said adhesion coating is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin.
By weight percentage, said heat radiation powder accounts for 40～90% of said adhesion coating solid content.
Said heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.
The average grain diameter of said heat radiation powder is at 5～20 microns.
Said copper foil layer is electrolysis or rolls a kind of in the copper, uses this copper foil layer can on the flexible heat sink substrate, form the high circuit layer that dispels the heat, preferably 16～35 microns of the thickness of copper foil layer.
The thickness of said aluminium sheet is 0.3～1 millimeter.
The solid material of said insulating heat-conductive polymeric layer is polyimides, PET (polyethylene terephthalate; PET), polyaniline (polyaniline; PAn), PEN (Polyethylene Naphthalate; PEN), epoxy resin and Merlon (Polycarbonate; PC) at least a in, at least a in polyimides and the PET preferably uses that anti-electrical breakdown and the mechanical strength to the high heat-radiating substrate of flexibility all is significantly improved behind this insulating heat-conductive polymeric layer.
Said the present invention reaches control radiating effect and breakdown voltage resistant purpose through the thickness of control insulating heat-conductive polymeric layer and the thickness of adhesion coating.
The two-sided soft or hard of described heat conduction combines method for preparing substrate following:
Step 1:, and obtain the single face copper clad laminate after drying formation heat conductive insulating polymeric layer at the matsurface coating insulating heat-conductive polymer of copper foil layer;
Step 2:, and make adhesion coating be in the semi-harden state of half polymerization with a kind of adhesion coating is formed on the insulating heat-conductive polymeric layer surface in coating and the transfer printing;
Step 3: have the adhesion coating of single face copper clad laminate on fitting in the aluminium sheet both sides, wherein two have between the adhesion coating of single face copper clad laminate no aluminium sheet position directly to subsides.
Step 4: the substrate of the back of will fitting carries out being cured by certain heating condition.
The invention has the beneficial effects as follows: the two-sided soft or hard of heat conduction of the present invention combines substrate to be made up of copper foil layer, polymeric layer, adhesion coating and aluminium sheet successively; Make by short-cut method; Can adjust the thickness of adhesion coating and polymeric layer as required; Make the two-sided soft or hard of the high heat-radiating substrate heat conduction of flexibility of the present invention combine substrate to meet high heat conduction efficiency, high breakdown voltage resistant characteristic.
Description of drawings
Fig. 1 is a cross-sectional view of the present invention.
Embodiment
Embodiment: the two-sided soft or hard of a kind of heat conduction combines substrate; Comprise copper foil layer 11, aluminium sheet 14, insulating heat-conductive polymeric layer 12 and adhesion coating 13, said insulating heat-conductive polymeric layer 12 fixedly adheres on adhesion coating 13 both sides, and copper foil layer 11 fixedly adheres on 12 liang of lateral surfaces of insulating heat-conductive polymeric layer; Aluminium sheet 14 is fixedly set in the inside of adhesion coating 13; Said aluminium sheet 14 surface areas are less than adhesion coating 13 surface areas, and said insulating heat-conductive polymeric layer 12 comprises solid material and heat radiation powder, and adhesion coating 13 comprises resin bed and heat radiation powder; Certainly the insulating heat-conductive polymeric layer also can comprise promoter except the material of solid and the powder that dispels the heat; Catalyst etc., adhesion coating can also comprise rubber, curing agent, rice inserts etc. how except resin bed and heat radiation powder, owing to contain the heat radiation powder in said polymeric layer and the adhering agent layer; The heat radiation powder improves radiating effect, so the present invention has better radiating effect.
In order to keep characteristic that the two-sided soft or hard of heat conduction of the present invention combines substrate to be applied to the led circuit plate; And can effectively control cost; The present invention is 5～30 microns with the THICKNESS CONTROL of said adhesion coating, and preferred 20～25 microns is 5～8 microns with the THICKNESS CONTROL of said insulating heat-conductive polymeric layer.
The resin bed material therefor of said adhesion coating is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin.
Said heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.By weight percentage, the heat radiation powder of said adhesion coating accounts for 40～90% of said adhesion coating solid content.
The average grain diameter of said heat radiation powder is at 5～20 microns.
The employed Copper Foil of said copper foil layer is a kind of in rolled copper foil (RA Copper Foil) and the high flexing Copper Foil of high temperature (HA Copper Foil), preferably 16～35 microns of the thickness of copper foil layer.
The thickness of said aluminium sheet is 0.3～1 millimeter.
The solid material of insulating heat-conductive polymeric layer used in the present invention is polyimides, PET (polyethylene terephthalate; PET), polyaniline (polyaniline; PAn), PEN (Polyethylene Naphthalate; PEN), epoxy resin and Merlon (Polycarbonate, at least a in PC), preferably at least a in polyimides and the PET; Further preferably use not halogen-containing Thermocurable polyimide material, preferred being to use has tack and not halogen-containing Thermocurable polyimide material.
The two-sided soft or hard of described heat conduction combines method for preparing substrate following:
Step 1:, and obtain the single face copper clad laminate after drying formation heat conductive insulating polymeric layer at the matsurface coating insulating heat-conductive polymer of copper foil layer;
Step 2: with a kind of adhesion coating is formed on the insulating heat-conductive polymeric layer surface in coating and the transfer printing; And make adhesion coating be in the semi-harden state of half polymerization (B-stage state; Chemical bond is few between adhesion coating molecule and the molecule at this moment, under HTHP, also can soften);
Step 3: have the adhesion coating of single face copper clad laminate on fitting in the aluminium sheet both sides, wherein two have that no aluminium sheet position reaches the effect of soft layer directly to subsides between the adhesion coating of single face copper clad laminate;
Step 4: the substrate of the back of will fitting carries out being cured by certain heating condition.
The present invention is with respect to general heat-conducting substrate; Thereby the thickness that in design, has reduced integral product has reached the effect of high-heat conductive efficency; Combine substrate to carry out the heat conduction analysis test to the two-sided soft or hard of heat conduction; Heat conducting efficient can reach more than 0.06, in addition owing to increased one deck insulating heat-conductive polymeric layer, thereby has reached high breakdown voltage resistant effect.A side is a soft layer simultaneously, has widened the category of circuit design, can effectively design the product of Different Plane.
Claims (10)
1. the two-sided soft or hard of heat conduction combines substrate; It is characterized in that: comprise copper foil layer, aluminium sheet, insulating heat-conductive polymeric layer and adhesion coating, said insulating heat-conductive polymeric layer fixedly adheres on the adhesion coating both sides, and copper foil layer fixedly adheres on insulating heat-conductive polymeric layer two lateral surfaces; Aluminium sheet is fixedly set in the inside of adhesion coating; Said surface of aluminum plate area is less than the adhesion coating surface area, and said insulating heat-conductive polymeric layer comprises solid material and heat radiation powder, and adhesion coating comprises resin bed and heat radiation powder.
2. the two-sided soft or hard of heat conduction according to claim 1 combines substrate, and it is characterized in that: the thickness of said insulating heat-conductive polymeric layer is 5～8 microns, and the thickness of said adhesion coating is 5～30 microns.
3. the two-sided soft or hard of heat conduction according to claim 1 combines substrate, it is characterized in that: the material of the resin bed of said adhesion coating is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin.
4. the two-sided soft or hard of heat conduction according to claim 1 combines substrate, and it is characterized in that: by weight percentage, the heat radiation powder of said adhesion coating accounts for 40～90% of said adhesion coating solid content.
5. the two-sided soft or hard of heat conduction according to claim 1 combines substrate, it is characterized in that: said heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.
6. the two-sided soft or hard of heat conduction according to claim 5 combines substrate, and it is characterized in that: the average grain diameter of said heat radiation powder is at 5～20 microns.
7. the two-sided soft or hard of heat conduction according to claim 1 combines substrate, it is characterized in that: said copper foil layer is a kind of in electrolytic copper foil and the rolled copper foil, and the thickness of copper foil layer is 16～35 microns.
8. the two-sided soft or hard of heat conduction according to claim 1 combines substrate, and it is characterized in that: the thickness of said aluminium sheet is 0.3～1 millimeter.
9. the two-sided soft or hard of heat conduction according to claim 1 combines substrate, it is characterized in that: the solid material of said polymeric layer is at least a in polyimides, PET, polyaniline, PEN, epoxy resin and the Merlon.
10. the two-sided soft or hard of a heat conduction as claimed in claim 1 combines the manufacture method of substrate, and it is characterized in that: concrete steps are following:
Step 1:, and obtain the single face copper clad laminate after drying formation heat conductive insulating polymeric layer at the matsurface coating insulating heat-conductive polymer of copper foil layer;
Step 2:, and make adhesion coating be in the semi-harden state of half polymerization with a kind of adhesion coating is formed on the insulating heat-conductive polymeric layer surface in coating and the transfer printing;
Step 3: have the adhesion coating of single face copper clad laminate on fitting in the aluminium sheet both sides, wherein two have between the adhesion coating of single face copper clad laminate no aluminium sheet position directly to subsides.
Step 4: the substrate of the back of will fitting carries out being cured by certain heating condition.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105512775A CN102469685A (en) | 2010-11-19 | 2010-11-19 | Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof |
| TW100217149U TWM420832U (en) | 2010-11-19 | 2011-09-14 | Rigid-flex double sided thermal conductivity substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105512775A CN102469685A (en) | 2010-11-19 | 2010-11-19 | Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102469685A true CN102469685A (en) | 2012-05-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105512775A Pending CN102469685A (en) | 2010-11-19 | 2010-11-19 | Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102469685A (en) |
| TW (1) | TWM420832U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970827A (en) * | 2012-11-19 | 2013-03-13 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing hybrid-material printed circuit board |
| CN103517565A (en) * | 2013-10-17 | 2014-01-15 | 景旺电子科技(龙川)有限公司 | Aluminum substrate sink copper plate electric edge sealing method |
| CN104139869A (en) * | 2013-05-10 | 2014-11-12 | 中国飞机强度研究所 | Bidirectional-transmitting load loading device |
| CN104968140A (en) * | 2015-06-10 | 2015-10-07 | 江西鑫力华数码科技有限公司 | Flexible circuit board |
| CN113109698A (en) * | 2021-04-13 | 2021-07-13 | 深圳市三维电路科技有限公司 | Defect testing method for multi-layer soft and hard combined circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080047742A1 (en) * | 2006-08-23 | 2008-02-28 | Mitsubishi Electric Corporation | Printed circuit board and method of manufacturing the same |
| KR100919975B1 (en) * | 2009-04-14 | 2009-10-05 | 주식회사 엘아이테크 | Print circuit board having excellent heat dissipating and light emitting diode module using thereof |
| CN101707853A (en) * | 2009-02-24 | 2010-05-12 | 常州市超顺电子技术有限公司 | Metal matrix copper-clad laminate |
-
2010
- 2010-11-19 CN CN2010105512775A patent/CN102469685A/en active Pending
-
2011
- 2011-09-14 TW TW100217149U patent/TWM420832U/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080047742A1 (en) * | 2006-08-23 | 2008-02-28 | Mitsubishi Electric Corporation | Printed circuit board and method of manufacturing the same |
| CN101707853A (en) * | 2009-02-24 | 2010-05-12 | 常州市超顺电子技术有限公司 | Metal matrix copper-clad laminate |
| KR100919975B1 (en) * | 2009-04-14 | 2009-10-05 | 주식회사 엘아이테크 | Print circuit board having excellent heat dissipating and light emitting diode module using thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970827A (en) * | 2012-11-19 | 2013-03-13 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing hybrid-material printed circuit board |
| CN102970827B (en) * | 2012-11-19 | 2015-04-22 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing hybrid-material printed circuit board |
| CN104139869A (en) * | 2013-05-10 | 2014-11-12 | 中国飞机强度研究所 | Bidirectional-transmitting load loading device |
| CN103517565A (en) * | 2013-10-17 | 2014-01-15 | 景旺电子科技(龙川)有限公司 | Aluminum substrate sink copper plate electric edge sealing method |
| CN104968140A (en) * | 2015-06-10 | 2015-10-07 | 江西鑫力华数码科技有限公司 | Flexible circuit board |
| CN104968140B (en) * | 2015-06-10 | 2018-08-10 | 江西鑫力华数码科技有限公司 | Flexible folding wiring board |
| CN113109698A (en) * | 2021-04-13 | 2021-07-13 | 深圳市三维电路科技有限公司 | Defect testing method for multi-layer soft and hard combined circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM420832U (en) | 2012-01-11 |
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Application publication date: 20120523 |