CN206350292U - The graphene heat dissipation film of low cost - Google Patents
The graphene heat dissipation film of low cost Download PDFInfo
- Publication number
- CN206350292U CN206350292U CN201720045859.3U CN201720045859U CN206350292U CN 206350292 U CN206350292 U CN 206350292U CN 201720045859 U CN201720045859 U CN 201720045859U CN 206350292 U CN206350292 U CN 206350292U
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- Prior art keywords
- layer
- graphene
- heat dissipation
- dissipation film
- adhesive layer
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Abstract
The utility model provides a kind of inexpensive graphene heat dissipation film, and it includes graphene layer, insulating barrier, copper foil layer, the first adhesive layer and the second adhesive layer.Graphene layer has a top surface and the bottom surface relative with the top surface；Insulating barrier is arranged on the top surface of the graphene layer；The top surface of copper foil layer is Nian Jie with the bottom surface of graphene layer by the first adhesive layer；Second adhesive layer is adhered to the bottom surface of copper foil layer；Wherein, the thickness of graphene layer is between 0.005-0.05mm.The utility model reduces production cost and improves tensile strength by the setting of graphene layer.
Description
Technical field
The utility model is related to heat sink material technical field, more particularly to a kind of inexpensive graphene heat dissipation film.
Background technology
With the development of modern technologies, miniaturization, the continuous improvement of chip dominant frequency of electronic device, function increasingly strengthens,
The power consumption of one single chip gradually increases, and causes heat flow density drastically to increase.And once the operating ambient temperature of electronic device is too high,
The job insecurity of electronic device can then be caused, even failed.
In the market, the heat dissipation film being mostly made of natural graphite material and artificial synthesized graphite material is to electricity
Sub- product is radiated, but the cost of manufacture of heat dissipation film that artificial synthesized graphite material is made is higher, and the stretching of graphite
Low intensity, when graphite radiating film is applied to electronic product, deals with improperly, is easily broken off or damages.
Therefore, it is desirable to provide a kind of heat dissipation film, to solve above-mentioned technical problem.
Utility model content
The utility model embodiment provides a kind of low cost and the high graphene heat dissipation film of tensile strength；It is existing to solve
The production cost height and the low technical problem of tensile strength of graphite radiating film.
The utility model embodiment provides a kind of inexpensive graphene heat dissipation film, and it includes：
Graphene layer, the graphene layer has a top surface and the bottom surface relative with the top surface；
Insulating barrier, the insulating barrier is arranged on the top surface of the graphene layer；
Copper foil layer, the top surface of the copper foil layer is Nian Jie with the bottom surface of the graphene layer by the first adhesive layer；
Second adhesive layer, second adhesive layer is adhered to the bottom surface of the copper foil layer；
Wherein, the graphene layer includes multiple lamellas, and the graphene layer thickness between 0.005-0.05mm
Between.
In the utility model, the granularity d50 of the lamella of the graphene layer is between 1-30um.
In the utility model, the specific surface area of the graphene layer is more than 50m2/g。
In the utility model, the insulating barrier is PET insulating barriers, and the thickness of the insulating barrier is between 0.005-
Between 0.05mm.
In the utility model, the thickness of the copper foil layer between 0.005-0.1mm, first adhesive layer
The thickness of thickness and second adhesive layer is between 0.002-0.05mm.
In the utility model, first adhesive layer and second adhesive layer are acrylate resin layer.
In the utility model, first adhesive layer and second adhesive layer are double faced adhesive tape.
Compared to the graphite radiating film of prior art, inexpensive graphene heat dissipation film of the present utility model passes through graphene
The setting of layer, reduces production cost and improves tensile strength, is carried out so as to reduce the utility model with electronic product
Spoilage during assembling；Solve existing graphite radiating film production cost height and the low technical problem of tensile strength.
Brief description of the drawings
In order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art, below in embodiment
The required accompanying drawing used is briefly described.Drawings in the following description are only section Example of the present utility model, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the structural representation of the preferred embodiment of inexpensive graphene heat dissipation film of the present utility model.
Embodiment
The schema in accompanying drawing is refer to, wherein identical element numbers represent identical component.The following description is to be based on
Illustrated the utility model specific embodiment, it is not construed as limiting the utility model other specific realities not detailed herein
Apply example.
Fig. 1 is refer to, Fig. 1 is the structural representation of the preferred embodiment of inexpensive graphene heat dissipation film of the present utility model
Figure.The graphene heat dissipation film of low cost includes graphene layer 11, insulating barrier 12, copper foil layer 13, the first adhesive layer 14 and the second glue
Adhesion coating 15.
Specifically, graphene layer 11 has a top surface and the bottom surface relative with the top surface；Insulating barrier 12 is arranged on graphite
On the top surface of alkene layer 11；The top surface of copper foil layer 13 is Nian Jie with the bottom surface of graphene layer 11 by the first adhesive layer 14；Second is gluing
Layer 15 is adhered to the bottom surface of copper foil layer 13.Graphene layer 11 includes multiple lamellas.
In the preferred embodiment, the number of plies of the lamella of graphene layer 11 is multilayer, i.e., more than three layers, graphene layer 11
Purity is 99.9%, is made up of the graphene of high-purity, and graphene sheet layer granularity d50 between but be not limited to 1-30um,
The specific surface area of graphene layer 11 is more than 50m2/g.Wherein, graphene has two-dimension plane structure, and it has higher than steel by about 200
Intensity and 2 times higher than diamond of thermal conductivity again, therefore the graphene layer 11 of this preferred embodiment has excellent thermal diffusivity
And intensity.In addition, graphene is expensive not as graphite, therefore the graphene heat dissipation film in this preferred embodiment is than traditional graphite
Heat dissipation film is more economical.
Consider the thermal diffusivity of graphene layer 11, durability and economy etc., the thickness of graphene layer 11 is between 0.005-
Between 0.05mm.
In the preferred embodiment, when this preferred embodiment is applied to the radiating of mobile phone, generally will originally it be preferable to carry out
The second adhesive layer 15 in the graphene heat dissipation film of example is bonded on the device of mobile phone heat production, such as chip, and insulating barrier 12 is then
It is adhered to the bottom surface of display panel；At this moment the effect of insulating barrier 12 be used not only for completely cutting off the current interference of the electronic device such as chip in
Display panel, and insulating barrier 12 is also with the effect of display panel light leak is prevented, when preventing light leak, insulating barrier 12
It is made up of the PET material of black.
If further, since when graphene layer 11 is externally exposed environment, graphene layer 11 can be by physical factor or chemistry
Factor is damaged, and is once damaged, then can reduce the thermal conductivity of this preferred embodiment, cause the decline of heat dispersion, therefore absolutely
Another effect that edge layer 12 is arranged on the top surface of graphene layer 11 is to be used to protect graphene layer 11.
Therefore, protectiveness, insulating properties, light-proofness and the heat absorptivity of insulating barrier 12 are considered, the thickness of insulating barrier 12 is situated between
Between 0.005-0.05mm, insulating barrier 12 is black PET insulating barriers.
In this preferred embodiment, based on above-mentioned structure, because copper foil has highly thermally conductive property and electromagnetic wave shielding, that is, improve
The heat dispersion of this preferred embodiment reduces injury of the electromagnetism to human body again, in addition, copper foil also has very strong ductility,
Hence in so that copper foil layer 13 has strong draftability.Simultaneously in view of basic unit of the copper foil layer as this preferred embodiment, because having
Certain support strength, thus copper foil layer 13 thickness between 0.005-0.1mm.
Further, the thickness of the first adhesive layer 14 is between 0.002-0.05mm, and the thickness of the second adhesive layer 15 is situated between
Between 0.002-0.05mm, the first adhesive layer 14 and the second adhesive layer 15 are double faced adhesive tape.
Wherein, the first adhesive layer 14 and the second adhesive layer 15 can be that identical can also be differed, i.e. the first glue
The adhesive layer 15 of adhesion coating 14 and second can be epoxy resin, phenolic resin, Lauxite, melamine-formaldehyde resin, acrylic acid
Resin, organic siliconresin, furane resins, unsaturated polyester (UP), polyimides, polybenzimidazoles, phenolic aldehyde-Pioloform, polyvinyl acetal, phenol
Any one in aldehyde-polyamide, phenolic aldehyde-epoxy resin or epoxy-polyamide.
In this preferred embodiment, the prompt operation of technique, and consider the feature of environmental protection of product for convenience, first is gluing
The adhesive layer 15 of layer 14 and second is acrylate resin layer.
Inexpensive graphene heat dissipation film of the present utility model by the setting of graphene layer, reduce production cost and
Tensile strength is improved, so as to reduce spoilage when the utility model is assembled with electronic product；Solve existing
Graphite radiating film production cost height and the low technical problem of tensile strength.
In summary, although the utility model is disclosed above with preferred embodiment, but above preferred embodiment is not used
To limit the utility model, one of ordinary skill in the art is not departing from spirit and scope of the present utility model, can made
Various changes are defined with retouching, therefore protection domain of the present utility model by the scope that claim is defined.
Claims (7)
1. a kind of inexpensive graphene heat dissipation film, it is characterised in that including：
Graphene layer, the graphene layer has a top surface and the bottom surface relative with the top surface；
Insulating barrier, the insulating barrier is arranged on the top surface of the graphene layer；
Copper foil layer, the top surface of the copper foil layer is Nian Jie with the bottom surface of the graphene layer by the first adhesive layer；
Second adhesive layer, second adhesive layer is adhered to the bottom surface of the copper foil layer；
Wherein, the graphene layer includes multiple lamellas, and the graphene layer thickness between 0.005-0.05mm it
Between.
2. inexpensive graphene heat dissipation film according to claim 1, it is characterised in that the granularity of the lamella of the graphene
D50 is between 1-30um.
3. inexpensive graphene heat dissipation film according to claim 1, it is characterised in that the specific surface area of the graphene layer
More than 50m2/g。
4. inexpensive graphene heat dissipation film according to claim 1, it is characterised in that the insulating barrier is PET insulating barriers,
The thickness of the insulating barrier is between 0.005-0.05mm.
5. inexpensive graphene heat dissipation film according to claim 1, it is characterised in that the thickness of the copper foil layer between
Between 0.005-0.1mm, the thickness of the thickness of first adhesive layer and second adhesive layer is between 0.002-0.05mm
Between.
6. inexpensive graphene heat dissipation film according to claim 1, it is characterised in that first adhesive layer and described the
Two adhesive layers are acrylate resin layer.
7. inexpensive graphene heat dissipation film according to claim 1, it is characterised in that first adhesive layer and described the
Two adhesive layers are double faced adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720045859.3U CN206350292U (en) | 2017-01-13 | 2017-01-13 | The graphene heat dissipation film of low cost |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720045859.3U CN206350292U (en) | 2017-01-13 | 2017-01-13 | The graphene heat dissipation film of low cost |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206350292U true CN206350292U (en) | 2017-07-21 |
Family
ID=59324424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720045859.3U Expired - Fee Related CN206350292U (en) | 2017-01-13 | 2017-01-13 | The graphene heat dissipation film of low cost |
Country Status (1)
| Country | Link |
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| CN (1) | CN206350292U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109334155A (en) * | 2018-10-25 | 2019-02-15 | 张家港展博电子科技有限公司 | Graphene-copper composite radiating film and its preparation method and application |
-
2017
- 2017-01-13 CN CN201720045859.3U patent/CN206350292U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109334155A (en) * | 2018-10-25 | 2019-02-15 | 张家港展博电子科技有限公司 | Graphene-copper composite radiating film and its preparation method and application |
| CN109334155B (en) * | 2018-10-25 | 2021-10-15 | 张家港展博电子科技有限公司 | Graphene-copper composite heat dissipation film and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 Guangdong province Shenzhen City Pingshan Kengzi Jinsha Street Community Joint Industrial Zone No. 5 Patentee after: SHENZHEN LAIBIDE TECHNOLOGY Co.,Ltd. Address before: 518000 Shenzhen, Shenzhen, Guangdong, Shenzhen city Baoan District Songgang Street Red Star Community Datian Industrial Zone Songgang East Road, No. 2 third floor C3 Patentee before: SHENZHEN LAIBIDE ELECTRONIC MATERIALS CO.,LTD. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170721 Termination date: 20220113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |