CN207336999U - A kind of liquid crystal display die set - Google Patents
A kind of liquid crystal display die set Download PDFInfo
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- CN207336999U CN207336999U CN201721464483.6U CN201721464483U CN207336999U CN 207336999 U CN207336999 U CN 207336999U CN 201721464483 U CN201721464483 U CN 201721464483U CN 207336999 U CN207336999 U CN 207336999U
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- layer
- liquid crystal
- crystal display
- die set
- thermally conductive
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Abstract
The utility model provides a kind of liquid crystal display die set, it includes metal frame and FPC, and the metal frame back side is equipped with thermally conductive layer at heat source；Its side of the FPC is turned on LCD modules, its opposite side is equipped with leakage copper position, and the leakage copper position is pasted onto in the thermally conductive layer by conducting foam.LCD module effective groundings can be achieved, to reduce electromagnetic interference, improve the electromagnetic compatibility index of electronic equipment；Even heat on FPC and at heat source can also be delivered in metal frame, improve heat dissipation effect.
Description
Technical field
A kind of technical field of liquid crystal display is the utility model is related to, more specifically to a kind of liquid crystal display die set.
Background technology
In the manufacturing process of LCD modules, the process such as pressure ACF, IC binding, FPC hot pressing, transmission, assembling can all produce quiet
Electricity, easily causes to puncture when discharging to liquid crystal display die set, and the component such as IC in LCD modules and electronic circuit etc. are universal
It is very sensitive to electrostatic, in the course of work, defect is easily caused when being subject to external electromagnetic pulsed field directly to act on.If LCD moulds
Housing antistatic property in group is bad, it is possible to fatal damage is caused to LCD modules.How LCD module effective is realized
Antistatic, becomes the problem that major production firm is being studied.
Utility model content
Technical problem to be solved in the utility model there is provided a kind of liquid crystal display die set.It can realize LCD modules
Effective grounding, to reduce electromagnetic interference, improves the electromagnetic compatibility index of electronic equipment；Can also be by the heat on FPC and at heat source
Amount is delivered evenly in metal frame, improves heat dissipation effect.
Technical problem to be solved in the utility model is achieved by the following technical programs：
In order to solve the above technical problems, the utility model provides a kind of liquid crystal display die set, it include metal frame and
FPC, the metal frame back side are equipped with thermally conductive layer at heat source；Its side of the FPC is turned on LCD modules, its is another
Side is equipped with leakage copper position, and the leakage copper position is pasted onto in the thermally conductive layer by conducting foam.
Further, the material of the thermally conductive layer is copper foil.
Further, the FPC is attached in the thermally conductive layer by electrically and thermally conductive adhesive.
Further, the thermally conductive layer is equipped with groove, and the groove is aligned for electrically and thermally conductive adhesive.
Further, the material of the thermally conductive layer is PET copper foil composite materials.
Further, the metal frame is brandreth.
Further, the FPC includes substrate layer, and the upper surface of the substrate layer is provided with circuit layer, the substrate layer
Lower surface be provided with metallic radiating layer.
Further, the FPC is further included at least one dissipates through the substrate layer, the circuit layer and the metal
The through hole of thermosphere, the inner wall of the through hole are provided with the heat-conducting layer contacted with the circuit layer, the metallic radiating layer.
Further, the heat carrier being connected with exterior conductive structure, the heat carrier and institute are provided with the through hole
Heat-conducting layer is stated to be in contact.
Further, the structure of the metallic radiating layer is net structure, list structure, wavelike structure or cellular knot
Structure.
The utility model has the advantages that：It can realize LCD module effective groundings, to reduce electromagnetic interference, carry
The electromagnetic compatibility index of high electronic equipment；Even heat on FPC and at heat source can also be delivered in metal frame, improved
Heat dissipation effect.
Groove in thermally conductive layer is aligned available for electrically and thermally conductive adhesive, and in assembling, staff is fast using the groove
Speed contraposition, prevents electrically and thermally conductive adhesive position offset.
The material selection PET copper foil composite materials of thermally conductive layer, the material not only have good electrical and thermal conductivity performance,
The material has viscosity in itself, without using electrically and thermally conductive adhesive, can save groove, contraposition, attach electrically and thermally conductive adhesive, carry
Efficiency of assembling is risen, reduces production cost.FPC can also be made seamlessly to be fitted in metal frame at the same time, further heat radiation
Ability.
Brief description of the drawings
Fig. 1 is a kind of liquid crystal display die set cross-sectional view provided by the utility model.
Fig. 2 is a kind of positive structure diagram of liquid crystal display die set provided by the utility model.
Fig. 3 is enlarged drawing at the A of Fig. 1.
Embodiment
The utility model is described in detail with reference to embodiment, embodiment is only the preferred reality of the utility model
Mode is applied, is not the restriction to the utility model.
Please refer to Fig.1 and Fig. 2, be a kind of liquid crystal display die set provided by the utility model, it includes 1 He of metal frame
FPC2,1 back side of metal frame are pasted with thermally conductive layer 3 at heat source.Led with LCD modules 10 its side of the FPC2
Logical, its opposite side is equipped with leakage copper position, and the thermally conductive layer 3 is equipped with conducting foam 4 in the leakage copper position corresponding position.The FPC2
Opposite side bendable fold to the back side of metal frame 1, leakage copper position is bonded with conducting foam 4.So as to fulfill leakage copper position and metal frame 1
It is electrically connected, and then realizes 10 effective grounding of LCD modules, to reduce electromagnetic interference, improves the electromagnetic compatibility index of electronic equipment.Lead
Even heat on FPC2 and at heat source can also be delivered in metal frame 1 by conductance thermosphere 3, improve heat dissipation effect.
The LCD modules 10 include being sequentially overlapped upper polaroid, upper substrate, infrabasal plate, the down polaroid of setting.It is described
The side of FPC is bound on LCD modules 10 by golden finger.
Preferably, the material of the thermally conductive layer 3 is copper foil, its electrical and thermal conductivity performance is good.More preferably, the FPC2 leads to
Cross electrically and thermally conductive adhesive to be attached in the thermally conductive layer 3, further lift the fixed effect of FPC2.More preferably, the conduction
Heat-conducting layer 3 is equipped with groove 5, and the groove 5 is aligned for electrically and thermally conductive adhesive, and in assembling, staff is using the groove 5
Rapid-aligning, prevents electrically and thermally conductive adhesive position offset.
Preferably, the material of the thermally conductive layer 3 is PET copper foil composite materials, which not only has good lead
Conductance hot property, itself also has viscosity, without using electrically and thermally conductive adhesive, can save groove 5, contraposition, attach conductive and heat-conductive
Glue and etc., efficiency of assembling is lifted, reduces production cost.At the same time FPC2 can also be made seamlessly to be fitted in metal frame 1, into
One step heat radiation ability.
Preferably, the metal frame 1 is brandreth, its mature production technology, and relative inexpensiveness is cost-effective.
Referring to Fig. 3, the FPC2 includes substrate layer 6, the upper surface of substrate layer 6 is provided with circuit layer 7, under substrate layer 6
Surface is provided with metallic radiating layer 8, its set-up mode can be circuit layer 7, metallic radiating layer 8 respectively by sticking double faced adhesive tape in
On substrate layer 6.Due to the thinner thickness of substrate layer 6, the heat on FPC2 can be diffused into metallic radiating layer 8 by substrate layer 6,
The metallic radiating layer 8 can effectively increase the heat dissipation area of FPC2, play the role of Homogeneouslly-radiating, so as to improve dissipating for FPC2
The thermal efficiency.Wherein substrate layer 6 can be any one in polyimides, polyester, polysulfones or polytetrafluoroethylene (PTFE), double faced adhesive tape third
Any one in olefin(e) acid glue-line or epoxy glue layer, which can be copper foil layer.
Preferably, FPC2 further includes at least one through hole 9 through substrate layer 6, circuit layer 7 and metallic radiating layer 8, should
The inner wall of through hole 9 is provided with the heat-conducting layer contacted with circuit layer 7, metallic radiating layer 8, using heat conductivility good at through hole 9,
The circuit layer 7 and metallic radiating layer 8 of 6 both sides of substrate layer can be electrically connected, plays good heat conduction function, and heat-conducting layer can carry
For heat conduction function, to reach good heat dissipation effect.Wherein, which can be copper glue conductive ink layer.
More preferably, it is provided with the heat carrier being connected with exterior conductive structure in through hole 9, the heat carrier is from circuit layer 7
Side is connected with exterior conductive structure, is also in contact with the heat-conducting layer in through hole 9, so that circuit layer 7, metallic radiating layer 8
It can be connected by through hole 9 with exterior conductive structure, so that the heat in FPC2 is expanded by the heat carrier in the through hole 9
Exterior conductive structure is dissipated to, to further improve the radiating efficiency of FPC2.Preferably, in order to allow through hole 9 and exterior heat conduction
Structure is connected, which is arranged at the marginal position of FPC2.
Preferably, which is uniform radiating structure, its structure can be net structure, list structure, wave
Any one in shape structure or honeycomb structure, by the uniform radiating structure, can preferably improve heat dissipation effect.
Above example only expresses the embodiment of the utility model, its description is more specific and detailed, but can not
Therefore the limitation to the utility model patent scope is interpreted as, as long as being obtained using the form of equivalent substitution or equivalent transformation
Technical solution, should all fall within the scope of protection of the utility model.
Claims (10)
1. a kind of liquid crystal display die set, it is characterised in that it includes：
Metal frame, the metal frame back side are equipped with thermally conductive layer at heat source；
FPC, its side are turned on LCD modules, its opposite side is equipped with leakage copper position, and the leakage copper position is pasted onto institute by conducting foam
State in thermally conductive layer.
2. liquid crystal display die set according to claim 1, it is characterised in that the material of the thermally conductive layer is copper foil.
3. liquid crystal display die set according to claim 2, it is characterised in that the FPC is attached at by electrically and thermally conductive adhesive
In the thermally conductive layer.
4. liquid crystal display die set according to claim 3, it is characterised in that the thermally conductive layer is equipped with groove, institute
Groove is stated to align for electrically and thermally conductive adhesive.
5. liquid crystal display die set according to claim 1, it is characterised in that the material of the thermally conductive layer is PET copper
Paper tinsel composite material.
6. liquid crystal display die set according to claim 1, it is characterised in that the metal frame is brandreth.
7. liquid crystal display die set according to claim 1, it is characterised in that the FPC includes substrate layer, the substrate layer
Upper surface be provided with circuit layer, the lower surface of the substrate layer is provided with metallic radiating layer.
8. liquid crystal display die set according to claim 7, it is characterised in that the FPC, which is further included, at least one runs through institute
State the through hole of substrate layer, the circuit layer and the metallic radiating layer, the inner wall of the through hole be provided with the circuit layer,
The heat-conducting layer of the metallic radiating layer contact.
9. liquid crystal display die set according to claim 8, it is characterised in that be provided with the through hole and exterior heat conduction
The heat carrier of structure connection, the heat carrier are in contact with the heat-conducting layer.
10. liquid crystal display die set according to claim 7, it is characterised in that the structure of the metallic radiating layer is netted
Structure, list structure, wavelike structure or honeycomb structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721464483.6U CN207336999U (en) | 2017-11-06 | 2017-11-06 | A kind of liquid crystal display die set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721464483.6U CN207336999U (en) | 2017-11-06 | 2017-11-06 | A kind of liquid crystal display die set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207336999U true CN207336999U (en) | 2018-05-08 |
Family
ID=62364350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721464483.6U Active CN207336999U (en) | 2017-11-06 | 2017-11-06 | A kind of liquid crystal display die set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207336999U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108986681A (en) * | 2018-07-27 | 2018-12-11 | 维沃移动通信有限公司 | A kind of backlit display screen and mobile terminal |
| CN110568964A (en) * | 2019-09-12 | 2019-12-13 | 业成科技（成都）有限公司 | Sensor assembly, preparation method thereof, bonding structure and touch panel module |
-
2017
- 2017-11-06 CN CN201721464483.6U patent/CN207336999U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108986681A (en) * | 2018-07-27 | 2018-12-11 | 维沃移动通信有限公司 | A kind of backlit display screen and mobile terminal |
| CN108986681B (en) * | 2018-07-27 | 2021-01-08 | 维沃移动通信有限公司 | Backlight display screen and mobile terminal |
| CN110568964A (en) * | 2019-09-12 | 2019-12-13 | 业成科技（成都）有限公司 | Sensor assembly, preparation method thereof, bonding structure and touch panel module |
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| GR01 | Patent grant |