CN207264052U

CN207264052U - A kind of FPC and liquid crystal display die set

Info

Publication number: CN207264052U
Application number: CN201721358899.XU
Authority: CN
Inventors: 章小和
Original assignee: Truly Opto Electronics Ltd
Current assignee: Truly Opto Electronics Ltd
Priority date: 2017-10-20
Filing date: 2017-10-20
Publication date: 2018-04-20
Anticipated expiration: 2027-10-20

Abstract

The utility model discloses a kind of FPC and liquid crystal display die set, wherein FPC includes FPC bodies and chip, and the pad of the chip both sides and the junction point of the FPC bodies scribble adhesive.It need not set stiffening plate, and pad and the FPC bodies junction of chip both sides are coated in instead of using adhesive point, increase the bonding strength of junction, reduce the probability of pad short circuit, ensure the reliability of product, cabling problem of Cracking caused by avoiding insufficient strength；Display screen shows white group when can also avoid the problem that using stiffening plate.

Description

A kind of FPC and liquid crystal display die set

Technical field

A kind of technical field of liquid crystal display is the utility model is related to, more specifically to a kind of FPC and liquid crystal display mode Group.

Background technology

At present the display screen of high-end mainstream smart mobile phone is using AMOLED, remaining big city except using incell screens, it Having the advantage that reduces the thickness of mobile phone so that cell phone manufacturer can carry out significantly more efficient profit to the inner space of mobile phone With.In addition, employing incell screen definitions can also improve.But needed using the product of incell in display screen FPC One chip of upper increase.Cabling is usually drawn on the outside of chip bonding pad in the prior art, to ensure the product matter after chip SMT Amount, will increase stiffening plate at the back side of chip.When display screen FPC is folded into backlight module, which can touch display The reflectance coating of backlight module on screen, the problem of reinforcement dash-board injury, membrane material can be caused to weigh wounded and then cause display screen to show white group, and If not using stiffening plate, cabling easily cracks at the pin of chip bonding pad both sides, the increase of pad short circuit probability.

Utility model content

Technical problem to be solved in the utility model there is provided a kind of FPC, it need not set stiffening plate, and replace making Pad and the FPC bodies junction of chip both sides are coated in adhesive point, increases the bonding strength of junction, reduces pad short circuit Probability, ensure the reliability of product, cabling problem of Cracking caused by avoiding insufficient strength；Also can avoid showing when using stiffening plate Display screen shows the problem of white group.

Technical problem to be solved in the utility model is achieved by the following technical programs：

In order to solve the above technical problems, the utility model provides a kind of FPC, it includes FPC bodies and chip, the core The pad of piece both sides and the junction point of the FPC bodies scribble adhesive.

Further, the chip is touch-control IC.

Further, additionally it is parallel with an at least lead on the inside of the pad on each chip.

Further, the FPC bodies include substrate layer, and the upper surface of the substrate layer is provided with circuit layer, the base The lower surface of material layer is provided with metallic radiating layer.

Further, the FPC bodies, which further include, at least one runs through the substrate layer, the circuit layer and the gold Belong to the through hole of heat dissipating layer, the inner wall of the through hole is provided with the heat-conducting layer contacted with the circuit layer, the metallic radiating layer.

Further, the heat carrier being connected with exterior conductive structure, the heat carrier and institute are provided with the through hole Heat-conducting layer is stated to be in contact.

Further, the structure of the metallic radiating layer is net structure, list structure, wavelike structure or cellular knot Structure.

The utility model additionally provides a kind of liquid crystal display die set, it includes such as above-mentioned any one of them FPC.

Further, the liquid crystal display die set further includes touch-control display panel and backlight module.

Further, the touch-control display panel include being sequentially overlapped the down polaroid of setting, infrabasal plate, liquid crystal layer, on Substrate and upper polaroid, are embedded with touch function in the liquid crystal layer；The FPC sides are bound on the infrabasal plate, described FPC opposite sides are folded on the backlight module；The chip is touch-control IC.

The utility model has the advantages that：FPC provided by the utility model need not set stiffening plate, and replace making Pad and the FPC bodies junction of chip both sides are coated in adhesive point, increases the bonding strength of junction, reduces pad short circuit Probability, ensure the reliability of product, cabling problem of Cracking caused by avoiding insufficient strength；Also can avoid showing when using stiffening plate Display screen shows the problem of white group.

As the connecting line on the outside of the pad on fruit chip cracks because of insufficient strength, extra lead in parallel still can be real Now it is electrically connected, further reduces the probability of pad short circuit, ensures the reliability of product.

FPC includes the heat dissipation area that circuit layer, substrate layer, metallic radiating layer can effectively increase FPC, plays Homogeneouslly-radiating Effect, so as to improve the radiating efficiency of FPC.

Brief description of the drawings

Fig. 1 is a kind of FPC structure diagrams provided by the utility model.

Fig. 2 is a kind of FPC cablings schematic diagram provided by the utility model.

Fig. 3 is a kind of FPC sectional views provided by the utility model.

Fig. 4 is a kind of liquid crystal display die set structure diagram provided by the utility model.

Embodiment

The utility model is described in detail with reference to embodiment, embodiment is only the preferred reality of the utility model Mode is applied, is not the restriction to the utility model.

It is a kind of FPC provided by the utility model, it includes FPC bodies 1 and chip 2, described incorporated by reference to Fig. 1 and Fig. 2 The junction point of the pad 3 of 2 both sides of chip and the FPC bodies 1 scribbles adhesive 4, and adhesive 4 is preferably UV by the present embodiment Glue, it need not set stiffening plate, and instead of using 4 points of pads 3 for being coated in 2 both sides of chip of adhesive and 1 junction of FPC bodies, Increase the bonding strength of junction, reduce the probability of the short circuit of pad 3, ensure the reliability of product, caused by avoiding insufficient strength Cabling problem of Cracking；Display screen shows white group when can also avoid the problem that using stiffening plate.

Preferably, the chip is touch-control IC.

Referring to Fig. 2, preferably, the inner side of pad 3 on each chip 2 is additionally parallel with an at least lead 5, Lead 5 and original lines in parallel, if the connecting line in the outside of pad 3 on the chip 2 cracks because of insufficient strength, additionally Lead 5 in parallel still can realize electrical connection, further reduce the probability of the short circuit of pad 3, ensure the reliability of product.

Referring to Fig. 3, preferably, which further includes substrate layer 6, the upper surface of substrate layer 6 is provided with circuit layer 7, base material The lower surface of layer 6 is provided with metallic radiating layer 8, its set-up mode can be circuit layer 7, metallic radiating layer 8 respectively by two-sided It is gluing to be affixed on substrate layer 6.Due to the thinner thickness of substrate layer 6, the heat on FPC can be diffused into metal by substrate layer 6 Heat dissipating layer 8, which can effectively increase the heat dissipation area of FPC, play the role of Homogeneouslly-radiating, so as to improve The radiating efficiency of FPC.Wherein substrate layer 6 can be any one in polyimides, polyester, polysulfones or polytetrafluoroethylene (PTFE), double Face glue is any one in acrylic acid glue-line or epoxy glue layer, which can be copper foil layer.

Preferably, FPC further includes at least one through hole 9 through substrate layer 6, circuit layer 7 and metallic radiating layer 8, should The inner wall of through hole 9 is provided with the heat-conducting layer contacted with circuit layer 7, metallic radiating layer 8, using heat conductivility good at through hole 9, The circuit layer 7 and metallic radiating layer 8 of 6 both sides of substrate layer can be electrically connected, plays good heat conduction function, and heat-conducting layer can carry For heat conduction function, to reach good heat dissipation effect.Wherein, which can be copper glue conductive ink layer.

More preferably, it is provided with the heat carrier being connected with exterior conductive structure in through hole 9, the heat carrier is from circuit layer 7 Side is connected with exterior conductive structure, is also in contact with the heat-conducting layer in through hole 9, so that circuit layer 7, metallic radiating layer 8 It can be connected by through hole 9 with exterior conductive structure, so that the heat in FPC is expanded by the heat carrier in the through hole 9 Exterior conductive structure is dissipated to, to further improve the radiating efficiency of FPC.Preferably, in order to allow through hole 9 and exterior heat conduction knot Structure is connected, which is arranged at the marginal position of FPC.

Preferably, which is uniform radiating structure, its structure can be net structure, list structure, wave Any one in shape structure or honeycomb structure, by the uniform radiating structure, can preferably improve heat dissipation effect.

Referring to Fig. 4, preferably, the liquid crystal display die set further includes touch-control display panel 10 and backlight module 11.

Preferably, the touch-control display panel 10 is the touch-control display panel 10 of incell types, specifically, the touch-control Display panel 10 includes being sequentially overlapped down polaroid 12, infrabasal plate 13, liquid crystal layer, upper substrate 14 and the upper polaroid 15 of setting, The FPC sides are bound on the infrabasal plate 13, and touch function is embedded with the liquid crystal layer；The FPC opposite sides bending Onto the backlight module 11；The chip 2 is touch-control IC.Stiffening plate is not provided with since FPC is equipped with chip 2, FPC bendings The reflection membrane material on backlight module 11 will not be caused to weigh wounded after on to backlight module 11, avoid generation display screen from showing that rolls into a ball in vain asks Topic.

Above example only expresses the embodiment of the utility model, its description is more specific and detailed, but can not Therefore the limitation to the utility model patent scope is interpreted as, as long as being obtained using the form of equivalent substitution or equivalent transformation Technical solution, should all fall within the scope of protection of the utility model.

Claims

1. a kind of FPC, it is characterised in that it includes FPC bodies and chip, the pad of the chip both sides and the FPC bodies Junction point scribble adhesive.

2. FPC according to claim 1, it is characterised in that the chip is touch-control IC.

3. FPC according to claim 1, it is characterised in that be additionally parallel with the inside of the pad on each chip An at least lead.

4. FPC according to claim 1, it is characterised in that the FPC bodies include substrate layer, the substrate layer it is upper Surface is provided with circuit layer, and the lower surface of the substrate layer is provided with metallic radiating layer.

5. FPC according to claim 4, it is characterised in that the FPC bodies, which further include, at least one runs through the base material The through hole of layer, the circuit layer and the metallic radiating layer, the inner wall of the through hole are provided with and the circuit layer, the gold Belong to the heat-conducting layer of heat dissipating layer contact.

6. FPC according to claim 5, it is characterised in that be provided with the through hole and be connected with exterior conductive structure Heat carrier, the heat carrier is in contact with the heat-conducting layer.

7. FPC according to claim 4, it is characterised in that the structure of the metallic radiating layer is net structure, strip knot Structure, wavelike structure or honeycomb structure.

8. a kind of liquid crystal display die set, it is characterised in that it includes such as claim 1-7 any one of them FPC.

9. liquid crystal display die set according to claim 8, it is characterised in that the liquid crystal display die set further includes touch-control and shows Show panel and backlight module.

10. liquid crystal display die set according to claim 9, it is characterised in that the touch-control display panel includes folding successively The down polaroid put, infrabasal plate, liquid crystal layer, upper substrate and upper polaroid are added, touch function is embedded with the liquid crystal layer；Institute State FPC sides to be bound on the infrabasal plate, the FPC opposite sides are folded on the backlight module；The chip is touch-control IC。