CN203504880U - Graphene heat conduction circuit substrate - Google Patents

Graphene heat conduction circuit substrate Download PDF

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Publication number
CN203504880U
CN203504880U CN201320202037.3U CN201320202037U CN203504880U CN 203504880 U CN203504880 U CN 203504880U CN 201320202037 U CN201320202037 U CN 201320202037U CN 203504880 U CN203504880 U CN 203504880U
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CN
China
Prior art keywords
graphene
layer
heat conduction
heat conductive
insulating layer
Prior art date
Application number
CN201320202037.3U
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Chinese (zh)
Inventor
辛莎
于伟
谢华清
Original Assignee
江苏悦达墨特瑞新材料科技有限公司
上海悦达墨特瑞新材料科技有限公司
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Priority to CN201320202037.3U priority Critical patent/CN203504880U/en
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Publication of CN203504880U publication Critical patent/CN203504880U/en

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Abstract

A graphene heat conduction circuit substrate has three layers as follows: a graphene layer, a heat conduction insulating layer and a conducting layer. The graphene layer is prepared from a graphene adhesive body, the graphene adhesive body comprises graphene slices or graphene polymer, the heat conduction insulating layer is a graphene boron nitride nano sheet like epoxy matrix thermal film, the conducting layer is a copper foil or a gold and silver foil, the conducting layer can be used for preparing a circuit and welding electric connection of electronic components, graphene has high thermal conductivity and good mechanical performance, the graphene layer and the heat conduction insulating layer enable heat generated when the electronic components work to be rapidly conducted and radiated, and the temperature of electronic components or electronic products is obviously reduced without increasing the size of the heat conduction substrate.

Description

Graphene heat conductive circuit base board

Technical field

The utility model relates to circuit substrate, the especially circuit substrate of Graphene heat conduction that is electrically connected and has heat conduction function for photoelectric subassembly.

Background technology

Heat conductive circuit base board is widely used in computer, LED illumination, communication, medical treatment, the field such as industrial equipment and space flight, heat conductive circuit base board divides three layers, bottom is heat dissipating layer, centre is dielectric insulation layer, upper strata is conductive layer, the heat dissipating layer of tradition heat conductive circuit base board generally adopts aluminium sheet, aluminium alloy plate, the metal materials such as copper coin are made, metallic radiating layer is due to the restriction of material and technique, there are a lot of defects, metal material density is excessive, for high-power equipment, need to solve the contradiction of weight and heat dispersion, because the limitation of metal material self heat conduction and heat radiation performance, need to take larger space, be unfavorable for the requirement of miniaturization of electronic products, in addition, the corrosion resistance of metal material is bad, limited it in the application in the fields such as chemical industry and environmental protection, electronic product and components and parts development are very fast now, especially the heat conduction governing in miniature electronic components and parts and heat conductive design increasingly stringent, requirement to heat conductive circuit base board is more and more higher, even arrived harsh degree, therefore, in order to improve performance and the stability of electronic devices and components and system thereof, increase the service life, the efficient heat conductive circuit base board of development of new is extremely urgent,

Graphene is a kind ofly by carbon atom, according to hexagon, arranged and interconnect the carbon molecule forming, and its structure is highly stable, be at present the thinnest be in the world the hardest nano material also, it is almost completely transparent, only absorbs 2.3% light; Conductive coefficient is up to 5000 W/mK, and higher than carbon nano-tube and diamond, under normal temperature, its electron mobility surpasses 15000 cm 2/ Vs, ratio nano carbon pipe or silicon wafer height, resistivity approximately 10 -6Ω cm, lower than copper or silver, because Graphene has the features such as high conductivity, high-termal conductivity, high tenacity, high strength, super large specific area, can be used widely in fields such as electronics, space flight military project, new forms of energy, new materials.

Summary of the invention

The utility model object is the deficiency that overcomes existing heat conductive circuit base board, and a kind of new and effective Graphene heat conductive circuit base board is provided.

The technical solution of the utility model: heat conductive circuit base board has three layers, be followed successively by graphene layer, heat conductive insulating layer, conductive layer, graphene layer material is Graphene adherend, Graphene adherend is comprised of graphene platelet or Graphene polymer, heat conductive insulating layer is the epoxy substrate conductive adhesive film of class Graphene boron nitride nanosheet, conductive layer is Copper Foil or gold, silver paper tinsel, and conductive layer can be made the electric connection of circuit and welding supplied for electronic assembly.

Graphene platelet is formed by the compression of Graphene microplate, and Graphene microplate is comprised of the Graphene stratiform accumulation body of 10~18 layers of carbon-coating numbers, thickness 5-100 nm, has kept the original planar carbon hexatomic ring of graphite conjugation crystal structure.

The thickness of graphene layer is 1~3 μ m, and the thickness of heat conductive insulating layer is 70~200 μ m, and conductive layer thickness is 35~200 μ m.

The beneficial effects of the utility model are: because Graphene has high thermal conductivity energy and good mechanical performance, the heat energy producing when graphene layer and heat conductive insulating layer can be worked electronic devices and components conducts out rapidly and distributes, and does not need to increase heat-conducting substrate volume and just can obviously reduce the working temperature of electronic devices and components or electronic product.

Accompanying drawing explanation

Accompanying drawing 1 is the structural representation of the utility model embodiment.

In figure: 1---graphene layer; 2---heat conductive insulating layer; 3---conductive layer.

Embodiment

Below in conjunction with drawings and Examples, the utility model is further illustrated:

In the drawings, heat conductive circuit base board comprises graphene layer 1, heat conductive insulating layer 2, conductive layer 3, graphene layer 1, heat conductive insulating layer 2 and conductive layer 3 press together from top to bottom successively, graphene layer 1 consists of Graphene adherend, Graphene adherend is graphene platelet, graphene platelet adopts the compression of Graphene microplate to obtain, kept the original planar carbon hexatomic ring of graphite conjugation crystal structure, heat conductive insulating layer 2 is the epoxy substrate conductive adhesive film of class Graphene boron nitride nanosheet, conductive layer 3 is on heat conductive insulating layer 2, can make the electric connection of circuit and pad supplied for electronic assembly, Graphene heat conductive circuit base board has the following advantages:

One, high temperature resistant, the fusing point of Graphene and the fusing point of graphite are approximate, and up to 3850 ℃, and intensity can raise and promote with temperature;

Two, high heat conduction, the conductive coefficient of Graphene, up to 5000 W/mK, higher than carbon nano-tube and diamond, surpasses plumbous nearly ten times, the metal that waits of iron and steel;

Three, stable chemical nature, the corrosion of energy acid and alkali-resistance and organic solvent, therefore can be applied in fields such as chemical industry and environmental protection;

Four, thermal shock resistance, Graphene in use, can be stood the unlikely destruction of temperature acute variation;

The utility model has utilized the heat superconducting performance, low thermal resistance of grapheme material, the feature such as lightweight, can meet the requirement of electronic devices and components microminiaturization, miniaturization of electronic products.

Claims (3)

1. Graphene heat conductive circuit base board, it is characterized in that: heat conductive circuit base board has three layers, be followed successively by graphene layer, heat conductive insulating layer, conductive layer, graphene layer material is Graphene adherend, Graphene adherend is comprised of graphene platelet or Graphene polymer, heat conductive insulating layer is the epoxy substrate conductive adhesive film of class Graphene boron nitride nanosheet, and conductive layer is Copper Foil or gold, silver paper tinsel.
2. Graphene heat conductive circuit base board according to claim 1, is characterized in that: graphene platelet is formed by the compression of Graphene microplate, and Graphene microplate is comprised of the Graphene stratiform accumulation body of 10~18 layers of carbon-coating numbers, thickness 5~100 nm.
3. Graphene heat conductive circuit base board according to claim 1, is characterized in that: the thickness of graphene layer is 1~3 μ m, and the thickness of heat conductive insulating layer is 70~200 μ m, and conductive layer thickness is 35~200 μ m.
CN201320202037.3U 2013-04-22 2013-04-22 Graphene heat conduction circuit substrate CN203504880U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320202037.3U CN203504880U (en) 2013-04-22 2013-04-22 Graphene heat conduction circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320202037.3U CN203504880U (en) 2013-04-22 2013-04-22 Graphene heat conduction circuit substrate

Publications (1)

Publication Number Publication Date
CN203504880U true CN203504880U (en) 2014-03-26

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Family Applications (1)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104538312A (en) * 2014-12-17 2015-04-22 华进半导体封装先导技术研发中心有限公司 Method for manufacturing cooling chip through boron nitride
CN105351774A (en) * 2015-12-21 2016-02-24 朱惠冲 LED module and lamp splicing structure
CN105361560A (en) * 2015-10-30 2016-03-02 福建翔丰华新能源材料有限公司 Graphene radiation-resistant long-service-life electric blanket
CN105472865A (en) * 2014-09-30 2016-04-06 三星电机株式会社 Circuit board comprising heat transfer structure
CN106571173A (en) * 2016-11-04 2017-04-19 郑州新世纪材料基因组工程研究院有限公司 High-temperature-resistant composite and transparent conductive film, preparation method thereof and application thereof
CN107686699A (en) * 2016-08-05 2018-02-13 中兴通讯股份有限公司 Heat-conducting interface material and heat-conducting interface material preparation method
CN108200716A (en) * 2018-01-16 2018-06-22 中山市佳信电路板有限公司 A kind of ceramic PCB manufacturing process based on graphene material

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105472865A (en) * 2014-09-30 2016-04-06 三星电机株式会社 Circuit board comprising heat transfer structure
CN104538312A (en) * 2014-12-17 2015-04-22 华进半导体封装先导技术研发中心有限公司 Method for manufacturing cooling chip through boron nitride
CN104538312B (en) * 2014-12-17 2017-04-12 华进半导体封装先导技术研发中心有限公司 Method for manufacturing cooling chip through boron nitride
CN105361560A (en) * 2015-10-30 2016-03-02 福建翔丰华新能源材料有限公司 Graphene radiation-resistant long-service-life electric blanket
CN105351774A (en) * 2015-12-21 2016-02-24 朱惠冲 LED module and lamp splicing structure
CN105351774B (en) * 2015-12-21 2019-02-22 朱惠冲 LED module and lamps and lanterns split structure
CN107686699A (en) * 2016-08-05 2018-02-13 中兴通讯股份有限公司 Heat-conducting interface material and heat-conducting interface material preparation method
CN106571173A (en) * 2016-11-04 2017-04-19 郑州新世纪材料基因组工程研究院有限公司 High-temperature-resistant composite and transparent conductive film, preparation method thereof and application thereof
CN108200716A (en) * 2018-01-16 2018-06-22 中山市佳信电路板有限公司 A kind of ceramic PCB manufacturing process based on graphene material

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140326

Termination date: 20160422