CN203206582U

CN203206582U - Printed circuit board

Info

Publication number: CN203206582U
Application number: CN 201320083911
Authority: CN
Inventors: 迈克尔·葛斯勒; 桑德拉·格拉布迈尔
Original assignee: AT&S China Co Ltd
Current assignee: AT&S China Co Ltd
Priority date: 2013-02-22
Filing date: 2013-02-22
Publication date: 2013-09-18
Anticipated expiration: 2023-02-22

Abstract

The utility model relates to a printed circuit board. The printed circuit board comprises at least two hard circuit boards (2, 3), each hard circuit board respectively has at least one conductive layer (5, 6, 7, 8, 13, 14) and at least more than one insulation layer (9, 11, 12) prepared by dielectric material, the hard circuit boards are in electrical and mechanical connection with at least one soft circuit board (4), the soft circuit board has at least one conductive layer (16) and at least one insulation layer (15) prepared by dielectric material, conductive areas of the hard circuit boards are connected with a conductive area of the soft circuit board through conductive guide holes (17), the at least two hard circuit boards are directly combined with the one insulation layer (15) of the soft circuit board (4), the conductive guide holes (17) are formed in through holes through one body molding, and the conductive materials are homogeneous.

Description

Printed circuit board

Technical field

The utility model relates to printed circuit board (pcb), particularly relate to the rigid-flexible circuit board that comprises at least two hard circuit boards, those hard circuit boards respectively carry at least one conductive layer and at least one insulating barrier made from the dielectric material, described hard circuit board is electrically connected with at least one flexible circuit board and is connected with being connected, this flexible circuit board is with at least one conductive layer and at least one insulating barrier made from the dielectric material, and the conductive region of those hard circuit boards is connected to each other with the conductive region of this flexible circuit board by the mode of conduction guide hole whereby.

Background technology

Owing to the relation of production method, comprise the rigid-flexible circuit board of two or more hard circuit boards, usually be limited to the hard circuit board with same structure and height.Or rather, according to prior art, all be combined with flexible circuit board in the whole surface of hard circuit board, and releasing layer then can separate some selected zones.With two circuit boards, i.e. this rigid and this flexible circuit board is after combining, by such as laser cutting the part hard circuit board being cut out and removes.The result is the combination of flexible circuit board and two or more hard circuit boards.

The utility model content

A purpose of the present utility model is for providing the rigid-flexible circuit board that comprises at least two hard circuit boards, and those hard circuit boards are electrically connected with at least one flexible circuit board and are connected with being connected.

Another purpose of the present utility model is for providing the rigid-flexible circuit board of high complexity, and it is with the hard circuit board of at least two different technologies levels.

Of the present utility model on the other hand for the rigid-flexible circuit board that comprises at least two hard circuit boards is provided, and the height of those hard circuit boards is different.

The rigid-flexible circuit board of another purpose of the present utility model for providing microminiaturized De Gengjia and production cost to reduce.

Therefore, the utility model provides a kind of printed circuit board, it comprises at least two hard circuit boards, those hard circuit boards respectively carry at least one conductive layer and at least one insulating barrier made from the dielectric material, described hard circuit board is electrically connected with at least one flexible circuit board and is connected with being connected, this flexible circuit board is with at least one conductive layer and at least one insulating barrier made from the dielectric material, the conductive region of those hard circuit boards is connected to each other with the conductive region of this flexible circuit board by the mode of conduction guide hole whereby, those at least two hard circuit boards directly are combined with the insulating barrier of this flexible circuit board, and those conduction guide holes form in through hole, and this conductive material is homogeneous all over.

In preferred embodiment of the present utility model, the structure of those at least two hard circuit boards is different.

Another desirable variant of the present utility model is characterised in that the thickness of those at least two hard circuit boards is different.

If the conductive material of those guide holes extends at the inner surface of those through holes, then can belong to favourable.

In other cases, suggestion is filled those through holes fully with this conductive material.

Another desirable variant is characterised in that this conductive material is cathode copper.

Description of drawings

Fig. 1 is as the schematic sectional view of the PCB with two hard circuit boards described in the utility model that those hard circuit boards are connected with being connected with the flexible circuit board electrical connection.

Fig. 2 a – Fig. 2 f schematically shown for the manufacture of as the method for optimizing of rigid-flexible circuit board described in the utility model in most important step.

Fig. 3 has shown for the manufacture of the device variant such as PCB described in the utility model with schematic side elevation.

Embodiment

Hereinafter with reference to the accompanying drawings to being described in detail such as PCB embodiment described in the utility model.For fear of repeat specification, same or analogous parts have been used identical Reference numeral.

As shown in Figure 1, comprise two

hard circuit boards

2 and 3 such as soft and hard combined printed wiring board 1 described in the utility model, described hard circuit board is electrically connected with flexible circuit board 4 and is connected with being connected.

In the example shown, hard circuit board 2 is multilayer circuit board, and it indicates with Reference numeral 5,6,7 and 8 in Fig. 1 from top to bottom with four structurized conductive layers, and three dielectric layers, indicates with

Reference numeral

9,10 and 11 from top to bottom.On the other hand, hard circuit board 3 is two-sided PCB, and it is by only a dielectric layer 12 and two structurized conductive layers 13 and 14 form.This flexible circuit board 4 is comprised of dielectric layer 15 and conductive layer 16.

The dielectric layer of those rigid PCB usually with by rank model (such as FR-4, FR-5) or other resins and resin (such as epoxy resin) flood and make such as the enhancing material of glass fibre.

The dielectric layer of this flexible circuit board 14 can depend on specific requirement, take polyimides or more cheap glass fibre such as FR as the basis.For disposable bending, it is no problem using FR4.With

hard circuit board

2 and 3 direct and these soft layer 4 combinations, namely do not use special adhesive phase or analog.

The conductive layer of those PCB is comprised of copper usually, and the conductive region of these conductive layers of those

hard circuit boards

2 and 3, such as conductive path, by the conduction mode of guide hole 17 and can electrically being connected to each other by the conductive region that copper or electrocondution slurry form of this soft road plate 4.Those conduction guide holes 17 form in through hole, and this conductive material is homogeneous all over.Can make suitable through hole by machine drilling or by laser drill.

The conductive material of those guide holes can be only extends (shown in Fig. 1 left side) at the inner surface of those through holes, or also can be as shown in Figure 1, those through holes are filled with this conductive material fully.

Usually the conductive layer thickness that is comprised of copper generally is situated between between the 1 and 35 μ m, and the thickness of those dielectric layers is generally between 5 and 200 μ m.

Now with reference to Fig. 2 a – Fig. 2 f, be provided for making the method for optimizing such as rigid-flexible circuit board described in the utility model.

Fig. 2 a is the schematic plan view of mould 18, and it is for the production of this rigid-flexible circuit board 1.This mould 18 can be by guaranteeing that the material that PCB or its parts can not adhere on this mold wall forms.Perhaps, can prevent adhering to the wall that coating applies this mould 18.Mould 18 is provided with cavity 19, can hold PCB.

Fig. 2 b is the schematic sectional view of this mould 18, and it is inserted with interim sept 20 in this cavity 19.This sept is divided into two

minutes chambeies

21,22 with this cavity 19.In the example shown, larger and darker than the area in minute chamber 22 on right side in minute chamber 21 in Fig. 2 b left side.

In first step, with the first hard circuit board 2 and the second hard circuit board 3 insert respectively those

minutes chamber

21 and 22 in.

Circuit board

2 and 3 basically can be corresponding with the PCB2 of Fig. 1 and 3.

Fig. 2 c shows this mould 18, is inserted with respectively those

hard circuit boards

2 and 3 in its minute chamber.In second step, will be as basically can placing on the whole surface of this cavity 19 by the soft PCB4 corresponding with the PCB4 in Fig. 1 so that shown in Fig. 2 d, rigid PCB2 and 3 and this interim sept 20 all capped.

As shown in Fig. 2 d, in next step, apply pressure and heating power with arrow p, h sign, so that those rigid PCB2 and 3 are laminated to this soft PCB4.Or rather, be respectively rigid PCB2 and 3 dielectric layer 11 and 12 and the dielectric layer 15(of this soft PCB4 see Fig. 1) by lamination.

In next step, this compound soft or hard that remains unfulfilled is carried out the demoulding in conjunction with PCB1.Then shown in Fig. 2 e, get out the hole for guide hole etc.For this purpose, use X-ray drilling machine 23 in the inner conducting layer 5,6,7,8,13,14 of those rigid PCB2 and 3, to determine target, and get out registration holes 24, guarantee in next step, accurately to get out through hole.

Shown in Fig. 2 e, through hole 25 is got out by computer-controlled drilling machine 26.PCB1 by the supporting of suitable drilling hole machine tool (not shown) is carried out with X-ray boring and gets out the step of those through holes 25.

After getting out those through holes 25, electroplate or fill those through holes with copper or electrocondution slurry, to form guide hole 17.Yet, those PCB2 of electrodepositable and/or structuring, 3,4 outer surface, with obtain as in soft or hard shown in Figure 1 and that schematically show at Fig. 2 f in conjunction with PCB1.

Although foregoing is for various preferred embodiments of the present utility model, it should be noted the variation that does not deviate from the utility model scope that claims limit and revise will be apparent for technical personnel.

Can be without special dies, but produce such as rigid-flexible circuit board described in the utility model with other equipment.For instance, as shown in Figure 3, can with two or more different hard circuit boards, such as PCB2,3, place on the flat estrade 27 that is surrounded by framework 28.Such framework can replace the sidewall of this mould 18, and can adjust in response to the PCB that must process.Sept 29 can remedy the differing heights of circuit board, so that the upper surface of this hard circuit board is in same level.For example be equipped with fixture 30 between two circuit boards, corresponding with shape and the function of the interim sept 20 of Fig. 2, its upper surface and those rigid PCB2,3 are positioned at same level, and the bottom side of PCB and this sept can be by the presspaper of the (not shown) substrate of for example being sold with the name of YOM by Yamauchi Corp., to remedy difference in height.As indicated above, soft PCB4 is placed those rigid PCB2,3 and the surface of this fixture 30, and exert pressure and heating power, with those PCB2 of lamination, 3,4.Then can by remove this framework 28 and should (or those) fixture 30 carries out the demoulding, and step subsequently is with described identical about Fig. 2.At this, the selected material that consists of this estrade 27, this framework 28 and this fixture 30 of this mould equally must not can adhere to those PCB.For instance, can use PTFE.

Claims

1. a printed circuit board (1), it comprises at least two hard circuit boards (2,3), and those hard circuit boards respectively carry at least one conductive layer (5,6,7,8; 13,14) and at least one insulating barrier made from the dielectric material (9,11; 12), described hard circuit board is electrically connected with at least one flexible circuit board (4) and is connected with being connected, this flexible circuit board is with at least one conductive layer (16) and insulating barrier (15) that at least one is made with the dielectric material, the conductive region of those hard circuit boards is connected to each other with the conductive region of this flexible circuit board by the mode of conduction guide hole (17) whereby

It is characterized in that

Those at least two hard circuit boards (2,3) directly with insulating barrier (15) combination of this flexible circuit board (4), and those conduct electricity guide holes (17) and form in through hole, this conductive material is homogeneous all over.

2. printed circuit board as claimed in claim 1 (1) is characterized in that the structure of those at least two hard circuit boards (2,3) is different.

3. printed circuit board as claimed in claim 1 (1) is characterized in that the thickness of those at least two hard circuit boards (2,3) is different.

4. printed circuit board as claimed in claim 1 (1) is characterized in that the conductive material of those guide holes (17) extends at the inner surface of those through holes.

5. printed circuit board as claimed in claim 1 (1) is characterized in that those through holes are fully with this conductive material filling.

6. such as claim 4 or 5 described printed circuit boards (1), it is characterized in that this conductive material is cathode copper.