CN201820746U - Soft ceramic composite metal substrate - Google Patents
Soft ceramic composite metal substrate Download PDFInfo
- Publication number
- CN201820746U CN201820746U CN201020529423XU CN201020529423U CN201820746U CN 201820746 U CN201820746 U CN 201820746U CN 201020529423X U CN201020529423X U CN 201020529423XU CN 201020529423 U CN201020529423 U CN 201020529423U CN 201820746 U CN201820746 U CN 201820746U
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- Prior art keywords
- soft ceramic
- metal substrate
- dissipating
- ceramic heat
- conductive adhesive
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Abstract
A soft ceramic composite metal substrate is provided with a metal substrate. Soft ceramic radiator paint is coated on the surface of the metal substrate and hardened into a soft ceramic radiator paint layer by being heated, and a thermal conductive adhesive film and a copper foil layer are sequentially arranged on the surface of the soft ceramic radiator paint layer, so that the copper foil layer can be stably positioned on the soft ceramic radiator paint layer by the aid of the thermal conductive adhesive film. The formation thickness of the soft ceramic radiator paint layer can be controlled by the thickness of the coated soft ceramic radiator paint, so that breakdown-resistant voltage provided by the soft ceramic radiator paint layer is changed. Accordingly, a manufacturer can manufacture various composite metal substrates with different breakdown-resistant voltages and reduce cost without changing manufacture procedures.
Description
Technical field
The utility model relates to a kind of soft Ceramic Composite formula metal substrate, and what refer to especially to utilize soft ceramic heat-dissipating enamelled coating to provide is breakdown voltage resistant, to allow the producer under the situation that does not change processing procedure, can produce the breakdown voltage resistant composite metal substrate of multiple difference.
Background technology
The demand of using in the face of the component density that raises day by day and high power IC element, high-capacity LED etc., traditional resin glass fiber substrate has faced the serious challenge of thermal endurance and reliability, because higher hot closeness makes operating temperature rise, cause element, substrate life-span and reliability to descend, product performance is low, solving this problem then must set about from promoting radiating efficiency, because metal substrate has characteristics such as high-cooling property, electromagnetic wave shielding, mechanical strength height, processing characteristics be good, metal substrate is become solve the heat radiation best solution.
See also shown in Figure 1, find out by knowing among the figure, this metal substrate A is made by aluminium base A1, and be sequentially provided with oxidation film layer A2 in aluminium base A1 surface, heat conduction glue-line A3 and copper foil layer A4, and heat conduction glue-line A3 is by stacking the forming of multilayered thermally-conductive glued membrane A31, and oxidation film layer A2 is in order to prevent the etching aluminum base material A1 of successive process chemical agent, therefore aluminium base A1 is made anodized, make its surface form oxidation film layer A2, yet considering metal substrate A and must have breakdown voltage resistant requirement based on safety, and under safety requirements constantly improves, metal substrate A relatively also must improve breakdown voltage resistant, and just must be provided with more multi-layered conductive adhesive film A31 this moment, improves the breakdown voltage resistant of metal substrate A, yet this kind practice is for having following deficiency:
(1) increases after sticking in oxidation film layer A2, must the tear cuticula on surface of conductive adhesive film A31 and just can paste down a slice conductive adhesive film A31 again, therefore the number of plies of conductive adhesive film A31 increases, the relative number of times of pasting conductive adhesive film A31 and tearing cuticula off that also can make increases, and processing procedure man-hour, material cost are improved.
(2) because conductive adhesive film A31 must keep smooth in the process of pasting, if conductive adhesive film A31 produces out-of-flatness, then can significantly reduce heat conducting usefulness, and conductive adhesive film A31 multilayer pastes Shi Gengjia and be easy to take place, make heat conduction glue-line A3 can't effectively carry out heat conduction.
(3) aluminium base A1 makes anodized, for preventing the etching aluminum base material A1 of chemical agent that successive process is used, also can slightly promote breakdown voltage resistant ability, but in the formation of aluminium base A1 surface, form oxidation film layer A2 in advance, also will hinder the heat conduction between aluminium base A1 and the heat conduction glue-line A3, the heat-sinking capability of metal substrate A is descended.
Therefore, how to solve above-mentioned prior art with not enough, and for being engaged in the problem place of the relevant improvement that the dealer desires most ardently of the industry.
Summary of the invention
Main purpose of the present utility model is, the thickness that utilizes the soft ceramic heat-dissipating of coating to coat with lacquer is controlled the formation thickness of soft ceramic heat-dissipating enamelled coating, to change breakdown voltage resistant that soft ceramic heat-dissipating enamelled coating is provided, to allow the producer under the situation that does not change processing procedure, can produce the breakdown voltage resistant composite metal substrate of multiple difference, and reduce cost.
For reaching above-mentioned purpose, a kind of soft Ceramic Composite formula metal substrate of the utility model, wherein, this metallic substrate surfaces is coated with soft ceramic heat-dissipating lacquer, and heating makes it harden into soft ceramic heat-dissipating enamelled coating, and be sequentially provided with a conductive adhesive film and copper foil layer in soft ceramic heat-dissipating enamelled coating surface, make copper foil layer rely on firm being positioned on the soft ceramic heat-dissipating enamelled coating of conductive adhesive film.
Preferable, this soft ceramic heat-dissipating lacquer is arranged at metallic substrate surfaces with spraying method.
Preferable, this soft ceramic heat-dissipating lacquer is arranged at metallic substrate surfaces with mode of printing.
Preferable, this metal substrate is the aluminium material substrate.
The beneficial effects of the utility model are: the thickness that utilizes the soft ceramic heat-dissipating of coating to coat with lacquer is controlled the formation thickness of soft ceramic heat-dissipating enamelled coating, to change breakdown voltage resistant that soft ceramic heat-dissipating enamelled coating is provided, to allow the producer under the situation that does not change processing procedure, can produce the breakdown voltage resistant composite metal substrate of multiple difference, and reduce cost.
Description of drawings
Fig. 1 is the side cutaway view of prior art;
Fig. 2 is a side cutaway view of the present utility model;
Fig. 3 is a side-looking sectional exploded view of the present utility model.
Description of reference numerals: 1-metal substrate; The soft ceramic heat-dissipating enamelled coating of 2-; The 3-conductive adhesive film; The 4-copper foil layer; The A-metal substrate; The A1-aluminium base; The A2-oxidation film layer; A3-heat conduction glue-line; The A31-conductive adhesive film; The A4-copper foil layer.
Embodiment
See also Fig. 2 and shown in Figure 3, find out that by knowing among the figure the utility model composite metal substrate is provided with metal substrate 1, metal substrate 1 surface is provided with soft ceramic heat-dissipating enamelled coating 2, and be sequentially provided with a conductive adhesive film 3 and copper foil layer 4 in soft ceramic heat-dissipating enamelled coating 2 surfaces, wherein:
This metal substrate 1 is that aluminium material or aluminum alloy material are made.
This soft ceramic heat-dissipating enamelled coating 2 is coated metal substrate 1 surface with soft ceramic heat-dissipating lacquer, and heating makes its sclerosis, and in the soft ceramic heat-dissipating enamelled coating 2 of metal substrate 1 surface formation, and soft ceramic heat-dissipating lacquer can spray or mode of printing is arranged at metal substrate 1 surface, and soft ceramic heat-dissipating enamelled coating 2 has high-termal conductivity and insulating properties.
This conductive adhesive film 3 is after soft ceramic heat-dissipating enamelled coating 2 forms; be attached at soft ceramic heat-dissipating enamelled coating 2 surfaces; and tear its diaphragm off, and again copper foil layer 4 is attached at conductive adhesive film 3 surfaces, make copper foil layer 4 can rely on conductive adhesive film 3 firm being positioned on the soft ceramic heat-dissipating enamelled coating 2.
From the above mentioned; when copper foil layer 4 expose, during following process such as etching; soft ceramic heat-dissipating enamelled coating 2 can be protected metal substrate 1 not corroded by the employed chemical agent of following process or destroy; and when being provided with heater elements such as IC, LED when copper foil layer 4 surfaces; the heat energy that it sent conducts to metal substrate 1 fast for relying on conductive adhesive film 3 and soft ceramic heat-dissipating enamelled coating 2; metal substrate 1 can be left heat energy, make heater element remain on normal working temperature.
Moreover it is higher breakdown voltage resistant that soft ceramic heat-dissipating enamelled coating 2 can provide, and can be according to the demand of composite metal substrate, and the thickness when utilizing soft ceramic heat-dissipating lacquer to be applied to metal substrate 1 surface is controlled breakdown voltage resistant.
Therefore, the utility model can solve the deficiencies in the prior art and disappearance, and can promote the effect that prior art does not have, and its key technology is:
(1) the utility model utilization thickness of being coated with soft ceramic heat-dissipating lacquer is controlled the formation thickness of soft ceramic heat-dissipating enamelled coating 2, to change breakdown voltage resistant that soft ceramic heat-dissipating enamelled coating 2 is provided, and the thickness of soft ceramic heat-dissipating enamelled coating 2 is thick more, can provide higher breakdown voltage resistant, under the situation that does not change processing procedure, can produce the breakdown voltage resistant composite metal substrate of multiple difference, make to make things convenient for the producer.
(2) conductive adhesive film 3 of the present utility model is mainly fixed bit copper foil layer 4 and uses, breakdown voltage resistant by being provided by soft ceramic heat-dissipating enamelled coating 2, therefore 3 need of conductive adhesive film are provided with one deck and get final product, to avoid in the prior art, multilayer is pasted the problem that processing procedure man-hour, material cost are improved and is taken place, and can effectively make conductive adhesive film 3 smooth pasting.
Claims (4)
1. soft Ceramic Composite formula metal substrate, it is characterized in that: this metallic substrate surfaces is coated with soft ceramic heat-dissipating lacquer, and heating makes it harden into soft ceramic heat-dissipating enamelled coating, and be sequentially provided with a conductive adhesive film and copper foil layer in soft ceramic heat-dissipating enamelled coating surface, make copper foil layer rely on conductive adhesive film to be positioned on the soft ceramic heat-dissipating enamelled coating.
2. soft Ceramic Composite formula metal substrate as claimed in claim 1 is characterized in that, this soft ceramic heat-dissipating lacquer is arranged at metallic substrate surfaces with spraying method.
3. soft Ceramic Composite formula metal substrate as claimed in claim 1 is characterized in that, this soft ceramic heat-dissipating lacquer is arranged at metallic substrate surfaces with mode of printing.
4. soft Ceramic Composite formula metal substrate as claimed in claim 1 is characterized in that this metal substrate is the aluminium material substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020529423XU CN201820746U (en) | 2010-09-15 | 2010-09-15 | Soft ceramic composite metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020529423XU CN201820746U (en) | 2010-09-15 | 2010-09-15 | Soft ceramic composite metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201820746U true CN201820746U (en) | 2011-05-04 |
Family
ID=43918690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020529423XU Expired - Fee Related CN201820746U (en) | 2010-09-15 | 2010-09-15 | Soft ceramic composite metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201820746U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980162A (en) * | 2012-12-13 | 2013-03-20 | 珠海市远康企业有限公司 | Heat radiator containing vacuum-evaporated coating for LED (Light Emitting Diode) lamp and manufacture preparation method thereof |
| CN103066186A (en) * | 2013-01-07 | 2013-04-24 | 浙江华正新材料股份有限公司 | Insulating layer and aluminum substrate of ceramic chip composite structure and manufacturing method of the same |
-
2010
- 2010-09-15 CN CN201020529423XU patent/CN201820746U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980162A (en) * | 2012-12-13 | 2013-03-20 | 珠海市远康企业有限公司 | Heat radiator containing vacuum-evaporated coating for LED (Light Emitting Diode) lamp and manufacture preparation method thereof |
| CN103066186A (en) * | 2013-01-07 | 2013-04-24 | 浙江华正新材料股份有限公司 | Insulating layer and aluminum substrate of ceramic chip composite structure and manufacturing method of the same |
| CN103066186B (en) * | 2013-01-07 | 2016-03-02 | 浙江华正新材料股份有限公司 | The insulating barrier of ceramic chip composite structure, aluminium base and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110504 Termination date: 20120915 |