CN208606014U - A kind of backlight module - Google Patents
A kind of backlight module Download PDFInfo
- Publication number
- CN208606014U CN208606014U CN201821348405.4U CN201821348405U CN208606014U CN 208606014 U CN208606014 U CN 208606014U CN 201821348405 U CN201821348405 U CN 201821348405U CN 208606014 U CN208606014 U CN 208606014U
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- backlight module
- conversion film
- light
- pcb layer
- layer
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Abstract
The utility model discloses a kind of backlight modules comprising pcb layer, Mini LED light and light conversion film, the pcb layer are spliced by multiple wiring boards；The Mini LED light is set on the pcb layer；The light conversion film is set to above the Mini LED light.Since pcb layer is spliced by multiple wiring boards, so it can produce multiple lesser wiring boards by small device to be spliced, without in addition purchasing large scale equipment, and light conversion film is directly arranged in above Mini LED light using one whole film, its size is corresponding with pcb layer, makes to lead to the problem of black line or black surround in stitching portion which obviate independent light mixing.
Description
Technical field
The utility model relates to a kind of field of display technology, more specifically to a kind of backlight module.
Background technique
Mini LED is between traditional LED and Micro LED, therefore for existing manufacturer, many existing systems
Journey and equipment can continue use, so without introducing too many new equipment.Especially by the soft base of Mini LED technology collocation
High curved surface backlight module can be made in plate, there will be an opportunity to take the lead in being directed in mobile phone, TV, vehicle-mounted panel, and the competing pen electricity of electricity etc.
A variety of applications, and Mini LED is not necessarily to the technical threshold for overcoming flood tide to shift, it is easier to realize volume production.
The size of backlight module is directly related with board equipment, therefore to produce large scale backlight module and have to investment greatly
Type equipment.And ought be all impacted with large scale equipment production its efficiency of small size backlight and precision, therefore buying large scale equipment must
Must have on certain order basis.For the manufacturer less for large scale backlight module order, large size is set
It is standby less, it generallys use mode made of multiple Mini LED backlight mould group splicings and is assembled into large-size ultra-thin backlight module,
But since fluorescent film is also to be spliced, lead to each fluorescent film independence light mixing, and due to not mixing at the gap of splicing
Light thereby reduces the competitiveness of product to show black line or black surround.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of backlight modules, since pcb layer is by multiple
What wiring board was spliced, so it can produce multiple lesser wiring boards by small device to be spliced, thus
Without in addition purchasing large scale equipment, and light conversion film is directly arranged in above Mini LED light using one whole film, size
It is corresponding with pcb layer, make to lead to the problem of black line or black surround in stitching portion which obviate independent light mixing.
Technical problem to be solved in the utility model is achieved by the following technical programs:
In order to solve the above technical problems, the utility model provides a kind of backlight module comprising pcb layer, Mini
LED light and light conversion film, the pcb layer are spliced by multiple wiring boards；The Mini LED light is set to the wiring board
On layer；The light conversion film is set to above the Mini LED light.
Further, the backlight module further includes binder, is set to the pcb layer and the light conversion film institute
In the space of formation.
Further, the light conversion film is quantum dot film.
Further, the backlight module further includes barrier layer, is set on the quantum dot film.
Further, the light conversion film is set on the pcb layer and covers the Mini LED light.
Further, the backlight module further includes edge sealing adhesive, is set to the wiring board outer rim and turns around the light
Change film.
Further, it is fixed between the wiring board by tape-stripping.
The utility model has the following beneficial effects:
Due to pcb layer be spliced by multiple wiring boards, so its can be produced by small device it is multiple
Lesser wiring board is spliced, and without in addition purchasing large scale equipment, and light conversion film is direct using one whole film
Set on above Mini LED light, size is corresponding with pcb layer, makes to generate which obviate independent light mixing in stitching portion
The problem of black line or black surround.
Detailed description of the invention
Fig. 1 is a kind of back light module unit structure schematic diagram provided by the utility model.
Fig. 2 is another back light module unit structure schematic diagram provided by the utility model.
Fig. 3 is another back light module unit structure schematic diagram provided by the utility model.
Fig. 4 is vapour molecule route schematic diagram.
Fig. 5 is the structural schematic diagram of wiring board.
Specific embodiment
The utility model is described in detail below with reference to embodiment, embodiment is only the preferred reality of the utility model
Mode is applied, is not the restriction to the utility model.
Referring to Fig. 1, being a kind of backlight module provided by the utility model comprising pcb layer, 1 and of Mini LED light
Light conversion film 2, the pcb layer are spliced by multiple wiring boards 3；The Mini LED light 1 is set to the pcb layer
On；The light conversion film 2 is set to 1 top of Mini LED light.Since pcb layer is spliced by multiple wiring boards 3
, so it can produce multiple lesser wiring boards 3 to be spliced, without in addition purchasing greatly by small device
Type equipment, and light conversion film 2 is directly arranged in above Mini LED light 1 using one whole film, size and pcb layer phase
It is corresponding, make to lead to the problem of black line or black surround in stitching portion which obviate independent light mixing.
Referring to Fig. 2, further, the backlight module further includes binder 4, be set to the pcb layer with it is described
Light conversion film 2 is formed by space.Binder 4 full of gap and glues pcb layer, Mini LED light 1 and light conversion film 2
It picks up and, due to being filled with binder 4, avoid light conversion film 2 from contacting with air, light conversion film 2 is protected not corroded by water oxygen, also
Binder 4 can be made to riddle at the splicing gap of wiring board 3, wiring board 3 is made to be stitched together.
Further, the light conversion film 2 is fluorescent film or quantum dot film, and the present embodiment is preferably quantum dot film, due to
Quantum dot film by water oxygen corrode, and in the gap in be full of binder 4 water oxygen can be made to be discharged, thus also obstructed water oxygen again into
Enter, protects quantum dot film.
Further, the backlight module further includes barrier layer 5, is set on the quantum dot film, can further hinder
It is again introduced into every water oxygen, protects quantum dot film.
Further, the light conversion film 2 is set on the pcb layer and covers the Mini LED light 1, passes through light
Film 2 is converted full of the gap between pcb layer, Mini LED light 1 and light conversion film 2, water oxygen is avoided to corrode.
1 and Fig. 3 are please referred to, further, the backlight module further includes edge sealing adhesive 6, is set to table on the wiring board 3
The outer rim in face and around the light conversion film 2, the end to end formation closed loop of edge sealing adhesive 6, edge sealing adhesive 6 is abutted to light conversion film 2,
And then promote the water oxygen resistant effect of backlight module.The outer rim of pcb layer upper surface is set to due to edge sealing adhesive 6 and is converted around light
The light of film 2, surrounding can be absorbed or be reflected by edge sealing adhesive 6, be avoided from surrounding light leakage.
Further, it is pasted and is fixed by adhesive tape 7 between the wiring board 3.
Referring to Fig. 4, further, added with inorganic material 8 that is neutral, being insoluble in water, inorganic material in the edge sealing adhesive 6
Material 8 is evenly distributed on inside edge sealing adhesive 6, and due to the blocking of inorganic material 8, vapour molecule 9 can not directly penetrate into inside, is seeped
Saturating passage length is elongated, and the width of infiltration lane narrows.It can be in the premise for not changing edge sealing adhesive 6 apparent thickness and width
Under, promote waterproof, the oxygen performance of edge sealing adhesive 6.Edge sealing adhesive 6 is preferably UV glue in the present embodiment, since UV glue belongs to organic matter,
Its distinguishing feature is that waterproof, oxygen performance be not high, and after addition inorganic material 8, waterproof, oxygen performance are available significant
It improves.
Further, diameter phi≤1 μm of the inorganic material 8.
Further, the inorganic material 8 is silicide.
Further, the silicide is SiO2Or Si3N4。
Referring to Fig. 5, further, which includes substrate layer 31, and the upper surface of substrate layer 31 is provided with circuit layer
32, the lower surface of substrate layer 31 is provided with metallic radiating layer 33, and set-up mode can divide for circuit layer 32, metallic radiating layer 33
Not Tong Guo sticking double faced adhesive tape on substrate layer 31.Due to the thinner thickness of substrate layer 31, the heat on wiring board 3 can pass through base
Material layer 31 is diffused into metallic radiating layer 33, which can effectively increase the heat dissipation area of wiring board 3, plays uniformly
The effect of heat dissipation, to improve the radiating efficiency of wiring board 3.Wherein substrate layer 31 can for polyimides, polyester, polysulfones or
Any one in polytetrafluoroethylene (PTFE), double-sided adhesive are any one in acrylic acid glue-line or epoxy glue layer, which dissipates
Thermosphere 33 can be copper foil layer.
Further, wiring board 3 further includes at least one through substrate layer 31, circuit layer 32 and metallic radiating layer 33
Through-hole 34, the inner wall of the through-hole 34 are provided with the heat-conducting layer contacted with circuit layer 32, metallic radiating layer 33, using good at through-hole 34
Good heating conduction can be electrically connected the circuit layer 32 and metallic radiating layer 33 of 31 two sides of substrate layer, play good thermally conductive
Function, and heat-conducting layer can provide thermally conductive function, to reach good heat dissipation effect.Wherein, which can be conductive for copper glue
Ink layer.
Further, it is provided with the heat carrier connecting with external conductive structure in through-hole 34, the heat carrier is from circuit layer
32 side is connected with external conductive structure, is also in contact with the heat-conducting layer in through-hole 34, so that circuit layer 32, metal dissipate
Thermosphere 33 can be connected by through-hole 34 with external conductive structure, so that the heat in wiring board 3 passes through the through-hole 34
In heat carrier diffuse to external conductive structure, to further increase the radiating efficiency of wiring board 3.Preferably, in order to make through-hole
34 can be connected with external conductive structure, which is set to the marginal position of wiring board 3.
Further, the metallic radiating layer 33 be uniform radiating structure, structure can for reticular structure, strip structure,
Any one in wavelike structure or honeycomb structure can preferably improve heat dissipation effect by the uniform radiating structure.
The utility model additionally provides a kind of display module comprising backlight module described in any of the above embodiments and be set to institute
State the TFT mould group on light conversion film 2.
Further, the upper surface of the edge sealing adhesive 6 is concordant with the upper surface of the TFT mould group.So that edge sealing adhesive 6 can be used
In TFT module group assembling, other packaging technologies are reduced, reduce production cost.
Above embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but can not
Therefore it is interpreted as that a limitation on the scope of the patent of the present invention, as long as the form using equivalent substitution or equivalent transformation is obtained
Technical solution, shall fall within the scope of the present invention.
Claims (7)
1. a kind of backlight module, characterized in that it comprises:
Pcb layer is spliced by multiple wiring boards；
Mini LED light is set on the pcb layer；
Light conversion film is set to above the Mini LED light.
2. backlight module according to claim 1, which is characterized in that further include binder, be set to the pcb layer
It is formed by space with the light conversion film.
3. backlight module according to claim 2, which is characterized in that the light conversion film is quantum dot film.
4. backlight module according to claim 3, which is characterized in that further include barrier layer, be set to the quantum dot film
On.
5. backlight module according to claim 1, which is characterized in that the light conversion film be set to the pcb layer on and
Cover the Mini LED light.
6. backlight module according to claim 1, which is characterized in that further include edge sealing adhesive, be set to outside the wiring board
Edge and the circular light conversion film.
7. backlight module according to claim 1, which is characterized in that fixed between the wiring board by tape-stripping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821348405.4U CN208606014U (en) | 2018-08-21 | 2018-08-21 | A kind of backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821348405.4U CN208606014U (en) | 2018-08-21 | 2018-08-21 | A kind of backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208606014U true CN208606014U (en) | 2019-03-15 |
Family
ID=65680295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821348405.4U Active CN208606014U (en) | 2018-08-21 | 2018-08-21 | A kind of backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208606014U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110133907A (en) * | 2019-04-02 | 2019-08-16 | 深圳康佳电子科技有限公司 | A kind of Mini-LED backlight module, display screen and TV |
| CN110361891A (en) * | 2019-07-29 | 2019-10-22 | 武汉华星光电技术有限公司 | Backlight module |
| CN110610929A (en) * | 2019-08-16 | 2019-12-24 | 武汉华星光电技术有限公司 | Backlight module |
| CN111580368A (en) * | 2020-05-20 | 2020-08-25 | 深圳扑浪创新科技有限公司 | Preparation method and device of light conversion film and micro light-emitting diode display module |
| WO2020220404A1 (en) * | 2019-04-29 | 2020-11-05 | 惠州市华星光电技术有限公司 | Mini-led backlight and method for manufacturing same |
| WO2021031379A1 (en) * | 2019-08-22 | 2021-02-25 | 武汉华星光电技术有限公司 | Backlight module, display device, and manufacturing method for backlight module |
| WO2021032164A1 (en) * | 2019-08-20 | 2021-02-25 | 海信视像科技股份有限公司 | Display apparatus and backlight module |
| CN112635625A (en) * | 2020-12-31 | 2021-04-09 | 深圳全息界科技有限公司 | Splicing type LED module packaging process |
| US11754876B2 (en) | 2021-06-09 | 2023-09-12 | Samsung Electronics Co., Ltd. | Display apparatus |
-
2018
- 2018-08-21 CN CN201821348405.4U patent/CN208606014U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110133907A (en) * | 2019-04-02 | 2019-08-16 | 深圳康佳电子科技有限公司 | A kind of Mini-LED backlight module, display screen and TV |
| WO2020220404A1 (en) * | 2019-04-29 | 2020-11-05 | 惠州市华星光电技术有限公司 | Mini-led backlight and method for manufacturing same |
| CN110361891A (en) * | 2019-07-29 | 2019-10-22 | 武汉华星光电技术有限公司 | Backlight module |
| US11061274B2 (en) | 2019-07-29 | 2021-07-13 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Backlight module and display device |
| CN110610929A (en) * | 2019-08-16 | 2019-12-24 | 武汉华星光电技术有限公司 | Backlight module |
| WO2021032164A1 (en) * | 2019-08-20 | 2021-02-25 | 海信视像科技股份有限公司 | Display apparatus and backlight module |
| WO2021031379A1 (en) * | 2019-08-22 | 2021-02-25 | 武汉华星光电技术有限公司 | Backlight module, display device, and manufacturing method for backlight module |
| US11391447B2 (en) * | 2019-08-22 | 2022-07-19 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Backlight module, display device and backlight module manufacturing method |
| CN111580368A (en) * | 2020-05-20 | 2020-08-25 | 深圳扑浪创新科技有限公司 | Preparation method and device of light conversion film and micro light-emitting diode display module |
| CN112635625A (en) * | 2020-12-31 | 2021-04-09 | 深圳全息界科技有限公司 | Splicing type LED module packaging process |
| US11754876B2 (en) | 2021-06-09 | 2023-09-12 | Samsung Electronics Co., Ltd. | Display apparatus |
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