CN213907030U

CN213907030U - Anti-interference bending-resistant multilayer FPC board

Info

Publication number: CN213907030U
Application number: CN202120005154.5U
Authority: CN
Inventors: 林国平; 吴巨德
Original assignee: Pingxiang Fengdaxing Circuit Board Manufacturing Co ltd
Current assignee: Pingxiang Fengdaxing Circuit Board Manufacturing Co ltd
Priority date: 2021-01-04
Filing date: 2021-01-04
Publication date: 2021-08-06
Anticipated expiration: 2031-01-04

Abstract

The utility model relates to a FPC board technical field, and disclose an anti-interference resistant multilayer FPC board of buckling, solved the present FPC board anti-interference and resistant relatively poor performance of buckling to and the relatively poor problem of radiating effect, it includes the base plate layer, base plate layer upper end is connected with first anti-interference layer, and first anti-interference layer upper end is connected with first copper foil layer, the utility model discloses, it is compound to have multilayer structure, has effectively improved its resistant performance of buckling, and first anti-interference layer and second anti-interference layer are made of metal material, can reduce mutual signal interference; this novel heat is through the setting on first heat dissipation layer and second heat dissipation layer, and the heat that FPC board work produced is absorbed by the heat-conducting plate and is transmitted to the heating panel, and after the heat-conducting plate absorbed the heat, under the effect of upper groove, low groove and first louvre to and accelerate the heat to give off under the effect of the second louvre on the heating panel, make FPC board radiating effect good, the effectual high temperature that has reduced leads to ageing increase of service life.

Description

Anti-interference bending-resistant multilayer FPC board

Technical Field

The utility model belongs to the technical field of the FPC board, specifically be an anti-interference resistant multilayer FPC board of buckling.

Background

A Flexible Printed Circuit (FPC) is a highly reliable and excellent Flexible Printed Circuit board made of polyimide or polyester film as a base material.

The existing FPC board has poor bending resistance and is easy to damage, in addition, when the FPC board works, heat generated between circuits is easy to gather in the FPC board, the heat dissipation effect is poor, the aging phenomenon is easy to occur, and the service life of the FPC board is shortened.

Disclosure of Invention

To the above situation, for overcoming prior art's defect, the utility model provides an anti-interference resistant multilayer FPC board of buckling, the effectual anti-interference and resistant performance of buckling of having solved present FPC board is relatively poor to and the relatively poor problem of radiating effect.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an anti-interference multilayer FPC board of nai buckling, includes the base plate layer, base plate layer upper end is connected with first anti-interference layer, and first anti-interference layer upper end is connected with first copper foil layer, and first copper foil layer upper end is connected with first protection rete, and first protection rete upper end is connected with first heat dissipation layer, and the base plate layer lower extreme is connected with the anti-interference layer of second, and the anti-interference layer lower extreme of second is connected with the second copper foil layer, and second copper foil layer lower extreme is connected with the protection rete of second, and second protection rete lower extreme is connected with the second heat dissipation layer.

Preferably, the substrate layer, the first anti-interference layer, the first copper foil layer, the first protective film layer, the first heat dissipation layer, the second anti-interference layer, the second copper foil layer, the second protective film layer and the second heat dissipation layer are bonded through an adhesive, and the adhesive is epoxy resin.

Preferably, first heat dissipation layer and second heat dissipation layer all include the heat-conducting plate, and the heat-conducting plate upper end is connected with the heating panel, and first louvre has evenly been seted up to the heat-conducting plate inside, and the upper groove has evenly been seted up to the heat-conducting plate up end, and the lower recess has evenly been seted up to the terminal surface under the heat-conducting plate, and the second louvre has evenly been seted up to the heating panel upper end.

Preferably, the upper end and the lower end of the second heat dissipation hole are both in horn-shaped structures.

Preferably, the cross sections of the upper groove and the lower groove are both arranged in an arc structure.

Preferably, the first anti-interference layer and the second anti-interference layer are made of metal materials.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses, through the first anti-interference layer, first copper foil layer, first protection rete, first heat dissipation layer, second anti-interference layer, second copper foil layer, second protection rete, the second heat dissipation layer that set up from top to bottom on the base plate layer, make this structure have multilayer structure complex, the effectual bending resistance performance that has improved, first anti-interference layer and second anti-interference layer are made of metal material, can reduce mutual signal interference;

(2) this novel heat is through the setting on first heat dissipation layer and second heat dissipation layer, and the heat that FPC board work produced is absorbed by the heat-conducting plate and is transmitted to the heating panel, and after the heat-conducting plate absorbed the heat, under the effect of upper groove, low groove and first louvre to and accelerate the heat to give off under the effect of the second louvre on the heating panel, make FPC board radiating effect good, the effectual high temperature that has reduced leads to ageing increase of service life.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

In the drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of a second heat dissipation layer of the present invention;

in the figure: 1. a substrate layer; 2. a first interference rejection layer; 3. a first copper foil layer; 4. a first protective film layer; 5. a first heat dissipation layer; 6. a second anti-interference layer; 7. a second copper foil layer; 8. a second protective film layer; 9. a second heat dissipation layer; 901. a heat conducting plate; 902. a heat dissipation plate; 903. a first heat dissipation hole; 904. an upper groove; 905. a lower groove; 906. a second heat dissipation hole; 10. and (3) an adhesive.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Embodiment one, given by fig. 1 and fig. 2, the utility model discloses a

base plate layer

1, 1 upper end on the base plate layer is connected with first anti-interference layer 2, 2 upper ends on first anti-interference layer are connected with first copper foil layer 3, 3 upper ends on first copper foil layer are connected with

first protection rete

4, 4 upper ends on first protection rete are connected with first heat dissipation layer 5, 1 lower extreme on base plate layer is connected with second

anti-interference layer

6, 6 lower extremes on second anti-interference layer are connected with second copper foil layer 7, 7 lower extremes on second copper foil layer are connected with second protection rete 8, 8 lower extremes on second protection rete are connected with second heat dissipation layer 9.

In the second embodiment, on the basis of the first embodiment, the substrate layer 1, the first interference-resistant layer 2, the first copper foil layer 3, the first protective film layer 4, the first heat dissipation layer 5, the second interference-resistant layer 6, the second copper foil layer 7, the second protective film layer 8, and the second heat dissipation layer 9 are all bonded by an adhesive 10, and the adhesive 10 is epoxy resin.

Third, on the basis of first embodiment, first heat dissipation layer 5 and second heat dissipation layer 9 all include heat-conducting plate 901, and heat-conducting plate 901 upper end is connected with heating panel 902, and first louvre 903 has evenly been seted up to heat-conducting plate 901 inside, and upper groove 904 has evenly been seted up to heat-conducting plate 901 upper end, and lower recess 905 has evenly been seted up to heat-conducting plate 901 lower terminal surface, and second louvre 906 has evenly been seted up to heating panel 902 upper end.

In the fourth embodiment, on the basis of the third embodiment, the upper and lower ends of the second heat dissipation holes 906 are both in a trumpet-shaped structure, so that heat can be dissipated conveniently.

In the fifth embodiment, on the basis of the third embodiment, the cross sections of the upper groove 904 and the lower groove 905 are both arranged in an arc structure.

Sixth embodiment, on the basis of first embodiment, first anti-interference layer 2 and second anti-interference layer 6 are made of metal material, can reduce mutual signal interference, and have heat conductivility.

The working principle is as follows: when using, first anti-interference layer 2 and second anti-interference layer 6 are owing to be that the metal material is made, can reduce the mutual signal interference of FPC board, and the metal material has heat conductivility, make FPC board heat conductivity good, in addition, first heat dissipation layer 5 and the second heat dissipation layer 9 that both sides set up about can dispel the heat at the during operation, the heat is absorbed by heat-conducting plate 901 and is transmitted to heating panel 902, after heat-conducting plate 901 absorbs the heat, at last recess 904, under the effect of lower recess 905 and first louvre 903, and accelerate the heat to distribute under the effect of second louvre 906 on heating panel 902, make FPC board radiating effect good.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an anti-interference resistant multilayer FPC board of buckling, includes base plate layer (1), its characterized in that: the solar photovoltaic panel is characterized in that a first anti-interference layer (2) is connected to the upper end of the substrate layer (1), a first copper foil layer (3) is connected to the upper end of the first anti-interference layer (2), a first protective film layer (4) is connected to the upper end of the first copper foil layer (3), a first heat dissipation layer (5) is connected to the upper end of the first protective film layer (4), a second anti-interference layer (6) is connected to the lower end of the substrate layer (1), a second copper foil layer (7) is connected to the lower end of the second anti-interference layer (6), a second protective film layer (8) is connected to the lower end of the second copper foil layer (7), and a second heat dissipation layer (9) is connected to the lower end of the second protective film layer (8).

2. A multilayer FPC board resistant to interference and bending according to claim 1, characterized in that: the substrate layer (1), the first anti-interference layer (2), the first copper foil layer (3), the first protective film layer (4), the first heat dissipation layer (5), the second anti-interference layer (6), the second copper foil layer (7), the second protective film layer (8) and the second heat dissipation layer (9) are all bonded through an adhesive (10), and the adhesive (10) is epoxy resin.

3. A multilayer FPC board resistant to interference and bending according to claim 1, characterized in that: first heat dissipation layer (5) and second heat dissipation layer (9) all include heat-conducting plate (901), and heat-conducting plate (901) upper end is connected with heating panel (902), and first louvre (903) have evenly been seted up to heat-conducting plate (901) inside, and upper groove (904) have evenly been seted up to heat-conducting plate (901) up end, and lower recess (905) have evenly been seted up to terminal surface under heat-conducting plate (901), and second louvre (906) have evenly been seted up to heating panel (902) upper end.

4. A tamper-resistant, bend-resistant, multi-layer FPC board as claimed in claim 3, wherein: the upper end and the lower end of the second heat dissipation hole (906) are both in horn-shaped structures.

5. A tamper-resistant, bend-resistant, multi-layer FPC board as claimed in claim 3, wherein: the sections of the upper groove (904) and the lower groove (905) are both arranged in an arc structure.

6. A multilayer FPC board resistant to interference and bending according to claim 1, characterized in that: the first anti-interference layer (2) and the second anti-interference layer (6) are made of metal materials.