CN207235352U - High heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material - Google Patents
High heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material Download PDFInfo
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- CN207235352U CN207235352U CN201721065396.3U CN201721065396U CN207235352U CN 207235352 U CN207235352 U CN 207235352U CN 201721065396 U CN201721065396 U CN 201721065396U CN 207235352 U CN207235352 U CN 207235352U
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Abstract
The utility model provides a kind of high heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material, including：Copper mesh composite stone layer of ink, the two sides of the copper mesh composite stone layer of ink are compounded with one layer of graphite linings；The copper mesh composite stone layer of ink is made of copper mesh and the graphite being filled in the copper mesh grid.For above-mentioned composite material compared to conventional thermal conductive or electromagnetic shielding material, while high heat conduction, high shield effectiveness is had concurrently, flexible effect is good, high temperature resistant, while easily prepared and processing, solderable.
Description
Technical field
It the utility model is related to field of compound material, more particularly to a kind of high heat conduction, high electromagnetic shielding copper mesh enhancing graphite
Composite material.
Background technology
With electronic component and the high-power of lithium battery, the development of high-energy-density, trend toward miniaturization, unit area institute
The heat of generation is higher and higher, and effective heat dissipation area is fewer and fewer.Heat dissipation problem become restrict high-power electronic device,
Electric automobile, the bottleneck of large scale integrated circuit development.Simultaneously because electronic product is increasingly come into the life of people, electricity is reduced
The problem of harm of the magnetic radiation to body becomes people's growing interest, so there is an urgent need to high heat conduction, high electromagnetic shielding material,
Need preparation method simple at the same time and lower cost.
The highly heat-conductive material of application on an electronic device is mainly graphite, aluminium sheet etc. at present, and electromagnetic shielding material is mainly
Metal foil, electrically-conducting paint, fabric shielding material etc., can heat conduction but also seldom, and the above-mentioned material as the material of electromagnetic shielding
There are preparation method is complicated, production efficiency is not high, pollution environment, cost is higher the problems such as.
Utility model content
The utility model is in order to solve technical problem of the prior art, there is provided a kind of high heat conduction, high electromagnetic shielding copper
Net enhancing graphite composite material, it includes：Copper mesh composite stone layer of ink, the two sides of the copper mesh composite stone layer of ink are compounded with one layer
Graphite linings；The copper mesh composite stone layer of ink is made of copper mesh and the graphite being filled in the copper mesh grid.
It is further that the thickness of the graphite linings is 0.01mm-1mm.
It is further that the thickness of the copper mesh composite stone layer of ink is 0.02mm-1.2mm.
It is further that the copper mesh is red copper net, it uses plain weave, and mesh number is -500 mesh of 10 mesh, and string diameter is
0.01mm-0.6mm。
Compared with prior art, the beneficial effects of the utility model are：
1. above-mentioned composite material is having high heat conduction, high shield effectiveness concurrently compared to conventional thermal conductive or electromagnetic shielding material
While, flexible effect is good, high temperature resistant, while easily prepared and processing, solderable；
2. above-mentioned composite material is to roll the copper mesh of different meshes in graphite powder, graphite powder is being filled in production
While into copper mesh, also certain thickness graphite linings can be formed on the two sides of copper mesh composite stone layer of ink, improve production efficiency
Meanwhile cost is reduced, and environment is not polluted.
Brief description of the drawings
, below will be to existing skill in order to illustrate more clearly of the technical solution in the utility model prior art and embodiment
Attached drawing is briefly described needed in art and embodiment description.
Fig. 1 is the structural representation of the high heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material disclosed in embodiment one
Figure.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe.
Embodiment one
High heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material, it includes：Thickness is answered for 0.02mm-1.2mm copper mesh
Graphite linings A is closed, the two sides of copper mesh composite stone layer of ink is compounded with graphite linings B and C that a layer thickness is 0.01mm-1mm.
Copper mesh composite stone layer of ink is made of copper mesh and the graphite being filled in copper mesh grid.Copper mesh is red copper net, it is used
Plain weave, mesh number are -500 mesh of 10 mesh, string diameter 0.01mm-0.6mm.
Graphite in graphite linings and copper mesh composite stone layer of ink is natural scale graphite or Delanium, the average grain of graphite powder
Footpath is at 10-50 μm, 2-8 μm of thickness.
Above-mentioned composite material is having high heat conduction, high shield effectiveness concurrently compared to conventional thermal conductive or electromagnetic shielding material
Meanwhile flexible effect is good, high temperature resistant, while easily prepared and processing, it is solderable.
The processing step of above-mentioned composite material is：
1st, graphite powder and organic solvent are mixed；
2nd, copper mesh is rolled in mixture in step 1；
3rd, the material after calendering formation is dried, the composite material obtained after drying includes copper mesh composite stone layer of ink A, and multiple
Close the graphite linings B and C on the two sides of copper mesh composite stone layer of ink.
It can be seen that composite material is to roll the copper mesh of different meshes in graphite in production in step from the process above
In the mixture of powder and organic solvent, while production efficiency is improved, cost is reduced, and dirt is not caused to environment
Dye.
Embodiment two
High heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material, it includes：Copper mesh composite stone layer of ink, copper mesh are compound
The two sides of graphite linings is compounded with one layer of graphite linings.Copper mesh composite stone layer of ink is by copper mesh and the graphite structure being filled in copper mesh grid
Into.Copper mesh is red copper net, it uses plain weave, and mesh number is 20 mesh, string diameter 0.3mm.
It is raw material that graphite, which selects natural flake graphite, and particle size range is 10-50 μm, and 2-8 μm of thickness, adds 2- in graphite
After 10% organic solvent, by the calendering of red copper net to wherein, then dry, the gross thickness of final material is 0.8mm.
Graphite complex copper net materials in present case, can meet electric automobile lithium battery heat sink material demand is big, cost will
Seek low, good heat conductivity needs.Solve in electric automobile that lithium battery battery temperature rise caused by heat dissipation problem is higher, temperature
Poor larger the problem of service life of lithium battery is shorter caused by.
Embodiment three
High heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material, it includes：Copper mesh composite stone layer of ink, copper mesh are compound
The two sides of graphite linings is compounded with one layer of graphite linings.Copper mesh composite stone layer of ink is by copper mesh and the graphite structure being filled in copper mesh grid
Into.Copper mesh is red copper net, it uses plain weave, and mesh number is 500 mesh, string diameter 0.025mm.
It is raw material that graphite, which selects electrographite, and after adding 2-10% organic solvents in graphite, the calendering of red copper net is arrived it
In, then dry, the gross thickness of final material is 0.075mm.
Graphite complex copper net materials in present case, can be applied to be used as shielding material and Heat Conduction Material in mobile phone, computer, solution
Determine the problem of both needing to be electromagnetically shielded heat sink material in need in the electronic equipments such as mobile phone and computer.
A variety of modifications to these embodiments will be apparent for those skilled in the art, herein
The General Principle for moving justice can be real in other embodiments without departing from the spirit or scope of the present utility model
It is existing.Therefore, the utility model is not intended to be limited to the embodiments shown herein, and be to fit to it is disclosed herein
Principle and the consistent most wide scope of features of novelty.
Claims (4)
1. high heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material, it is characterised in that including：Copper mesh composite stone layer of ink, institute
The two sides for stating copper mesh composite stone layer of ink is compounded with one layer of graphite linings；The copper mesh composite stone layer of ink is by copper mesh and is filled in described
Graphite in copper mesh grid is formed.
2. high heat conduction according to claim 1, high electromagnetic shielding copper mesh enhancing graphite composite material, it is characterised in that institute
The thickness for stating graphite linings is 0.01mm-1mm.
3. high heat conduction according to claim 1 or 2, high electromagnetic shielding copper mesh enhancing graphite composite material, it is characterised in that
The thickness of the copper mesh composite stone layer of ink is 0.02mm-1.2mm.
4. high heat conduction according to claim 3, high electromagnetic shielding copper mesh enhancing graphite composite material, it is characterised in that institute
It is red copper net to state copper mesh, it uses plain weave, and mesh number is -500 mesh of 10 mesh, string diameter 0.01mm-0.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721065396.3U CN207235352U (en) | 2017-08-24 | 2017-08-24 | High heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721065396.3U CN207235352U (en) | 2017-08-24 | 2017-08-24 | High heat conduction, high electromagnetic shielding copper mesh enhancing graphite composite material |
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| Publication Number | Publication Date |
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| CN207235352U true CN207235352U (en) | 2018-04-13 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602936A (en) * | 2019-10-15 | 2019-12-20 | 汕头大学 | Heat-conducting electromagnetic shielding substrate and preparation process thereof |
| CN115070045A (en) * | 2022-08-22 | 2022-09-20 | 有研工程技术研究院有限公司 | Ultrahigh-thermal-conductivity graphite-copper composite material and preparation method thereof |
-
2017
- 2017-08-24 CN CN201721065396.3U patent/CN207235352U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602936A (en) * | 2019-10-15 | 2019-12-20 | 汕头大学 | Heat-conducting electromagnetic shielding substrate and preparation process thereof |
| CN110602936B (en) * | 2019-10-15 | 2021-06-08 | 汕头大学 | Heat-conducting electromagnetic shielding substrate and preparation process thereof |
| CN115070045A (en) * | 2022-08-22 | 2022-09-20 | 有研工程技术研究院有限公司 | Ultrahigh-thermal-conductivity graphite-copper composite material and preparation method thereof |
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