CN113411972A - Manufacturing method of stepped slot circuit board solder mask plug hole - Google Patents
Manufacturing method of stepped slot circuit board solder mask plug hole Download PDFInfo
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- CN113411972A CN113411972A CN202110668764.8A CN202110668764A CN113411972A CN 113411972 A CN113411972 A CN 113411972A CN 202110668764 A CN202110668764 A CN 202110668764A CN 113411972 A CN113411972 A CN 113411972A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of a stepped slot circuit board solder mask plug hole, which is characterized in that a first sub-board with a blind slot, a second sub-board and a PP composite layer are pressed together, so that the blind slot, a slot bottom circuit graph and a hollow graph are aligned conveniently, the blind slot is subjected to depth-control uncovering electric milling treatment on the first side of the first sub-board, the slot bottom circuit graph at the bottom of the blind slot is exposed, and the processing of the stepped slot of the circuit board is completed. The side wall of the stepped groove manufactured by the invention is in a non-metallization design; a gasket is not needed, the depth of the stepped groove can be accurately controlled, and the problem of residual glue at the bottom of the groove can be avoided; the manufacturing of the tank bottom resistance welding plug hole and the tank bottom circuit pattern resistance welding layer can be realized, the corrosion of subsequent copper deposition and electroplating liquid medicine to the tank bottom selective gold deposition PAD is avoided, and the reliability of the product is improved.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a stepped slot circuit board solder mask plug hole.
Background
Printed Circuit Boards (PCBs), also called Printed Circuit boards, are important electronic components, support bodies for electronic components, and carriers for electrical interconnection of electronic components, and are widely used in various electronic devices.
At present, for a stepped groove circuit board with a circuit pattern, a via hole solder mask plug hole and a surface treatment manufactured at the groove bottom of a stepped groove, the prior art adopts a mode that a gasket is embedded in the groove for glue resistance, and the circuit pattern and the surface treatment of the groove bottom are manufactured in advance. In the mode, because the stepped groove has the limitation of height difference, the solder mask plug hole can not be performed from the grooved surface, and the solder mask plug hole can only be performed from the other surface opposite to the grooved surface, so that the condition of uneven oil bleeding exists, particularly, the oil bleeding at the groove bottom of the stepped groove is more serious, and the groove bottom is polluted. Moreover, the embedded gasket in the prior art is usually a silicon sheet. Because there is the gap in the silica gel piece, remaining steam in the gap can expand under high temperature high pressure to lead to lamination prepreg fracture etc.. In addition, the PAD with selective gold deposition at the bottom of the tank is easily corroded by subsequent copper deposition and electroplating liquid.
Therefore, it is necessary to develop a new solder mask via hole manufacturing process to solve the above technical problems in the prior art.
The above information is given as background information only to aid in understanding the present disclosure, and no determination or admission is made as to whether any of the above is available as prior art against the present disclosure.
Disclosure of Invention
The invention provides a manufacturing method of a stepped slot circuit board solder mask plug hole, which aims to overcome the defects of the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a manufacturing method of a stepped slot circuit board solder mask plug hole comprises the following steps:
s1, manufacturing a first sub-board, wherein the first sub-board comprises at least one inner layer copper foil layer and an outer layer copper foil layer arranged on the first side of the first sub-board, and a blind groove is formed on the second side of the first sub-board;
s2, manufacturing a second sub-board, wherein the second sub-board is a double-sided or multi-layer board, a metalized through hole is manufactured at the bottom position of the groove corresponding to the blind groove on the first side of the second sub-board, and a groove bottom circuit pattern is formed on the first side of the second sub-board;
s3, performing solder mask hole plugging on the metalized through hole, and manufacturing a solder mask layer at the bottom of the groove and a selective gold deposition PAD;
s4, manufacturing a PP composite layer, wherein a hollow pattern with the size matched with the shape of the blind groove is formed on the PP composite layer;
s5, performing brown oxidation treatment on the first sub-board, the second sub-board and the PP composite layer, and sequentially laminating the second sub-board, the PP composite layer and the first sub-board after brown oxidation treatment to align the positions of the blind groove, the groove bottom circuit pattern and the hollow pattern, and pressing to form a mother board;
s6, drilling through holes on the motherboard, and manufacturing an outer layer circuit pattern and an outer layer solder mask after metallization;
s7, carrying out depth control uncovering electric milling treatment on the position of the blind groove on the first side of the first sub-board to form a stepped groove and obtain a stepped groove circuit board.
Further, in the manufacturing method of the stepped slot circuit board solder mask plug hole, a circuit pattern is arranged on the inner copper foil layer.
Further, in the manufacturing method of the stepped slot circuit board solder mask plug hole, the blind slot is formed in a pre-controlled deep electric milling mode.
Further, in the manufacturing method of the stepped slot circuit board solder mask plug hole, the slot bottom circuit pattern on the first side of the second sub-board is formed by etching the outer copper foil layer on the first side of the second sub-board.
Further, in the method for manufacturing the stepped slot circuit board solder mask plug hole, step S7 includes:
carrying out depth-controlled uncovering electric milling treatment on the position of the blind groove on the first side of the first sub-board to form a stepped groove;
removing the residual glue in the bottom of the stepped groove in a laser ablation manner;
and carrying out a surface treatment process on the motherboard to obtain the stepped groove circuit board.
Further, in the method for manufacturing the stepped slot circuit board solder mask plug hole, step S4 includes:
stacking and positioning a plurality of PP spaced epoxy resin light plates;
according to the harmomegathus data of the first sub-plate, carrying out electric milling data on the PP composite layer pre-discharge through groove, and controlling the temperature in the electric milling process to be lower than the resin curing temperature of PP;
and forming a hollow pattern with the size matched with the shape of the blind groove according to the glue overflowing amount of the PP.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the manufacturing method of the stepped slot circuit board solder mask plug hole, the first sub-board with the blind slot, the second sub-board and the PP composite layer are pressed, so that the blind slot, the slot bottom circuit graph and the hollow graph are aligned conveniently, depth-control uncovering electric milling processing is carried out on the blind slot on the first side of the first sub-board, the slot bottom circuit graph at the bottom of the blind slot is exposed, and processing of the stepped slot of the circuit board is completed; a gasket is not needed, the depth of the stepped groove can be accurately controlled, and the problem of residual glue at the bottom of the groove can be avoided; the manufacturing of the tank bottom resistance welding plug hole and the tank bottom circuit pattern resistance welding layer can be realized, the corrosion of subsequent copper deposition and electroplating liquid medicine to the tank bottom selective gold deposition PAD is avoided, and the reliability of the product is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic flow chart of a method for manufacturing a stepped slot circuit board solder mask plug hole according to an embodiment of the present invention;
fig. 2 is a schematic state diagram of the manufacturing method of the stepped slot circuit board solder mask plug hole provided in the embodiment of the invention at step S1;
FIG. 3 is a schematic diagram of a state of the method for manufacturing a solder resist plug hole of a stepped slot circuit board in steps S2 and S3 according to an embodiment of the present invention;
fig. 4 is a schematic state diagram of the manufacturing method of the stepped slot circuit board solder mask plug hole provided in the embodiment of the invention at step S4;
FIG. 5 is a schematic diagram of a state of the method for manufacturing the solder resist plug hole of the stepped slot circuit board in step S5 according to the embodiment of the present invention;
fig. 6 is a schematic state diagram of the manufacturing method of the stepped slot circuit board solder mask plug hole provided in the embodiment of the invention at step S6;
fig. 7 is a schematic state diagram of the manufacturing method of the stepped-slot circuit board solder mask plug hole provided in the embodiment of the invention at step S7.
Reference numerals:
the circuit board comprises a first sub-board 10, a blind groove 10a, a second sub-board 20, a metalized through hole 20a, a hole plugging solder resist ink 20b, a groove bottom circuit pattern 20c, a groove bottom solder resist layer 20d, a selective gold deposition PAD20e, a PP composite layer 30, a hollow pattern 30a, a mother board 40, a circuit board semi-finished product 50, an outer layer circuit pattern 50a, an outer layer solder resist layer 50b, a stepped groove circuit board 60 and a stepped groove 60 a.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.
Furthermore, the terms "long", "short", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention, but do not indicate or imply that the referred devices or elements must have the specific orientations, be configured to operate in the specific orientations, and thus are not to be construed as limitations of the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Example one
In view of the above-mentioned defects of the conventional solder mask hole plugging manufacturing process, the applicant of the present invention is based on the practical experience and professional knowledge that are abundant for many years in the design and manufacture of such products, and is actively researched and innovated in cooperation with the application of theory, so as to hopefully create a technology capable of solving the defects in the prior art, and thus the solder mask hole plugging manufacturing process has higher practicability. After continuous research and design and repeated trial production and improvement, the invention with practical value is finally created.
Referring to fig. 1 to 7, an embodiment of the present invention provides a method for manufacturing a solder mask plug hole of a stepped slot circuit board, where the method includes:
s1, manufacturing a first sub-board 10, wherein the first sub-board 10 comprises at least one inner copper foil layer and an outer copper foil layer arranged on a first side of the first sub-board, and a blind groove 10a is formed on a second side of the first sub-board; as shown in particular in fig. 2.
In this embodiment, a circuit pattern is disposed on the inner copper foil layer. The blind groove 10a is formed by a pre-controlled deep electric milling mode.
S2, manufacturing a second sub-board 20, wherein the second sub-board 20 is a double-sided or multi-layer board, a metalized through hole 20a is manufactured at the bottom position of the groove corresponding to the blind groove 10a on the first side of the second sub-board 20, and a groove bottom circuit pattern 20c is formed on the first side of the second sub-board 20; as shown in particular in figure 3.
In this embodiment, the groove bottom circuit pattern 20c on the first side of the second sub-board 20 is formed by etching the outer copper foil layer on the first side of the second sub-board 20.
S3, performing solder mask hole plugging on the metalized through hole 20a by using solder mask ink 20b, and manufacturing a groove bottom solder mask layer 20d and a selective gold deposition PAD20 e; as shown in particular in figure 3.
S4, manufacturing a PP composite layer 30, wherein a hollow pattern 30a with the size matched with the shape of the blind groove 10a is formed on the PP composite layer 30; as shown in particular in fig. 4.
In the present embodiment, step S4 includes:
stacking and positioning a plurality of PP spaced epoxy resin light plates;
according to the harmomegathus data of the first sub-board 10, carrying out electric milling data on the PP composite layer pre-discharge through groove, and controlling the temperature in the electric milling process to be lower than the resin curing temperature of PP;
and forming a hollow-out pattern 30a with the size matched with the shape of the blind groove 10a according to the glue overflowing amount of the PP.
S5, performing brown oxidation treatment on the first sub-board 10, the second sub-board 20 and the PP composite layer 30, and sequentially stacking the second sub-board 20, the PP composite layer 30 and the first sub-board 10 after brown oxidation treatment, so that the blind groove 10a, the groove bottom circuit pattern 20c and the hollow pattern 30a are aligned in position, and pressing to form the mother board 40; as shown in particular in fig. 5.
S6, drilling through holes on the motherboard 40, and manufacturing an outer layer circuit pattern 50a and an outer layer solder mask layer 50b after metallization to obtain a circuit board semi-finished product 50; as shown in particular in fig. 6.
S7, carrying out depth-controlled uncovering electric milling treatment on the position of the blind groove 10a on the first side of the first sub-board to form a stepped groove and obtain a stepped groove circuit board.
In the present embodiment, step S7 includes:
carrying out depth-controlled uncovering electric milling treatment on the position of the blind groove 10a on the first side of the first sub-board 10 to form a stepped groove 60 a;
removing the residual glue in the bottom of the stepped groove 60a by means of laser ablation;
performing a surface treatment process on the motherboard 40 to obtain a stepped groove circuit board 60; as shown in particular in fig. 7.
According to the manufacturing method of the stepped-groove circuit board solder mask plug hole, the first sub-board with the blind groove, the second sub-board and the PP composite layer are pressed, so that the blind groove, the groove bottom circuit graph and the hollow graph are aligned conveniently, the blind groove is subjected to depth-control uncovering electric milling treatment on the first side of the first sub-board, the groove bottom circuit graph at the bottom of the blind groove is exposed, and the processing of the stepped groove of the circuit board is completed. The side wall of the stepped groove manufactured by the invention is in a non-metallization design; a gasket is not needed, the depth of the stepped groove can be accurately controlled, and the problem of residual glue at the bottom of the groove can be avoided; the manufacturing of the tank bottom resistance welding plug hole and the tank bottom circuit pattern resistance welding layer can be realized, the corrosion of subsequent copper deposition and electroplating liquid medicine to the tank bottom selective gold deposition PAD is avoided, and the reliability of the product is improved.
The foregoing description of the embodiments has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same elements or features may also vary in many respects. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.
Example embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous details are set forth, such as examples of specific parts, devices, and methods, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In certain example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises" and "comprising" are intended to be inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed and illustrated, unless explicitly indicated as an order of performance. It should also be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being "on" … … "," engaged with "… …", "connected to" or "coupled to" another element or layer, it can be directly on, engaged with, connected to or coupled to the other element or layer, or intervening elements or layers may also be present. In contrast, when an element or layer is referred to as being "directly on … …," "directly engaged with … …," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship of elements should be interpreted in a similar manner (e.g., "between … …" and "directly between … …", "adjacent" and "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region or section from another element, component, region or section. Unless clearly indicated by the context, use of terms such as the terms "first," "second," and other numerical values herein does not imply a sequence or order. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Spatially relative terms, such as "inner," "outer," "below," "… …," "lower," "above," "upper," and the like, may be used herein for ease of description to describe a relationship between one element or feature and one or more other elements or features as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below … …" can encompass both an orientation of facing upward and downward. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted.
Claims (6)
1. A manufacturing method of a stepped slot circuit board solder mask plug hole is characterized by comprising the following steps:
s1, manufacturing a first sub-board, wherein the first sub-board comprises at least one inner layer copper foil layer and an outer layer copper foil layer arranged on the first side of the first sub-board, and a blind groove is formed on the second side of the first sub-board;
s2, manufacturing a second sub-board, wherein the second sub-board is a double-sided or multi-layer board, a metalized through hole is manufactured at the bottom position of the groove corresponding to the blind groove on the first side of the second sub-board, and a groove bottom circuit pattern is formed on the first side of the second sub-board;
s3, performing solder mask hole plugging on the metalized through hole, and manufacturing a solder mask layer at the bottom of the groove and a selective gold deposition PAD;
s4, manufacturing a PP composite layer, wherein a hollow pattern with the size matched with the shape of the blind groove is formed on the PP composite layer;
s5, performing brown oxidation treatment on the first sub-board, the second sub-board and the PP composite layer, and sequentially laminating the second sub-board, the PP composite layer and the first sub-board after brown oxidation treatment to align the positions of the blind groove, the groove bottom circuit pattern and the hollow pattern, and pressing to form a mother board;
s6, drilling through holes on the motherboard, and manufacturing an outer layer circuit pattern and an outer layer solder mask after metallization;
s7, carrying out depth control uncovering electric milling treatment on the position of the blind groove on the first side of the first sub-board to form a stepped groove and obtain a stepped groove circuit board.
2. The method for manufacturing the stepped slot circuit board solder mask plug hole according to claim 1, wherein a circuit pattern is arranged on the inner copper foil layer.
3. The method for manufacturing the stepped slot circuit board solder mask plug hole according to claim 1, wherein the blind slot is formed by a pre-controlled depth electric milling method.
4. The method for manufacturing the stepped slot circuit board solder mask plug hole according to claim 1, wherein the slot bottom circuit pattern of the first side of the second sub-board is formed by etching an outer copper foil layer of the first side of the second sub-board.
5. The method for manufacturing the stepped slot circuit board solder mask plug hole according to claim 1, wherein the step S7 includes:
carrying out depth-controlled uncovering electric milling treatment on the position of the blind groove on the first side of the first sub-board to form a stepped groove;
removing the residual glue in the bottom of the stepped groove in a laser ablation manner;
and carrying out a surface treatment process on the motherboard to obtain the stepped groove circuit board.
6. The method for manufacturing the stepped slot circuit board solder mask plug hole according to claim 1, wherein the step S4 includes:
stacking and positioning a plurality of PP spaced epoxy resin light plates;
according to the harmomegathus data of the first sub-plate, carrying out electric milling data on the PP composite layer pre-discharge through groove, and controlling the temperature in the electric milling process to be lower than the resin curing temperature of PP;
and forming a hollow pattern with the size matched with the shape of the blind groove according to the glue overflowing amount of the PP.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110668764.8A CN113411972A (en) | 2021-06-16 | 2021-06-16 | Manufacturing method of stepped slot circuit board solder mask plug hole |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110668764.8A CN113411972A (en) | 2021-06-16 | 2021-06-16 | Manufacturing method of stepped slot circuit board solder mask plug hole |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113873745A (en) * | 2021-09-18 | 2021-12-31 | 华为技术有限公司 | Printed Circuit Board (PCB) and preparation method thereof |
| CN114025486A (en) * | 2021-10-21 | 2022-02-08 | 深圳明阳电路科技股份有限公司 | Printed circuit board blind slot, printed circuit board, electronic equipment and manufacturing method thereof |
| CN114340168A (en) * | 2021-12-29 | 2022-04-12 | 珠海杰赛科技有限公司 | Processing method of metallized blind slot and printed circuit board |
| CN114340224A (en) * | 2021-12-14 | 2022-04-12 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN114980575A (en) * | 2022-05-26 | 2022-08-30 | 珠海杰赛科技有限公司 | Processing method of half-side metalized half-side non-metalized blind groove and printed circuit board |
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| US20090084598A1 (en) * | 2007-10-01 | 2009-04-02 | Intel Corporation | Coreless substrate and method of manufacture thereof |
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| CN114025486B (en) * | 2021-10-21 | 2024-02-23 | 深圳明阳电路科技股份有限公司 | Blind groove of printed circuit board, electronic equipment and manufacturing method of blind groove |
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| CN114340168B (en) * | 2021-12-29 | 2023-01-17 | 珠海杰赛科技有限公司 | Processing method of metallized blind slot and printed circuit board |
| CN114980575A (en) * | 2022-05-26 | 2022-08-30 | 珠海杰赛科技有限公司 | Processing method of half-side metalized half-side non-metalized blind groove and printed circuit board |
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Application publication date: 20210917 |