CN109334155A - Graphene-copper composite radiating film and its preparation method and application - Google Patents
Graphene-copper composite radiating film and its preparation method and application Download PDFInfo
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- CN109334155A CN109334155A CN201811246638.8A CN201811246638A CN109334155A CN 109334155 A CN109334155 A CN 109334155A CN 201811246638 A CN201811246638 A CN 201811246638A CN 109334155 A CN109334155 A CN 109334155A
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 38
- 239000010949 copper Substances 0.000 title claims abstract description 38
- 239000002131 composite material Substances 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 63
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 11
- 229910021382 natural graphite Inorganic materials 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000004945 emulsification Methods 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 238000002604 ultrasonography Methods 0.000 claims abstract description 6
- 238000007781 pre-processing Methods 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 7
- 229910002804 graphite Inorganic materials 0.000 abstract description 3
- 239000010439 graphite Substances 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 52
- 239000000463 material Substances 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000003796 beauty Effects 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000005056 compaction Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- DWDGSKGGUZPXMQ-UHFFFAOYSA-N OPPO Chemical compound OPPO DWDGSKGGUZPXMQ-UHFFFAOYSA-N 0.000 description 1
- 241000935974 Paralichthys dentatus Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 239000002969 artificial stone Substances 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000013102 re-test Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/184—Preparation
- C01B32/19—Preparation by exfoliation
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/194—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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Abstract
The present invention relates to graphene-copper composite radiating films and its preparation method and application, and the preparation method includes the following steps: first to pre-process natural graphite, then successively obtain graphene through high speed shear, ultrasound removing and emulsification；By graphene mixing, film forming and drying are then prepared, obtains graphene film, the graphene film is heated under preset temperature then and prepares micro- air bag, then uses micro- air bag described in mechanical roll-in to prepare micro- fold under preset pressure；Graphene film and copper foil are compacted, then the thermally conductive black film is pasted onto the other side of the copper foil, obtain graphene-copper composite radiating film.Graphene of the invention-copper composite radiating film preparation method; it is distributed by the way that dotted heat source is balanced to face, then by longitudinal, accelerates distributing for heat; to reach the protective effect of product component, heat dissipation effect is better than the graphite flake and electrographite piece of traditional handicraft.
Description
Technical field
The invention belongs to materials to process preparation field, and in particular to a kind of graphene-copper composite radiating film and its preparation side
Method and application.
Background technique
Graphene (Graphene) is a kind of plane for forming hexangle type in honeycomb lattice with sp2 hybridized orbit by carbon atom
Film, the two-dimensional material of only one carbon atom thickness.It is but also most hard nano material that graphene, which is currently most thin in the world,
It is almost transparent, only absorb 2.3% light；Thermal coefficient is up to 5300W/mK, is higher than carbon nanotube and diamond, often
Its lower electron mobility of temperature is more than 15000cm2/ Vs, but it is higher than carbon nanotubes or silicon crystal, and about 10 Ω m of resistivity
~8 Ω m, it is lower than copper or silver, it is the smallest material of world resistivity.Electronic apparatus can generate heat when working, and need High Efficiency Thermal
Management is to guarantee its normal operation.Device of new generation also requires bendable folding endurance.Therefore, research high thermal conductivity high flexibility material to close weight
It wants.But the high thermal conductivity and high flexibility of existing macroscopic material are that a pair of of fish and bear's paw are difficult to the contradiction to get both.Graphene is
It solves this contradiction and provides theoretic possibility.It is a kind of honeycomb plane formed by carbon atom with sp2 hybrid form
Single layer two dimension macromolecular.Atomic mass is light, simple and strength bonded structure imparts the thermal conductivity of its superelevation；Meanwhile it is single
It is preferable flexible that atomic layer level thickness has it.Regrettably, existing exfoliated graphene film is small at present, defect is more,
Its macroscopic material thermal conductivity assembled and flexibility be not all good enough.
Summary of the invention
An object of the present invention is to provide a kind of graphene-copper composite radiating film preparation methods.
Graphene of the invention-copper composite radiating film preparation method, includes the following steps: S101: first by natural stone
Ink is pre-processed, and then successively obtains graphene through high speed shear, ultrasound removing and emulsification；S102: by the step
The graphene mixing that S101 is obtained, then prepares film forming and drying, obtains graphene film, then by the graphene film default
At a temperature of heating prepare micro- air bag, then use under preset pressure micro- air bag described in machinery roll-in to prepare micro- fold；S103: will
The processed graphene film of step S102 and copper foil are compacted, then the thermally conductive black film is pasted onto the other side of the copper foil,
Obtain graphene-copper composite radiating film.
Graphene of the invention-copper composite radiating film preparation method by the way that dotted heat source is balanced to face, then passes through
Longitudinal direction distributes, and distributing for heat is accelerated, to reach the protective effect of product component.Heat dissipation effect is better than traditional handicraft
Graphite flake and electrographite piece.Graphene nano heat dissipating layer high compaction is anti-scratch and ethanol-tolerant and other solvents, cross cutting it is simple and
Rate of good quality rate does not need bound edge and adds cover film, and heat dissipation performance is more prominent.With good flexibility, it can be processed, can returns
It repairs；EMI shielding and absorption, to protect sensitive electronic component；Solvent resistant, has an antistatic effect, and resistance is 103 Europe/flat
Square inch；It is die-cuttable at arbitrary shape, it is not out of dust to be not necessarily to bound edge；It, can be fast by heat loss through conduction, heat loss through convection and heat loss through radiation
Heat point source is switched to plane heat source by speed；The temperature of electronic product can be reduced, electronic component is protected and extends the longevity of electronic product
Life；The low acid heat of self research and development radiates soaking glue, will not corrode to electronic component；Material has excellent electric conductivity；
Neat in edge after cross cutting, without dust；Compared to natural stone ink film or electrographite film, there are dust, opponents after cross cutting
Machine, there may be the danger of line short for the interiors of products such as tablet computer electronic component；Substrate, which is done, with copper is convenient for cross cutting, it will not
Rupture, high yield rate；Natural graphite and electrographite are easy to damage in die cutting process and in paste process without base copper；Have
It reprocesses, can reuse conducive to machine.
In addition, graphene-copper composite radiating film preparation method that the present invention is above-mentioned, can also have following additional skill
Art feature:
Further, the graphene-copper composite radiating film is with a thickness of 25 μm~150 μm.
Further, in the step S102, the preset temperature is 2900 DEG C~3100 DEG C.
Further, in the step S102, the preset pressure is 290MPa~310MPa.
It is another object of the present invention to the graphene-copper composite radiating films for proposing the method preparation.
Another object of the present invention is to propose the graphene-copper composite radiating film in intelligent terminal, LED, logical
Interrogate the application of industry and new energy field.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Specific embodiment
The embodiment of the present invention is described below in detail, the embodiment is exemplary, it is intended to it is used to explain the present invention, and
It is not considered as limiting the invention.
Embodiment 1
Embodiment 1 proposes a kind of graphene-copper composite radiating film, and preparation method includes the following steps:
S101: first pre-processing natural graphite, then successively through high speed shear, ultrasound removing and emulsification,
Obtain graphene.
S102: then the graphene mixing that the step S101 is obtained prepares film forming and drying, obtains graphene film,
Then the graphene film is heated at a temperature of 2900 DEG C and prepares micro- air bag, then using mechanical roll-in under 310MPa pressure
Micro- air bag is to prepare micro- fold.
S103: the processed graphene film of step S102 and copper foil are compacted, the thermally conductive black film is then pasted onto institute
The other side for stating copper foil obtains the graphene with a thickness of 25 μm-copper composite radiating film.
Embodiment 2
Embodiment 2 proposes a kind of graphene-copper composite radiating film, and preparation method includes the following steps:
S101: first pre-processing natural graphite, then successively through high speed shear, ultrasound removing and emulsification,
Obtain graphene.
S102: then the graphene mixing that the step S101 is obtained prepares film forming and drying, obtains graphene film,
Then the graphene film is heated at a temperature of 3100 DEG C and prepares micro- air bag, then using mechanical roll-in under 290MPa pressure
Micro- air bag is to prepare micro- fold.
S103: the processed graphene film of step S102 and copper foil are compacted, the thermally conductive black film is then pasted onto institute
The other side for stating copper foil obtains the graphene with a thickness of 150 μm-copper composite radiating film.
Embodiment 3
Embodiment 3 proposes a kind of graphene-copper composite radiating film, and preparation method includes the following steps:
S101: first pre-processing natural graphite, then successively through high speed shear, ultrasound removing and emulsification,
Obtain graphene.
S102: then the graphene mixing that the step S101 is obtained prepares film forming and drying, obtains graphene film,
Then the graphene film is heated at a temperature of 3000 DEG C and prepares micro- air bag, then using mechanical roll-in under 300MPa pressure
Micro- air bag is to prepare micro- fold.
S103: the processed graphene film of step S102 and copper foil are compacted, the thermally conductive black film is then pasted onto institute
The other side for stating copper foil obtains the graphene with a thickness of 80 μm-copper composite radiating film.
Table 1: thermally conductive black film parameter
It is surveyed in the new material laboratory of Yangpu district of Shanghai undertaking base by the FLUKE TiS65 test equipment of profession
Try OPPO model machine: 1, gum and double-sided adhesive are sticked in heat dissipation film both sides respectively, are then affixed on the inside of model machine rear cover, and torrent speedboat 2 is transported
Row one hour, test result chose the temperature difference (T/ DEG C of Δ) maximum data in 1 hour；2, each sample retest 3 times are chosen most
Big temperature difference, the result is that the temperature coefficient with artificial graphite is suitable, and the insulation black film of the method for the present invention preparation replaces in the market
Black film after, properties of product are even more to be substantially better than artificial stone ink film.
Graphene prepared by the present invention-copper heat dissipation film has characteristics that
1, excellent in heat dissipation effect, the effect for the electrographite film that matches in excellence or beauty；
2, existing lateral heat dissipation soaking, and have longitudinal quick conductive；
3, good flexility, it is easy to process to be die cut and install and use；
4, high reliability, high stability, no problem of aging；
5, high performance-price ratio.
By its other heat sink material of graphene-copper heat dissipation film comparison of preparation of the embodiment of the present invention, as a result as shown in table 2.
Table 2: heat sink material comparative analysis
Comparison sheet 2 has apparent as can be seen that graphene-copper heat dissipation film of the invention is compared with other heat dissipation products
Advantage:
1, thermal coefficient can match in excellence or beauty electrographite；
2, cost is only the 60% of electrographite；
3, processability and foldable number are more outstanding than other products.
To sum up, graphene of the invention-copper composite radiating film preparation method, by the way that dotted heat source is balanced to face,
It is distributed again by longitudinal, distributing for heat is accelerated, to reach the protective effect of product component.Heat dissipation effect is better than tradition
The graphite flake and electrographite piece of technique.Graphene nano nanometer heat dissipating layer high compaction is anti-scratch and ethanol-tolerant and other solvents,
It is die cut simple and rate of good quality rate, do not need bound edge and adds cover film, heat dissipation performance is more prominent.It, can with good flexibility
Processing, it is reworkable；EMI shielding and absorption, to protect sensitive electronic component；Solvent resistant, has antistatic effect, and resistance is
103 Europe/square inch；It is die-cuttable at arbitrary shape, it is not out of dust to be not necessarily to bound edge；Pass through heat loss through conduction, heat loss through convection and radiation
Heat dissipation, quickly can switch to plane heat source for heat point source；The temperature of electronic product can be reduced, electronic component is protected and extends electronics
The service life of product；The low acid heat of self research and development radiates soaking glue, will not corrode to electronic component；Material has excellent lead
Electrical property；Neat in edge after cross cutting, without dust；Compared to natural stone ink film or electrographite film, there are powder after cross cutting
Dirt, to mobile phone, there may be the danger of line short for the interiors of products such as tablet computer electronic component；Substrate is done with copper convenient for mould
It cuts, will not rupture, high yield rate；Natural graphite and electrographite are without base copper, in die cutting process and in paste process easily
Damage；Be conducive to machine to reprocess, can reuse.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (6)
1. a kind of graphene-copper composite radiating film preparation method, which comprises the steps of:
S101: first pre-processing natural graphite, then successively obtains through high speed shear, ultrasound removing and emulsification
Graphene；
S102: then the graphene mixing that the step S101 is obtained prepares film forming and drying, obtains graphene film, then
The graphene film is heated under preset temperature and prepares micro- air bag, then using micro- air bag described in mechanical roll-in under preset pressure
To prepare micro- fold；
S103: the processed graphene film of step S102 and copper foil are compacted, the thermally conductive black film is then pasted onto the copper
The other side of foil obtains graphene-copper composite radiating film.
2. graphene according to claim 1-copper composite radiating film preparation method, which is characterized in that the graphene-
Copper composite radiating film with a thickness of 25 μm~150 μm.
3. graphene according to claim 1-copper composite radiating film preparation method, which is characterized in that in the step
In S102, the preset temperature is 2900 DEG C~3100 DEG C.
4. graphene according to claim 1-copper composite radiating film preparation method, which is characterized in that in the step
In S102, the preset pressure is 290MPa~310MPa.
5. graphene-copper composite radiating film of any one of claim 1-4 the method preparation.
6. the described in any item graphenes of claim 1-5-copper composite radiating film is in intelligent terminal, LED, communications industry and new energy
The application of source domain.
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Cited By (1)
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