CN207281421U - Display panel and electronic equipment - Google Patents
Display panel and electronic equipment Download PDFInfo
- Publication number
- CN207281421U CN207281421U CN201721350896.1U CN201721350896U CN207281421U CN 207281421 U CN207281421 U CN 207281421U CN 201721350896 U CN201721350896 U CN 201721350896U CN 207281421 U CN207281421 U CN 207281421U
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- CN
- China
- Prior art keywords
- driving chip
- heat
- display panel
- conduction material
- heat conduction
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 48
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000012528 membrane Substances 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 29
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 239000011521 glass Substances 0.000 description 19
- 238000010586 diagram Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000006121 base glass Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Abstract
The embodiment of the present application, which provides a kind of display panel and electronic equipment, the display panel, to be included：Array base palte, layer of liquid crystal molecule and color membrane substrates, the array base palte and the color membrane substrates are relatively arranged on the layer of liquid crystal molecule both sides, and the array base palte is included to box region and binding region, and driving chip is provided with the binding region；Wherein, a Heat Conduction Material is bonded in the binding region, and the Heat Conduction Material covers the driving chip, the heat the driving chip to be distributed reaches the binding region everywhere.In the present solution, a Heat Conduction Material is bonded in the binding region of array base palte, and Heat Conduction Material covering driving chip, therefore the heat that can distribute driving chip reaches binding region everywhere, can effectively reduce the temperature of driving chip.It is thus possible to improve the heat dissipation effect of display panel, and then improve the heat dissipation effect of electronic equipment.
Description
Technical field
This application involves technical field of electronic equipment, more particularly to a kind of display panel and electronic equipment.
Background technology
With the fast development of electronic technology, the electronic equipment such as smart mobile phone, tablet computer is increasingly popularized.
Wherein, the electronic equipment such as smart mobile phone, tablet computer all has display panel.And with the maturation of LCD technology, liquid crystal
Display panel is more and more applied in electronic equipment.
Driving chip is by binding process Installation on the glass substrate in liquid crystal display panel, since driving chip easily distributes
Heat, and the heat-conducting effect of glass is poor, so that the heat that driving chip gives out is concentrated on driving chip, heat dissipation effect
Fruit is bad.
Utility model content
The embodiment of the present application provides a kind of display panel and electronic equipment, can improve the heat dissipation effect of electronic equipment.
The embodiment of the present application provides a kind of display panel, including：Array base palte, layer of liquid crystal molecule and color membrane substrates, it is described
Array base palte and the color membrane substrates are relatively arranged on the layer of liquid crystal molecule both sides, the array base palte include to box region and
Binding region, is provided with driving chip in the binding region；Wherein,
A Heat Conduction Material is bonded in the binding region, and the Heat Conduction Material covers the driving chip, to by institute
State the heat that driving chip distributes and reach the binding region everywhere.
The embodiment of the present application also provides a kind of electronic equipment, including housing and display panel, and the display panel is installed on
On the housing, the display panel is above-mentioned display panel.
In display panel provided by the embodiments of the present application, a Heat Conduction Material is bonded in the binding region of array base palte, and
The Heat Conduction Material covers driving chip, therefore the heat that can distribute driving chip reaches binding region everywhere, can be effective
Reduce the temperature of driving chip.It is thus possible to improve the heat dissipation effect of display panel, and then improve the heat dissipation effect of electronic equipment
Fruit.
Brief description of the drawings
In order to illustrate more clearly of the technical solution in the embodiment of the present application, make required in being described below to embodiment
Attached drawing is briefly described.It should be evident that drawings in the following description are only some embodiments of the present application, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the structure diagram of electronic equipment provided by the embodiments of the present application.
Fig. 2 is that display panel is bonded the structure diagram before Heat Conduction Material in electronic equipment 100 shown in Fig. 1.
Fig. 3 is sectional view of the display panel 20 along P-P directions shown in Fig. 2.
Fig. 4 is that display panel 20 is bonded the structure diagram after Heat Conduction Material in electronic equipment 100 shown in Fig. 1.
Fig. 5 is first sectional view of the display panel 20 shown in Fig. 4 along Q-Q directions.
Fig. 6 is second sectional view of the display panel 20 shown in Fig. 4 along Q-Q directions.
Fig. 7 is threeth sectional view of the display panel 20 shown in Fig. 4 along Q-Q directions.
Fig. 8 is that display panel 20 is bonded another structure diagram after Heat Conduction Material in electronic equipment 100 shown in Fig. 1.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, the technical solution in the embodiment of the present application is carried out clear, complete
Site preparation describes.Obviously, described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, the every other implementation that those skilled in the art are obtained without creative efforts
Example, shall fall in the protection scope of this application.
In the description of the present application, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Describe the application and simplify to describe, rather than indicate or imply that signified device or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In the description of the present application, " multiple " are meant that two or more, unless otherwise specifically defined.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；It can be directly connected, can also be by between intermediary
Connect connected, can be the interaction relationship of connection inside two elements or two elements.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to
Simplify disclosure herein, hereinafter the component and setting of specific examples are described.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, this application provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides a kind of electronic equipment.The electronic equipment can be the equipment such as smart mobile phone, tablet computer.
With reference to figure 1, electronic equipment 100 includes cover board 10, display panel 20, circuit board 30 and housing 40.
Wherein, cover board 10 is installed on display panel 20, to cover display panel 20.Cover board 10 can be transparent glass cover
Plate.In certain embodiments, cover board 10 can be with glass cover-plates made of material such as sapphires.
Display panel 20 is installed on housing 40, to form the display surface of electronic equipment 100.In certain embodiments, show
Show that panel 20 includes display area 201 and non-display area 202.Display area 201 is used to show the information such as image, text.It is non-
Display area 202 does not show information.The bottom of non-display area 202 can set the functional units such as fingerprint module, touch-control circuit.
In certain embodiments, display panel 20 is liquid crystal display panel.
Circuit board 30 is installed on inside housing 40.Circuit board 30 can be the mainboard of electronic equipment 100.Set on circuit board 30
Earth point is equipped with, to realize the ground connection of circuit board 30.Camera, proximity sensor and processing can be integrated with circuit board 30
The functional units such as device.Meanwhile display panel 20 can be electrically connected to circuit board 30.
In certain embodiments, it is provided with display control circuit on circuit board 30.The display control circuit is to display panel
20 output electric signals, to control the display panel 20 display information.
Housing 40 is used for the exterior contour for forming electronic equipment 100.The material of housing 40 can be plastics or metal.Housing
40 can be integrally formed.
Referring to figs. 2 and 3.Wherein, Fig. 2 is that display panel is bonded the knot before Heat Conduction Material in electronic equipment 100 shown in Fig. 1
Structure schematic diagram, Fig. 3 are sectional view of the display panel 20 along P-P directions shown in Fig. 2.
Wherein, display panel 20 includes：Array base palte 21, layer of liquid crystal molecule 22 and color membrane substrates 23,21 He of array base palte
Color membrane substrates 23 are oppositely arranged, and array base palte 21 is included to box region 210 and binding region 211.It should be noted that array base
Plate 21 is oppositely arranged box region 210 and color membrane substrates 23 display area 201 to form display panel 20.Further, should
Driving chip 24 is installed, in practical application, in the use process of electronic equipment 100 in the binding region 211 of array base palte 21
In, driving chip 24 can distribute heat, if heat cannot export in time, be easy to cause driving chip 24 and be damaged.
In certain embodiments, with reference to figure 4.Wherein, Fig. 4 is that the fitting of display panel 20 is led in electronic equipment 100 shown in Fig. 1
Structure diagram after hot material.With reference to shown in Fig. 2, Fig. 4, a heat conduction material is bonded in the binding region 211 of array base palte 21
Material 25, and driving chip 24 of the Heat Conduction Material 25 covering in 21 binding region 211 of array base palte, so as to which this is driven
The heat that dynamic chip 24 distributes reaches binding region 211 everywhere, reaches good heat dissipation effect.For example, the heat sink material 25 can
Think graphite or metal, can be by being bonded stone in binding region 211 since graphite or metal have good heat dissipation performance
Ink or metal, and the graphite or metal are thermally contacted with driving chip 24 and array base palte glass at the same time, and then will can drive
The heat that chip 24 distributes reaches array base palte glass everywhere by graphite or metal, reaches good heat dissipation effect.
In certain embodiments, the thickness of the heat sink material 25 is between 0.1mm-1mm.
In certain embodiments, as shown in figure 5, Fig. 5 is first sectional view of the display panel 20 shown in Fig. 4 along Q-Q directions.
Wherein, in the binding region 211 of the array base palte 21, Heat Conduction Material 25 fits in binding area by heat-conducting glue 26
On domain 211, on the one hand the heat that driving chip 24 distributes can be directly transferred to the array base palte glass immediately below driving chip 24
On 27, on the other hand it can be reached by Heat Conduction Material 25 on the array base palte glass 27 of 24 both sides of driving chip, so as to drive
The heat that chip 24 distributes is not concentrated on driving chip 24, has good heat-conducting effect.For example, the heat-conducting glue 26 can be with
For heat conductive silica gel, i.e. can first instil on driving chip 24 and on the array base palte glass 27 of 24 both sides of driving chip
Heat conductive silica gel, then Heat Conduction Material 25 is bonded, so that driving chip 24, heat-conducting glue 26, Heat Conduction Material 25 and array base
Glass sheet 27 thermally contacts, and carries out the transmission of heat, heat will not be concentrated at one.
In addition, the heat-conducting glue being equal to positioned at the thickness of the heat-conducting glue of 24 both sides of driving chip above driving chip 24
The sum of thickness of thickness and driving chip 24.In practical applications, can be respectively on driving chip 24 and driving chip
Instil appropriate heat-conducting glue for 2426 both sides, and then Heat Conduction Material 25 is attached on heat-conducting glue 26.For example, instil in driving chip 24
The thickness of heat-conducting glue 26 above is plus the thickness of of driving chip 24 itself equal to the heat-conducting glue 26 positioned at 24 both sides of driving chip
Thickness, can so ensure after Heat Conduction Material 25 is placed, surfacing, and Heat Conduction Material 25 will not produce fracture.
Further, with reference to figure 6, Fig. 6 is second sectional view of the display panel 20 shown in Fig. 4 along Q-Q directions.Wherein, lead
The quantity of hot glue 26 is multiple, in the heat-conducting glue 26 positioned at 24 both sides of driving chip, the heat-conducting glue at driving chip 24
26 density is more than the density away from the heat-conducting glue 26 at driving chip 24, i.e. on the region of 24 both sides of driving chip, more leans on
Nearly driving chip 24, the quantity of heat-conducting glue 26 thereon are more.
It should be noted that the heat that driving chip 24 distributes is concentrated near driving chip 24, i.e. closer to driving core
Piece 24, heat is higher, and on the one hand the heat that driving chip 24 distributes is directly transferred to the array base palte glass of the lower section of driving chip 24
It is on the other hand then on the array base palte glass 27 for reach 24 both sides of driving chip by Heat Conduction Material 25 on glass 27, i.e. driving
The heat that chip 24 distributes, a part reach Heat Conduction Material 25, subsequent heat conduction by the heat-conducting glue 26 on driving chip 24
Material 25 again reaches heat through heat-conducting glue 26 on the array base palte glass 27 of 24 both sides of driving chip.By in driving chip 24
Both sides set the heat-conducting glue 26 of different densities so that heat can more uniformly reach array base palte glass 27 everywhere, reach
More preferable heat dissipation effect.
For example, in practical applications, first area S1, second area will be divided into positioned at the region of 24 both sides of driving chip
S2 and the 3rd region S3, wherein first area S1 are nearest apart from driving chip 24, and the 3rd region S3 is farthest apart from driving chip 24,
Second area S2 is placed in the middle, and the density of the heat-conducting glue 26 to instil in the S1 of first area is a, in the heat-conducting glue that second area S2 instils
26 density is b, is c in the density for the heat-conducting glue 26 that the 3rd region S3 instils, and a>b>c.In synchronization, due to the firstth area
Domain S1 is nearest apart from driving chip 24, therefore the heat at first area 24 is with respect to second area S2 and the 3rd region S3 high, at this time,
It is higher than second area S2 and the 3rd region S3 by what the density of heat-conducting glue 26 was set on the S1 of first area, so that hot
Amount is reached rapidly on array base palte glass 27 by more heat-conducting glue 26 so that at any one time, array base palte glass 27 is each
The heat balance at place.
In certain embodiments, as shown in fig. 7, Fig. 7 is threeth sectional view of the display panel 20 shown in Fig. 4 along Q-Q directions.
Wherein, in the binding region 211 of the array base palte 21, Heat Conduction Material 25 is mounted directly in binding region 211,
On the one hand the heat that driving chip 24 distributes can be directly transferred on the array base palte glass 27 immediately below driving chip 24, another
Aspect can be reached on the array base palte glass 27 of 24 both sides of driving chip by Heat Conduction Material 25, so that driving chip 24 distributes
Heat be not concentrated on driving chip 24, there is good heat-conducting effect.
The Heat Conduction Material 25 includes the first fit area 251 and the second fit area 252, and the first fit area 251 is located at
Above driving chip 24, the second fit area 252 is located at 24 both sides of driving chip, and the thickness of the second fit area 252 is equal to
After the thickness of the first fit area 251 and the thickness of driving chip 24.In practical applications, can be by the Heat Conduction Material 25
The thickness of second area 252 is arranged to the thickness of the first area 251 of the Heat Conduction Material 25 and the thickness of of driving chip 24 itself
The sum of degree, in this way, directly can be bonded the Heat Conduction Material 25 with binding region 211, so that driving chip 24, Heat Conduction Material
25 and array base palte glass 27 thermally contact, carry out the transmission of heat, heat will not be concentrated at one.
In certain embodiments, as shown in figure 8, Fig. 8 is that display panel 20 is bonded heat conduction in electronic equipment 100 shown in Fig. 1
Another structure diagram after material.Wherein, Fig. 8 and Fig. 4 difference lies in：Driving chip 24 also with a flexible printed circuit board
28 connections, Heat Conduction Material 25 are extended on flexible printed circuit board 28.
Display panel provided by the embodiments of the present application and electronic equipment are described in detail above, it is used herein
Specific case is set forth the principle and embodiment of the application, and the explanation of above example is only intended to help to understand this
Application.Meanwhile for those skilled in the art, according to the thought of the application, in specific embodiments and applications
It will change, in conclusion this specification content should not be construed as the limitation to the application.
Claims (10)
- A kind of 1. display panel, it is characterised in that including：Array base palte, layer of liquid crystal molecule and color membrane substrates, the array base palte The layer of liquid crystal molecule both sides are relatively arranged on the color membrane substrates, the array base palte is included to box region and binding area Domain, is provided with driving chip in the binding region；Wherein,A Heat Conduction Material is bonded in the binding region, and the Heat Conduction Material covers the driving chip, to by the drive The heat that dynamic chip distributes reaches the binding region everywhere.
- 2. display panel according to claim 1, it is characterised in that the Heat Conduction Material is fitted in described by heat-conducting glue In binding region.
- 3. display panel according to claim 2, it is characterised in that positioned at the thickness of the heat-conducting glue of the driving chip both sides Degree is equal to the sum of the thickness of the heat-conducting glue above the driving chip and the thickness of the driving chip.
- 4. display panel according to claim 2, it is characterised in that the quantity of the heat-conducting glue is multiple, positioned at institute In the heat-conducting glue for stating driving chip both sides, the density of the heat-conducting glue at the driving chip is more than away from the driving chip The density of the heat-conducting glue at place.
- 5. display panel according to claim 2, it is characterised in that the heat-conducting glue is heat conductive silica gel.
- 6. display panel according to claim 1, it is characterised in that the Heat Conduction Material includes the first fit area and the Two fit areas, first fit area are located above the driving chip, and second fit area is located at the driving Chip both sides, and the thickness of second fit area is equal to the thickness of first fit area and the thickness of the driving chip The sum of degree.
- 7. according to claim 1-6 any one of them display panels, it is characterised in that the driving chip is also printed with a flexibility Printed circuit board connects, and the Heat Conduction Material extends to the flexible printed circuit board, with cover the driving chip with it is described soft The joint of property printed circuit board (PCB).
- 8. according to claim 1-6 any one of them display panels, it is characterised in that the Heat Conduction Material is graphite or gold Belong to.
- 9. according to claim 1-6 any one of them display panels, it is characterised in that the thickness of the Heat Conduction Material between Between 0.1mm-1mm.
- 10. a kind of electronic equipment, it is characterised in that including housing and display panel, the display panel is installed on the housing On, the display panel is claim 1 to 9 any one of them display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721350896.1U CN207281421U (en) | 2017-10-19 | 2017-10-19 | Display panel and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721350896.1U CN207281421U (en) | 2017-10-19 | 2017-10-19 | Display panel and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207281421U true CN207281421U (en) | 2018-04-27 |
Family
ID=61980848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721350896.1U Expired - Fee Related CN207281421U (en) | 2017-10-19 | 2017-10-19 | Display panel and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207281421U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110033705A (en) * | 2019-04-29 | 2019-07-19 | 上海天马有机发光显示技术有限公司 | A kind of display module and display device |
| CN112331802A (en) * | 2020-11-03 | 2021-02-05 | 京东方科技集团股份有限公司 | Flexible display panel and display device |
-
2017
- 2017-10-19 CN CN201721350896.1U patent/CN207281421U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110033705A (en) * | 2019-04-29 | 2019-07-19 | 上海天马有机发光显示技术有限公司 | A kind of display module and display device |
| CN110033705B (en) * | 2019-04-29 | 2022-03-08 | 武汉天马微电子有限公司 | Display module and display device |
| CN112331802A (en) * | 2020-11-03 | 2021-02-05 | 京东方科技集团股份有限公司 | Flexible display panel and display device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180427 |
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| CF01 | Termination of patent right due to non-payment of annual fee |