CN203504880U - Graphene heat conduction circuit substrate - Google Patents

Abstract

A graphene heat conduction circuit substrate has three layers as follows: a graphene layer, a heat conduction insulating layer and a conducting layer. The graphene layer is prepared from a graphene adhesive body, the graphene adhesive body comprises graphene slices or graphene polymer, the heat conduction insulating layer is a graphene boron nitride nano sheet like epoxy matrix thermal film, the conducting layer is a copper foil or a gold and silver foil, the conducting layer can be used for preparing a circuit and welding electric connection of electronic components, graphene has high thermal conductivity and good mechanical performance, the graphene layer and the heat conduction insulating layer enable heat generated when the electronic components work to be rapidly conducted and radiated, and the temperature of electronic components or electronic products is obviously reduced without increasing the size of the heat conduction substrate.

Description

Graphene heat conductive circuit base board

Technical field

The utility model relates to circuit substrate, the especially circuit substrate of Graphene heat conduction that is electrically connected and has heat conduction function for photoelectric subassembly.

Background technology

Heat conductive circuit base board is widely used in computer, LED illumination, communication, medical treatment, the field such as industrial equipment and space flight, heat conductive circuit base board divides three layers, bottom is heat dissipating layer, centre is dielectric insulation layer, upper strata is conductive layer, the heat dissipating layer of tradition heat conductive circuit base board generally adopts aluminium sheet, aluminium alloy plate, the metal materials such as copper coin are made, metallic radiating layer is due to the restriction of material and technique, there are a lot of defects, metal material density is excessive, for high-power equipment, need to solve the contradiction of weight and heat dispersion, because the limitation of metal material self heat conduction and heat radiation performance, need to take larger space, be unfavorable for the requirement of miniaturization of electronic products, in addition, the corrosion resistance of metal material is bad, limited it in the application in the fields such as chemical industry and environmental protection, electronic product and components and parts development are very fast now, especially the heat conduction governing in miniature electronic components and parts and heat conductive design increasingly stringent, requirement to heat conductive circuit base board is more and more higher, even arrived harsh degree, therefore, in order to improve performance and the stability of electronic devices and components and system thereof, increase the service life, the efficient heat conductive circuit base board of development of new is extremely urgent,

Graphene is a kind ofly by carbon atom, according to hexagon, arranged and interconnect the carbon molecule forming, and its structure is highly stable, be at present the thinnest be in the world the hardest nano material also, it is almost completely transparent, only absorbs 2.3% light; Conductive coefficient is up to 5000 W/mK, and higher than carbon nano-tube and diamond, under normal temperature, its electron mobility surpasses 15000 cm ²/ Vs, ratio nano carbon pipe or silicon wafer height, resistivity approximately 10 ^-6Ω cm, lower than copper or silver, because Graphene has the features such as high conductivity, high-termal conductivity, high tenacity, high strength, super large specific area, can be used widely in fields such as electronics, space flight military project, new forms of energy, new materials.

Summary of the invention

The utility model object is the deficiency that overcomes existing heat conductive circuit base board, and a kind of new and effective Graphene heat conductive circuit base board is provided.

The technical solution of the utility model: heat conductive circuit base board has three layers, be followed successively by graphene layer, heat conductive insulating layer, conductive layer, graphene layer material is Graphene adherend, Graphene adherend is comprised of graphene platelet or Graphene polymer, heat conductive insulating layer is the epoxy substrate conductive adhesive film of class Graphene boron nitride nanosheet, conductive layer is Copper Foil or gold, silver paper tinsel, and conductive layer can be made the electric connection of circuit and welding supplied for electronic assembly.

Graphene platelet is formed by the compression of Graphene microplate, and Graphene microplate is comprised of the Graphene stratiform accumulation body of 10～18 layers of carbon-coating numbers, thickness 5-100 nm, has kept the original planar carbon hexatomic ring of graphite conjugation crystal structure.

The thickness of graphene layer is 1～3 μ m, and the thickness of heat conductive insulating layer is 70～200 μ m, and conductive layer thickness is 35～200 μ m.

The beneficial effects of the utility model are: because Graphene has high thermal conductivity energy and good mechanical performance, the heat energy producing when graphene layer and heat conductive insulating layer can be worked electronic devices and components conducts out rapidly and distributes, and does not need to increase heat-conducting substrate volume and just can obviously reduce the working temperature of electronic devices and components or electronic product.

Accompanying drawing explanation

Accompanying drawing 1 is the structural representation of the utility model embodiment.

In figure: 1---graphene layer; 2---heat conductive insulating layer; 3---conductive layer.

Embodiment

Below in conjunction with drawings and Examples, the utility model is further illustrated:

In the drawings, heat conductive circuit base board comprises graphene layer 1, heat conductive insulating layer 2, conductive layer 3, graphene layer 1, heat conductive insulating layer 2 and conductive layer 3 press together from top to bottom successively, graphene layer 1 consists of Graphene adherend, Graphene adherend is graphene platelet, graphene platelet adopts the compression of Graphene microplate to obtain, kept the original planar carbon hexatomic ring of graphite conjugation crystal structure, heat conductive insulating layer 2 is the epoxy substrate conductive adhesive film of class Graphene boron nitride nanosheet, conductive layer 3 is on heat conductive insulating layer 2, can make the electric connection of circuit and pad supplied for electronic assembly, Graphene heat conductive circuit base board has the following advantages:

One, high temperature resistant, the fusing point of Graphene and the fusing point of graphite are approximate, and up to 3850 ℃, and intensity can raise and promote with temperature;

Two, high heat conduction, the conductive coefficient of Graphene, up to 5000 W/mK, higher than carbon nano-tube and diamond, surpasses plumbous nearly ten times, the metal that waits of iron and steel;

Three, stable chemical nature, the corrosion of energy acid and alkali-resistance and organic solvent, therefore can be applied in fields such as chemical industry and environmental protection;

Four, thermal shock resistance, Graphene in use, can be stood the unlikely destruction of temperature acute variation;

The utility model has utilized the heat superconducting performance, low thermal resistance of grapheme material, the feature such as lightweight, can meet the requirement of electronic devices and components microminiaturization, miniaturization of electronic products.

Claims (3)

1. Graphene heat conductive circuit base board, it is characterized in that: heat conductive circuit base board has three layers, be followed successively by graphene layer, heat conductive insulating layer, conductive layer, graphene layer material is Graphene adherend, Graphene adherend is comprised of graphene platelet or Graphene polymer, heat conductive insulating layer is the epoxy substrate conductive adhesive film of class Graphene boron nitride nanosheet, and conductive layer is Copper Foil or gold, silver paper tinsel.

2. Graphene heat conductive circuit base board according to claim 1, is characterized in that: graphene platelet is formed by the compression of Graphene microplate, and Graphene microplate is comprised of the Graphene stratiform accumulation body of 10～18 layers of carbon-coating numbers, thickness 5～100 nm.

3. Graphene heat conductive circuit base board according to claim 1, is characterized in that: the thickness of graphene layer is 1～3 μ m, and the thickness of heat conductive insulating layer is 70～200 μ m, and conductive layer thickness is 35～200 μ m.