CN102131342A - Printed circuit board and liquid crystal display device - Google Patents
Printed circuit board and liquid crystal display device Download PDFInfo
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- CN102131342A CN102131342A CN 201110049450 CN201110049450A CN102131342A CN 102131342 A CN102131342 A CN 102131342A CN 201110049450 CN201110049450 CN 201110049450 CN 201110049450 A CN201110049450 A CN 201110049450A CN 102131342 A CN102131342 A CN 102131342A
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- circuit board
- printed circuit
- pcb
- conductive pattern
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 15
- 230000004907 flux Effects 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 239000011889 copper foil Substances 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 5
- 239000010931 gold Substances 0.000 abstract 5
- 229910052737 gold Inorganic materials 0.000 abstract 5
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000007906 compression Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- VYMDGNCVAMGZFE-UHFFFAOYSA-N phenylbutazonum Chemical compound O=C1C(CCCC)C(=O)N(C=2C=CC=CC=2)N1C1=CC=CC=C1 VYMDGNCVAMGZFE-UHFFFAOYSA-N 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
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- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a printed circuit board and a liquid crystal display device. The printed circuit board comprises an insulating substrate, a gold finger area arranged on one side surface of the insulating substrate and a conducting layer electrically isolated with the gold finger area; the gold finger area is used for electrically bonding with a bonded area of a flip chip film; the conducting layer comprises a first area and a second area; the gold finger area is vertically projected on the first area and the second area of the conducting layer; heat is dissipated through the first area in a first heat flux and dissipated through the second area in a second heat flux when the gold finger area is heated; the first area is provided with discrete conducting patterns; the second area is provided with continuous conducting patterns; and a structure which can not cut off the conducting patterns of the second area and is specially used for reducing the second heat flux is arranged on the second area to ensure that the second heat flux is basically equal to the first heat flux, so that the problem of poor bonding between the printed circuit board and the flip chip film can be effectively prevented.
Description
Technical field
The present invention relates to technical field of liquid crystal display, relate in particular to a kind of printed circuit board (PCB) and adopt the liquid crystal indicator of this printed circuit board (PCB).
Background technology
In recent years, fast development along with flat panel display, LCD (Liquid Crystal Display, LCD) because of having that volume is little, in light weight, image quality is high and driving voltage is low etc. that advantage is widely used in that (Personal Digital Assistant is PDA) etc. in the various portable type electronic products such as mobile phone, notebook computer, personal digital assistant.
(Liquid Crystal Module LCM) is the important component part of LCD to the liquid crystal display module.The liquid crystal display module generally includes display panels, (the Chip On Film that covers brilliant film, COF) and printed circuit board (PCB) (the Printed Circuit Board that is used to install electronic devices and components, PCB), in the assembling process of liquid crystal display module, an end that needs to cover brilliant film is electrically connected to display panels, to cover the other end of brilliant film again and link to each other with golden finger on the printed circuit board (PCB), thereby, by covering brilliant film printed circuit board (PCB) is electrically connected on the display panels.Wherein, printed circuit board (PCB) is a kind of important electron parts, also is the supporting body of electronic devices and components simultaneously.
Fig. 1 to Fig. 3 has disclosed a kind of structure of existing printed circuit board (PCB), wherein, Figure 1 shows that the cross-sectional view of existing printed circuit board (PCB), and Fig. 2 is the vertical view of printed circuit board (PCB) shown in Figure 1, and Fig. 3 is the upward view of printed circuit board (PCB) shown in Figure 1.As shown in Figure 1 to Figure 3, printed circuit board (PCB) 100 the copper foil layer 103 that comprises insulated substrate 101, be positioned at the golden finger zone 102 of insulated substrate 101 upper surfaces and be positioned at insulated substrate 101 lower surfaces corresponding to golden finger zone 102.In the manufacturing process of printed circuit board (PCB) 100, precipitate one deck copper foil layer 103 earlier by lower surface at insulated substrate 101, then, the copper foil layer 103 that is deposited in insulated substrate 101 lower surfaces is partly etched away, wherein, a part that stays is formed for electrically connecting the conducting wire of electronic component, these conducting wires constitute the conductive pattern zone 104 of printed circuit board (PCB) 100, and the not etched zone of another part forms copper paving area 105, and this copper paving area 105 is connected with the ground wire of power supply as the ground area.As shown in Figure 3, in printed circuit board (PCB) 100, mutual electrical isolation between conductive pattern zone 104 in copper foil layer 103 and the copper paving area 105, and having the gap between the Copper Foil conducting wire in the conductive pattern zone 104, then is the integrated entity structure as the Copper Foil in the copper paving area 105 of ground area.
On the copper foil layer 103 corresponding to golden finger zone 102 on the printed circuit board (PCB) 100, owing to have the gap between the Copper Foil conducting wire in the conductive pattern of copper foil layer 103 zone 104, as the Copper Foil in the copper paving area 105 of ground area then is the integrated entity structure, therefore, there is evident difference in the overall distribution density corresponding to Copper Foil between the conductive pattern in golden finger zone 102 zone 104 and the copper paving area 105.When carrying out the hot pressing bonding in the bonding that will cover brilliant film (Bonding) zone and the golden finger zone 102 on the printed circuit board (PCB) 100, because the heat that bonding produces makes golden finger zone 102 be heated, simultaneously, the heat that produces will outwards distribute by conductive pattern zone 104 and copper paving area 105, yet, because inhomogeneous corresponding to the Copper Foil overall distribution density in the conductive pattern on the copper foil layer 103 in golden finger zone 102 zone 104 and the copper paving area 105 of printed circuit board (PCB) 100 lower surfaces, the heat flux that will cause conductive pattern zone 104 and copper paving area 105 externally to distribute is unbalanced, and then causes the heat radiation corresponding to the lower surface in golden finger zone 102 of printed circuit board (PCB) 100 inhomogeneous.Therefore, this will cause producing problems such as bonding bubble, bonding rosin joint in the bonding processing procedure that covers brilliant film and printed circuit board (PCB) 100, even can cause covering the bonding failure in the golden finger zone 102 of the bonded areas of brilliant film and printed circuit board (PCB) 100, thereby the electric property between the golden finger zone 102 of the bonded areas of brilliant film and printed circuit board (PCB) 100 is covered in influence.
Therefore, be necessary to provide improved technical scheme to overcome the above technical problem that exists in the prior art.
Summary of the invention
In view of this, technical problem to be solved by this invention provides improved printed circuit board (PCB) and adopts the liquid crystal indicator of this printed circuit board (PCB), and this printed circuit board (PCB) can effectively improve and cover the imperfect bonding problem between the brilliant film.
For solving the problems of the technologies described above, an aspect of of the present present invention provides a kind of printed circuit board (PCB), it comprises insulated substrate, be positioned at the golden finger zone of described insulated substrate one side, and with the conductive layer of described golden finger zone electrical isolation, described golden finger zone is used for electrically boning with the bonded areas of covering brilliant film, described conductive layer comprises first area and second area, described golden finger regions perpendicular is projected in the described first area and the second area of described conductive layer, when described golden finger zone is heated, heat distributes with first heat flux by described first area and distributes with second heat flux by described second area, described first area has discrete conductive pattern, described second area has continuous conductive pattern, and, described second area offers the structure that reduces described second heat flux that is exclusively used in of the conductive pattern that do not cut off described second area, so that described second heat flux equates substantially with described first heat flux.
Another aspect of the present invention provides a kind of liquid crystal indicator, and it comprises display panels, covers brilliant film and aforesaid printed circuit board (PCB), covers brilliant film described printed circuit board (PCB) is electrically connected on the described display panels by described.
Printed circuit board (PCB) with respect to prior art, printed circuit board (PCB) of the present invention is by offering the structure that reduces described second heat flux that is exclusively used in of the conductive pattern that do not cut off second area on second area, this constitutional balance the difference of the heat flux of outwards distributing between second area and the first area, thereby make in conductive layer corresponding to the golden finger zone, second heat flux of outwards distributing of second area equates substantially with first heat flux of outwards distributing of first area, therefore, when thermo-compression bonding is carried out in the golden finger zone on the bonded areas of covering brilliant film and the printed circuit board (PCB), the heat that produces in the thermo-compression bonding of golden finger location can be by outwards distributing back to first area and second area in the golden finger zone, because second heat flux that second area outwards distributes equates substantially with first heat flux that outwards distribute the first area, therefore, first area and second area can Homogeneouslly-radiatings, and then make that the temperature distribution of the golden finger location on the printed circuit board (PCB) is even, thereby can avoid covering and produce the bonding bubble between brilliant film and the printed circuit board (PCB), imperfect bonding problems such as bonding rosin joint have effectively guaranteed to cover the electric property between brilliant film and the printed circuit board (PCB).
By the detailed description below with reference to accompanying drawing, it is obvious that others of the present invention and feature become.But should be known in only the purpose design of this accompanying drawing, rather than as the qualification of scope of the present invention, this is because it should be with reference to additional claim for explaining.Should also be appreciated that, unless otherwise noted, the unnecessary accompanying drawing of drawing to scale, they only try hard to illustrate conceptually structure described herein and flow process.
Description of drawings
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail, wherein:
Fig. 1 is the cross-sectional view of existing a kind of printed circuit board (PCB);
Fig. 2 is the vertical view of printed circuit board (PCB) shown in Figure 1;
Fig. 3 is the upward view of printed circuit board (PCB) shown in Figure 1;
Fig. 4 is the cross-sectional view of the printed circuit board (PCB) of one embodiment of the present invention;
Fig. 5 is the vertical view of printed circuit board (PCB) shown in Figure 4;
Fig. 6 is the upward view of printed circuit board (PCB) shown in Figure 4.
Embodiment
For make purpose of the present invention, technical scheme, and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the present invention is described in more detail.
Need to prove that for illustrated clear and for simplicity, accompanying drawing of the present invention has only shown with creation of the present invention puts closely-related architectural feature, then omits for other architectural feature.
Liquid crystal indicator of the present invention comprises display panels (not shown), covers brilliant film (not shown) and printed circuit board (PCB) 200, wherein, an end that covers brilliant film is electrically connected to display panels, and its other end links to each other with printed circuit board (PCB) 200, thereby, printed circuit board (PCB) 200 is electrically connected on the display panels by covering brilliant film.
Fig. 4 to Fig. 6 has disclosed the structure of the printed circuit board (PCB) 200 of one embodiment of the present invention, wherein, Figure 4 shows that the cross-sectional view of printed circuit board (PCB) 200 among the present invention, Fig. 5 is the vertical view of printed circuit board (PCB) 200 shown in Figure 4, and Fig. 6 is the upward view of printed circuit board (PCB) 200 shown in Figure 4.Extremely shown in Figure 6 as Fig. 4, the printed circuit board (PCB) 200 of one embodiment of the present invention comprises insulated substrate 201, be positioned at insulated substrate 201 1 sides golden finger zone 202 and with the conductive layer 203 of golden finger zone 201 electrical isolation, and the position of conductive layer 203 is corresponding with the position in golden finger zone 202.In this embodiment, conductive layer 203 is formed on the another side with respect to golden finger zone 202 of insulated substrate 201.Yet, the present invention is not limited to this, the present invention also goes for the situation of multilayer circuit board, conductive layer 203 of the present invention also can be formed on the intermediate layer of insulated substrate 201, in fact, as long as satisfying the layer at 202 places, golden finger zone is not to be positioned on same one deck of insulated substrate 201 with conductive layer 203, and, golden finger zone 202 and conductive layer 203 insulated from each other getting final product.
Preferably, conductive layer 203 is a copper foil layer.Because Copper Foil is a kind of electrolysis material, so when making printed circuit board (PCB) 200, Copper Foil can relatively easily be deposited on the insulated substrate 201 and form skim.Certainly, conductive layer 203 of the present invention is not limited to copper foil layer, also can adopt other metal materials that are easy to be deposited on the insulated substrate 201 to form.
When carrying out thermo-compression bonding between the golden finger zone 202 on the bonded areas of covering brilliant film and the printed circuit board (PCB) 200, because producing a large amount of heats, thermo-compression bonding make golden finger zone 202 be heated, at this moment, the heat of generation will distribute with first heat flux and second area 205 by conductive layer 203 distributes with second heat flux by the first area 204 of conductive layer 203.As shown in Figure 6, first area 204 has discrete mutual disjunct conductive pattern, and second area 205 has continuous conductive pattern connected to one another.In the present embodiment, the conductive pattern of first area 204 is used to connect electronic component, and the conductive pattern of second area 205 is the ground area that is connected with power ground.
In the present embodiment, in order to make second heat flux equate substantially with first heat flux, can be so that second area 205 has and first area 204 conductive pattern overall distribution density about equally.Because first area 204 has discrete mutual disjunct conductive pattern, and second area 205 has continuous conductive pattern connected to one another, has about equally conductive pattern overall distribution density in order to ensure second area 205 and first area 204, therefore, on second area 205, offer the structure that reduces described second heat flux that is exclusively used in of the conductive pattern that do not cut off second area 205, thereby make second heat flux equate substantially with first heat flux.In one embodiment, second area 205 is formed the space part 206 of no conductive pattern by partially-etched fall, the space part 206 of no conductive pattern constitutes the structure that reduces described second heat flux that is exclusively used in of the conductive pattern of offering that does not cut off second area 205 of the present invention on second area 205.
Because first area 204 has discrete conductive pattern, and second area 205 has continuous conductive pattern, therefore, in execution mode as shown in Figure 6, for example, the conductive pattern of second area 205 can be latticed arranging, thereby, on second area 205, form the space part 206 of no conductive pattern, therefore, can reduce the conductive pattern overall distribution density variation between first area 204 and the second area 205, and then reduce the difference of the heat flux of outwards distributing of first area 204 and second area 205.
Certainly, the shape of the conductive pattern of second area 205 is not limited in latticed arranging among the present invention, and the conductive pattern of second area 205 also can be strip arranges, and perhaps other figure is arranged.So long as can make second heat flux of externally distributing of second area 205 keep identical structural design with first heat flux of externally distributing of first area 204 in essence, all within protection scope of the present invention.
Printed circuit board (PCB) with respect to prior art, printed circuit board (PCB) 200 of the present invention is by offering the structure that reduces described second heat flux that is exclusively used in of not cutting off second area 205 conductive patterns on second area 205, this constitutional balance the difference of the heat flux of outwards distributing between second area 205 and the first area 204, thereby make that in conductive layer 203 second heat flux that second area 205 outwards distributes equates substantially with first heat flux of outwards distributing of first area 204 corresponding to golden finger zone 201.In the packaging technology of liquid crystal indicator, when thermo-compression bonding is carried out in the golden finger zone on the bonded areas of covering brilliant film and the printed circuit board (PCB) 200 201, the heat that produces in the 201 places thermo-compression bonding of golden finger zone can be by outwards distributing back to first area 204 and second area 205 in golden finger zone 201, because second heat flux that second area 205 outwards distributes equates substantially with first heat flux that outwards distribute first area 204, therefore, first area 204 and second area 205 can Homogeneouslly-radiatings, and then make that the temperature distribution at 201 places, golden finger zone on the printed circuit board (PCB) 200 is even, thereby can effectively guarantee the golden finger zone 201 on the printed circuit board (PCB) 200 and cover electrical bonding between the bonded areas of brilliant film, effectively avoid covering and produce the bonding bubble between brilliant film and the printed circuit board (PCB) 200, imperfect bonding problems such as bonding rosin joint have effectively guaranteed to cover the electric property between brilliant film and the printed circuit board (PCB) 200.
Other it should be noted that, the conductive pattern of second area 205 of the present invention is not limited to the ground area that is connected with power ground, and it also can be as the zone with other effects.So long as in the golden finger of printed circuit board (PCB) 200 zone with the bonded areas of covering brilliant film when bonding; for with printed circuit board (PCB) 200 on golden finger zone 201 vertical corresponding All Rangeses in; if the zone each other or intra-zone exist heat flux to scatter uneven problem; can adopt this structural design of the present invention; and do not break away from creation essence of the present invention, also all will be within protection scope of the present invention at the above equivalents of doing.
Though the present invention with better embodiment openly as above; but it is not to be used for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can make possible change and modification; therefore, protection scope of the present invention should be as the criterion with claim of the present invention institute restricted portion.
Claims (8)
1. printed circuit board (PCB), it comprises insulated substrate, be positioned at described insulated substrate one side golden finger zone and with the conductive layer of described golden finger zone electrical isolation, described golden finger zone is used for electrically boning with the bonded areas of covering brilliant film, described conductive layer comprises first area and second area, described golden finger regions perpendicular is projected in the described first area and the second area of described conductive layer, when described golden finger zone is heated, heat distributes with first heat flux by described first area and distributes with second heat flux by described second area, it is characterized in that, described first area has discrete conductive pattern, described second area has continuous conductive pattern, and, described second area offers the structure that reduces described second heat flux that is exclusively used in of the conductive pattern that do not cut off described second area, so that described second heat flux equates substantially with described first heat flux.
2. printed circuit board (PCB) as claimed in claim 1, wherein, the conductive pattern of described first area is used to connect electronic component, and the conductive pattern of described second area is the ground area.
3. printed circuit board (PCB) as claimed in claim 1, wherein, described conductive layer is a copper foil layer.
4. as each described printed circuit board (PCB) in the claim 1 to 3, wherein, described second area has and described first area conductive pattern overall distribution density about equally.
5. printed circuit board (PCB) as claimed in claim 4, wherein, described second area is formed the space part of no conductive pattern by partially-etched fall, and the space part of described no conductive pattern constitutes the described structure that reduces described second heat flux that is exclusively used in.
6. printed circuit board (PCB) as claimed in claim 5, wherein, the conductive pattern of described second area is latticed and arranges.
7. printed circuit board (PCB) as claimed in claim 5, wherein, the conductive pattern of described second area is strip and arranges.
8. liquid crystal indicator is characterized in that, it comprises display panels, cover brilliant film and as each described printed circuit board (PCB) in the claim 1 to 7, covers brilliant film described printed circuit board (PCB) is electrically connected on the described display panels by described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100494506A CN102131342B (en) | 2011-03-01 | 2011-03-01 | Printed circuit board and liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100494506A CN102131342B (en) | 2011-03-01 | 2011-03-01 | Printed circuit board and liquid crystal display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102131342A true CN102131342A (en) | 2011-07-20 |
| CN102131342B CN102131342B (en) | 2012-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100494506A Active CN102131342B (en) | 2011-03-01 | 2011-03-01 | Printed circuit board and liquid crystal display device |
Country Status (1)
| Country | Link |
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| CN (1) | CN102131342B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103294272A (en) * | 2013-05-30 | 2013-09-11 | 南昌欧菲光科技有限公司 | Transparent conductive film |
| CN103338589A (en) * | 2013-05-30 | 2013-10-02 | 南昌欧菲光科技有限公司 | Flexible circuit connecting component |
| CN106413251A (en) * | 2015-07-31 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof, and electronic apparatus employing circuit board |
| CN109673102A (en) * | 2018-12-19 | 2019-04-23 | 惠科股份有限公司 | Printed wiring board and its display panel |
| CN110568964A (en) * | 2019-09-12 | 2019-12-13 | 业成科技（成都）有限公司 | Sensor assembly, preparation method thereof, bonding structure and touch panel module |
| CN110796975A (en) * | 2019-11-25 | 2020-02-14 | Tcl华星光电技术有限公司 | Display panel and display device |
| CN114762461A (en) * | 2019-12-12 | 2022-07-15 | 索尼互动娱乐股份有限公司 | Multilayer printed circuit board and electronic device |
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| CN1411329A (en) * | 2001-10-02 | 2003-04-16 | 日本电气株式会社 | Circuit substrate connecting structure, liquid crystal display with same and mounting method |
| CN101478858A (en) * | 2009-01-21 | 2009-07-08 | 友达光电股份有限公司 | Circuit board construction, manufacturing method and liquid crystal display |
| JP2009176770A (en) * | 2008-01-21 | 2009-08-06 | Ube Ind Ltd | Method of manufacturing copper wiring insulation film, and copper wiring insulation film manufactured from the same |
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2011
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Patent Citations (3)
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| CN1411329A (en) * | 2001-10-02 | 2003-04-16 | 日本电气株式会社 | Circuit substrate connecting structure, liquid crystal display with same and mounting method |
| JP2009176770A (en) * | 2008-01-21 | 2009-08-06 | Ube Ind Ltd | Method of manufacturing copper wiring insulation film, and copper wiring insulation film manufactured from the same |
| CN101478858A (en) * | 2009-01-21 | 2009-07-08 | 友达光电股份有限公司 | Circuit board construction, manufacturing method and liquid crystal display |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103294272A (en) * | 2013-05-30 | 2013-09-11 | 南昌欧菲光科技有限公司 | Transparent conductive film |
| CN103338589A (en) * | 2013-05-30 | 2013-10-02 | 南昌欧菲光科技有限公司 | Flexible circuit connecting component |
| CN103294272B (en) * | 2013-05-30 | 2016-04-13 | 南昌欧菲光科技有限公司 | Nesa coating |
| CN106413251A (en) * | 2015-07-31 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof, and electronic apparatus employing circuit board |
| CN106413251B (en) * | 2015-07-31 | 2019-01-25 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and its manufacturing method, the electronic device using the circuit board |
| CN109673102A (en) * | 2018-12-19 | 2019-04-23 | 惠科股份有限公司 | Printed wiring board and its display panel |
| CN110568964A (en) * | 2019-09-12 | 2019-12-13 | 业成科技（成都）有限公司 | Sensor assembly, preparation method thereof, bonding structure and touch panel module |
| CN110796975A (en) * | 2019-11-25 | 2020-02-14 | Tcl华星光电技术有限公司 | Display panel and display device |
| CN110796975B (en) * | 2019-11-25 | 2023-11-28 | Tcl华星光电技术有限公司 | Display panel and display device |
| CN114762461A (en) * | 2019-12-12 | 2022-07-15 | 索尼互动娱乐股份有限公司 | Multilayer printed circuit board and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102131342B (en) | 2012-07-18 |
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Address after: 215301 No. 1, Longteng Road, Kunshan, Jiangsu Patentee after: InfoVision Optoelectronics(Kunshan)Co.,Ltd. Address before: 215301 No. 1, Longteng Road, Kunshan, Jiangsu Patentee before: INFOVISION OPTOELECTRONICS (KUNSHAN) Co.,Ltd. |