CN104968140B - Flexible folding wiring board - Google Patents
Flexible folding wiring board Download PDFInfo
- Publication number
- CN104968140B CN104968140B CN201510315878.9A CN201510315878A CN104968140B CN 104968140 B CN104968140 B CN 104968140B CN 201510315878 A CN201510315878 A CN 201510315878A CN 104968140 B CN104968140 B CN 104968140B
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- China
- Prior art keywords
- flexible
- layer
- hard
- line
- substrate
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Abstract
The present invention provides a kind of flexible folding wiring board, its part uses hard substrate, including hard substrate, the upper surface of described hard substrate is equipped with the first radiating insulating glue-line, the upper surface of described first radiating insulating glue-line is equipped with first circuit layer, the upper surface of described first circuit layer is equipped with the first insulation solder mask, its another part uses flexible parent metal, including the first flexible substrate layer, the first circuit layer extends to the upper surface of the first flexible substrate layer from the first radiating insulating glue-line of hard substrate, the lower surface of a part for first flexible substrate layer is connected by the upper surface of the first radiating insulating glue-line and hard substrate.Flexible parent metal and hard substrate are combined together in the present invention, can not only be destroyed or force to yield, but also can be applied on the wiring board for needing good heat radiating, and when mounted, it can directly be welded on hard substrate, it is simple and convenient, the radiator of existing automobile tail light can be improved.
Description
Technical field：
The present invention relates to wiring board manufacturing technology fields, are especially a kind of flexible folding wiring board.
Background technology：
There are two types of the wiring boards of the prior art, and one is the wiring boards of hard, aluminum substrate are usually used, then in aluminium base
Line layer is done by copper foil on plate, then does insulation solder mask on line layer.This wiring board can lead to welding to be fixedly mounted
Onto product, but this wiring board can not bending therefore can not be close to the peace for not being plane once bending is exactly to damage substantially
Dress face is installed, such as curved surface, step surface and other irregular mounting surfaces.Also one is flexible circuit board, it is generally adopted
Use the soft substrate layers of PI as substrate layer, copper foil is then arranged on soft substrate layer does line layer, then leaves no room for manoeuvre on line layer again
Edge solder mask, this flexible circuit board can need product surface to be mounted with bending to be attached to, but since it is flexible material
Matter, therefore be fixed in cumbersome when product surface, it is more difficult to it is fixed in the way of welding, and this flexible circuitry
The substrate material of plate is typically all non-metallic material, and heat dissipation effect is poor, especially for applying on electroluminescent lamp
Flexible circuit board, heat dissipation problem can be than more prominent.Especially for the radiator of automobile tail light, if with flexible circuit board,
It then radiates bad, if with hard wiring board, due to the curve of automobile tail light, it is not easy to install.Therefore, it is badly in need of at present a kind of
It can destroy or force to yield, and installation fixation is more convenient, and the also relatively good flexible folding wiring board that radiates.
Invention content：
The technical problem to be solved by the present invention is to providing one kind can destroy or force to yield, and it is more convenient and scattered to install fixation
Hot also relatively good flexible folding wiring board.
The present invention provides a kind of flexible folding wiring board, its part uses hard substrate, including hard substrate, described hard
The upper surface of matter substrate is equipped with the first radiating insulating glue-line, and the upper surface of described first radiating insulating glue-line is equipped with first circuit layer, institute
The upper surface of first circuit layer is stated equipped with the first insulation solder mask, its another part uses flexible parent metal, including the first flexible base
Material layer, the first circuit layer extend to the upper table of the first flexible substrate layer from the first radiating insulating glue-line of hard substrate
The lower surface in face, a part for first flexible substrate layer is connected by the upper surface of the first radiating insulating glue-line and hard substrate
It connects.
With the above structure, the present invention has the following advantages：Flexible parent metal and hard substrate are incorporated in the present invention
Together, by radiating insulating glue connection on hard substrate, since hard substrate generally uses metal substrate, such as aluminum substrate,
Heat dissipation is preferable, therefore can apply on the wiring board for needing good heat radiating, can be direct such as LED lamp panel, and when mounted
It is welded on hard substrate, it is simple and convenient, and for the wiring board of hard substrate, the present invention can destroy or force to yield,
The radiator of existing automobile tail light can be improved.
The flexible folding wiring board is single layer wiring board, and the hard substrate is one piece, and first flexible substrate layer is
One piece, the lower surface of the part at the edge of first flexible substrate layer is connected by the first radiating insulating glue-line and hard substrate
It connects.
The flexible folding wiring board is single layer wiring board, and the hard substrate is at least two pieces, first flexible parent metal
Layer is at least one piece, and the first radiating insulating glue-line is connected to two hard bases respectively on the both sides of described every piece the first flexible substrate layer
On the upper surface of plate.
The flexible folding wiring board is double-layered circuit board, and the second radiating insulating is also equipped with successively below the hard substrate
Glue-line, the second circuit layer and the second insulation solder mask, the flexible folding wiring board further includes the second flexible substrate layer, and described second
Circuit layer extends to the lower surface of the second flexible substrate layer from the second radiating insulating glue-line of hard substrate, and described second is flexible
The upper surface of a part for substrate layer is connected by the lower surface of the second radiating insulating glue-line and hard substrate.
The hard substrate is one piece, and first flexible substrate layer is one piece, and second flexible substrate layer is one piece,
The upper table that the lower surface of the part at the edge of first flexible substrate layer passes through the first radiating insulating glue-line and hard substrate
Face connects, and the upper surface of the part at the edge of second flexible substrate layer passes through the second radiating insulating glue-line and hard substrate
Lower surface connection.
The hard substrate is at least two pieces, and first flexible substrate layer is at least one piece, second flexible parent metal
Layer is at least one piece, and the lower surface on the both sides of described every piece the first flexible substrate layer is connected by the first radiating insulating glue-line respectively
On the upper surface of two hard substrates, the upper surface on the both sides of described every piece the second flexible substrate layer passes through the second heat dissipation respectively
Insulation glue-line is connected on the lower surface of two hard substrates.
Description of the drawings：
Fig. 1 is the structural schematic diagram of the flexible folding wiring board of one of embodiment.
Fig. 2 is the structural schematic diagram of two flexible folding wiring board of embodiment；
Fig. 3 is the structural schematic diagram of three flexible folding wiring board of embodiment；
Fig. 4 is the structural schematic diagram of four flexible folding wiring board of embodiment；
In figure：1, hard substrate, the 2, first radiating insulating glue-line, the 3, first circuit layer, 4, first insulation solder mask, 5, the
One flexible substrate layer, the 6, second radiating insulating glue-line, the 7, the second circuit layer, 8, second insulation solder mask, the 9, second flexible parent metal
Layer.
Specific implementation mode：
It elaborates to the present invention with reference to specific embodiments and the drawings explanation：
As shown in Figure 1, Figure 2, Figure 3, Figure 4, the present invention provides a kind of flexible folding wiring board, its part uses hard base
Material, including hard substrate 1, the upper surface of described hard substrate 1 are equipped with the first radiating insulating glue-line 2, the first radiating insulating glue
The upper surface of layer 2 is equipped with first circuit layer 3, and the upper surface of described first circuit layer 3 is equipped with the first insulation solder mask 4, its another portion
Divide and uses flexible parent metal, including the first flexible substrate layer 5, first radiating insulating glue of the first circuit layer 3 from hard substrate 1
The upper surface of the first flexible substrate layer 5 is extended on layer 2, and is connect with the upper surface of the first flexible substrate layer 5, described first is soft
The lower surface of a part for property substrate layer 5 is connect by the first radiating insulating glue-line 2 with the upper surface of hard substrate 1.
Hard substrate generally uses aluminum substrate, aluminum substrate to shine since heat conduction is widely used in LED soon in the present embodiment
Field of circuit boards, naturally it is also possible to which, using the hard substrate of other materials, such as ceramic substrate, the radiating insulating glue is high score
Sub- material generally uses organosilicon material, and the performance with preferable heat conduction and insulation is the prior art, and flexible substrate layer is adopted
With PI flexible parent metals, the circuit layer is generally copper foil.
Flexible circuit board and hard substrate are combined together by the present invention, and utilize radiating insulating glue by flexible circuit board
In flexible parent metal connect with hard substrate, using the good heat dissipation performance of hard substrate, radiate to flexible circuit board,
Heat dissipation effect is more better than flexible circuit board.The application is described further with reference to embodiment：
One of embodiment：As shown in Figure 1, the flexible folding wiring board is single layer wiring board, the hard substrate 1 is one
Block, first flexible substrate layer 5 are one piece, and the lower surface of the part at the edge of first flexible substrate layer 5 passes through the
One radiating insulating glue-line 2 is connect with hard substrate 1.
The two of embodiment：As shown in Fig. 2, the flexible folding wiring board is single layer wiring board, the hard substrate 1 is at least
Two pieces, be two pieces in Fig. 2, first flexible substrate layer 5 is at least one piece, the both sides of described every piece the first flexible substrate layer 5
It is connected on two hard substrates 1.I.e. both sides are hard substrate, and hard substrate is connected to by the first flexible substrate layer 5
Together.
The flexible folding wiring board is double-layered circuit board, and it is exhausted to be also equipped with the second heat dissipation successively below the hard substrate 1
Edge glue-line 6, the insulation solder mask 8 of the second circuit layer 7 and second, the flexible folding wiring board further includes the second flexible substrate layer 9, institute
State the lower surface that the second circuit layer 7 extends to the second flexible substrate layer 9 from the second radiating insulating glue-line 8 of hard substrate, institute
The upper surface for stating a part for the second flexible substrate layer 9 is connected by the lower surface of the second radiating insulating glue-line 8 and hard substrate 1
It connects.This structure designs for double-layered circuit board.
The three of embodiment, as shown in Figure 3：The hard substrate 1 is one piece, and first flexible substrate layer 5 is one piece, institute
It is one piece to state the second flexible substrate layer 9, and the lower surface of the part at the edge of first flexible substrate layer 5 passes through the first heat dissipation
Insulation glue-line 2 is connect with the upper surface of hard substrate 1, and the upper surface of the part at the edge of second flexible substrate layer 9 is logical
The second radiating insulating glue-line 8 is crossed to connect with the lower surface of hard substrate 1.
The four of embodiment, as shown in figure 4, the hard substrate 1 is at least two pieces, first flexible substrate layer 5 is extremely
One piece few, second flexible substrate layer 9 is at least one piece, described every piece the first flexible parent metal, the lower surface difference on 5 both sides
It is connected on the upper surface of two hard substrates 1 by the first radiating insulating glue-line 2, described every piece the second flexible substrate layer 9
The upper surface on both sides is connected to by the second radiating insulating glue-line 8 on the lower surface of two hard substrates respectively.
Claims (6)
1. a kind of flexible folding wiring board, it is characterised in that：Its part uses hard substrate, including hard substrate, described hard
The upper surface of matter substrate is equipped with the first radiating insulating glue-line, and the upper surface of described first radiating insulating glue-line is equipped with first circuit layer, institute
The upper surface of first circuit layer is stated equipped with the first insulation solder mask, its another part uses flexible parent metal, including the first flexible base
Material layer, the first circuit layer extend to the upper table of the first flexible substrate layer from the first radiating insulating glue-line of hard substrate
The lower surface in face, a part for first flexible substrate layer is connected by the upper surface of the first radiating insulating glue-line and hard substrate
It connects.
2. flexible folding wiring board according to claim 1, it is characterised in that：The flexible folding wiring board is single layer circuit
Plate, the hard substrate are one piece, and first flexible substrate layer is one piece, one of the edge of first flexible substrate layer
The lower surface divided is connect by the first radiating insulating glue-line with hard substrate.
3. flexible folding wiring board according to claim 1, it is characterised in that：The flexible folding wiring board is single layer circuit
Plate, the hard substrate are at least two pieces, and first flexible substrate layer is at least one piece, described every piece the first flexible substrate layer
Both sides be connected on the upper surface of two hard substrates by the first radiating insulating glue-line respectively.
4. flexible folding wiring board according to claim 1, it is characterised in that：The flexible folding wiring board is the double-deck circuit
Plate is also equipped with the second radiating insulating glue-line, the second circuit layer and the second insulation solder mask, institute below the hard substrate successively
It further includes the second flexible substrate layer, second radiating insulating glue-line of the second circuit layer from hard substrate to state flexible folding wiring board
On extend to the lower surface of the second flexible substrate layer, the upper surface of a part for second flexible substrate layer passes through the second heat dissipation
The lower surface of insulation glue-line and hard substrate connects.
5. flexible folding wiring board according to claim 4, it is characterised in that：The hard substrate be one piece, described first
Flexible substrate layer is one piece, and second flexible substrate layer is one piece, the part at the edge of first flexible substrate layer
Lower surface is connected by the upper surface of the first radiating insulating glue-line and hard substrate, and the one of the edge of second flexible substrate layer
Partial upper surface is connected by the lower surface of the second radiating insulating glue-line and hard substrate.
6. flexible folding wiring board according to claim 4, it is characterised in that：The hard substrate is at least two pieces, described
First flexible substrate layer is at least one piece, and second flexible substrate layer is at least one piece, described every piece the first flexible substrate layer
The lower surface on both sides be connected on the upper surface of two hard substrates by the first radiating insulating glue-line respectively, described every piece
The upper surface on the both sides of two flexible substrate layers is connected to the lower surface of two hard substrates by the second radiating insulating glue-line respectively
On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510315878.9A CN104968140B (en) | 2015-06-10 | 2015-06-10 | Flexible folding wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510315878.9A CN104968140B (en) | 2015-06-10 | 2015-06-10 | Flexible folding wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104968140A CN104968140A (en) | 2015-10-07 |
| CN104968140B true CN104968140B (en) | 2018-08-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510315878.9A Active CN104968140B (en) | 2015-06-10 | 2015-06-10 | Flexible folding wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104968140B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3048153B1 (en) * | 2016-02-22 | 2019-11-29 | Valeo Vision | LUMINOUS MODULE FOR A MOTOR VEHICLE WITH MASS RECOVERY |
| CN105555019B (en) * | 2016-02-25 | 2018-09-04 | 广东欧珀移动通信有限公司 | Rigid Flex, terminal and Rigid Flex production method |
| CN106255311B (en) * | 2016-08-18 | 2019-09-06 | 东莞市五株电子科技有限公司 | Aluminium base rigid-flex combined board and its processing method |
Citations (6)
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|---|---|---|---|---|
| CN201426214Y (en) * | 2009-03-23 | 2010-03-17 | 沈李豪 | PCB with radiating structure having heat-conducting and heat-radiating printing ink |
| CN102264193A (en) * | 2010-05-24 | 2011-11-30 | 健鼎（无锡）电子有限公司 | Method for manufacturing rigid-flex circuit board |
| CN102469685A (en) * | 2010-11-19 | 2012-05-23 | 昆山雅森电子材料科技有限公司 | Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof |
| CN203206582U (en) * | 2013-02-22 | 2013-09-18 | 奥特斯(中国)有限公司 | Printed circuit board |
| CN104459878A (en) * | 2013-09-22 | 2015-03-25 | 上海美维科技有限公司 | Soft and hard photoelectric composite board and manufacturing method thereof |
| CN204697385U (en) * | 2015-06-10 | 2015-10-07 | 江西鑫力华数码科技有限公司 | Flexible folding wiring board |
-
2015
- 2015-06-10 CN CN201510315878.9A patent/CN104968140B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201426214Y (en) * | 2009-03-23 | 2010-03-17 | 沈李豪 | PCB with radiating structure having heat-conducting and heat-radiating printing ink |
| CN102264193A (en) * | 2010-05-24 | 2011-11-30 | 健鼎（无锡）电子有限公司 | Method for manufacturing rigid-flex circuit board |
| CN102469685A (en) * | 2010-11-19 | 2012-05-23 | 昆山雅森电子材料科技有限公司 | Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof |
| CN203206582U (en) * | 2013-02-22 | 2013-09-18 | 奥特斯(中国)有限公司 | Printed circuit board |
| CN104459878A (en) * | 2013-09-22 | 2015-03-25 | 上海美维科技有限公司 | Soft and hard photoelectric composite board and manufacturing method thereof |
| CN204697385U (en) * | 2015-06-10 | 2015-10-07 | 江西鑫力华数码科技有限公司 | Flexible folding wiring board |
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| Publication number | Publication date |
|---|---|
| CN104968140A (en) | 2015-10-07 |
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| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Flexible circuit board Effective date of registration: 20211208 Granted publication date: 20180810 Pledgee: Industrial and Commercial Bank of China Limited Yongxin sub branch Pledgor: SUCCESS DIGITAL TECHNOLOGY (JIANGXI ) CO.,LTD. Registration number: Y2021980014439 |
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